CN212498800U

CN212498800U - Quick demoulding structure of injection molding

Info

Publication number: CN212498800U
Application number: CN202020402685.3U
Authority: CN
Inventors: 杨立义
Original assignee: Guangdong Liyea Precision Mould Manufacturing Co ltd
Current assignee: Guangdong Liyea Precision Mould Manufacturing Co ltd
Priority date: 2020-12-10
Filing date: 2020-12-10
Publication date: 2021-02-09
Anticipated expiration: 2030-12-10

Abstract

The utility model relates to a quick demoulding structure of an injection molding piece, belonging to the technical field of injection molding; the glue injection cavities arranged in the upper module and the lower module are mutually communicated through the upper module and the lower module in a butt joint mode, the lug plates corresponding to each other in the vertical direction are connected through a first demolding hydraulic cylinder, a demolding push plate matched with the shape and size of the conical groove is embedded and installed in the conical groove, a second demolding hydraulic cylinder is installed at the top of the upper module and the bottom of the lower module through an installation frame, and the telescopic portion of the second demolding hydraulic cylinder penetrates through the through hole to be fixedly connected with the corresponding demolding push plate; the utility model discloses a set up first drawing of patterns pneumatic cylinder and second drawing of patterns pneumatic cylinder and carry out twice drawing of patterns action to the process need not artifical manually operation here, the in-process drawing of patterns of moulding plastics large-scale piece is quick more, reliable, safety, simultaneously, sets up semiconductor refrigeration piece and air cooling device, improves the cooling efficiency of injection molding, has alleviateed the injection molding because of the not abundant drawing of patterns product deformation that leads to of cooling when the drawing of patterns.

Description

Quick demoulding structure of injection molding

Technical Field

The utility model relates to an injection molding quick demoulding structure belongs to the technical field of moulding plastics.

Background

The existing plastic mold needs to perform demolding work on the processed mold after the processing work is finished, but the demolding efficiency of the existing device is low, so that the efficiency of plastic mold injection work development is greatly reduced, especially in the process of injection molding of large-scale plastic parts, manual demolding is slow, and the demolding work is dangerous due to the fact that the plastic parts are heavy.

In the production process of the injection molding part, due to the design of a mold or the structure of the injection molding part, the cooling of the injection molding part before demolding is insufficient, so that the injection molding part is easy to deform during demolding.

SUMMERY OF THE UTILITY MODEL

In order to overcome the problem that exists among the background art, the utility model discloses a set up first drawing of patterns pneumatic cylinder and second drawing of patterns pneumatic cylinder and carry out twice drawing of patterns action to need not artifical manually operation at this process, it is faster, reliable, safe to mould plastics the in-process drawing of patterns of large-scale plastic part, simultaneously, set up semiconductor refrigeration piece and air cooling device, improve the cooling efficiency of injection molding, alleviateed the injection molding because of the not abundant drawing of patterns product deformation that leads to of cooling when the drawing of patterns.

In order to overcome the problem that exists among the background art, for solving above-mentioned problem, the utility model discloses a following technical scheme realizes:

the rapid demoulding structure of the injection molding piece comprises an upper die set, a lower die set, a first demoulding hydraulic cylinder, a second demoulding hydraulic cylinder, a semiconductor refrigerating piece and a demoulding push plate, wherein glue injection cavities arranged in the upper die set and the lower die set are mutually butted and communicated through the upper die set and the lower die set, the top of the upper die set is provided with a glue injection port, two sides of the upper die set and the lower die set are respectively provided with an ear plate, the ear plates which are mutually corresponding in the vertical direction are connected through the first demoulding hydraulic cylinder, the top of the upper die set and the bottom of the lower die set are both provided with a conical groove, the bottom of the conical groove is provided with a through hole, the demoulding push plate which is matched with the conical groove in shape and size is embedded in the conical groove, the top of the upper die set and the bottom of the lower die set are provided with the second demoulding hydraulic cylinder through, go up module and lower module inside and evenly seted up the mounting groove around the injecting glue chamber, mounting groove internally mounted has the semiconductor refrigeration piece, and the refrigeration face of semiconductor refrigeration piece corresponds the injecting glue chamber.

Preferably, go up the module and set up the cooling chamber with the lower module is inside along the mounting groove outside, the intercommunication has air intake and air outlet on the cooling chamber, and the air intake passes through the connecting pipe and connects the fan.

The utility model has the advantages that:

the utility model discloses a set up first drawing of patterns pneumatic cylinder and second drawing of patterns pneumatic cylinder and carry out twice drawing of patterns action to the process need not artifical manually operation here, the in-process drawing of patterns of moulding plastics large-scale piece is quick more, reliable, safety, simultaneously, sets up semiconductor refrigeration piece and air cooling device, improves the cooling efficiency of injection molding, has alleviateed the injection molding because of the not abundant drawing of patterns product deformation that leads to of cooling when the drawing of patterns.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a top view of the upper module of the present invention;

fig. 3 is a schematic cross-sectional view of the lower module of the present invention.

The reference numbers in the figures are: 1-an upper module, 2-a lower module, 3-an ear plate, 4-an air inlet device, 5-a first demoulding hydraulic cylinder, 6-a second demoulding hydraulic cylinder, 7-a mounting frame, 8-an injection gate, 9-an injection cavity, 10-a cooling cavity, 11-a semiconductor refrigeration piece, 12-a demoulding push plate, 13-a connecting pipe, 14-an air inlet and 15-an air outlet.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the following will explain in detail a preferred embodiment of the present invention with reference to the accompanying drawings to facilitate understanding of the skilled person.

As shown in fig. 1-3, the rapid injection molding demoulding structure comprises an upper module 1, a lower module 2, a first demoulding hydraulic cylinder 5, a second demoulding hydraulic cylinder 6, a semiconductor refrigerating sheet 11 and a demoulding push plate 12, wherein glue injection cavities 9 formed inside the upper module 1 and the lower module 2 are mutually butted and communicated through the upper module 1 and the lower module 2, and can form a complete glue injection cavity 9 after being communicated, a glue injection port is formed in the top of the upper module 1, lug plates 3 are respectively arranged on two sides of the upper module 1 and the lower module 2, the lug plates 3 corresponding to each other in the vertical direction are connected through the first demoulding hydraulic cylinder 5, the two first demoulding hydraulic cylinders 5 are symmetrically arranged on the lug plates 3 on two sides of the upper module 1 and the lower module 2, conical grooves are respectively formed in the top of the upper module 1 and the bottom of the lower module 2, through holes are formed in the bottoms of the conical grooves, and are embedded in the conical grooves and mounted in the conical grooves, The demoulding push plate 12 is matched with the conical groove in size, the demoulding push plate 12 and the conical groove are installed in a matched mode, the conical groove is sealed by the demoulding push plate 12 after installation, a second demoulding hydraulic cylinder 6 is installed at the top of the upper module 1 and the bottom of the lower module 2 through an installation frame 7, after the second demoulding hydraulic cylinder 6 retracts to a proper position, the demoulding push plate 12 can be tightly pressed in the conical groove, the telescopic part of the second demoulding hydraulic cylinder 6 penetrates through a through hole to be fixedly connected with the corresponding demoulding push plate 12, installation grooves are evenly formed in the upper module 1 and the lower module 2 along the periphery of the glue injection cavity 9 and are not communicated with the glue injection cavity 9, a semiconductor refrigerating sheet 11 is installed in each installation groove, the refrigerating surface of each semiconductor refrigerating sheet 11 corresponds to the glue injection cavity 9, after the semiconductor refrigerating sheets 11 are electrified, the refrigerating surface cools the upper module 1 and the lower module 2 which are heated after injection molding, so, the method has the advantages of quickening the forming of the plastic part, improving the cooling efficiency of the injection molding part and reducing the deformation of a demolding product caused by insufficient cooling when the injection molding part is demolded.

Preferably, go up module 1 and 2 inside cooling chamber 10 of having seted up along the mounting groove outside of having seted up of lower module, the intercommunication has air intake 14 and air outlet 15 on the cooling chamber 10, and air intake 14 passes through connecting pipe 13 and connects hot blast blowpipe apparatus 4, in this embodiment, hot blast blowpipe apparatus 4 is the fan, also can be the air compressor machine etc. through setting up cooling chamber 10 and air cooling device, carry out the secondary refrigeration to the heating face and the whole module of semiconductor refrigeration piece 11, thereby guarantee the normal work and the holistic life of module of semiconductor refrigeration piece 11.

The utility model discloses a working process: the controller controls the retraction of the first demoulding hydraulic cylinder 5, after the upper module 1 and the lower module 2 are butted, the inner parts of the upper module 1 and the lower module 2 are butted to form a complete glue injection cavity 9, glue injection work is started, the glue injection machine injects glue through a glue injection opening, after the glue injection work is finished, the controller is used for electrifying and opening the semiconductor refrigerating sheet 11 and the fan, the refrigerating surface of the semiconductor refrigerating sheet 11 is used for cooling the module on the contact surface, so that the temperature around the glue injection cavity 9 is reduced, the cooling efficiency of an injection molding piece is improved, the deformation of a demoulding product caused by insufficient cooling during demoulding of the injection molding piece is reduced, meanwhile, the fan works, air flow is increased in the cooling cavity 10, the heat release surface (heating surface) close to the semiconductor refrigerating sheet 11 is cooled, the service life of the whole module is not influenced by overhigh temperature, and the cooling time reaches the time controlled by the controller, the controller controls the semiconductor refrigerating sheet 11 and the fan to be powered off and closed, then the controller controls the first demolding hydraulic cylinder 5 to extend, the upper module 1 and the lower module 2 are separated, and after the separation is in place, the controller controls the second demolding hydraulic cylinder 6 on the upper module 1 and the lower module 2 to extend, so that the demolding push plate 12 is jacked, a plastic part is pushed, and the secondary demolding action is completed.

Finally, it is noted that the above-mentioned preferred embodiments illustrate rather than limit the invention, and that, although the invention has been described in detail with reference to the above-mentioned preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the invention as defined by the appended claims.

Claims

1. The utility model provides an injection molding quick demoulding structure which characterized in that: the rapid demoulding structure of the injection molding piece comprises an upper die set, a lower die set, a first demoulding hydraulic cylinder, a second demoulding hydraulic cylinder, a semiconductor refrigerating piece and a demoulding push plate, wherein glue injection cavities arranged in the upper die set and the lower die set are mutually butted and communicated through the upper die set and the lower die set, the top of the upper die set is provided with a glue injection port, two sides of the upper die set and the lower die set are respectively provided with an ear plate, the ear plates which are mutually corresponding in the vertical direction are connected through the first demoulding hydraulic cylinder, the top of the upper die set and the bottom of the lower die set are both provided with a conical groove, the bottom of the conical groove is provided with a through hole, the demoulding push plate which is matched with the conical groove in shape and size is embedded in the conical groove, the top of the upper die set and the bottom of the lower die set are provided with the second demoulding hydraulic cylinder through, go up module and lower module inside and evenly seted up the mounting groove around the injecting glue chamber, mounting groove internally mounted has the semiconductor refrigeration piece, and the refrigeration face of semiconductor refrigeration piece corresponds the injecting glue chamber.

2. The rapid demoulding structure of the injection molding part according to claim 1, is characterized in that: go up module and lower module inside and seted up the cooling chamber along the mounting groove outside, the intercommunication has air intake and air outlet on the cooling chamber, and the air intake passes through the connecting pipe and connects the fan.