CN212515674U - Computer heat dissipation machine case - Google Patents
Computer heat dissipation machine case Download PDFInfo
- Publication number
- CN212515674U CN212515674U CN202021370338.3U CN202021370338U CN212515674U CN 212515674 U CN212515674 U CN 212515674U CN 202021370338 U CN202021370338 U CN 202021370338U CN 212515674 U CN212515674 U CN 212515674U
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- Prior art keywords
- case
- heat dissipation
- cooling
- dust screen
- box
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Abstract
The utility model discloses a computer heat dissipation machine case, include: the box body, the air inlet fan, the filter plate, the heat radiation fan, the side cover and the dust screen, wherein the side cover is arranged on one side of the box body, a plurality of heat radiation holes are formed in the side cover, and the dust screen is arranged on the inner side of the side cover; the top end of the box body is provided with a through hole, the air inlet fan is arranged in the through hole, and the filter plate is arranged above the through hole; the box is internally fixed with a mainboard, the side wall of the mainboard is connected with a heat-conducting plate, the heat-conducting plate is provided with a radiating fin, and the radiating fan is arranged on one side of the radiating fin close to the dustproof net. The utility model discloses simple structure, not only the radiating effect is good, has good dustproof function moreover.
Description
Technical Field
The utility model belongs to the technical field of computer machine case, more specifically the utility model relates to a computer heat dissipation machine case that says so.
Background
With the development of society, the living standard of people is continuously improved, electronic devices such as computers gradually become important devices in life, study and work, however, the problem of computer heat dissipation is always an important problem concerned by computer users, and the computer often crashes and is stuck due to overhigh temperature when in use, which brings great inconvenience to people. The existing computer heat dissipation adopts the heat dissipation holes arranged on the case, and achieves the heat dissipation effect through the automatic exchange of the heat inside and outside the case, the existing case has a poor heat dissipation effect, when the temperature rises, the operation efficiency of the computer is greatly reduced, the dustproof effect is poor, and the accumulation of dust influences the heat dissipation effect of the computer.
Therefore, how to provide a heat dissipation chassis for a computer is an urgent problem to be solved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a computer heat dissipation machine case, simple structure, not only the radiating effect is good, has good dustproof function moreover.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a computer heat sink chassis comprising: the air conditioner comprises a box body, an air inlet fan, a filter plate, a heat radiation fan, a side cover and a dust screen, wherein the side cover is arranged on one side of the box body, a plurality of heat radiation holes are formed in the side cover, and the dust screen is arranged on the inner side of the side cover; the top end of the box body is provided with a through hole, the air inlet fan is arranged in the through hole, and the filter plate is arranged above the through hole; the dustproof box is characterized in that a main board is fixed in the box body, a heat-conducting plate is connected to the side wall of the main board, radiating fins are installed on the heat-conducting plate, and a radiating fan is installed on one side, close to the dustproof net, of the radiating fins.
Preferably, install clean mechanism of dust screen and collection box in the box, clean mechanism of dust screen is installed be close to in the box the top of dust screen one side, it installs to collect the box the clean below of mechanism of dust screen.
Preferably, the dust screen cleaning mechanism comprises an electric telescopic rod, a connecting plate and a brush head, wherein the connecting plate is installed at the output end of the electric telescopic rod, one end of the brush head is installed on the connecting plate, and the other end of the brush head is attached to the dust screen.
Preferably, a water cooling mechanism is further installed in the box body.
Preferably, the water-cooling mechanism includes cooler bin, cooling tube and water pump, the cooler bin is installed in the box, and be located the below of mainboard, the water pump sets up in the cooler bin, just the output of water pump with the one end of cooling tube is linked together, and the other end of cooling tube gets into in the cooler bin after passing the fin.
Preferably, the cooling fins are provided with a plurality of cooling fins, each cooling fin is provided with a cooling pipe mounting hole, and the cooling pipes are coiled pipes and mounted in the cooling pipe mounting holes.
Preferably, the water cooling mechanism further comprises a semiconductor refrigeration piece, and the semiconductor refrigeration piece is installed at the bottom of the cooling box.
Preferably, a protective cover is arranged above the filter plate.
Preferably, the two sides of the top end of the box body are both connected with handles.
Preferably, four corners of the bottom end of the box body are provided with supporting legs.
The beneficial effects of the utility model reside in that:
the utility model discloses simple structure, the mainboard lateral wall passes through the heat-conducting plate and connects the fin, is favorable to improving the radiating effect of mainboard to can introduce the cold wind in the box outside through air inlet fan, discharge hot-blast through radiator fan, the radiating effect who has further improved the mainboard is good, and the setting of filter and dust screen makes the quick-witted case of heat dissipation have good dustproof function.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is an assembly view of the cooling fin and the cooling pipe according to the present invention.
Wherein, in the figure,
1-a box body; 2-an air intake fan; 3-a filter plate; 4-a heat dissipation fan; 5-side cover; 6-dust screen; 7-a through hole; 8-a main board; 9-heat conducting plate; 10-a heat sink; 11-a collection box; 12-an electric telescopic rod; 13-a connecting plate; 14-a brush head; 15-a cooling tank; 16-a cooling tube; 17-a water pump; 18-semiconductor refrigeration chip; 19-a protective cover; 20-a handle; 21-supporting the feet.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a computer heat dissipation case, including: the air conditioner comprises a box body 1, an air inlet fan 2, a filter plate 3, a heat radiation fan 4, a side cover 5 and a dust screen 6, wherein the side cover 5 is arranged on one side of the box body 1, a plurality of heat radiation holes are formed in the side cover 5, and the dust screen 6 is arranged on the inner side of the side cover 5; the top end of the box body 1 is provided with a through hole 7, the air inlet fan 2 is arranged in the through hole 7, and the filter plate 3 is arranged above the through hole 7; the box 1 internal fixation has mainboard 8, is connected with heat-conducting plate 9 on the mainboard 8 lateral wall, installs fin 10 on the heat-conducting plate 9, and radiator fan 4 installs in the fin 10 one side that is close to dust screen 6. The heat generated by the main board 8 is transferred to the heat dissipation fins 10 through the heat conduction plate 9, and the heat in the box body 1 can be quickly discharged through the heat dissipation holes under the action of the heat dissipation fan 4.
Install the clean mechanism of dust screen and collect box 11 in the box 1, the clean mechanism of dust screen installs the top that is close to dust screen 6 one side in the box 1, collects box 11 and installs the below at the clean mechanism of dust screen, collects box 11 and is provided with sealed lid with box 1 relative position department. The dust screen cleaning mechanism can remove dust on the dust screen 6, the dust falls into the collecting box 11, after the collection is finished, the collecting box 11 is taken out by opening the sealing cover, so that the dust in the collecting box 11 is poured, and then the collecting box 11 is put back to the original position.
Clean mechanism of dust screen includes electric telescopic handle 12, connecting plate 13 and brush head 14, and connecting plate 13 is installed at electric telescopic handle 12's output, and the one end of brush head 14 is installed on connecting plate 13, and the other end laminating is on dust screen 6. When the dust screen 6 needs to be cleaned, the electric telescopic rod 12 is started, and the electric telescopic rod 12 drives the brush head 14 to move up and down through the connecting plate 13, so that the dust screen 6 is cleaned.
Still install water-cooling mechanism in the box 1, water-cooling mechanism includes cooler bin 15, cooling tube 16 and water pump 17, and cooler bin 15 installs in box 1, and is located the below of mainboard 8, and water pump 17 sets up in cooler bin 15, and the output of water pump 17 is linked together with the one end of cooling tube 16, and the other end of cooling tube 16 passes into cooler bin 15 behind the fin 10. Under the action of the water pump 17, the liquid in the cooling tank 15 enters from one end of the cooling pipe 16, and after the cooling fin 10 is cooled, the liquid flows back into the cooling tank 15 from the other end of the cooling pipe 16, so that the efficient cooling of the chassis is realized.
In another embodiment, a plurality of fins 10 are provided, and each fin 10 is provided with a cooling pipe mounting hole, and the cooling pipe 16 is a serpentine pipe and is mounted in the cooling pipe mounting hole. The cooling pipe mounting holes are arranged to facilitate the mounting of the cooling pipes 16, and the cooling pipes 16 are coiled pipes, so that the length of the cooling pipes 16 is prolonged, and the cooling effect is improved.
In another embodiment, the water cooling mechanism further comprises a semiconductor chilling plate 18, the semiconductor chilling plate 18 is installed at the bottom of the cooling box 15, and the liquid in the cooling box 15 can be cooled through the semiconductor chilling plate 18.
In another embodiment, a protective cover 19 is installed above the filter plate 3, the protective cover 19 can protect the filter plate 3 to a certain extent, the protective cover 19 is opened when the case is used, and the protective cover 19 is installed when the case is not used.
In another embodiment, the two sides of the top end of the box body 1 are both connected with the lifting handles 20, so that the case can be conveniently lifted through the lifting handles 20, and the case is more convenient and faster to move.
In another embodiment, the four corners of the bottom end of the box body 1 are provided with the supporting legs 21, so that the box body 1 is supported, and the heat dissipated by the semiconductor refrigeration piece 18 can be rapidly discharged from the gap between the supporting legs 21.
The utility model discloses simple structure, the mainboard lateral wall passes through the heat-conducting plate and connects the fin, is favorable to improving the radiating effect of mainboard to can introduce the cold wind in the box outside through air inlet fan, discharge hot-blast through radiator fan, the radiating effect who has further improved the mainboard is good, and the setting of filter and dust screen makes the quick-witted case of heat dissipation have good dustproof function.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A computer heat dissipation case, comprising: the air conditioner comprises a box body, an air inlet fan, a filter plate, a heat radiation fan, a side cover and a dust screen, wherein the side cover is arranged on one side of the box body, a plurality of heat radiation holes are formed in the side cover, and the dust screen is arranged on the inner side of the side cover; the top end of the box body is provided with a through hole, the air inlet fan is arranged in the through hole, and the filter plate is arranged above the through hole; the dustproof box is characterized in that a main board is fixed in the box body, a heat-conducting plate is connected to the side wall of the main board, radiating fins are installed on the heat-conducting plate, and a radiating fan is installed on one side, close to the dustproof net, of the radiating fins.
2. The computer heat dissipation case of claim 1, wherein a dust screen cleaning mechanism and a collection box are installed in the case, the dust screen cleaning mechanism is installed at a top portion of one side of the case close to the dust screen, and the collection box is installed below the dust screen cleaning mechanism.
3. The computer heat dissipation case of claim 2, wherein the dust screen cleaning mechanism comprises an electric telescopic rod, a connecting plate and a brush head, the connecting plate is mounted at an output end of the electric telescopic rod, one end of the brush head is mounted on the connecting plate, and the other end of the brush head is attached to the dust screen.
4. The computer heat dissipation case of claim 1, wherein a water cooling mechanism is further installed in the case.
5. The computer heat dissipation case of claim 4, wherein the water cooling mechanism comprises a cooling box, a cooling pipe and a water pump, the cooling box is installed in the case and located below the main board, the water pump is arranged in the cooling box, an output end of the water pump is communicated with one end of the cooling pipe, and the other end of the cooling pipe penetrates through the heat dissipation fins and then enters the cooling box.
6. The computer heat sink case as claimed in claim 5, wherein the heat sink fins are provided in plural, and each heat sink fin is provided with a cooling pipe mounting hole, and the cooling pipe is a serpentine pipe and is mounted in the cooling pipe mounting hole.
7. The computer heat dissipation case of claim 5 or 6, wherein the water cooling mechanism further comprises a semiconductor refrigeration piece, and the semiconductor refrigeration piece is mounted at the bottom of the cooling case.
8. The heat sink case of claim 1, wherein a protective cover is mounted over the filter board.
9. The computer heat dissipation case of claim 1, wherein handles are connected to both sides of the top end of the case body.
10. The computer heat dissipation case of claim 1, wherein four corners of the bottom end of the case are provided with support legs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021370338.3U CN212515674U (en) | 2020-07-13 | 2020-07-13 | Computer heat dissipation machine case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021370338.3U CN212515674U (en) | 2020-07-13 | 2020-07-13 | Computer heat dissipation machine case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212515674U true CN212515674U (en) | 2021-02-09 |
Family
ID=74437048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021370338.3U Expired - Fee Related CN212515674U (en) | 2020-07-13 | 2020-07-13 | Computer heat dissipation machine case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212515674U (en) |
-
2020
- 2020-07-13 CN CN202021370338.3U patent/CN212515674U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210209 Termination date: 20210713 |