CN212541232U - Computer mainframe with dustproof function of high-efficient heat dissipation - Google Patents
Computer mainframe with dustproof function of high-efficient heat dissipation Download PDFInfo
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- CN212541232U CN212541232U CN202021680704.5U CN202021680704U CN212541232U CN 212541232 U CN212541232 U CN 212541232U CN 202021680704 U CN202021680704 U CN 202021680704U CN 212541232 U CN212541232 U CN 212541232U
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Abstract
A computer mainframe box with efficient heat dissipation and dustproof functions comprises a shell, a liquid outlet pipe, a heat dissipation plate, a heat conduction pipe, a liquid return pipe and a cooling liquid conveying assembly; the U-shaped heat-conducting plate is arranged in the shell; the interior of the shell is divided into an installation bin and a cooling bin for installing computer accessories; installing a cooling trigger module in the bin; two ends of the plurality of groups of heat dissipation plates are respectively connected with the inner wall of the cooling bin and the outer end surface of the heat conduction plate; the multiple groups of heat conduction pipes are respectively arranged on the multiple groups of heat dissipation plates, liquid inlet pipe orifices of the multiple groups of heat conduction pipes are connected with one end pipe orifice of the liquid outlet pipe, and liquid outlet pipe orifices of the multiple groups of heat conduction pipes are connected with one end pipe orifice of the liquid return pipe; the pipe orifice at the other end of the liquid return pipe and the pipe orifice at the other end of the liquid outlet pipe are both communicated with the cooling liquid conveying assembly; the cooling liquid conveying assembly is arranged in the cooling bin. The utility model is simple in operation convenient to use, can the efficient dispel the heat to computer accessories in the installation storehouse, computer accessories installs and avoids impurity such as dust to cause the influence to the operation of accessory under sealed environment.
Description
Technical Field
The utility model relates to a computer mainframe technical field especially relates to a computer mainframe with dustproof function of high-efficient heat dissipation.
Background
The computer mainframe is used as one part of computer accessories, and has the main function of placing and fixing the computer accessories to play a role in bearing and protecting; in the running process of a computer, because the running of devices in a main case can generate a large amount of heat, the heat must be radiated, but most of the existing heat radiating devices are that a fan is additionally arranged on one side surface of a memory to exhaust the air of the memory, and because the fan is only arranged on one side surface of the memory in a false mode, only one side surface of the memory is radiated in the air exhausting process, the heat radiating effect on other electrified running accessories in the main case is poor, the main case is enabled to continuously work under the condition of high temperature under the condition of poor heat radiating effect in the main case, and finally the whole circuit in the main case is short-circuited, so that the internal parts are damaged; in addition, small particle impurities such as dust are easily blown into the mainframe box through air draft heat dissipation, and the dust and the like are accumulated on computer accessories in the mainframe box, so that the service performance of the accessories is influenced, and the heat dissipation of the accessories is influenced; therefore, the application provides a computer mainframe with efficient heat dissipation and dust prevention functions.
SUMMERY OF THE UTILITY MODEL
Objects of the invention
For solving the technical problem that exists among the background art, the utility model provides a computer mainframe with dustproof function of high-efficient heat dissipation, the utility model is simple in operation convenient to use can the efficient dispel the heat to computer accessories in the installation storehouse, and computer accessories installs and avoids impurity such as dust to cause the influence to the operation of accessory under sealed environment.
(II) technical scheme
In order to solve the problems, the utility model provides a computer mainframe box with high-efficiency heat dissipation and dust prevention functions, which comprises a shell, a liquid outlet pipe, a heat dissipation plate, a heat conduction pipe, a liquid return pipe, a microcontroller and a cooling liquid conveying assembly;
a heat conducting plate is arranged in the shell; the heat conducting plate is U-shaped, an installation bin for installing computer accessories is defined between the inner end surface of the heat conducting plate and the inner wall of the shell, and a cooling bin is defined between the outer end surface of the heat conducting plate and the inner wall of the shell; two sets of side end faces of the cooling bin, which are far away from each other from the shell, are respectively provided with two ventilation openings;
the mounting bin is provided with a plurality of groups of connecting sockets on the shell, a cooling trigger module used for sensing the temperature in the mounting bin is arranged in the mounting bin, and the mounting bin is provided with a first opening on the shell; the shell is provided with a sealing door for sealing the first opening; the sealed door is provided with an identity recognition module;
the multiple groups of heat dissipation plates are vertically distributed in the cooling bin along the central axis direction of the shell, and two ends of the multiple groups of heat dissipation plates are respectively connected with the inner wall of the cooling bin and the outer end face of the heat conduction plate;
the multiple groups of heat conduction pipes are all positioned in the cooling bin, the multiple groups of heat conduction pipes are respectively arranged on the multiple groups of heat dissipation plates along the length direction of the multiple groups of heat dissipation plates, liquid inlet pipe orifices of the multiple groups of heat conduction pipes are all connected with one end pipe orifice of the liquid outlet pipe, and liquid outlet pipe orifices of the multiple groups of heat conduction pipes are all connected with one end pipe orifice of the liquid return pipe; the pipe orifice at the other end of the liquid return pipe and the pipe orifice at the other end of the liquid outlet pipe are both communicated with a cooling liquid conveying assembly which is used for conveying cooling liquid into the liquid outlet pipe periodically and recovering the cooling liquid flowing into the liquid return pipe under the triggering state of the cooling triggering module; the cooling liquid conveying assembly is arranged in the cooling bin;
microcontroller installs in the storehouse of cooling, and microcontroller communication connection identity identification module and cooling trigger module respectively, and microcontroller's control output connects the control input of coolant liquid conveying component.
Preferably, the distances from the two groups of ventilation openings to the ground plane are the same, and the minimum distance value from the two groups of ventilation openings to the ground plane is smaller than the minimum distance value from the heat-conducting plate to the ground plane.
Preferably, each group of ventilation openings is internally provided with a dust screen.
Preferably, the cooling liquid conveying assembly comprises a cooling liquid box, a first piston, a telescopic device and a sliding rod; the cooling liquid box is connected with the inner wall of the cooling bin;
the first piston is connected with the inner wall of the cooling liquid tank in a sliding manner, the first piston is used for dividing the interior of the cooling liquid tank into a liquid storage bin and a liquid return bin, and a plurality of first through holes used for communicating the liquid storage bin with the liquid return bin are formed in the first piston; a first one-way valve is arranged in each first through hole;
the liquid storage bin is filled with cooling liquid, and a plurality of groups of liquid outlet holes used for connecting pipe orifices at the other ends of a plurality of groups of liquid outlet pipes are arranged on the cooling liquid box of the liquid storage bin; a second one-way valve is arranged in each group of liquid outlet holes; the liquid return bin is provided with a plurality of groups of liquid inlet holes used for connecting pipe orifices at the other ends of a plurality of groups of liquid return pipes on the cooling liquid box; a third one-way valve is arranged in each group of liquid inlet holes; a second through hole is formed in the end face, parallel to the first piston, of the cooling liquid tank of the liquid return bin; a seal sleeve is arranged in the second through hole; one end of the sliding rod is connected with the telescopic end of the telescopic device; the telescopic device is connected with the inner wall of the cooling bin; the other end of the sliding rod penetrates through the sealing sleeve and is connected with the first piston, and the sliding rod is in interference sealing connection with the sealing sleeve.
Preferably, the cooling liquid tank is made of an aluminum alloy material.
Preferably, the device also comprises two groups of splitter plates and a plurality of groups of blowing devices; wherein, the length value of the heat dissipation plate is smaller than the height value of the heat conduction plate;
the two groups of flow distribution plates are provided with a plurality of groups of flow distribution holes, the two groups of flow distribution plates are perpendicular to the plurality of groups of heat dissipation plates, the two groups of flow distribution plates are connected with the heat conduction plate and the inner wall of the cooling bin, and the two groups of flow distribution plates respectively form two groups of air inlet bins with the outer end surface of the heat conduction plate and the inner wall of the cooling bin; each group of air inlet bins are provided with air inlet holes on the shell;
a plurality of groups of air blowing devices are respectively arranged in the two groups of air inlet bins, the plurality of groups of air blowing devices are respectively connected with the microcontroller in a control manner, and the air inlet ends of the plurality of groups of air blowing devices are respectively connected with a plurality of groups of air inlet holes; and a filtering protective net is arranged in each group of air inlet holes.
Preferably, a plurality of groups of partition plates are arranged in the mounting bin; the multiple groups of partition plates are distributed side by side along the height direction of the shell and used for dividing the interior of the installation bin into multiple groups of storage bins.
Preferably, the end face of each group of partition plates is provided with a flexible graphite packing pad.
Preferably, the cooling trigger module comprises a liquid storage cylinder, a second piston, a first electrical contact and a second electrical contact;
the liquid storage cylinder is connected with the inner wall of the mounting bin, and one end of the liquid storage cylinder is provided with a mounting part; the mounting part is provided with a third through hole along the central axis direction thereof for communicating the outside with the inside of the liquid storage cylinder; the second piston is connected with the inner wall of the liquid storage cylinder in a sliding manner, and a liquid storage space for storing the solution which is easy to volatilize at high temperature is defined between the end surface of the second piston, which is far away from the mounting part, and the inner wall of the liquid storage cylinder; the first electric contact is connected with the end face, facing the mounting part, of the second piston; a second electrical contact connecting mounting section; the second electrical contact, the first electrical contact and the microcontroller are electrically connected to form a trigger circuit.
Preferably, the mounting part is in threaded connection with the liquid storage cylinder, and the mounting part is rotatably connected with the second electric contact.
The above technical scheme of the utility model has following profitable technological effect:
in the utility model, when in use, the computer fittings are arranged in the installation bin, the computer fittings are matched and connected with the sockets arranged on the shell, and the installation bin is sealed by using the sealing door, thereby avoiding the influence of external dust impurities and the like entering the installation bin on the operation of the computer fittings; when the computer accessory is electrified and operated, high temperature generated by the computer accessory is conducted to the heat conducting plate; the heat energy on the heat conducting plate is transferred to the plurality of groups of heat dissipation plates and the heat conducting pipes through heat conduction; the cooling bin is communicated with the external environment, and a plurality of groups of heat dissipation plates and heat conduction pipes in the cooling bin dissipate the high temperature on the cooling bin along with the flowing air; when the cooling triggering module in the installation bin is triggered, the microcontroller controls the cooling liquid conveying assembly, the cooling liquid conveying assembly periodically conveys cooling liquid into the liquid outlet pipe, and the cooling liquid flows into the multiple groups of heat conduction pipes to cool the multiple groups of heat conduction pipes in a heat dissipation manner so as to improve the cooling effect on the interior of the installation bin; high-temperature cooling liquid in the multiple groups of heat conduction pipes flows back to the cooling liquid conveying assembly to be cooled and then is reused, so that the use efficiency of the cooling liquid is greatly improved, the cooling liquid is more energy-saving and environment-friendly, and the normal and efficient operation of computer accessories can be ensured, so that the use performance of computer equipment is improved.
Drawings
Fig. 1 is a schematic structural diagram of a computer mainframe with a high-efficient heat dissipation and dust prevention function according to the present invention.
Fig. 2 is a schematic perspective view of a computer mainframe with high-efficient heat dissipation and dust prevention functions according to the present invention.
Fig. 3 is the utility model provides a structural schematic diagram of coolant tank installation in computer mainframe with dustproof function of high-efficient heat dissipation.
Fig. 4 is the utility model provides a cooling trigger module's in computer mainframe with dustproof function of high-efficient heat dissipation structural schematic diagram.
Fig. 5 is a schematic block diagram of a computer mainframe with high-efficient heat dissipation and dust prevention functions provided by the present invention.
Reference numerals: 1. a housing; 2. a sealing door; 3. supporting legs; 4. an identity recognition module; 5. a dust screen; 6. a ventilation opening; 7. a cooling bin; 8. a coolant tank; 9. a first piston; 10. a first through hole; 11. a liquid outlet pipe; 12. a heat dissipation plate; 13. a heat conducting pipe; 14. a liquid return pipe; 15. a flow distribution plate; 16. a blowing device; 17. a first opening; 18. a cooling triggering module; 19. an air inlet hole; 20. a heat conducting plate; 21. a partition plate; 22. a telescoping device; 23. a slide bar; 24. a first check valve; 25. a liquid storage bin; 26. a second one-way valve; 27. a third check valve; 28. a liquid storage cylinder; 29. a second piston; 30. a first electrical contact; 31. a second electrical contact; 32. an installation part; 33. a third through hole; 34. a microcontroller; 35. and a liquid return bin.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in fig. 1-5, the computer mainframe box with high-efficiency heat dissipation and dust prevention functions provided by the present invention comprises a housing 1, a liquid outlet pipe 11, a heat dissipation plate 12, a heat conduction pipe 13, a liquid return pipe 14, a microcontroller 34 and a cooling liquid conveying assembly;
a heat conducting plate 20 is arranged in the shell 1; the heat conducting plate 20 is U-shaped, and an installation bin for installing computer accessories is enclosed between the inner end surface of the heat conducting plate 20 and the inner wall of the shell 1; the computer accessories include a CPU, a motherboard, a hard disk, an optical drive, and the like, which are described in detail in the prior art;
a cooling bin 7 is enclosed between the outer end face of the heat conducting plate 20 and the inner wall of the shell 1; two sets of side end faces of the cooling bin 7, which are far away from each other, of the shell 1 are respectively provided with two ventilation openings 6;
the mounting bin is provided with a plurality of groups of connecting sockets on the shell 1; (ii) a The multiple groups of sockets comprise a power socket, a network cable socket, a USB socket and the like, and the shell 1 is also provided with a power switch;
a cooling trigger module 18 for sensing the temperature in the installation bin is arranged in the installation bin, and a first opening 17 is formed in the shell 1 of the installation bin; the shell 1 is provided with a sealing door 2 for sealing the first opening 17; the identity recognition module 4 is arranged on the sealing door 2; it should be noted that one end of the sealing door 2 is rotatably connected with the housing 1 through a hinge, the other end of the sealing door 2 is connected with the housing 1 through an intelligent lock, after the identity recognition module 4 recognizes the identity information of a user, the intelligent lock opens the sealing door, and the intelligent lock is controlled and connected with the microcontroller 34;
further, a transparent observation window is arranged on the sealing door 2;
a plurality of groups of heat dissipation plates 12 are vertically distributed in the cooling bin 7 along the central axis direction of the shell 1, and two ends of the plurality of groups of heat dissipation plates 12 are respectively connected with the inner wall of the cooling bin 7 and the outer end face of the heat conduction plate 20; wherein, the heat conducting plate 20 and the heat dissipating plate 12 are made of aluminum alloy materials, but not limited thereto;
the multiple groups of heat conduction pipes 13 are all positioned in the cooling bin 7, the multiple groups of heat conduction pipes 13 are respectively installed on the multiple groups of heat dissipation plates 12 along the length direction of the multiple groups of heat dissipation plates 12, liquid inlet pipe orifices of the multiple groups of heat conduction pipes 13 are all connected with one end pipe orifice of the liquid outlet pipe 11, and liquid outlet pipe orifices of the multiple groups of heat conduction pipes 13 are all connected with one end pipe orifice of the liquid return pipe 14; the heat pipe 13 is made of, but not limited to, an aluminum alloy material;
the other end pipe orifice of the liquid return pipe 14 and the other end pipe orifice of the liquid outlet pipe 11 are both communicated with a cooling liquid conveying assembly which is used for periodically conveying cooling liquid into the liquid outlet pipe 11 and simultaneously recovering the cooling liquid flowing into the liquid return pipe 14 in a triggered state of the cooling triggering module 18; the cooling liquid conveying assembly is arranged in the cooling bin 7;
microcontroller 34 is installed in cooling storehouse 7, and microcontroller 34 is the communication connection identity identification module 4 and cooling trigger module 18 respectively, and the control input of microcontroller 34 is connected the control input of coolant liquid conveying component.
In the utility model, when in use, the computer fittings are arranged in the installation bin, the computer fittings are matched and connected with the sockets arranged on the shell 1, and the installation bin is sealed by the sealing door 2, thereby preventing external impurity dust and the like from entering the installation bin, preventing the dust and the like from gathering on the computer fittings to influence the service performance of the computer fittings, and ensuring the high-efficiency operation of the computer fittings; when the computer accessory is electrified and operated, the high temperature generated by the computer accessory is conducted to the heat conducting plate 20; the heat energy on the heat conducting plate 20 is transferred to the plurality of sets of heat dissipation plates 12 and the heat conducting pipes 13 through heat conduction; the cooling bin 7 is communicated with the external environment, and a plurality of groups of heat dissipation plates 12 and heat conduction pipes 13 positioned in the cooling bin 7 dissipate the high temperature air flowing on the cooling bin; when the cooling triggering module 18 in the installation bin is triggered, the microcontroller 34 controls the cooling liquid conveying assembly, the cooling liquid conveying assembly periodically conveys cooling liquid into the liquid outlet pipe 11, and the cooling liquid flows into the multiple groups of heat conduction pipes 13 to cool the multiple groups of heat conduction pipes 13 in a heat dissipation manner, so that the cooling effect on the interior of the installation bin is improved; the high-temperature cooling liquid in the multiple groups of heat conduction pipes 13 flows back to the cooling liquid conveying assembly to be cooled and then is reused, so that the use efficiency of the cooling liquid is greatly improved, the cooling liquid is more energy-saving and environment-friendly, and the normal and efficient operation of computer accessories can be ensured, so that the use performance of computer equipment is improved.
In an optional embodiment, the distances from the two sets of ventilation openings 6 to the ground plane are the same, and the minimum distance value from the two sets of ventilation openings 6 to the ground plane is smaller than the minimum distance value from the heat-conducting plate 20 to the ground plane, so that the two sets of ventilation openings 6 are oppositely arranged, and thus, the outside air can pass through the shell 1 from the two sets of ventilation openings 6 to perform air-cooling heat dissipation on each heat dissipation component inside the cooling bin 7; the coolant delivery assembly is located between the two sets of ventilation openings 6.
In an alternative embodiment, each set of ventilation openings 6 is provided with a dust screen 5, and the dust screen 5 is arranged to prevent external impurities from entering the cooling chamber 7 from the two sets of ventilation openings 6.
In an alternative embodiment, the cooling fluid delivery assembly comprises a cooling fluid tank 8, a first piston 9, a telescopic device 22 and a sliding rod 23; the cooling liquid box 8 is connected with the inner wall of the cooling bin 7;
the first piston 9 is connected with the inner wall of the cooling liquid tank 8 in a sliding manner, the first piston 9 is used for dividing the interior of the cooling liquid tank 8 into a liquid storage bin 25 and a liquid return bin 35, and a plurality of first through holes 10 used for communicating the liquid storage bin 25 with the liquid return bin 35 are formed in the first piston 9; a first one-way valve 24 is arranged in each first through hole 10;
the liquid storage bin 25 is internally provided with cooling liquid, and a plurality of groups of liquid outlet holes used for connecting pipe orifices at the other ends of the plurality of groups of liquid outlet pipes 11 are arranged on the cooling liquid tank 8 of the liquid storage bin 25; a second one-way valve 26 is arranged in each group of liquid outlet holes;
the liquid return bin 35 is provided with a plurality of groups of liquid inlet holes used for connecting pipe orifices at the other ends of the plurality of groups of liquid return pipes 14 on the cooling liquid tank 8; a third one-way valve 27 is arranged in each group of liquid inlet holes;
a second through hole is formed in the liquid return bin 35 on the end face, parallel to the first piston 9, of the cooling liquid tank 8; a seal sleeve is arranged in the second through hole;
one end of the sliding rod 23 is connected with the telescopic end of the telescopic device 22; the telescopic device 22 is connected with the inner wall of the cooling bin 7; the other end of the sliding rod 23 penetrates through the sealing sleeve and is connected with the first piston 9, and the sliding rod 23 is in interference sealing connection with the sealing sleeve;
when the cooling device is used, the telescopic device 22 is controlled to operate to drive the first piston 9 to move in the cooling liquid tank 8 so as to extrude the interior of the liquid storage bin 25, cooling liquid in the liquid storage bin 25 flows into the multiple groups of liquid outlet pipes 11 from the multiple groups of second one-way valves 26 and then enters the multiple groups of heat conduction pipes 13, high-temperature cooling liquid in the multiple groups of heat conduction pipes 13 enters the liquid return pipe 14, and the high-temperature cooling liquid flows into the liquid return bin 35 through the multiple groups of third one-way valves 27, so that liquid flow is formed in the heat conduction pipes 13, the heat conduction pipes 13 and the heat dissipation plate 12 are cooled, heat dissipation is performed on the heat conduction plate 20, high temperature in the installation bin is dissipated, and the service performance of each electric component in; the expansion device 22 drives the first piston 9 to retract, so that the cooling liquid in the liquid return bin 35 flows into the liquid storage bin 25 through the first one-way valve 24.
In an alternative embodiment, the cooling liquid tank 8 is made of an aluminum alloy material, and the cooling liquid tank 8 made of the aluminum alloy material has good heat conductivity.
In an alternative embodiment, the device further comprises a two-component flow plate 15 and a plurality of groups of blowing devices 16; wherein, the length value of the heat dissipation plate 12 is smaller than the height value of the heat conduction plate 20;
the two sets of flow plates 15 are provided with a plurality of sets of flow holes, the two sets of flow plates 15 are perpendicular to the plurality of sets of heat dissipation plates 12, the two sets of flow plates 15 are connected with the heat conduction plate 20 and the inner wall of the cooling bin 7, and the two sets of flow plates 15 respectively form two sets of air inlet bins with the outer end surface of the heat conduction plate 20 and the inner wall of the cooling bin 7; each group of air inlet bins are provided with air inlet holes 19 on the shell 1;
the multiple groups of blowing devices 16 are respectively arranged in the two groups of air inlet bins, the multiple groups of blowing devices 16 are respectively connected with the microcontroller 34 in a control mode, and the air inlet ends of the multiple groups of blowing devices 16 are respectively connected with the multiple groups of air inlet holes 19; a filtering protective net is arranged in each group of the air inlet holes 19;
the operation of the multiple groups of blowing devices 16 is to blow the outside air into the cooling bin 7 after filtering so as to dissipate heat of all heat dissipation components in the cooling bin 7, thereby accelerating the heat dissipation effect in the cooling bin 7 and further improving the heat dissipation effect in the installation bin.
In an alternative embodiment, a plurality of groups of partition plates 21 are arranged in the mounting bin; the plurality of groups of partition boards 21 are distributed side by side along the height direction of the shell 1 and are used for dividing the interior of the installation bin into a plurality of groups of storage bins.
In an alternative embodiment, the end face of each set of partition plates 21 is provided with a flexible graphite packing having excellent elasticity and thermal conductivity.
In an alternative embodiment, the cool down trigger module 18 includes a reservoir 28, a second piston 29, a first electrical contact 30, and a second electrical contact 31;
the liquid storage cylinder 28 is connected with the inner wall of the mounting bin, and one end of the liquid storage cylinder 28 is provided with a mounting part 32; the mounting portion 32 is provided with a third through hole 33 along the central axial direction thereof for communicating the outside with the interior of the liquid storage cylinder 28; the second piston 29 is connected with the inner wall of the liquid storage cylinder 28 in a sliding manner, and a liquid storage space for storing high-temperature volatile solution is defined between the end surface of the second piston 29, which is far away from the mounting part 32, and the inner wall of the liquid storage cylinder 28; the first electrical contact 30 connects the end face of the second piston 29 facing the mounting portion 32; the second electrical contact 31 is connected to the mounting portion 32; the second electrical contact 31, the first electrical contact 30 and the microcontroller 34 are electrically connected to form a trigger circuit, and the microcontroller controls the operation of the cooling fluid delivery assembly.
In an alternative embodiment, the mounting portion 32 is threadably coupled to the cartridge 28 to facilitate coupling of the mounting portion 32 to the cartridge 28, and the mounting portion 32 is rotatably coupled to the second electrical contact 31.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (10)
1. A computer mainframe box with efficient heat dissipation and dust prevention functions is characterized by comprising a shell (1), a liquid outlet pipe (11), a heat dissipation plate (12), a heat conduction pipe (13), a liquid return pipe (14), a microcontroller (34) and a cooling liquid conveying assembly;
a heat conducting plate (20) is arranged in the shell (1); the heat conducting plate (20) is U-shaped, an installation bin for installing computer accessories is defined between the inner end surface of the heat conducting plate (20) and the inner wall of the shell (1), and a cooling bin (7) is defined between the outer end surface of the heat conducting plate (20) and the inner wall of the shell (1); two sets of side end faces of the cooling bin (7), which are far away from each other, of the shell (1) are respectively provided with two ventilation openings (6);
a plurality of groups of connecting sockets are arranged on the shell (1) of the mounting bin, a cooling trigger module (18) used for sensing the temperature in the mounting bin is arranged in the mounting bin, and a first opening (17) is arranged on the shell (1) of the mounting bin; a sealing door (2) for sealing the first opening (17) is arranged on the shell (1); an identity recognition module (4) is arranged on the sealing door;
a plurality of groups of heat dissipation plates (12) are vertically distributed in the cooling bin (7) along the central axis direction of the shell (1), and two ends of the plurality of groups of heat dissipation plates (12) are respectively connected with the inner wall of the cooling bin (7) and the outer end face of the heat conduction plate (20);
multiple groups of heat conduction pipes (13) are positioned in the cooling bin (7), the multiple groups of heat conduction pipes (13) are respectively installed on the multiple groups of heat dissipation plates (12) along the length direction of the multiple groups of heat dissipation plates (12), liquid inlet pipe orifices of the multiple groups of heat conduction pipes (13) are connected with one end pipe orifice of the liquid outlet pipe (11), and liquid outlet pipe orifices of the multiple groups of heat conduction pipes (13) are connected with one end pipe orifice of the liquid return pipe (14); the other end pipe orifice of the liquid return pipe (14) and the other end pipe orifice of the liquid outlet pipe (11) are communicated with a cooling liquid conveying assembly which is used for periodically conveying cooling liquid into the liquid outlet pipe (11) and simultaneously recovering the cooling liquid flowing into the liquid return pipe (14) in the state of being triggered by the cooling triggering module (18); the cooling liquid conveying assembly is arranged in the cooling bin (7);
microcontroller (34) are installed in cooling storehouse (7), and microcontroller (34) communication connection identity identification module (4) and cooling trigger module (18) respectively, and the control input of control output of microcontroller (34) connection coolant liquid conveying component.
2. The computer case with high-efficiency heat-dissipation and dust-prevention functions as claimed in claim 1, wherein the distances from the ground plane to the two sets of ventilation openings (6) are the same, and the minimum distance value from the ground plane to the two sets of ventilation openings (6) is smaller than the minimum distance value from the heat-conducting plate (20) to the ground plane.
3. The computer mainframe box with high-efficiency heat-dissipation and dust-prevention functions as claimed in claim 2, wherein a dust-prevention screen (5) is arranged in each set of ventilation openings (6).
4. The computer mainframe box with high-efficiency heat-dissipation and dust-prevention functions as claimed in claim 1, wherein the cooling liquid conveying assembly comprises a cooling liquid box (8), a first piston (9), a telescopic device (22) and a slide rod (23); the cooling liquid box (8) is connected with the inner wall of the cooling bin (7);
the first piston (9) is connected with the inner wall of the cooling liquid tank (8) in a sliding mode, the first piston (9) is used for dividing the interior of the cooling liquid tank (8) into a liquid storage bin (25) and a liquid return bin (35), and a plurality of first through holes (10) used for communicating the liquid storage bin (25) with the liquid return bin (35) are formed in the first piston (9); a first one-way valve (24) is arranged in each first through hole (10);
the liquid storage bin (25) is internally provided with cooling liquid, and a plurality of groups of liquid outlet holes used for connecting pipe orifices at the other ends of a plurality of groups of liquid outlet pipes (11) are arranged on the cooling liquid box (8) of the liquid storage bin (25); a second one-way valve (26) is arranged in each group of liquid outlet holes; a plurality of groups of liquid inlet holes used for connecting pipe orifices at the other ends of a plurality of groups of liquid return pipes (14) are arranged on the cooling liquid box (8) of the liquid return bin (35); a third one-way valve (27) is arranged in each group of liquid inlet holes; a second through hole is formed in the liquid return bin (35) on the end face, parallel to the first piston (9), of the cooling liquid tank (8); a seal sleeve is arranged in the second through hole; one end of the sliding rod (23) is connected with the telescopic end of the telescopic device (22); the telescopic device (22) is connected with the inner wall of the cooling bin (7); the other end of the sliding rod (23) penetrates through the sealing sleeve and is connected with the first piston (9), and the sliding rod (23) is in interference sealing connection with the sealing sleeve.
5. The computer mainframe box with efficient heat dissipation and dust prevention functions as claimed in claim 4, wherein the cooling liquid box (8) is made of an aluminum alloy material.
6. The computer mainframe box with high-efficiency heat-dissipation and dust-prevention functions as claimed in claim 1, further comprising two sets of splitter plates (15) and a plurality of sets of blowing devices (16); wherein, the length value of the heat dissipation plate (12) is smaller than the height value of the heat conduction plate (20);
the two groups of flow distribution plates (15) are provided with multi-component flow holes, the two groups of flow distribution plates (15) are perpendicular to the multiple groups of heat dissipation plates (12), the two groups of flow distribution plates (15) are connected with the inner walls of the heat conduction plate (20) and the cooling bin (7), and the two groups of flow distribution plates (15) form two groups of air inlet bins with the outer end face of the heat conduction plate (20) and the inner wall of the cooling bin (7) respectively; each group of air inlet bins are provided with air inlet holes (19) on the shell (1);
a plurality of groups of blast devices (16) are respectively arranged in the two groups of air inlet bins, the plurality of groups of blast devices (16) are respectively connected with the microcontroller (34) in a control way, and the air inlet ends of the plurality of groups of blast devices (16) are respectively connected with a plurality of groups of air inlet holes (19); and a filtering protective net is arranged in each group of the air inlet holes (19).
7. The computer mainframe box with high-efficiency heat-dissipation and dust-prevention functions as claimed in claim 1, wherein a plurality of groups of partition plates (21) are arranged in the mounting bin; the multiple groups of partition plates (21) are distributed side by side along the height direction of the shell (1) and are used for dividing the interior of the installation bin into multiple groups of storage bins.
8. The computer mainframe box with high-efficiency heat-dissipation and dust-prevention functions as claimed in claim 7, wherein flexible graphite packing pads are arranged on the end faces of each group of partition plates (21).
9. The computer main case with the efficient heat dissipation and dust prevention functions as claimed in claim 1, wherein the cooling trigger module (18) comprises a liquid storage cylinder (28), a second piston (29), a first electrical contact (30) and a second electrical contact (31);
the liquid storage cylinder (28) is connected with the inner wall of the mounting bin, and one end of the liquid storage cylinder (28) is provided with a mounting part (32); the mounting part (32) is provided with a third through hole (33) along the central axial direction thereof for communicating the outside with the inside of the liquid storage cylinder (28); the second piston (29) is connected with the inner wall of the liquid storage cylinder (28) in a sliding manner, and a liquid storage space for storing high-temperature volatile solution is defined between the end surface of the second piston (29) far away from the mounting part (32) and the inner wall of the liquid storage cylinder (28); the first electric contact (30) is connected with the end surface of the second piston (29) facing the mounting part (32); the second electrical contact (31) is connected with the mounting part (32); the second electrical contact (31), the first electrical contact (30) and the microcontroller (34) are electrically connected for forming a trigger circuit.
10. The computer mainframe box with efficient heat dissipation and dust prevention functions as claimed in claim 9, wherein the mounting portion (32) is screwed to the liquid storage cylinder (28), and the mounting portion (32) is rotatably connected to the second electrical contact (31).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021680704.5U CN212541232U (en) | 2020-08-13 | 2020-08-13 | Computer mainframe with dustproof function of high-efficient heat dissipation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021680704.5U CN212541232U (en) | 2020-08-13 | 2020-08-13 | Computer mainframe with dustproof function of high-efficient heat dissipation |
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| CN212541232U true CN212541232U (en) | 2021-02-12 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022027751A1 (en) * | 2020-08-05 | 2022-02-10 | 国为(南京)软件科技有限公司 | Big-data server case |
| CN115176581A (en) * | 2022-08-08 | 2022-10-14 | 江苏大学 | Hot air cleaning device and heat dissipation prevention system for rice and wheat oil combine harvester |
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2020
- 2020-08-13 CN CN202021680704.5U patent/CN212541232U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022027751A1 (en) * | 2020-08-05 | 2022-02-10 | 国为(南京)软件科技有限公司 | Big-data server case |
| CN115176581A (en) * | 2022-08-08 | 2022-10-14 | 江苏大学 | Hot air cleaning device and heat dissipation prevention system for rice and wheat oil combine harvester |
| CN115176581B (en) * | 2022-08-08 | 2023-12-01 | 江苏大学 | Hot air cleaning device and heat radiation prevention system for rice and wheat oil combine harvester |
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