CN212517150U - UV protection film of fixed use of semiconductor cutting - Google Patents

UV protection film of fixed use of semiconductor cutting Download PDF

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Publication number
CN212517150U
CN212517150U CN202021382049.5U CN202021382049U CN212517150U CN 212517150 U CN212517150 U CN 212517150U CN 202021382049 U CN202021382049 U CN 202021382049U CN 212517150 U CN212517150 U CN 212517150U
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China
Prior art keywords
film
rotating shaft
semiconductor
shell
protection film
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CN202021382049.5U
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Chinese (zh)
Inventor
卢荣贵
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Nantong Weiteng Semiconductor Technology Co ltd
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Dongguan Weiteng Semiconductor Technology Co ltd
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Publication of CN212517150U publication Critical patent/CN212517150U/en
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Abstract

The utility model discloses a UV protection film for fixing use in semiconductor cutting, which comprises an outer packaging mechanism and a protection film body, wherein the protection film body is arranged inside the outer packaging mechanism, the basement membrane is a component made of EVA plastic coating UV coating material, the semiconductor part is attached through the basement membrane, the EVA plastic has strong toughness and soft texture, when the protection film is attached, the semiconductor surface is not easy to be damaged, because of the soft texture, the semiconductor part can be better attached, through the protection of the shell, the contact between the UV film and visible light is reduced, so as to ensure the best use state, a first rotating shaft and a second rotating shaft are convenient for the UV film to extend and attach from a receiving port, a spline connection is formed between the connecting groove and the connecting piece, the first rotating shaft and the second rotating shaft inside can not slide, the shell is connected with the second rotating shaft through the connecting piece, when the UV film is extended and attached, the inside keeps rotating the operation, avoids appearing the UV membrane and appears parallel displacement card dead phenomenon in inside.

Description

UV protection film of fixed use of semiconductor cutting
Technical Field
The utility model relates to a UV protection film technical field specifically is a UV protection film of fixed use of semiconductor cutting.
Background
The UV film is prepared by coating a special formula coating on the surface of a PET, P0, PVC or EVA film substrate to achieve the effect of blocking ultraviolet light and short-wavelength visible light, is suitable for optical etching process or industries needing UV isolation in the process, such as semiconductor industry, electronic industry and the like, and avoids the poor product quality caused by improper light leakage.
Present UV protection film is generally made for giving first place to a PVC material, and the texture is comparatively hard, though can be fine through the UV coating and carry out attachedly with semiconductor part, nevertheless because harder texture, cause the damage to semiconductor part's surface easily, the attached problem of also being convenient for extend when using.
For solving the UV protection film and generally being a PVC material and making for giving first place to, the texture is comparatively hard, though can be fine through the UV coating and carry out attached with the semi-conductive part, nevertheless because harder texture causes the damage to the surface of semi-conductive part easily, the attached problem of also being convenient for extend when using. Therefore, a UV protective film for fixing the semiconductor cutting is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a UV protection film of fixed use of semiconductor cutting to having solved among the prior art UV protection film and generally having made for the owner for a PVC material, the texture is comparatively hard, though can be fine through the UV coating carry on attachingly with the semiconductor part, nevertheless because harder texture, cause the damage to the surface of semiconductor part easily, also be convenient for extend attached problem when using.
In order to achieve the above object, the utility model provides a following technical scheme: the UV protective film fixedly used for semiconductor cutting comprises an outer packaging mechanism and a protective film body, wherein the protective film body is arranged inside the outer packaging mechanism, the outer packaging mechanism comprises a shell, connecting pieces and a cashier opening, the protective film body is arranged inside the shell, the connecting pieces are arranged on two sides of the inner wall of the shell, and the cashier opening is formed in the periphery of the shell;
the protection film body includes UV membrane and rotation piece, the periphery at rotation piece is twined and parcel to UV membrane.
Preferably, the UV film includes an upper mold, an adhesive layer, and a base film, and the upper mold is adhered to the base film by the adhesive layer.
Preferably, the upper die is a component made of a PVC plastic coating UV coating material, the bonding layer is a component made of a UV adhesive material, and the bottom film is a component made of an EVA plastic coating UV coating material.
Preferably, the rotating part comprises a first rotating shaft and a second rotating shaft, the periphery of the first rotating shaft is wound and wrapped with a UV film, and the inner wall of the first rotating shaft is attached to the second rotating shaft.
Preferably, two ends of the inner wall of the second rotating shaft are provided with four connecting grooves.
Preferably, the connecting groove and the connecting piece form a spline connection.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model provides a pair of UV protection film of fixed use of semiconductor cutting includes mould, bond line and basement membrane through the UV membrane, goes up the mould and passes through the bond line and adhere mutually with the basement membrane, and the basement membrane is the component that EVA plastics coating UV coating material was made, laminates semiconductor parts through the basement membrane, and EVA plastics toughness is strong, and the texture is soft, when attaching, is difficult for causing the damage to the semiconductor surface, because of soft texture, can be better carry out attachedly to semiconductor parts, strengthen attached compactness.
2. The utility model provides a pair of UV protection film of fixed use of semiconductor cutting, through the internally mounted protection film body of shell, the connecting piece sets up the inner wall both sides at the shell, the cashier's mouth has been seted up to the periphery of shell, the peripheral winding of first pivot has the UV membrane to wrap up, and inner wall and second pivot are laminated mutually, through the protection of shell, reduce the contact of UV membrane and visible light, with the best user state of guarantee, through first pivot and second pivot, the UV membrane of being convenient for extends attached operation from the cashier's mouth.
3. The utility model provides a pair of UV protection film of fixed use of semiconductor cutting, the spread groove has been seted up altogether through the inner wall both ends of second pivot, constitute splined connection between spread groove and the connecting piece, guarantee UV membrane when extending attached, skid can not appear in inside first pivot and second pivot, the shell is connected with the second pivot through the connecting piece, make UV membrane when extending attached, the operation is rotated to inside keeping, avoid appearing UV membrane and appear the dead phenomenon of parallel displacement card in inside.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the overall split three-dimensional structure of the present invention;
FIG. 3 is a schematic view of the enlarged three-dimensional structure at the position A of the present invention;
fig. 4 is a schematic view of the structure of the UV film of the present invention.
In the figure: 1. an outsourcing mechanism; 11. a housing; 12. a connecting member; 13. a cashier port; 2. a protective film body; 21. a UV film; 211. an upper die; 212. an adhesive layer; 213. a base film; 22. a rotating member; 221. a first rotating shaft; 222. a second rotating shaft; 2221. and connecting the grooves.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 and 4, a UV protective film for fixing a semiconductor during cutting includes an outer covering mechanism 1 and a protective film body 2, the protective film body 2 is disposed inside the outer covering mechanism 1, the outer covering mechanism 1 includes a housing 11, a connecting member 12 and a receiving opening 13, the protective film body 2 is mounted inside the housing 11, the connecting member 12 is disposed on two sides of an inner wall of the housing 11, the receiving opening 13 is disposed on a periphery of the housing 11, the protective film body 2 includes a UV film 21 and a rotating member 22, the UV film 21 is wound and wrapped on a periphery of the rotating member 22, the UV film 21 includes an upper mold 211, an adhesive layer 212 and a bottom film 213, the upper mold 211 is adhered to the bottom film 213 through the adhesive layer 212, the upper mold 211 is made of a PVC plastic UV coating material, the adhesive layer 212 is made of a UV coating material, the bottom film 213 is made of an EVA plastic UV coating material, and the semiconductor parts are adhered through the bottom film 213, and EVA plastics toughness is strong, and the texture is soft, when attaching, is difficult for causing the damage to the semiconductor surface, because of soft texture, can be better attach the semiconductor part, strengthen attached compactness.
Referring to fig. 2-3, a UV protective film for cutting and fixing a semiconductor device, a rotating member 22 includes a first rotating shaft 221 and a second rotating shaft 222, a UV film 21 is wound and wrapped around the first rotating shaft 221, an inner wall of the first rotating shaft is attached to the second rotating shaft 222, a protective film body 2 is installed inside a housing 11, a connecting member 12 is disposed on both sides of the inner wall of the housing 11, a receiving opening 13 is formed in the periphery of the housing 11, a UV film 21 is wound and wrapped around the first rotating shaft 221, and the inner wall of the first rotating shaft is attached to the second rotating shaft 222, the contact between the UV film 21 and visible light is reduced by the protection of the housing 11 to ensure an optimal use state, the UV film 21 is conveniently extended and attached from the receiving opening 13 through the first rotating shaft 221 and the second rotating shaft 222, four connecting grooves 2221 are formed at both ends of the inner wall of the second rotating shaft 222, and the connecting grooves 2221 and the connecting member 12 form, guarantee UV membrane 21 is when extending attached, and the slip can not appear in inside first pivot 221 and second pivot 222, and shell 11 is connected with second pivot 222 through connecting piece 12, makes UV membrane 21 when extending attached, and inside keeps rotating the operation, avoids appearing UV membrane 21 and appears parallel displacement card dead phenomenon inside.
In summary, the following steps: the utility model provides a fixed UV protection film that uses of semiconductor cutting, including outsourcing mechanism 1 and protection film body 2, protection film body 2 sets up the inside of outsourcing mechanism 1, include last mould 211, bond line 212 and basement membrane 213 through UV membrane 21, it is mutually bonded with basement membrane 213 through bond line 212 to go up mould 211, basement membrane 213 is the component that EVA plastics coating UV coating material was made, laminate semiconductor parts through basement membrane 213, and EVA plastics toughness is strong, the texture is soft, when attaching, be difficult for causing the damage to the semiconductor surface, because of soft texture, can be better attach semiconductor parts, strengthen the compactness of attaching, through the internally mounted protection film body 2 of shell 11, connecting piece 12 sets up the inner wall both sides of shell 11, shell 11 has seted up peripheral mouth of receiving 13, the peripheral winding of first pivot 221 has UV membrane 21, and the inner wall is laminated with the second pivot 222 mutually, through the protection of shell 11, reduce the contact of UV membrane 21 and visible light, in order to ensure the best user state, through first pivot 221 and second pivot 222, be convenient for UV membrane 21 to carry out the attached operation of extension from cashier's office in a shop 13, the inner wall both ends through second pivot 222 have seted up four spread groove 2221 altogether, constitute splined connection between spread groove 2221 and the connecting piece 12, ensure that UV membrane 21 is when extending and attaching, inside first pivot 221 and second pivot 222 can not appear skidding, shell 11 is connected with second pivot 222 through connecting piece 12, make UV membrane 21 when extending and attaching, inside keeps rotating the operation, avoid appearing UV membrane 21 and appear parallel displacement card dead phenomenon in inside.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a fixed UV protection film that uses of semiconductor cutting, includes outsourcing mechanism (1) and protection film body (2), protection film body (2) set up the inside of outsourcing mechanism (1), its characterized in that: the outsourcing mechanism (1) comprises a shell (11), connecting pieces (12) and a receiving port (13), wherein the protective film body (2) is arranged inside the shell (11), the connecting pieces (12) are arranged on two sides of the inner wall of the shell (11), and the receiving port (13) is formed in the periphery of the shell (11);
the protective film body (2) comprises a UV film (21) and a rotating piece (22), wherein the UV film (21) is wound and wrapped on the periphery of the rotating piece (22).
2. The UV protective film for fixing the semiconductor cutting according to claim 1, wherein: the UV film (21) comprises an upper die (211), a bonding layer (212) and a bottom film (213), wherein the upper die (211) is bonded with the bottom film (213) through the bonding layer (212).
3. The UV protective film for fixing the semiconductor cutting according to claim 2, wherein: go up mould (211) and be the component that a PVC plastics coating UV coating material was made, adhesive layer (212) is the component that a UV gum material was made, basement membrane (213) is the component that a EVA plastics coating UV coating material was made.
4. The UV protective film for fixing the semiconductor cutting according to claim 1, wherein: the rotating piece (22) comprises a first rotating shaft (221) and a second rotating shaft (222), the periphery of the first rotating shaft (221) is wound and wrapped with the UV film (21), and the inner wall of the first rotating shaft is attached to the second rotating shaft (222).
5. The UV protective film for fixing semiconductor cutting according to claim 4, wherein: two ends of the inner wall of the second rotating shaft (222) are provided with four connecting grooves (2221).
6. The UV protective film for fixing the semiconductor cutting as claimed in claim 5, wherein: and the connecting groove (2221) and the connecting piece (12) form spline connection.
CN202021382049.5U 2020-07-14 2020-07-14 UV protection film of fixed use of semiconductor cutting Active CN212517150U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021382049.5U CN212517150U (en) 2020-07-14 2020-07-14 UV protection film of fixed use of semiconductor cutting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021382049.5U CN212517150U (en) 2020-07-14 2020-07-14 UV protection film of fixed use of semiconductor cutting

Publications (1)

Publication Number Publication Date
CN212517150U true CN212517150U (en) 2021-02-09

Family

ID=74437224

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021382049.5U Active CN212517150U (en) 2020-07-14 2020-07-14 UV protection film of fixed use of semiconductor cutting

Country Status (1)

Country Link
CN (1) CN212517150U (en)

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TR01 Transfer of patent right

Effective date of registration: 20220809

Address after: 226500 No. 99, Wangyuan Road, Rucheng street, Rugao City, Nantong City, Jiangsu Province

Patentee after: Nantong weiteng Semiconductor Technology Co.,Ltd.

Address before: 523000 shop B35, Yangguang Aoyuan South Street, Dongtai community, Dongcheng Street, Dongguan City, Guangdong Province

Patentee before: Dongguan weiteng Semiconductor Technology Co.,Ltd.