CN212541396U - Soft patch type IC card for mobile phone - Google Patents
Soft patch type IC card for mobile phone Download PDFInfo
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- CN212541396U CN212541396U CN202021620569.5U CN202021620569U CN212541396U CN 212541396 U CN212541396 U CN 212541396U CN 202021620569 U CN202021620569 U CN 202021620569U CN 212541396 U CN212541396 U CN 212541396U
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Abstract
The utility model discloses a soft patch type IC card for mobile phone, which comprises a packaging chip card, wherein the inner side of the packaging chip card is provided with a glue layer, and the surface layer of the glue layer is provided with a protection paste; a card base made of ferrite material is arranged in the packaging chip card, and a customized coil and a capacitor are arranged on the card base; the outer side of the packaging chip card is provided with a protective layer; the glue layer is 3M back glue. The utility model discloses more change original card base into the ferrite material, use customized coil and electric capacity on the ferrite surface to improve chip signal strength and response distance, at the practical high strength 3M gum at the ferrite back, thereby make the cell-phone paste the card can be firm fix can not drop easily on the cell-phone, adopt the traffic card chip that accords with the traffic portion standard simultaneously, thereby realize the interconnected intercommunication function of national traffic.
Description
Technical Field
The utility model relates to a smart card technical field specifically is a SMD IC-card of software for cell-phone.
Background
At present, a general IC card structure is formed by combining a chip, a coil and a card base, and due to the particularity of a mobile phone (a back plate is mostly of a metal structure and has signal output), signal interference can be caused to the card, and the existing card has uniform shape and large size.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a SMD IC-card of software for cell-phone to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a soft patch type IC card for a mobile phone comprises a packaging chip card, wherein a glue layer is arranged on the inner side of the packaging chip card, and a protective sticker is arranged on the surface layer of the glue layer.
Preferably, a card base made of ferrite is arranged in the packaging chip card, and a customized coil and a capacitor are arranged on the card base.
Preferably, a protective layer is arranged on the outer side of the packaged chip card.
Preferably, the glue layer is a 3M back glue.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model provides a SMD IC-card of software for cell-phone changes original card base into the ferrite material, uses customization coil and electric capacity on the ferrite surface to improve chip signal strength and inductive distance, at the practical high strength 3M gum at the ferrite back, thereby make the cell-phone paste that the card can be firm fix can not drop easily on the cell-phone, adopt the traffic card chip that accords with the standard of the department of transportation simultaneously, thereby realize the mutual intercommunication function of national traffic.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, the present invention provides an embodiment: a soft patch type IC card for a mobile phone comprises a packaging chip card 1, wherein an adhesive layer 2 is arranged on the inner side of the packaging chip card 1, and a protective sticker 4 is arranged on the surface layer of the adhesive layer.
The packaging chip card 1 is provided with a card base 5 made of ferrite, and the card base is provided with a customized coil and a capacitor.
And a protective layer 3 is arranged on the outer side of the packaging chip card.
The glue layer 2 is 3M back glue.
The embodiment provides a SMD IC-card of software for cell-phone, changes original card base into the ferrite material, uses customized coil and electric capacity on the ferrite surface to improve chip signal strength and inductive distance, practical high strength 3M gum at the ferrite back, thereby make the cell-phone paste the card can be firm fix can not drop easily on the cell-phone, adopt the traffic card chip that accords with the traffic ministry of telecommunication's norm simultaneously, thereby realize national traffic interconnection function.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (4)
1. The utility model provides a SMD IC-card of software for cell-phone, includes encapsulation chip card, its characterized in that: the inner side of the packaged chip card is provided with an adhesive layer, and the surface layer of the adhesive layer is provided with a protective sticker.
2. The soft patch type IC card for mobile phone according to claim 1, wherein: the packaging chip card is internally provided with a card base made of ferrite, and the card base is provided with a customized coil and a capacitor.
3. The soft patch type IC card for mobile phone according to claim 1, wherein: and a protective layer is arranged on the outer side of the packaging chip card.
4. The soft patch type IC card for mobile phone according to claim 1, wherein: the glue layer is 3M back glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021620569.5U CN212541396U (en) | 2020-08-06 | 2020-08-06 | Soft patch type IC card for mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021620569.5U CN212541396U (en) | 2020-08-06 | 2020-08-06 | Soft patch type IC card for mobile phone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212541396U true CN212541396U (en) | 2021-02-12 |
Family
ID=74528507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021620569.5U Active CN212541396U (en) | 2020-08-06 | 2020-08-06 | Soft patch type IC card for mobile phone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212541396U (en) |
-
2020
- 2020-08-06 CN CN202021620569.5U patent/CN212541396U/en active Active
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