CN212519869U

CN212519869U - Printed circuit board positioning device and SMT production equipment with same

Info

Publication number: CN212519869U
Application number: CN202021646923.1U
Authority: CN
Inventors: 王生康
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2020-08-10
Filing date: 2020-08-10
Publication date: 2021-02-09
Anticipated expiration: 2030-08-10

Abstract

The application discloses printed circuit board positioner and have its SMT production facility, printed circuit board positioner includes: the carrier is provided with at least two bearing parts, and the bearing parts are used for bearing the printed circuit board; the base is arranged below the carrier and detachably arranged with the carrier, the base comprises at least two first positioning pieces corresponding to the at least two bearing parts, and the first positioning pieces are used for positioning the printed circuit board borne by the bearing parts. The application provides a printed circuit board positioner and have its SMT production facility can eliminate the deviation volume that interval between the printed circuit board that the carrier bore among the prior art has position error to form because of the pilot pin, guarantees the relative position between the printed circuit board that bears on the carrier, has improved SMT production facility to printed circuit board's tin cream printing precision, and then has improved SMT production facility's yield.

Description

Printed circuit board positioning device and SMT production equipment with same

Technical Field

The utility model relates to a surface mounting field, concretely relates to SMT processing equipment technical field especially relates to printed circuit board positioner and have its SMT production facility.

Background

The mobile phone comprises a plurality of PCB boards, wherein the PCB boards comprise a PCB main board and more than one PCB auxiliary board, the PCB boards are processed by an SMT (Surface Mounted Technology) Technology to mount components, and the SMT Technology is implemented by an SMT production line. Every SMT production line generally need dispose several hundred carriers, and every carrier all is used for bearing a PCB board, and SMT production line carries out SMT technology processing such as solder paste printing, components and parts dress to the PCB board that bears on the carrier.

In order to improve the processing efficiency of the SMT production line, the number of the PCB loaded on each carrier can be increased. However, when each carrier carries at least two PCB boards, since a certain position error exists in the relative set position of the positioning pins on most carriers during production, it is difficult to ensure the relative position between the PCB boards, and further the yield of the SMT production line is reduced.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a printed circuit board positioning device and an SMT production apparatus having the same.

In a first aspect, the present application provides a printed circuit board positioning device, comprising:

the carrier is provided with at least two bearing parts, and the bearing parts are used for bearing the printed circuit board;

the base is arranged below the carrier and detachably arranged with the carrier, the base comprises at least two first positioning pieces corresponding to the at least two bearing parts, and the first positioning pieces are used for positioning the printed circuit board borne by the bearing parts.

Further, the first positioning piece comprises a first positioning bulge, and the first positioning bulge is matched with the first positioning hole in the printed circuit board in a positioning mode.

Furthermore, the bottom surface of the bearing part is provided with an avoiding through hole part penetrating through the carrier, and the avoiding through hole part is used for allowing the first positioning piece to pass through.

Further, the shapes of the printed circuit boards carried by the at least two carrying parts are different.

Furthermore, a second positioning piece is further arranged on the base, the carrier is provided with a matching piece, and the second positioning piece and the matching piece are detachably matched in a positioning mode.

Furthermore, the second positioning piece is a second positioning bulge, and the matching piece is a second positioning hole; or the second positioning piece is a second positioning hole, and the matching piece is a second positioning bulge.

Furthermore, the first positioning piece and the second positioning piece are arranged on the top surface of the base.

Further, the second positioning part is positioned on the periphery of the first positioning part.

Furthermore, after the printed circuit board carried by the carrying part is positioned by the first positioning piece, the carrying part is fixedly connected with the printed circuit board carried by the carrying part through an adhesive tape.

In a second aspect, the present application further provides an SMT production apparatus, including the above-mentioned printed circuit board positioning device.

The utility model provides a printed circuit board positioner and have its SMT production facility, be provided with at least two supporting parts that are used for bearing the weight of printed circuit board through every carrier, the base is provided with two at least first locating pieces that set up with two at least supporting part one-to-ones, the base sets up in the below of carrier and fixes a position the printed circuit board that the supporting part bore through first locating piece, the deviation volume that interval between the printed circuit board that the carrier bore among the prior art has formed because of the position error of pilot pin has been eliminated, guarantee the relative position between the printed circuit board that bears on the carrier, SMT production facility has improved the tin cream printing precision to printed circuit board, and then SMT production facility's yield has been improved.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

fig. 1 is a schematic structural diagram of a base according to an embodiment of the present disclosure;

FIG. 2 is a top view of the structure shown in FIG. 1;

fig. 3 is a schematic structural diagram of a carrier according to an embodiment of the present disclosure;

fig. 4 is a schematic usage diagram of a printed circuit board positioning device according to an embodiment of the present application.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not limiting of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

Referring to fig. 1 to 4, an embodiment of the present application provides a printed circuit board positioning apparatus, including:

the carrier 200, the carrier 200 has at least two bearing parts 210, the bearing part 210 is used for bearing the printed circuit board 300;

the base 100 is disposed under the carrier 200 and detachably disposed with the carrier 200, the base 100 includes at least two first positioning elements 110 corresponding to the at least two carrying portions 210, and the first positioning elements 110 are used for positioning the printed circuit board 300 carried by the carrying portions 210.

In the present embodiment, the positioning device includes carriers 200, and the number of the carriers 200 may be more than one. Each carrier 200 is provided with at least two carrying parts 210, and the printed circuit board 300 is carried by the carrying parts 210. At least two carrying portions 210 on the carrier 200 are located on the same side of the carrier 200. The positioning device is provided with at least two first positioning elements 110, the at least two first positioning elements 110 are arranged corresponding to the at least two carrying parts 210 on the carrier 200 one by one, and the first positioning elements 110 can position the printed circuit board 300 carried by the carrying parts 210. The base 100 can cooperate with each carrier 200 to position the pcb 300 carried on each carrier 200. The process of the base 100 and each carrier 200 matching may be: the current carrier 200 is placed above the base 100, and the first positioning element 110 positions the printed circuit board 300 carried by the current carrier 200. After the circuit board carried by the current carrier 200 is positioned, the base 100 and the current carrier 200 are separated, and then the next carrier 200 is placed on the base 100, and the process is repeated.

In the embodiment, the first positioning element 110 on the base 100 is used to position the pcb 300 supported by the supporting portion 210 on each carrier 200, so as to eliminate the deviation of the distance between the pcbs 300 supported by the carriers 200 due to the position error of the positioning pin in the prior art, ensure the relative position between the pcbs 300 supported by the carriers 200, improve the solder paste printing precision of the SMT production equipment on the pcb 300, and further improve the yield of the SMT production equipment. Meanwhile, since the carrier 200 can bear more than two printed circuit boards 300, the SMT production equipment can process more than two circuit printing boards on the carrier 200, and the processing efficiency of the SMT production equipment is improved. In addition, since the carrier 200 is not processed with a positioning pin for positioning with the pcb 300, the processing requirement of the carrier 200 is reduced, and the versatility of the carrier 200 is improved.

The number of the pcbs 300 carried on the carrier 200 may be two or more, and the pcbs 300 carried on the carrier 200 may have the same or different shapes, so as to improve the practicability of the carrier 200. The types of the PCB 300 carried on the carrier 200 may be a PCB main board or a PCB sub-board, or a combination of the PCB main board and the PCB sub-board. The position states of the two or more printed circuit boards 300 on the carrier 210 may be both forward (i.e. the top surface of the printed circuit board 300 is located above the bot surface) or reverse (i.e. the top surface of the printed circuit board 300 is located below the bot surface), or a combination of forward and reverse. For example: two PCB sub-boards can be loaded on the carrier 200, and the two PCB sub-boards are loaded on the carrier 200 in the forward and reverse positions respectively.

The supporting portion 210 may be a receiving groove for receiving the printed circuit board 300. A certain mounting gap is formed between the accommodating groove and the printed circuit board 300 for fine adjustment of the position of the printed circuit board 300 in the accommodating groove.

In some embodiments of the present application, the first positioning member 110 includes a first positioning protrusion 111, and the first positioning protrusion 111 is in positioning fit with a first positioning hole on the printed circuit board 300. With such an arrangement, not only the positioning structure between the base 100 and the printed circuit board 300 is simple and easy to operate, but also the influence of the positioning protrusion formed on the printed circuit board 300 on the use of the printed circuit board 300 can be avoided.

The first positioning protrusion 111 is, for example but not limited to, a needle shape, a column shape, etc., and the first positioning hole may be a blind hole or a through hole structure. The number of the first positioning protrusions 111 may be more than one, and the number of the first positioning holes matches the number of the first positioning protrusions 111. Based on the structure shown in fig. 1-2 and 4, the first positioning element 110 has four first positioning protrusions 111 (shown in the dashed line in fig. 2) arranged in a rectangular array, and the printed circuit board 300 is correspondingly provided with four first positioning holes (not shown in the drawings) arranged in a rectangular array.

The assembly gap between the first positioning protrusion 111 and the first positioning hole should be as small as possible to improve the positioning accuracy of the first positioning member 110 on the printed circuit board 300 while ensuring the separability therebetween. For example, the assembly gap is not greater than 0.025mm, so that the position deviation of the spacing between the adjacent printed circuit boards 300 on the carrier 200 is not greater than 0.05mm, and can be controlled to be even less than 0.04 mm.

Of course, in other embodiments, the first positioning member 110 is not limited to a positioning protrusion structure, for example, the first positioning member 110 may also be a positioning slot or the like to position the printed circuit board 300 therein.

In some embodiments of the present application, the bottom surface of the bearing portion 210 is provided with an avoiding through hole 220 portion penetrating through the carrier 200, and the avoiding through hole 220 portion is used for the first positioning member 110 to pass through.

In the present embodiment, when the carrier 200 is placed on the base 100, the first positioning element 110 can be at least transmitted to the carrying portion 210 through the avoiding through hole 220 to position the circuit printing plate located on the carrying portion 210.

When the first positioning member 110 is the first positioning protrusion 111, the number of the avoiding through holes 220 in the avoiding through hole 220 portion may match the number of the first positioning protrusion 111. Based on the structure shown in fig. 1-4, the first positioning element 110 includes four first positioning protrusions 111 arranged in a rectangular array, and four avoidance through holes 220 arranged in a rectangular array are correspondingly disposed on the carrier 200.

The first positioning protrusion 111 and the corresponding avoiding through hole 220 are in clearance fit to realize the separation between the two. For example, a fitting gap is formed between the first positioning protrusion 111 and the corresponding escape through hole 220, and the fitting gap may preferably be 0.15 mm.

Of course, in other embodiments, more than two first positioning protrusions 111 may share one escape through hole 220.

In some embodiments of the present application, the base 100 is further provided with a second positioning element, the carrier 200 is provided with a mating element, and the second positioning element and the mating element are detachably positioned and mated with each other.

In the present embodiment, the second positioning element on the base 100 and each carrier 200 are separately positioned and matched, so that the base 100 can position each carrier 200 respectively. So set up, because the interval of first setting element 110 and second setting element on base 100 is fixed, fix a position printed circuit board 300 and fix a position carrier 200 through the second setting element through first setting element 110, can ensure on every carrier 200 printed circuit board 300 and carrier 200 between relative, reduce SMT production equipment to the position control volume of carrier 200 or the position control volume of tin cream print template, and then improve SMT production equipment's machining efficiency, still fix a position carrier 200 through the second setting element simultaneously in order to reduce carrier 200 the crowded collision to first setting element 110 in the use, and then form the protection to first setting element 110.

The second positioning element can be detachably positioned and matched with the matching element, so that the second positioning element and the carrier 200 can be detachably positioned.

Further, the second positioning element is a second positioning protrusion 120, and the mating element is a second positioning hole 230; alternatively, the second positioning member is a second positioning hole 230, and the mating member is a second positioning protrusion 120. Thus, the positioning structure between the base 100 and the carrier 200 is simple and easy to operate.

Preferably, the second positioning element is the second positioning protrusion 120, and the mating element is the second positioning hole 230, so that the carriers 200 can be stacked and stored conveniently, and the storage space of the carriers 200 is reduced.

The second positioning protrusion 120 may be needle-shaped, column-shaped, etc., and the second positioning hole 230 may be a through hole or a blind hole. The number of the second positioning protrusions 120 may be more than one, and the number of the mating members matches with the number of the second positioning protrusions 120. When the number of the second positioning projections 120 is two or more, the positioning accuracy between the two can be increased. Based on the structure shown in fig. 1-4, the second positioning element includes four second positioning protrusions 120 arranged in a rectangular array, and the mating element corresponds to four second positioning holes 230 arranged in a rectangular array.

In some embodiments of the present application, the first positioning element 110 and the second positioning element are disposed on the top surface of the base 100. By the arrangement, the structure of the positioning device can be simplified, so that the production difficulty of the positioning device is reduced.

In some embodiments of the present application, the second positioning member is located at the outer periphery of the first positioning member 110. With such an arrangement, the second positioning element can be prevented from interfering with the printed circuit board 300 when the first positioning element 110 positions the printed circuit board 300.

In some embodiments, after the printed circuit board 300 carried by the carrying part 210 is positioned by the first positioning member 110, the carrying part 210 and the printed circuit board 300 carried thereby are fixedly connected by an adhesive tape. With such an arrangement, the position of the pcb 300 can be fixed with the carrier 200 after being positioned by the first positioning member 110, so as to prevent relative movement between the pcb 300 and the carrier 200 during and after separation of the carrier 200 from the base 100, thereby ensuring yield of SMT production equipment.

The fixed connection between the carrying part 210 and the pcb 300 carried by the carrying part is adhesive tape bonding, which is not only low in cost, but also easy to bond and tear.

In an embodiment of the pcb positioning apparatus, the pcb positioning apparatus operates as follows:

placing the positioning device on a working platform such as a desktop;

placing the current carrier on the base 100 and positioning between the current carrier 200 and the positioning device, wherein the second positioning protrusion 120 on the positioning device is in positioning fit with the second positioning hole 230 on the carrier 200, and the first positioning protrusion 111 on the positioning device passes through the avoiding through hole 220 of the current carrier 200;

placing the printed circuit board 300 on the bearing part 210 of the current carrier 200 and positioning between the base 100 and the printed circuit board 300, wherein the first positioning hole on the printed circuit board 300 is in positioning fit with the first positioning protrusion 111 on the positioning device;

fixedly bonding the current carrier 200 and the printed circuit board 300 carried by the current carrier by using an adhesive tape;

separating the positioning device from the current carrier 200;

and sequentially circulating until the printed circuit boards 300 to be processed are all fixed on the carrier 200.

The embodiment of the application also provides SMT production equipment, which comprises a printed circuit board positioning device.

The SMT production equipment is provided with a solder paste printing template, the solder paste printing template is provided with at least two printing layouts for performing solder paste printing on at least two printed circuit boards 300 borne by the carrier 200, and the distance between the adjacent layouts is preset and fixed. The SMT production apparatus may adjust the position of the carrier 200 or adjust the position of the solder paste printing stencil so that the solder paste printing stencil is opposite to the printed circuit board 300 supported by the carrier 200, thereby improving the solder paste printing accuracy.

It will be understood that any reference to the above orientation or positional relationship as indicated by the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc., is intended to be based on the orientation or positional relationship shown in the drawings and is for convenience in describing and simplifying the invention, and does not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be considered as limiting. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be understood by those skilled in the art that the scope of the present invention is not limited to the specific combination of the above-mentioned features, but also covers other embodiments formed by any combination of the above-mentioned features or their equivalents without departing from the spirit of the present invention. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims

1. A printed circuit board positioning device, comprising:

the base is arranged below the carrier and can be detachably arranged with the carrier, the base comprises at least two first positioning pieces corresponding to the at least two bearing parts, and the first positioning pieces are used for positioning the printed circuit board borne by the bearing parts.

2. The printed circuit board positioning device of claim 1, wherein the first positioning member comprises a first positioning protrusion, and the first positioning protrusion is positioned and matched with a first positioning hole on the printed circuit board.

3. The printed circuit board positioning device according to claim 1, wherein the bottom surface of the carrying portion is provided with an avoiding through hole portion penetrating through the carrier, and the avoiding through hole portion is used for the first positioning member to pass through.

4. The printed circuit board positioning device of claim 1, wherein the shapes of the printed circuit boards carried by the at least two carrying parts are different.

5. The apparatus as claimed in claim 1, wherein the base further comprises a second positioning member, the carrier comprises a mating member, and the second positioning member is detachably positioned and mated with the mating member.

6. The printed circuit board positioning device of claim 5, wherein the second positioning member is a second positioning protrusion, and the mating member is a second positioning hole; or, the second positioning piece is a second positioning hole, and the matching piece is a second positioning bulge.

7. The apparatus as claimed in claim 5, wherein the first positioning member and the second positioning member are disposed on the top surface of the base.

8. The printed circuit board positioning device of claim 5, wherein the second positioning member is located at an outer periphery of the first positioning member.

9. The printed circuit board positioning device according to any one of claims 1 to 8, wherein after the printed circuit board carried by the carrying part is positioned by the first positioning member, the carrying part and the printed circuit board carried thereby are fixedly connected by an adhesive tape.

10. An SMT production apparatus, comprising a printed circuit board positioning device according to any of claims 1-9.