CN212494929U

CN212494929U - Hardware processing is with mould that has heat radiation structure

Info

Publication number: CN212494929U
Application number: CN202020837002.7U
Authority: CN
Inventors: 崔小伟
Original assignee: SHENZHEN RUIHUA XINXING DIGITAL TECHNOLOGY CO LTD
Current assignee: SHENZHEN RUIHUA XINXING DIGITAL TECHNOLOGY CO LTD
Priority date: 2020-05-19
Filing date: 2020-05-19
Publication date: 2021-02-09
Anticipated expiration: 2030-05-19

Abstract

The utility model discloses a hardware processing is with mould that has heat radiation structure, including workstation main part, mould main part and stamping workpiece main part, the mould main part is installed on workstation main part top, the stamping workpiece main part is installed on mould main part top, workstation main part top is provided with heat dissipation mechanism, mould main part top is provided with buffer gear. The utility model discloses an open first valve, cold water passes through inside the water injection case gets into the pipe, thereby cool down the mould main part, when needing to change the inside water of pipe, open the second valve, waste water passes through inside the connecting pipe gets into the waste water tank this moment, thereby carry out recycle to waste water, the above-mentioned device, it easily produces a large amount of heats when the punching press to have solved it, lead to the mould temperature higher, the problem of the life of mould has been reduced, the cooling efficiency of mould main part has been increased, the service life of device has been promoted, and the device can make water resource cyclic utilization.

Description

Hardware processing is with mould that has heat radiation structure

Technical Field

The utility model relates to a hardware processing technology field specifically is a hardware processing is with mould that has heat radiation structure.

Background

The various tools and products used in daily production and life are as large as a base and a machine body shell of a machine tool and as small as a shell of a button screw and a button and shells of various household appliances, and have no close relation with a die, and a hardware die is a necessary tool for producing hardware parts in industrial production and is a part in a required shape by manufacturing metal materials, so that the existing die with a heat dissipation structure for hardware processing basically meets the requirements of people, but still has some problems.

The first problem is that: the existing die with the heat dissipation structure for hardware processing is easy to generate a large amount of heat during stamping, so that the temperature of the die is high, and the service life of the die is shortened.

The second problem is that: present hardware processing is with mould that has heat radiation structure because traditional mould does not set up buffer gear, easily leads to the device to cause mould and bed die contact when the punching press to cause the device to damage, consequently need a hardware processing to solve above-mentioned problem with the mould that has heat radiation structure urgently.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a hardware processing is with mould that has heat radiation structure to the mould that provides in solving above-mentioned background art is higher at the during operation temperature, and the mould is at the during operation problem that mould and bed die easily produced the collision.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a hardware processing is with mould that has heat radiation structure, includes workstation main part, mould main part and stamping workpiece main part, the mould main part is installed on workstation main part top, the stamping workpiece main part is installed on mould main part top, workstation main part top is provided with heat dissipation mechanism, mould main part top is provided with buffer gear.

Preferably, heat dissipation mechanism includes first bracing piece, water injection case, pipe, first valve, connecting pipe, second valve and waste water tank, the first bracing piece of workstation main part top fixedly connected with, first bracing piece top fixedly connected with water injection case, the water injection case bottom is embedded to have the pipe, and the pipe runs through in the mould main part, the inside embedded first valve that has of pipe, the inside embedded connecting pipe that has of pipe, the inside embedded second valve that has of connecting pipe, the cover is equipped with the waste water tank connecting pipe bottom.

Preferably, buffer gear includes second bracing piece, stopper, buffer board, spring, solid fixed ring and blotter, the equal fixedly connected with second bracing piece in mould main part top left and right sides, it is two sets of the equal fixedly connected with stopper in second bracing piece top, second bracing piece outer wall cover is equipped with the buffer board, the winding of second bracing piece outer wall has the spring, solid fixed ring of stamping workpiece main part outer wall fixedly connected with, the sticky blotter that has in buffer board top.

Preferably, the shape of the cushion pad is set to be rectangular, and the cushion pad is made of rubber.

Preferably, the shape of the limiting block is rectangular, and the width of the limiting block is greater than that of the second supporting rod.

Preferably, the maximum compressed length of the spring is less than the internal length of the die body.

Compared with the prior art, the beneficial effects of the utility model are that:

1. this hardware processing is with mould that has heat radiation structure is provided with first bracing piece, the water injection case, the pipe, first valve, the connecting pipe, second valve and waste water tank, when needing to dispel the heat to the mould main part, open first valve, cold water passes through inside the water injection case gets into the pipe, thereby cool down the mould main part, when needing to change the water of pipe inside, open the second valve, waste water passes through inside the connecting pipe gets into the waste water tank, thereby recycle, the above-mentioned device, it easily produces a large amount of heats when the punching press to have solved, lead to the mould temperature higher, the problem of the life of mould has been reduced, the cooling efficiency of mould main part has been increased, the life of device has been promoted, and the device can make water resource cyclic utilization.

2. This hardware processing is with mould that has heat radiation structure is provided with the second bracing piece, the stopper, the buffer board, a spring, solid fixed ring and cushion, when stamping workpiece main part bumps downwards, drive solid fixed ring downstream, drive the buffer board downstream, and the spring receives the extrusion and takes place deformation, elastic action through the spring, the impact to the stamping workpiece main part cushions, the device, solved because traditional mould does not set up buffer gear, easily lead to the device to cause mould and bed die contact when the punching press, thereby cause the problem of device damage, the normal moulding-die of device has been guaranteed, the service life of device has been promoted.

Drawings

Fig. 1 is a schematic front view of the present invention;

fig. 2 is a schematic front view of the cross-sectional structure of the present invention;

FIG. 3 is a schematic view of a front view cross section of the present invention;

fig. 4 is an enlarged schematic structural diagram of a in fig. 2 according to the present invention.

In the figure: 1. a table main body; 2. a mold body; 3. a stamping part main body; 411. a first support bar; 412. a water injection tank; 413. a conduit; 414. a first valve; 415. a connecting pipe; 416. a second valve; 417. a wastewater tank; 511. a second support bar; 512. a limiting block; 513. a buffer plate; 514. a spring; 515. a fixing ring; 516. a cushion pad.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides an embodiment: the utility model provides a hardware processing is with mould that has heat radiation structure, includes workstation main part 1, mould main part 2 and stamping workpiece main part 3, and mould main part 2 is installed on workstation main part 1 top, and stamping workpiece main part 3 is installed on 2 tops of mould main part, and 1 tops of workstation main part are provided with heat dissipation mechanism, and 2 tops of mould main part are provided with buffer gear.

The heat dissipation mechanism comprises a first supporting rod 411, a water injection tank 412, a conduit 413, a first valve 414, a connecting pipe 415, a second valve 416 and a waste water tank 417, wherein the top end of the workbench main body 1 is fixedly connected with the first supporting rod 411, the top end of the first supporting rod 411 is fixedly connected with the water injection tank 412, the bottom end of the water injection tank 412 is embedded with the conduit 413, the conduit 413 penetrates through the mold main body 2, the first valve 414 is embedded inside the conduit 413, the connecting pipe 415 is embedded inside the conduit 413, the second valve 416 is embedded inside the connecting pipe 415, the waste water tank 417 is sleeved at the bottom end of the connecting pipe 415, when the mold main body 2 needs to dissipate heat, the first valve 414 is opened, cold water enters the conduit 413 through the water injection tank 412, so as to cool the mold main body 2, when the water inside the conduit 413 needs to be replaced, the second valve 416 is opened, waste water enters the waste water tank 417, above-mentioned device has solved its easy a large amount of heats that produce when the punching press, leads to the mould temperature higher, has reduced the life's of mould problem, has increased the cooling efficiency of mould main part 2, has promoted the life of device, and the device can make water resource cyclic utilization.

The buffer mechanism comprises a second support rod 511, limit blocks 512, buffer plates 513, springs 514, fixing rings 515 and buffer pads 516, the left and right sides of the top end of the die main body 2 are fixedly connected with the second support rods 511, the top ends of the two groups of second support rods 511 are fixedly connected with the limit blocks 512, the outer wall of each second support rod 511 is sleeved with a buffer plate 513, the springs 514 are wound on the outer wall of each second support rod 511, the fixing rings 515 are fixedly connected with the outer wall of the stamping part main body 3, the buffer pads 516 are glued at the top ends of the buffer plates 513, when the stamping part main body 3 collides downwards, the fixing rings 515 are driven to move downwards, the buffer plates 513 are driven to move downwards, the springs 514 are extruded to deform, the impact of the stamping part main body 3 is buffered through the elastic action of the springs 514, the device solves the problem that the traditional die is not provided with a buffer, thereby cause the problem that the device damaged, the normal moulding-die of device has been guaranteed, the life of device has been promoted, blotter 516 shape sets up to the rectangle, and the concrete material of blotter 516 is the rubber material, further protect solid fixed ring 515 and buffer board 513, avoid solid fixed ring 515 to cause the damage to buffer board 513 when the downstream, stopper 512 shape sets up to the rectangle, and the width of stopper 512 is greater than the width of second bracing piece 511, prescribe a limit to the removal interval of buffer board 513, avoid buffer board 513 to breaking away from second bracing piece 511 when upwards bouncing up, the maximum compression length of spring 514 is less than the inside length of mould main part 2, avoid stamping workpiece main part 3 to contact in 2 bottom inner walls of mould main part when the downstream, thereby cause the mould damage.

The working principle is as follows: when the heat dissipation of the mold body 2 is needed, the first valve 414 is opened, cold water enters the conduit 413 through the water injection tank 412, so that the temperature of the mold body 2 is reduced, when the water in the conduit 413 needs to be replaced, the second valve 416 is opened, and waste water enters the waste water tank 417 through the connecting pipe 415, so that the waste water is recycled;

when stamping part main part 3 clashes downwards, drive solid fixed ring 515 and move down, drive buffer board 513 and move down, and spring 514 receives the extrusion and takes place deformation, through the elastic action of spring 514, cushions stamping part main part 3's impact.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a hardware processing is with mould that has heat radiation structure, includes workstation main part (1), mould main part (2) and stamping workpiece main part (3), mould main part (2) are installed on workstation main part (1) top, stamping workpiece main part (3), its characterized in that are installed on mould main part (2) top: the top end of the workbench main body (1) is provided with a heat dissipation mechanism, and the top end of the die main body (2) is provided with a buffer mechanism.

2. The mold with the heat dissipation structure for hardware processing according to claim 1, characterized in that: heat dissipation mechanism includes first bracing piece (411), water injection case (412), pipe (413), first valve (414), connecting pipe (415), second valve (416) and waste water tank (417), workstation main part (1) top fixedly connected with first bracing piece (411), first bracing piece (411) top fixedly connected with water injection case (412), water injection case (412) bottom is embedded to have pipe (413), and pipe (413) run through in mould main part (2), pipe (413) inside is embedded to have first valve (414), pipe (413) inside is embedded to have connecting pipe (415), connecting pipe (415) inside is embedded to have second valve (416), connecting pipe (415) bottom pot head is equipped with waste water tank (417).

3. The mold with the heat dissipation structure for hardware processing according to claim 1, characterized in that: buffer gear includes second bracing piece (511), stopper (512), buffer board (513), spring (514), solid fixed ring (515) and cushion (516), mould main part (2) top left and right sides all fixedly connected with second bracing piece (511), two sets of all fixedly connected with stopper (512) in second bracing piece (511) top, second bracing piece (511) outer wall cover is equipped with buffer board (513), second bracing piece (511) outer wall winding has spring (514), stamping workpiece main part (3) outer wall fixedly connected with solid fixed ring (515), buffer board (513) top is glued and is had cushion (516).

4. The mold with the heat dissipation structure for hardware processing according to claim 3, characterized in that: the shape of the buffer pad (516) is set to be rectangular, and the specific material of the buffer pad (516) is rubber material.

5. The mold with the heat dissipation structure for hardware processing according to claim 3, characterized in that: the shape of the limiting block (512) is set to be rectangular, and the width of the limiting block (512) is larger than that of the second supporting rod (511).

6. The mold with the heat dissipation structure for hardware processing according to claim 3, characterized in that: the maximum compressed length of the spring (514) is less than the internal length of the die body (2).