CN212497255U - Silicon chip side-polishing liquid supplementing system - Google Patents
Silicon chip side-polishing liquid supplementing system Download PDFInfo
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- CN212497255U CN212497255U CN202021052012.6U CN202021052012U CN212497255U CN 212497255 U CN212497255 U CN 212497255U CN 202021052012 U CN202021052012 U CN 202021052012U CN 212497255 U CN212497255 U CN 212497255U
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- liquid
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- polishing liquid
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- 239000007788 liquid Substances 0.000 title claims abstract description 298
- 238000005498 polishing Methods 0.000 title claims abstract description 195
- 230000001502 supplementing effect Effects 0.000 title claims abstract description 52
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 37
- 239000010703 silicon Substances 0.000 title claims abstract description 37
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 238000001514 detection method Methods 0.000 claims abstract description 47
- 230000009469 supplementation Effects 0.000 claims description 6
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000012423 maintenance Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 7
- 239000013589 supplement Substances 0.000 description 5
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model provides a silicon chip side-throwing liquid supplementing system, which comprises a supplementing liquid containing device, a side-throwing liquid PH detection device, a side-throwing liquid supply box, a liquid supply power device and a control device, wherein the side-throwing liquid PH detection device is arranged on the side-throwing liquid supply box and is used for detecting the PH value of the side-throwing liquid in the side-throwing liquid supply box; the liquid supply power device is respectively connected with the side polishing liquid supply box and the supplementary liquid containing device and supplies supplementary liquid to the side polishing liquid supply box; the side polishing liquid PH detection device and the liquid supply power device are both electrically connected with the control device, and the control device controls the liquid supply power device to act according to a side polishing liquid PH value signal detected by the side polishing liquid PH detection device. The beneficial effects of the utility model are that simple structure, convenient to use, easy to assemble and maintenance have and supply liquid power device, limit to throw liquid PH detection device and flow detection device, can throw the pH value of liquid according to the limit that detects whether in the upper limit value and the lower limit value of settlement, and control supplies liquid power device action, and the pH value of liquid is thrown to the opposite side is adjusted.
Description
Technical Field
The utility model belongs to the technical field of silicon chip production, especially, relate to a liquid supplementation system is thrown on silicon chip limit.
Background
When the silicon wafer is subjected to side polishing, the side polishing liquid is adopted for side polishing, but in the side polishing process, the pH value of the side polishing liquid can be reduced, and liquid supplement needs to be carried out on the side polishing liquid in order to increase the pH value of the side polishing.
SUMMERY OF THE UTILITY MODEL
In view of the above problem, the utility model provides a silicon chip is thrown simultaneously and is mended liquid system to solve more than prior art exists or other former problems.
In order to solve the technical problem, the utility model discloses a technical scheme is: a silicon wafer side-polishing liquid supplementing system comprises a supplementing liquid containing device, a side-polishing liquid PH detection device, a side-polishing liquid supply box, a liquid supply power device and a control device, wherein,
the side polishing liquid PH detection device is arranged on the side polishing liquid supply box and is used for detecting the PH value of the side polishing liquid in the side polishing liquid supply box;
the liquid supply power device is respectively connected with the side polishing liquid supply box and the supplementary liquid containing device and supplies supplementary liquid to the side polishing liquid supply box;
the side polishing liquid PH detection device and the liquid supply power device are both electrically connected with the control device, and the control device controls the liquid supply power device to act according to a side polishing liquid PH value signal detected by the side polishing liquid PH detection device.
The device further comprises a flow detection device, wherein the flow detection device is arranged at the liquid outlet end of the liquid supply power device and is used for detecting the flow of the supplementing liquid entering the side polishing liquid supply box.
Further, the side polishing solution PH detection device is a PH detector.
Further, the liquid supply power device is a liquid supply pump.
Further, the control device is a PLC controller.
By adopting the technical scheme, the silicon wafer edge polishing liquid supplementing system is simple in structure, convenient to use and convenient to install and maintain, and is provided with the liquid supply power device, the edge polishing liquid PH detection device and the flow detection device, the liquid supply power device can be controlled to act according to whether the detected PH value of the edge polishing liquid is within the set upper limit value and the set lower limit value, the PH value of the edge polishing liquid is adjusted, the supply of the supplementing liquid is carried out according to the PH value of the edge polishing liquid at any time, the PH value of the edge polishing liquid is adjusted at any time, simplicity and convenience are realized, the PH value is not adjusted when the total amount of the edge polishing liquid reaches the set value, the edge roughness of a silicon wafer is reduced, the adverse phenomena of layer faults, dislocation and the like in subsequent epitaxial processing are prevented, the edge stress is reduced, and the risks of edge chipping, chipping and.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
In the figure:
1. a replenishing liquid containing device 2, a liquid supply power device 3, a side polishing liquid supply box 4, a flow detection device 5 and a side polishing liquid PH detection device
Detailed Description
The invention will be further described with reference to the accompanying drawings and specific embodiments.
Fig. 1 shows the structural schematic diagram of an embodiment of the utility model, this embodiment relates to a liquid supplementation system is thrown on silicon chip limit for carry out the limit to the silicon chip and throw the use, this silicon chip limit is thrown liquid supplementation system and is thrown the machine with the limit and be connected, be used for throwing the machine to the limit and carry out the limit and throw liquid supplementation, guarantee the pH value of the liquid of throwing on the limit, and then guarantee the concentration of throwing the liquid on the limit, be convenient for carry out the limit to the silicon chip and throw, adopt this liquid supplementation system to carry out the limit to the silicon chip and throw, reduce the edge stress of silicon chip, the edge collapses the limit when reducing the silicon chip limit and throwing, risks.
A silicon wafer side-polishing solution supplementing system comprises a supplementing solution containing device 1, a side-polishing solution PH detection device 5, a side-polishing solution supply box 3, a liquid supply power device 2 and a control device, wherein the supplementing solution containing device 1 is used for containing supplementing solution, the side-polishing solution supply box 3 is used for containing side-polishing solution and supplying the side-polishing solution to a side-polishing machine (not shown in the figure) so as to ensure that the side-polishing machine can perform side-polishing on a silicon wafer;
the side polishing liquid PH detection device 5 is arranged on the side polishing liquid supply box 3, detects the PH value of the side polishing liquid in the side polishing liquid supply box 3 at any time, ensures that the side polishing liquid supplied to the side polishing machine meets the requirements, and meets the use requirements of the side polishing liquid during the side polishing of the silicon wafer;
the liquid supply power device 2 is respectively connected with the side polishing liquid supply box 3 and the supplementary liquid containing device 1, supplies supplementary liquid for the side polishing liquid supply box 3, conveys the supplementary liquid in the supplementary liquid containing device 1 into the side polishing liquid supply box 3 through the action of the liquid supply power device 2, provides the supplementary liquid for the side polishing liquid supply box 3, and ensures the pH value of the side polishing liquid in the side polishing liquid supply box 3;
the side polishing liquid PH detection device 5 and the liquid supply power device 2 are electrically connected with the control device, the control device controls the liquid supply power device 2 to act according to a PH value signal of side polishing liquid in the side polishing liquid supply box 3 detected by the side polishing liquid PH detection device 5, the side polishing liquid PH detection device 5 detects the PH value of the side polishing liquid in the side polishing liquid supply box 3 at all times, and after the PH value of the side polishing liquid in the side polishing liquid supply box 3 is reduced to be lower than a specified required lower limit value, the control device controls the liquid supply power device 2 to act, so that the supplementing liquid in the supplementing liquid containing device 1 is conveyed into the side polishing liquid supply box 3, the supplementing liquid is mixed with the side polishing liquid in the side polishing liquid supply box 3, the PH value of the side polishing liquid is improved, and the PH value of the side polishing liquid meets the use requirement of a silicon wafer during side polishing; when the pH value of the side polishing liquid in the side polishing liquid supply tank 3 rises to the upper limit value required by the regulation, the control device controls the liquid supply power device 2 to stop operating, and stops supplying the supplementary liquid into the side polishing liquid supply tank 3, so that the pH value of the side polishing liquid in the side polishing liquid supply tank 3 can meet the use requirement all the time.
According to a further optimization scheme, the silicon wafer side polishing liquid supplementing system further comprises a flow detection device 4, the flow detection device 4 is arranged at the liquid outlet end of the liquid supply power device 2 and is used for detecting the flow of the supplementing liquid entering the side polishing liquid supply box 3, the flow detection device 4 is arranged so that the flow of the supplementing liquid transported into the side polishing liquid supply box 3 by the liquid supply power device 2 is quantized, operators can observe the flow of the supplementing liquid entering the side polishing liquid supply box 3 conveniently, meanwhile, the flow of the supplementing liquid entering the side polishing liquid supply box 3 can be controlled, the supplementing liquid can enter the side polishing liquid supply box 3 gradually, the pH value of the side polishing liquid in the side polishing liquid supply box 3 is improved gradually, and meanwhile, the pH value of the side polishing liquid in the side polishing liquid supply box 3 is guaranteed not to exceed a specified upper limit value. Meanwhile, an operator can set the supply amount of the side polishing liquid supply box 3 to the side polishing liquid of the side polishing machine according to the flow of the liquid supply power device 2 measured by the flow detection device 4, so that the total amount of the side polishing liquid in the side polishing liquid supply box 3 does not exceed the upper limit, and the side polishing liquid flows out of the side polishing liquid supply box 3
The above-mentioned side polishing liquid PH detection device 5 is a PH detector, is a commercially available product, and is selected according to actual requirements, and no specific requirements are made here.
The liquid supply power device 2 is a liquid supply pump, and provides power for the supplement liquid in the supplement liquid container 1 to enter the side casting liquid supply tank 3, so that the supplement liquid in the supplement liquid container 1 enters the side casting liquid supply tank 3, and the liquid supply pump is a commercially available product and is selected according to actual requirements, and no specific requirement is made here.
The flow rate detection device 4 is a flow meter, is a commercially available product, and is selected according to actual requirements, and no specific requirements are made here.
The control device is a PLC (programmable logic controller), an edited program is preset, and meanwhile, the upper limit value and the lower limit value of the pH value of the side polishing liquid are preset, so that the control device can control the action of the liquid supply power device 2, control the amount of the supplementing liquid in the supplementing liquid accommodating device 1 entering the supplementing liquid supply tank 3 and control the pH value of the side polishing liquid in the side polishing liquid supply tank 3 according to the pH value of the side polishing liquid in the side polishing liquid supply tank 3 detected by the side polishing liquid pH detection device 5 and compared with the preset upper limit value and the preset lower limit value, and meet the using requirements.
When the silicon wafer side polishing liquid supplementing system is used, a supplementing liquid containing device 1 is connected with a liquid inlet of a liquid supply power device 2, a liquid outlet of the liquid supply power device 2 is connected with a side polishing liquid supply box 3, meanwhile, the side polishing liquid supply box 3 is connected with the side polishing machine system, so that the side polishing liquid supply box 3 can supply side polishing liquid for the side polishing machine, the supplementing liquid enters the side polishing liquid supply box 3 under the action of the liquid supply power device 2 and provides the supplementing liquid for the side polishing liquid supply box 3, the pH value of the side polishing liquid in the side polishing liquid supply box 3 is improved, the pH value of the side polishing liquid in the side polishing liquid supply box 3 meets the use requirement, meanwhile, a side polishing liquid pH detection device 5 is arranged on the side polishing liquid supply box 3 to detect the pH value of the side polishing liquid in the side polishing liquid supply box 3 in real time, and meanwhile, a liquid outlet end of the liquid supply power device 2 is provided with a flow detection device 4, preferably, the flow detection device 4 is installed on a connecting pipeline between the liquid outlet of the liquid supply power device 2 and the side polishing liquid supply box 3, and detects the flow of the replenishment liquid entering the side polishing liquid supply box 3, so that the replenishment liquid constantly enters the side polishing liquid supply box 3, and the PH value of the side polishing liquid is improved.
The control device is respectively connected with the flow detection device 4 and the side polishing liquid PH detection device 5, the liquid supply power device 2 is controlled to act according to the PH value of the side polishing liquid detected by the side polishing liquid PH detection device 5, so that the supplementing liquid in the supplementing liquid containing device 1 enters the side polishing liquid supply box 3, the PH value of the side polishing liquid in the side polishing liquid supply box 3 is adjusted, and when the PH value of the side polishing liquid in the side polishing liquid supply box 3 drops to a set lower limit, the control device controls the liquid supply power device 2 to act to supply the side polishing liquid supply box 3 with the supplementing liquid; when the pH value of the side polishing liquid in the side polishing liquid supply tank 3 reaches a set upper limit value, the control device controls the liquid supply power device 2 to stop supplying the supplementary liquid; in this process, the flow detection device 4 detects the flow rate into the side polishing liquid supply tank 3, so that the replenishment liquid enters the side polishing liquid supply tank 3 at a set flow rate to adjust the PH of the side polishing liquid.
The make-up liquid is an alkaline solution, and in the present embodiment, a potassium hydroxide solution is preferred.
Example one
In the process of liquid supplementing, the flow of a liquid supply power device 2 and the upper limit value and the lower limit value of the PH value of a side polishing liquid PH detection device 5 are set, so that a supplementing liquid containing device 1 is used for supplementing liquid to a side polishing liquid supply box 3. The flow rate of the liquid supply power device 2 is 10ml/s, the upper limit value of the pH value is 10.30-10.50, the lower limit value of the pH value is 10.00-10.20, the selection is carried out according to the actual requirement, no specific requirement is made here, in the embodiment, the upper limit value of the pH value is 10.30, the lower limit value of the pH value is 10.05, and the control of the supplementing liquid entering the side polishing liquid supply tank 3 is carried out according to the set upper limit value and the set lower limit value of the pH value of the side polishing liquid. The supplementary liquid is alkali liquid, preferably, in the embodiment, the supplementary liquid is potassium hydroxide solution.
In the process of polishing the silicon wafer, the silicon wafer side polishing liquid supplementing method is adopted for liquid supplementing during side polishing, and meanwhile, parameters of different stations are set, wherein the parameters comprise:
v groove station: the polishing pressure is 4-11N, the polishing time is 20-50s, the polishing angle is 0 degree, 40-50 degrees and- (40-50) degrees, preferably, in the embodiment, the pressure of the polishing head is 11N, and the polishing time is 50 s;
edge station: the rotation speed of the polishing head is 220-300rmp and the time is 50-70s, preferably, in this embodiment, the rotation speed of the polishing head is 300rmp and the time is 70 s;
the pH value of the polishing solution is 10-12.
Example two
In the process of liquid supplementing, the flow of a liquid supply power device 2 and the upper limit value and the lower limit value of the PH value of a side polishing liquid PH detection device 5 are set, so that a supplementing liquid containing device 1 is used for supplementing liquid to a side polishing liquid supply box 3. The flow rate of the liquid supply power device 2 is 10ml/s, the upper limit value of the pH value is 10.30-10.50, the lower limit value of the pH value is 10.00-10.19, the selection is carried out according to the actual requirement, no specific requirement is made here, in the embodiment, the upper limit value of the pH value is 10.30, the lower limit value of the pH value is 10.05, and the control of the supplementing liquid entering the side polishing liquid supply tank 3 is carried out according to the set upper limit value and the set lower limit value of the pH value of the side polishing liquid. The supplementary liquid is alkali liquid, preferably, in the embodiment, the supplementary liquid is potassium hydroxide solution.
In the process of polishing the silicon wafer, the silicon wafer side polishing liquid supplementing method is adopted for liquid supplementing during side polishing, and meanwhile, parameters of different stations are set, wherein the parameters comprise:
v groove station: the polishing pressure is 4-11N, the polishing time is 20-40s, the polishing angle is 0 degree, 40-50 degrees and- (40-50) degrees, preferably, in the embodiment, the pressure of the polishing head is 4N, and the polishing time is 20 s;
edge station: the rotation speed of the polishing head is 220-300rmp and the time is 40-80s, preferably, in this embodiment, the rotation speed of the polishing head is 300rmp and the time is 40 s;
the pH value of the polishing solution is 10-12.
The parameters are adopted for setting, the silicon wafer is polished at the side, meanwhile, a silicon wafer side polishing liquid supplementing system is adopted for supplementing liquid, and the pH value of the side polishing liquid is adjusted, so that the pH value of the side polishing liquid is maintained in a set range, the edge roughness of the silicon wafer is reduced, the phenomena of faults, dislocation and the like during subsequent epitaxial processing are prevented, the edge stress is reduced, and the risks of edge breakage, chipping and the like are reduced.
By adopting the technical scheme, the silicon wafer edge polishing liquid supplementing system is simple in structure, convenient to use and convenient to install and maintain, and is provided with the liquid supply power device, the edge polishing liquid PH detection device and the flow detection device, the liquid supply power device can be controlled to act according to whether the detected PH value of the edge polishing liquid is within the set upper limit value and the set lower limit value, the PH value of the edge polishing liquid is adjusted, the supply of the supplementing liquid is carried out according to the PH value of the edge polishing liquid at any time, the PH value of the edge polishing liquid is adjusted at any time, simplicity and convenience are realized, the PH value is not adjusted when the total amount of the edge polishing liquid reaches the set value, the edge roughness of a silicon wafer is reduced, the adverse phenomena of layer faults, dislocation and the like in subsequent epitaxial processing are prevented, the edge stress is reduced, and the risks of edge chipping, chipping and.
The embodiments of the present invention have been described in detail, but the description is only for the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.
Claims (5)
1. The utility model provides a silicon chip is thrown liquid supplementation system which characterized in that: comprises a replenishing liquid containing device, a side polishing liquid PH detection device, a side polishing liquid supply box, a liquid supply power device and a control device,
the side polishing liquid PH detection device is arranged on the side polishing liquid supply box and is used for detecting the PH value of the side polishing liquid in the side polishing liquid supply box;
the liquid supply power device is respectively connected with the side polishing liquid supply box and the supplementary liquid containing device and supplies supplementary liquid to the side polishing liquid supply box;
the side polishing liquid PH detection device and the liquid supply power device are both electrically connected with the control device, and the control device controls the liquid supply power device to act according to a side polishing liquid PH value signal detected by the side polishing liquid PH detection device.
2. The silicon wafer edge-polishing solution supplementing system according to claim 1, wherein: the liquid supply device comprises a liquid supply power device, a liquid outlet end of the liquid supply power device and a flow detection device, wherein the flow detection device is arranged at the liquid outlet end of the liquid supply power device and is used for detecting the flow of the supplementing liquid entering the side polishing liquid supply box.
3. The silicon wafer edge-polishing solution replenishment system according to claim 1 or 2, characterized in that: the side polishing solution PH detection device is a PH detector.
4. The silicon wafer edge-polishing solution supplementing system according to claim 3, wherein: the liquid supply power device is a liquid supply pump.
5. The silicon wafer edge-polishing solution supplementing system according to claim 4, wherein: the control device is a PLC controller.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021052012.6U CN212497255U (en) | 2020-06-10 | 2020-06-10 | Silicon chip side-polishing liquid supplementing system |
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| CN202021052012.6U CN212497255U (en) | 2020-06-10 | 2020-06-10 | Silicon chip side-polishing liquid supplementing system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111546239A (en) * | 2020-06-10 | 2020-08-18 | 天津中环领先材料技术有限公司 | Silicon wafer side polishing liquid supplementing system, liquid supplementing method and silicon wafer side polishing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111546239A (en) * | 2020-06-10 | 2020-08-18 | 天津中环领先材料技术有限公司 | Silicon wafer side polishing liquid supplementing system, liquid supplementing method and silicon wafer side polishing method |
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Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 inside. Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region after: China Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Address before: No.12 Haitai East Road, Huayuan Industrial Zone, Binhai New Area, Tianjin Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region before: China Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. |
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