CN212542415U - High temperature resistant endless IGBT module - Google Patents

High temperature resistant endless IGBT module Download PDF

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Publication number
CN212542415U
CN212542415U CN202021345427.2U CN202021345427U CN212542415U CN 212542415 U CN212542415 U CN 212542415U CN 202021345427 U CN202021345427 U CN 202021345427U CN 212542415 U CN212542415 U CN 212542415U
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box
fixedly connected
base
shell
liquid
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CN202021345427.2U
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邱嘉龙
李志军
朱永斌
何祖辉
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Zhejiang Tianyi Semiconductor Technology Co ltd
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Zhejiang Tianyi Semiconductor Technology Co ltd
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Abstract

The utility model discloses a high temperature resistant endless IGBT module, the on-line screen storage device comprises a base, the mounting groove has been seted up to the bottom of base, the inner chamber fixedly connected with heat dissipation box of mounting groove, base bottom fixedly connected with coolant liquid box, the top intercommunication on coolant liquid box right side has the liquid feeding pipe, the left bottom intercommunication of coolant liquid box has the fluid-discharge tube, the surface winding of coolant liquid box has the looped pipeline, the one end intercommunication of pipeline and looped pipeline is passed through in the left side of heat dissipation bottom of the box portion. The utility model discloses a setting up the cooperation of heat dissipation box, coolant liquid box, ring pipe, drawing liquid pump, heat conduction stick, fixed block, shell, fan, mount pad, exhaust hole, temperature-sensing ware, inlet port and controller and using, possessing the good advantage of radiating effect, it is poor to have solved current IGBT module radiating effect, and IGBT produces the unable fine effluvium of heat in a large number in the use, and IGBT inner member is ageing with higher speed during high temperature, reduces IGBT life's problem.

Description

High temperature resistant endless IGBT module
Technical Field
The utility model relates to a IGBT module technical field specifically is a high temperature resistant endless IGBT module.
Background
IGBT, insulated gate bipolar transistor, it is the compound full accuse type voltage drive formula power semiconductor device that comprises BJT and MOS, have MOSFET's high input impedance and GTR's low conduction voltage drop two-sided advantage concurrently, IGBT can produce a large amount of heats in the use, and current IGBT module radiating effect is poor, and IGBT produces a large amount of heats in the use and can't fine effluvium, and IGBT inner member is ageing-accelerated during high temperature, reduces IGBT life.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high temperature resistant endless IGBT module possesses the good advantage of radiating effect, and it is poor to have solved current IGBT module radiating effect, and IGBT produces the unable fine effluvium of heat in a large number in the use, and IGBT inner member is ageing-accelerated during high temperature, reduces IGBT life's problem.
In order to achieve the above object, the utility model provides a following technical scheme: the IGBT module with high temperature circulation resistance comprises a base, wherein the bottom of the base is provided with a mounting groove, the inner cavity of the mounting groove is fixedly connected with a heat dissipation box, the bottom of the base is fixedly connected with a cooling liquid box, the top of the right side of the cooling liquid box is communicated with a liquid feeding pipe, the bottom of the left side of the cooling liquid box is communicated with a liquid discharging pipe, the surface of the cooling liquid box is wound with a ring pipe, the left side of the bottom of the heat dissipation box is communicated with one end of the ring pipe through a pipeline, the other end of the ring pipe is communicated with the bottom of the right side of the cooling liquid box, the right side of the top of the cooling liquid box is fixedly connected with a liquid pump, a liquid suction pipe of the liquid pump is communicated with the right side of the top of the cooling liquid box, a liquid discharge pipe of the liquid pump is communicated with the right side of the bottom of the heat dissipation box, heat, the both sides at base top all are through bolt fixedly connected with fixed block, the relative one side fixedly connected with shell of fixed block, the equal fixedly connected with fan in both sides at base top, the top fixedly connected with mount pad of base, the exhaust hole has all been seted up to the both sides at shell top, shell cavity's top fixedly connected with temperature-sensing ware, the top intercommunication of base has the jack, the inlet port has all been seted up to the front side and the rear side of shell, the top fixedly connected with controller of coolant liquid box, the controller respectively with drawing liquid pump, fan and temperature-sensing ware electric connection.
Preferably, the top of the liquid feeding pipe is in threaded connection with a pipe cover, and the surface of the liquid discharging pipe is sleeved with a valve.
Preferably, the surface of the mounting seat is provided with a vent hole, and the base is made of high-temperature-resistant materials.
Preferably, the inner cavity of the exhaust hole is fixedly connected with a first filter screen, and the inner cavity of the air inlet hole is fixedly connected with a second filter screen.
Preferably, the top of the heat conducting rod penetrates through the top of the base and extends to the inner cavity of the shell, and the fan and the mounting seat are both located inside the shell.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a setting up the cooperation of heat dissipation box, coolant liquid box, ring pipe, drawing liquid pump, heat conduction stick, fixed block, shell, fan, mount pad, exhaust hole, temperature-sensing ware, inlet port and controller and using, possessing the good advantage of radiating effect, it is poor to have solved current IGBT module radiating effect, and IGBT produces the unable fine effluvium of heat in a large number in the use, and IGBT inner member is ageing with higher speed during high temperature, reduces IGBT life's problem.
2. The utility model discloses a set up the tube cap, can prevent effectively that the coolant liquid from spilling from the liquid feeding pipe, through setting up fluid-discharge tube and valve, the change of coolant liquid in the coolant liquid box of can being convenient for, through setting up the air vent, the circulation of air in the shell of can being convenient for, through setting up first filter screen and second filter screen, can play and carry out filterable effect to the air in the entering shell, can prevent effectively that debris from getting into in the shell, through setting up the heat conduction stick, can play the effect of heat conduction, can be convenient for derive the heat in the shell, through setting up the ring pipe, the cooling of coolant liquid of can being convenient for.
Drawings
FIG. 1 is a front sectional view of the structure of the present invention;
fig. 2 is a top view of the base of the present invention;
fig. 3 is a front view of the structure of the present invention.
In the figure: the heat dissipation device comprises a base 1, a mounting groove 2, a heat dissipation box 3, a cooling liquid box 4, a liquid adding pipe 5, a liquid discharging pipe 6, a ring pipe 7, a liquid drawing pump 8, a heat conducting rod 9, a fixing block 10, a shell 11, a fan 12, a mounting seat 13, an exhaust hole 14, a temperature sensor 15, a jack 16, an air inlet 17 and a controller 18.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to be referred must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The utility model provides a base 1, mounting groove 2, heat dissipation box 3, coolant liquid box 4, liquid feeding pipe 5, fluid-discharge tube 6, ring pipe 7, drawing liquid pump 8, heat conduction rod 9, fixed block 10, shell 11, fan 12, mount pad 13, exhaust hole 14, temperature-sensing ware 15, jack 16, inlet port 17 and parts such as controller 18 are general standard component or the part that technical staff in the field know, and its structure and principle all can learn the manual or learn through conventional experimental method for technical staff in the field through the technique.
Referring to fig. 1-3, a high temperature cycle resistant IGBT module comprises a base 1, a mounting groove 2 is formed at the bottom of the base 1, a heat dissipation box 3 is fixedly connected to the inner cavity of the mounting groove 2, a coolant box 4 is fixedly connected to the bottom of the base 1, a liquid feeding pipe 5 is communicated with the top of the right side of the coolant box 4, a liquid discharging pipe 6 is communicated with the bottom of the left side of the coolant box 4, a pipe cover is threadedly connected to the top of the liquid feeding pipe 5, the coolant can be effectively prevented from spilling out of the liquid feeding pipe 5 by the arrangement of the pipe cover, a valve is sleeved on the surface of the liquid discharging pipe 6, the replacement of the coolant in the coolant box 4 can be facilitated by the arrangement of the liquid discharging pipe 6 and the valve, a ring pipe 7 is wound on the surface of the coolant box 4, the cooling of the coolant can be facilitated by the arrangement of the ring pipe 7, the left side of the bottom of the heat dissipation box 3 is communicated with one end, the right side of the top of the cooling liquid box 4 is fixedly connected with a liquid pump 8, a liquid pumping pipe of the liquid pump 8 is communicated with the right side of the top of the cooling liquid box 4, a liquid outlet pipe of the liquid pump 8 is communicated with the right side of the bottom of the heat dissipation box 3, the front side and the rear side of the top of the heat dissipation box 3 are both provided with heat conduction rods 9 in a penetrating way, the bottoms of the heat conduction rods 9 extend to the inner cavity of the heat dissipation box 3, both sides of the top of the base 1 are both fixedly connected with fixing blocks 10 through bolts, one side opposite to the fixing blocks 10 is fixedly connected with a shell 11, both sides of the top of the base 1 are both fixedly connected with a fan 12, the top of the base 1 is fixedly connected with a mounting seat 13, the surface of the mounting seat 13 is provided with air holes, through the air holes, the circulation of air in the shell 11 can be facilitated, the base 1 is made of high-temperature resistant, through setting up heat conduction stick 9, can play the effect of heat conduction, can be convenient for derive the heat in the shell 11, exhaust hole 14 has all been seted up to the both sides at shell 11 top, the top fixedly connected with temperature-sensing ware 15 of shell 11 inner chamber, the top intercommunication of base 1 has jack 16, inlet port 17 has all been seted up to the front side and the rear side of shell 11, the inner chamber fixedly connected with first filter screen of exhaust hole 14, the inner chamber fixedly connected with second filter screen of inlet port 17, through setting up first filter screen and second filter screen, can play the effect of filtering the air that gets into in shell 11, can effectively prevent debris from getting into in the shell 11, the top fixedly connected with controller 18 of coolant liquid box 4, controller 18 respectively with drawing liquid pump 8, fan 12 and temperature-sensing ware 15 electric connection, through setting up heat dissipation box 3, coolant liquid box 4, ring form 7, drawing liquid pump 8, Heat conduction stick 9, fixed block 10, shell 11, fan 12, mount pad 13, exhaust hole 14, temperature-sensing ware 15, inlet port 17 and controller 18's cooperation is used, possesses the good advantage of radiating effect, and it is poor to have solved current IGBT module radiating effect, and IGBT produces heat in a large number in the use and can't fine effluvium, and IGBT inner member is ageing-accelerated during high temperature, reduces IGBT life's problem.
When the cooling device is used, the temperature sensor 15 senses the temperature in the shell 11, when the temperature in the shell 11 is too high, the temperature sensor 15 transmits information to the controller 18 for processing, the controller 18 starts the fan 12, the fan 12 blows hot air in the shell 11 out of the exhaust hole 14, air outside the shell 11 enters the shell 11 through the air inlet hole 17, the flowing of the air in the shell 11 is accelerated to speed up the cooling in the shell 11, the controller 18 starts the liquid pump 8, the liquid pump 8 pumps cooling liquid in the cooling liquid box 4 to the inner cavity of the heat dissipation box 3, the cooling liquid is in contact with the heat conduction rod 9, the heat conduction rod 9 plays a role in conducting heat, the cooling liquid cools the heat conduction rod 9 to achieve the effect of cooling in the shell 11, the cooling liquid with the increased temperature flows into the annular pipe 7, the cooling liquid flows in the annular pipe 7 to dissipate heat, and flows into the cooling liquid box 4 again for reuse after being cooled.
In summary, the following steps: this high temperature resistant endless IGBT module, through setting up heat dissipation box 3, coolant liquid box 4, ring pipe 7, drawing liquid pump 8, heat conduction rod 9, fixed block 10, shell 11, fan 12, mount pad 13, exhaust hole 14, temperature-sensing ware 15, inlet port 17 and controller 18, it is poor to have solved current IGBT module radiating effect, the unable fine effluvium of a large amount of heat production in the use of IGBT, IGBT inner member is ageing-accelerated during high temperature, reduce IGBT life's problem.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. The utility model provides a high temperature resistant endless IGBT module, includes base (1), its characterized in that: the bottom of the base (1) is provided with a mounting groove (2), the inner cavity of the mounting groove (2) is fixedly connected with a heat dissipation box (3), the bottom of the base (1) is fixedly connected with a cooling liquid box (4), the top of the right side of the cooling liquid box (4) is communicated with a liquid adding pipe (5), the left bottom of the cooling liquid box (4) is communicated with a liquid discharging pipe (6), the surface of the cooling liquid box (4) is wound with a ring pipe (7), the left side of the bottom of the heat dissipation box (3) is communicated with one end of the ring pipe (7) through a pipeline, the other end of the ring pipe (7) is communicated with the bottom of the right side of the cooling liquid box (4), the right side of the top of the cooling liquid box (4) is fixedly connected with a liquid pumping pump (8), the liquid pumping pipe of the liquid pumping pump (8) is communicated with the right side of the top of the cooling liquid box (4), the liquid pumping pipe of, the heat dissipation box is characterized in that heat conduction rods (9) are arranged on the front side and the rear side of the top of the heat dissipation box (3) in a penetrating mode, the bottom of each heat conduction rod (9) extends to the inner cavity of the heat dissipation box (3), fixed blocks (10) are fixedly connected to the two sides of the top of the base (1) through bolts, a shell (11) is fixedly connected to one side, opposite to the fixed blocks (10), of each base, fans (12) are fixedly connected to the two sides of the top of the base (1), mounting seats (13) are fixedly connected to the top of the base (1), exhaust holes (14) are formed in the two sides of the top of the shell (11), a temperature sensor (15) is fixedly connected to the top of the inner cavity of the shell (11), jacks (16) are communicated with the top of the base (1), air inlets (17) are formed in the front side and the rear side of the shell (11), and, the controller (18) is electrically connected with the liquid pump (8), the fan (12) and the temperature sensor (15) respectively.
2. The IGBT module of claim 1 that is resistant to high temperature cycling, characterized in that: the top of the liquid feeding pipe (5) is in threaded connection with a pipe cover, and the surface of the liquid discharging pipe (6) is sleeved with a valve.
3. The IGBT module of claim 1 that is resistant to high temperature cycling, characterized in that: the surface of the mounting seat (13) is provided with vent holes, and the base (1) is made of high-temperature-resistant materials.
4. The IGBT module of claim 1 that is resistant to high temperature cycling, characterized in that: the inner cavity of the exhaust hole (14) is fixedly connected with a first filter screen, and the inner cavity of the air inlet hole (17) is fixedly connected with a second filter screen.
5. The IGBT module of claim 1 that is resistant to high temperature cycling, characterized in that: the top of the heat conducting rod (9) penetrates through the top of the base (1) and extends to the inner cavity of the shell (11), and the fan (12) and the mounting seat (13) are both located inside the shell (11).
CN202021345427.2U 2020-07-09 2020-07-09 High temperature resistant endless IGBT module Active CN212542415U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021345427.2U CN212542415U (en) 2020-07-09 2020-07-09 High temperature resistant endless IGBT module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021345427.2U CN212542415U (en) 2020-07-09 2020-07-09 High temperature resistant endless IGBT module

Publications (1)

Publication Number Publication Date
CN212542415U true CN212542415U (en) 2021-02-12

Family

ID=74521753

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021345427.2U Active CN212542415U (en) 2020-07-09 2020-07-09 High temperature resistant endless IGBT module

Country Status (1)

Country Link
CN (1) CN212542415U (en)

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