CN212542362U

CN212542362U - Semiconductor diode frame rapid Assembly instrument

Info

Publication number: CN212542362U
Application number: CN202021007794.1U
Authority: CN
Inventors: 韩波
Original assignee: Hans Automation Technology Jiangsu Co ltd
Current assignee: Hans Automation Technology Jiangsu Co ltd
Priority date: 2020-06-04
Filing date: 2020-06-04
Publication date: 2021-02-12
Anticipated expiration: 2030-06-04

Abstract

The utility model relates to a diode technical field discloses a semiconductor diode frame rapid Assembly instrument, and its structure includes the fixed plate, be provided with spout, spacing hole, left support plate and right branch fagging on the fixed plate, the spout is located the inside right side of fixed plate, spacing hole site in the fixed plate upper surface, and with the right side of right branch fagging, the left support plate pass through the screw with the left side fixed connection of fixed plate upper surface, the right branch fagging pass through the slide with the spout is connected, the right surface of right branch fagging is provided with connecting plate and jack, the connecting plate through weld in the well below fixed connection on right branch fagging right side surface. The utility model discloses having accelerated the speed of diode when the welding, having improved the convenience when diode frame mount, having saved the time when operating personnel changes the solder wire, avoided using assembly and disassembly tools to carry out the dismouting to the right branch fagging.

Description

Semiconductor diode frame rapid Assembly instrument

Technical Field

The utility model relates to a diode technical field specifically is a semiconductor diode frame rapid Assembly instrument.

Background

According to patent 201921803898.0, a semiconductor diode frame rapid Assembly instrument can know, including the workstation, the last fixed surface of workstation is connected with the disk, and the disk uses the axis of workstation to be the symmetric distribution as the center of symmetry, and the fixed surface of disk is connected with the bearing, the outer lane fixedly connected with L template of bearing. This semiconductor diode frame rapid Assembly instrument, upper surface through setting up the L template is provided with the fixing machine, and fixed establishment is including sliding port, reached and to have had no need to assemble repeatedly, stabilize fixed effect, it must repeated multilayer step again when having solved current fixed point of gluing, extravagant manpower and production efficiency are very low, if not fixed with it, it is very easy when the point is glued, some of them can not arrive, and flow in one process next, make when examining, the probability of substandard product increases, the waste of material has been caused, thereby production efficiency has seriously been influenced and can need not to assemble repeatedly, and can stably fixed characteristics.

Currently, existing semiconductor diode frame rapid assembly tools suffer from some deficiencies, such as; the speed of the existing quick assembling tool for the semiconductor diode frame is slower when the diode is welded, the convenience of the diode frame during installation is reduced, the time of replacing a solder wire by an operator is longer, and the assembling and disassembling tool is required to be used for assembling and disassembling the right support plate. For this reason, new technical solutions need to be designed to solve the problem.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor diode frame rapid Assembly instrument has solved the problem that proposes in the background art.

In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor diode frame rapid assembly tool comprises a fixed plate, wherein a sliding groove, a limiting hole, a left support plate and a right support plate are arranged on the fixed plate, the sliding groove is positioned on the right side inside the fixed plate, the limiting hole is positioned on the upper surface of the fixed plate and is fixedly connected with the right side of the right support plate, the left support plate is fixedly connected with the left side of the upper surface of the fixed plate through a screw, the right support plate is connected with the sliding groove through a sliding plate, a connecting plate and a jack are arranged on the right surface of the right support plate, the connecting plate is fixedly connected with the middle lower part of the right surface of the right support plate through welding, the jack is positioned above the middle part inside the right support plate, a limiting pin is arranged on the connecting plate, the left support plate is connected with the right support plate, and the outer surface of the winding drum is wound with a solder wire.

As a preferred embodiment of the present invention, the sliding plate is embedded inside the sliding groove and movably connected to the inside of the sliding groove, and the upper end of the sliding groove is communicated with the upper surface of the fixing plate.

As a preferred embodiment of the present invention, the lower end of the right supporting plate is connected to the upper surface of the sliding plate through a screw, and is movably connected to the upper surface of the fixing plate.

In a preferred embodiment of the present invention, the stopper pin passes through the inside of the connecting plate and is fitted in the inside of the stopper hole.

As a preferred embodiment of the present invention, the reel sleeve is disposed on the outer surface of the fixing shaft, and is movably connected to the outer surface of the fixing shaft, the left end of the fixing shaft is fixed to the left support plate by a screw, and the right end of the fixing shaft is engaged with the inside of the insertion hole.

Compared with the prior art, the beneficial effects of the utility model are as follows:

the utility model discloses a spout, spacing hole, the slide, the jack, the spacer pin, the combination of fixed axle and reel, when needing to weld after diode frame installs, operating personnel can directly stimulate the solder wire on the reel to place and use the welding ware to weld in diode frame department, the speed of diode when welding has effectively been accelerated, the convenience when having improved diode frame installation, and after the solder wire on the reel used up, operating personnel takes out the spacer pin from the inside in spacing hole earlier, move right backup pad through the slide in the inside of spout right, until the slide breaks away from the fixed plate, then take out the reel from the fixed axle and change into new solder wire, then insert the slide of right backup pad bottom into the inside of spout again, insert the spacer pin into the inside in spacing hole again, the right-hand member of fixed axle inserts the inside of jack simultaneously, the time of the operator when changing the solder wire is saved, and the use of a dismounting tool for dismounting the right support plate is avoided.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a schematic structural view of a fixing plate of a rapid assembling tool for a semiconductor diode frame according to the present invention;

fig. 2 is a cross-sectional view of a fixing plate of the semiconductor diode frame rapid assembling tool of the present invention.

In the figure: the soldering tin soldering device comprises a fixing plate 1, a sliding groove 2, a limiting hole 3, a left supporting plate 4, a right supporting plate 5, a sliding plate 6, a connecting plate 7, a jack 8, a limiting pin 9, a fixing shaft 10, a winding drum 11 and a soldering tin wire 12.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected" and "disposed" are to be construed broadly, and may for example be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. To the ordinary technical personnel in this field, can understand the specific meaning in the utility model of above-mentioned term with the concrete condition, the utility model provides an electrical apparatus's model is the reference only, can be through changing different models electrical apparatus that the function is the same according to the actual use condition.

Referring to fig. 1-2, the present invention provides a technical solution: a semiconductor diode frame rapid assembly tool comprises a fixing plate 1, wherein a sliding groove 2, a limiting hole 3, a left support plate 4 and a right support plate 5 are arranged on the fixing plate 1, the sliding groove 2 is positioned on the right side inside the fixing plate 1, the limiting hole 3 is positioned on the upper surface of the fixing plate 1 and is connected with the right side of the right support plate 5, the left support plate 4 is fixedly connected with the left side of the upper surface of the fixing plate 1 through a screw, the right support plate 5 is connected with the sliding groove 2 through a sliding plate 6, a connecting plate 7 and a jack 8 are arranged on the right surface of the right support plate 5, the connecting plate 7 is fixedly connected with the middle lower part of the right surface of the right support plate 5 through welding, the jack 8 is positioned on the middle upper part inside the right support plate 5, a limiting pin 9 is arranged on the connecting plate 7, and the left support plate 4 is connected, the outer surface of the fixed shaft 10 is provided with a winding drum 11, the outer surface of the winding drum 11 is wound with solder wires 12, in the embodiment, as shown in fig. 1 and fig. 2, through the combination of the chute 2, the limiting hole 3, the sliding plate 6, the jack 8, the limiting pin 9, the fixed shaft 10 and the winding drum 11, when a diode frame needs to be welded after being installed, an operator can directly pull the solder wires 12 on the winding drum 11 to be placed at the diode frame for welding by using a welder, so that the speed of the diode during welding is effectively increased, the convenience of the diode frame during installation is improved, and after the solder wires 12 on the winding drum 11 are used up, the operator firstly pulls out the limiting pin 9 from the limiting hole 3, then moves the right support plate 5 to the right in the chute 2 through the sliding plate 6 until the sliding plate 6 is separated from the fixed plate 1, and then pulls out the winding drum 11 from the fixed shaft 10 to replace new solder, then insert the inside of spout 2 with the slide 6 of right branch fagging 5 bottom again, insert the inside of spacing hole 3 with spacer pin 9 again, the inside of jack 8 is inserted to the right-hand member of fixed axle 10 simultaneously, time when having saved operating personnel and having changed solder wire 12 has avoided using assembly and disassembly tools to carry out the dismouting to right branch fagging 5.

In this embodiment, referring to fig. 2, the sliding plate 6 is embedded in the sliding groove 2 and movably connected to the inside of the sliding groove 2, and the upper end of the sliding groove 2 is communicated with the upper surface of the fixing plate 1, which is effective to improve the flexibility of the sliding plate 6 when moving in the sliding groove 2.

In this embodiment, referring to fig. 2, the lower end of the right supporting plate 5 is fixedly connected to the upper surface of the sliding plate 6 through a screw and movably connected to the upper surface of the fixing plate 1, so that the right supporting plate 5 can effectively move on the upper surface of the fixing plate 1.

In the embodiment, referring to fig. 1, the limiting pin 9 passes through the inside of the connecting plate 7 and is embedded in the limiting hole 3, which is used for effectively and conveniently fixing the right supporting plate.

In this embodiment, referring to fig. 1, the winding drum 11 is sleeved on the outer surface of the fixing shaft 10 and movably connected to the outer surface of the fixing shaft 10, the left end of the fixing shaft 10 is fixedly connected to the left support plate 4 through a screw, and the right end of the fixing shaft 10 is embedded in the insertion hole 8, so that the flexibility of the winding drum 11 and the fixing shaft 10 can be effectively improved.

It should be noted that, the semiconductor diode frame rapid assembly tool of the present invention includes a fixing plate 1, a sliding groove 2, a limiting hole 3, a left support plate 4, a right support plate 5, a sliding plate 6, a connecting plate 7, a jack 8, a limiting pin 9, a fixing shaft 10, a reel 11, a solder wire 12, and other components that are all universal standard components or known by those skilled in the art, and the structure and principle thereof are known by those skilled in the art through technical manuals or conventional experimental methods, and in the idle position of the device, all the electrical components, which refer to power components, electrical components, and adaptive monitoring computers, are connected to a power supply through wires, and the specific connection means should refer to the following working principle in which electrical connections are completed sequentially between the electrical components, and the detailed connection means thereof are known in the art, and the following working principle and process are mainly described, without describing the electrical control, when a semiconductor diode frame rapid assembly tool is used, through the combination of the chute 2, the limiting hole 3, the sliding plate 6, the jack 8, the limiting pin 9, the fixed shaft 10 and the winding drum 11, when the diode frame needs to be welded after being installed, an operator can directly pull the solder wire 12 on the winding drum 11 to be placed at the diode frame for welding by using a welder, so that the speed of the diode during welding is effectively increased, the convenience of the diode frame during installation is improved, and after the solder wire 12 on the winding drum 11 is used up, the operator firstly pulls out the limiting pin 9 from the limiting hole 3, then moves the right support plate 5 to the right in the chute 2 through the sliding plate 6 until the sliding plate 6 is separated from the fixed plate 1, then pulls out the winding drum 11 from the fixed shaft 10 to replace the new solder wire 12, then inserts the sliding plate 6 at the bottom of the right support plate 5 into the chute 2, the limiting pin 9 is inserted into the limiting hole 3, and the right end of the fixing shaft 10 is inserted into the insertion hole 8, so that time for replacing the solder wires 12 by an operator is saved, and the right support plate 5 is prevented from being disassembled and assembled by using an assembling and disassembling tool.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A semiconductor diode frame rapid Assembly instrument, includes fixed plate (1), its characterized in that: the fixing plate (1) is provided with a sliding groove (2), a limiting hole (3), a left supporting plate (4) and a right supporting plate (5), the sliding groove (2) is located on the right side inside the fixing plate (1), the limiting hole (3) is located on the upper surface of the fixing plate (1) and is connected with the right side of the right supporting plate (5), the left supporting plate (4) is fixedly connected with the left side of the upper surface of the fixing plate (1) through a screw, the right supporting plate (5) is connected with the sliding groove (2) through a sliding plate (6), the right surface of the right supporting plate (5) is provided with a connecting plate (7) and a jack (8), the connecting plate (7) is fixedly connected with the middle lower part of the right surface of the right supporting plate (5) through welding, the jack (8) is located on the middle upper part inside the right supporting plate (5), and a limiting pin (9) is arranged on the connecting plate, the left support plate (4) is connected with the right support plate (5) through a fixing shaft (10), a winding drum (11) is arranged on the outer surface of the fixing shaft (10), and a soldering tin wire (12) is wound on the outer surface of the winding drum (11).

2. The tool of claim 1, wherein: the sliding plate (6) is embedded in the sliding chute (2) and movably connected with the inside of the sliding chute (2), and the upper end of the sliding chute (2) is communicated with the upper surface of the fixing plate (1).

3. The tool of claim 1, wherein: the lower end of the right supporting plate (5) is fixedly connected with the upper surface of the sliding plate (6) through a screw and movably connected with the upper surface of the fixing plate (1).

4. The tool of claim 1, wherein: the limiting pin (9) penetrates through the connecting plate (7) and is embedded in the limiting hole (3).

5. The tool of claim 1, wherein: the winding drum (11) is sleeved on the outer surface of the fixing shaft (10) and movably connected with the outer surface of the fixing shaft (10), the left end of the fixing shaft (10) is fixedly connected with the left supporting plate (4) through a screw, and the right end of the fixing shaft (10) is embedded in the insertion hole (8).