CN212485408U - Liquid cooling plate and battery - Google Patents

Liquid cooling plate and battery Download PDF

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Publication number
CN212485408U
CN212485408U CN202021300636.5U CN202021300636U CN212485408U CN 212485408 U CN212485408 U CN 212485408U CN 202021300636 U CN202021300636 U CN 202021300636U CN 212485408 U CN212485408 U CN 212485408U
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China
Prior art keywords
plate
collecting pipe
liquid
liquid cooling
heat
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CN202021300636.5U
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Chinese (zh)
Inventor
何建
肖人漳
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Chongqing Jinkang Power New Energy Co Ltd
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Chongqing Jinkang Power New Energy Co Ltd
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Priority to CN202021300636.5U priority Critical patent/CN212485408U/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Abstract

The application provides a liquid cooling board and battery relates to battery heat dissipation technical field. The application provides a liquid cooling board includes: the heat-dissipating plate comprises an upper collecting pipe, a heat-dissipating plate and a lower collecting pipe; the lower end of the heat dissipation plate is fixed and communicated with the lower collecting pipe, and the lower collecting pipe is provided with a liquid outlet; the upper collecting pipe comprises an upper layer collecting pipe, a flow isolating plate and a lower layer collecting pipe, the upper layer collecting pipe is provided with a liquid inlet, the flow isolating plate is provided with a plurality of flow dividing holes, and the lower layer collecting pipe is fixed to and communicated with the upper end of the heat dissipation plate. The battery that this application provided, including the liquid cooling board that this application provided to alleviate among the prior art liquid cooling device and use plug type installation pipe for improving flow homogeneity, make liquid cooling device have the technical problem of weeping risk.

Description

Liquid cooling plate and battery
Technical Field
The application relates to the technical field of battery heat dissipation, in particular to a liquid cooling plate and a battery.
Background
The power battery needs to work within an optimal temperature range (such as 10-30 ℃), good power, cycle life and the like can be guaranteed, accidents such as fire and explosion and the like caused by thermal runaway can be caused due to overhigh temperature, the liquid cooling device can effectively heat and cool the battery and guarantee the temperature balance of the battery, and safety accidents are avoided or reduced, so that the liquid cooling device is very necessary for the normal work of the battery.
At present, the liquid cooling device is generally adopted by the industry to design a route of the liquid cooling pipe according to the position of the liquid cooling plate, change the pipe diameter of the liquid cooling pipe and the inner diameter of the liquid cooling pipe joint, change the inner diameters of the water inlet joint and the water outlet joint of the liquid cooling plate and the like, adjust the flow of each liquid cooling plate, and improve the flow uniformity of the whole liquid cooling device.
The disadvantages of this liquid cooling device are mainly: if good flow uniformity is to be realized, the types of liquid cooling pipes with different pipe diameters, liquid cooling pipe quick-plug connectors and liquid cooling plate water inlet and outlet connectors are increased, so that the types of parts of the liquid cooling device are increased, the production period is long, the overall cost is increased, and the installation efficiency is low; secondly, because there is liquid cooling pipe quick connector, the pulling-out power of quick connector at present generally is less than 600N, and in whole life cycle, the rubber spare takes place the condition such as ageing, plug many times and plug not in place, all can increase the weeping risk, reduces the reliability of whole liquid cooling board.
SUMMERY OF THE UTILITY MODEL
The application provides a liquid cooling board to alleviate among the prior art liquid cooling device and use plug type installation pipe in order to improve flow homogeneity, make liquid cooling device have the technical problem of weeping risk.
A first aspect of the present application provides a liquid cooling panel comprising:
the heat-dissipating plate comprises an upper collecting pipe, a heat-dissipating plate and a lower collecting pipe;
the lower end of the heat dissipation plate is fixed and communicated with the lower collecting pipe, and the lower collecting pipe is provided with a liquid outlet;
the upper collecting pipe comprises an upper layer collecting pipe, a flow isolating plate and a lower layer collecting pipe, the upper layer collecting pipe is provided with a liquid inlet, the flow isolating plate is provided with a plurality of flow dividing holes, and the lower layer collecting pipe is fixed to and communicated with the upper end of the heat dissipation plate.
In a possible design, a welding ring is arranged between the lower-layer collecting pipe and the heat dissipation plate, and the welding ring is welded with the lower-layer collecting pipe and the heat dissipation plate respectively.
In one possible design, the weld ring includes:
the first end face is used for being attached to the lower-layer collecting pipe;
and the second end face is used for being attached to the radiating plate.
In a possible design, the heat dissipation plate is provided in a plurality, and a plurality of the heat dissipation pipes are arranged in parallel at intervals.
In one possible design, a plurality of channels are provided in the heat sink.
In one possible design, the lower header and the heat sink are connected by welding.
In one possible design, the heat sink is in the shape of a harmonica.
In one possible design, the upper current collector, the heat sink, the lower current collector and the weld ring are all made of aluminum or aluminum alloy.
In one possible design, the cross section of the upper layer collecting pipe is rectangular, square, circular or semicircular;
the cross section of the lower-layer collecting pipe is rectangular, square, circular or semicircular.
A second aspect of the present application provides a battery comprising any one of the liquid-cooled panels.
The technical scheme provided by the application can achieve the following beneficial effects:
when the liquid cooling plate provided by the application is used, liquid enters from the liquid inlet and flows into the upper collecting pipe of the upper collecting pipe, the middle flow partition plate is provided with the flow dividing holes, the liquid enters the heating panel through the flow dividing holes, then flows to the lower collecting pipe, and finally the liquid flows out through the liquid outlet. In the design, the uniformity of the flow distribution of the liquid cooling plate can be improved by adjusting the hole opening aperture, the number, the hole opening position and the like of the shunting holes, and the functions of effectively heating, cooling and temperature equalization of the battery are realized.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application, as provided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a liquid cooling plate according to an embodiment of the present disclosure;
FIG. 2 is a cross-sectional view of an upper header provided in an embodiment of the present application;
fig. 3 is a schematic view of a solder ring and a heat sink plate according to an embodiment of the present disclosure;
FIG. 4 is a schematic structural diagram of a weld ring provided in an embodiment of the present application;
FIG. 5 is a sectional view of the main liquid inlet side.
Reference numerals:
1-liquid inlet;
2-an upper header;
201-upper layer collecting pipe;
202-a flow isolating plate;
202 a-a tap hole;
203-lower layer collecting pipe;
205-lower header aperture;
3-heat exchange plates;
4-a lower header;
5-a liquid outlet;
6-welding a ring;
601-a first end face;
602-second end face.
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
Detailed Description
For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.
It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be noted that the terms "upper", "lower", "left", "right", and the like used in the embodiments of the present application are described in terms of the angles shown in the drawings, and should not be construed as limiting the embodiments of the present application. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element via an intermediate element.
As shown in fig. 1, 3 and 5, a liquid cooling plate provided in an embodiment of the present application includes: an upper header 2, a heat radiation plate and a lower header 4; the lower end of the heat dissipation plate is fixed and communicated with the lower collecting pipe 4, and the lower collecting pipe 4 is provided with a liquid outlet; the upper header 2 includes an upper header 201, a flow isolating plate 202, and a lower header 203, the upper header 201 has a liquid inlet 1, the flow isolating plate 202 has a plurality of flow dividing holes 202a, and the lower header 203 is fixed to and communicated with the upper end of the heat dissipating plate. The liquid enters from the liquid inlet 1 and flows into the upper layer collecting pipe 201 of the upper collecting pipe 2, the middle flow partition plate 202 is provided with a flow dividing hole 202a, the liquid enters the heat dissipation plate through the flow dividing hole 202a and then flows to the lower layer collecting pipe 203, and finally the liquid flows out through the liquid outlet. In the design, the uniformity of the flow distribution of the liquid cooling plate can be improved by adjusting the hole opening aperture, the number, the hole opening position and the like of the shunting holes 202a, and the functions of effective heating, cooling and temperature equalization of the battery are realized.
The flow isolating plate 202 extends along the length direction of the lower header 4, the lower header 4 is divided into a double-layer header with an upper cavity and a lower cavity, the two cavities are the upper header 201 and the lower header 203 respectively, the lower header hole 205 is formed by one-step die punching, and then die punching or CNC machining of the flow dividing hole 202a in the middle flow isolating plate 202 is performed. In this double-deck reposition of redundant personnel structure liquid cold plate, there is not quick connector, has reduced the weeping risk.
Referring to fig. 2, the lower header 4 is mainly divided into an upper header 201, a flow divider 202, and a lower header 203, the lower header 4 has a single-layer structure, the upper header 2 has a double-layer structure, and the lower header 4 and the upper header 2 are both integrally molded by extrusion.
As shown in fig. 3, a harmonica-shaped heat dissipation plate is arranged between the upper header 2 and the lower header 4, micro-channels are arranged in the heat dissipation plate, the heat dissipation plate is also formed by extrusion molding of a die, the common width is 30-100mm, the thickness is 3-6mm, the number of the internal branch flow holes 202a is about 5-12, the micro-channel structure increases the heat dissipation area of the heat dissipation plate, and the cooling and heating effects are obvious.
As shown in fig. 4 and 5, a weld ring 6 is provided between the lower header 203 and the heat sink, and the weld ring 6 is welded to the lower header 203 and the heat sink, respectively.
Generally, the lower header 203 and each heat dissipation plate are directly welded, and the welding effective area is small. As shown in fig. 3, a weld ring 6 structure is designed between the lower layer header 203 and each heat dissipation plate, and the weld ring 6 structure is also formed by die stamping. As shown in fig. 4, the weld ring 6 includes: the first end surface 601 is used for being attached to the lower-layer collecting pipe 203; the second end face 602, the second end face 602 is used for attaching to a heat sink. The first end 601 increases the welding area between the weld ring 6 and the lower header 203, and the second end 602 increases the welding area between the weld ring 6 and the heat dissipation plate. After the whole welding area is increased, the structural strength of the welding area can be improved, and the liquid leakage risk is reduced.
The lower collecting pipe 4 and the heat dissipation plate are formed by brazing, the connection between molecules or atoms is formed, the bursting pressure is larger than or equal to 3MPa and is far larger than about 2MPa of the bursting pressure of the PA hose with the quick connector, and the reliability of the liquid cooling plate is improved.
The lower header 203 is provided with a lower header hole 205, and the end of the heat dissipating plate is inserted into the lower header hole 205 and fixed to the lower header 203.
In a specific implementation mode, the heat dissipation plate is arranged in a plurality of parallel heat dissipation pipes at intervals, so that the heat dissipation area of the heat dissipation plate is increased, and the cooling and heating effects are remarkable.
In a specific embodiment, a plurality of channels are arranged in the heat dissipation plate, so that the heat dissipation area of the heat dissipation plate is increased, and the cooling and heating effects are remarkable, wherein the channels can be micro-channels, and the equivalent diameter of the channels is 10-1000 μm.
In a specific embodiment, the lower-layer header 203 and the heat dissipation plate are connected by welding to form a connection between molecules or atoms, thereby improving the connection strength.
In a particular embodiment, the heat sink is in the shape of a harmonica.
In one embodiment, the upper header 2, the heat sink, the lower header 4 and the weld ring 6 are made of aluminum or an aluminum alloy.
As shown in fig. 2, the cross section of the upper layer header 201 is rectangular, square, circular or semicircular; the cross section of the lower collecting pipe 203 is rectangular, square, round or semicircular, so that the extrusion molding is convenient, and the processing method is simple.
Embodiments of the present application also provide a battery including any one of the liquid-cooled panels. The battery that this application provided has the same advantage for prior art under the liquid cold plate that this application provided, and it is no longer repeated here.
In conclusion, the liquid cooling plate provided by the application adopts the upper collecting pipe 2 of the double-layer shunt structure, has no quick connector, reduces the liquid leakage risk of the liquid cooling plate, and improves the reliability of the liquid cooling plate.
By adjusting the hole opening aperture, the number, the hole opening position and the like of the shunting holes 202a, the uniformity of the flow distribution of the liquid cooling plate is improved, and the functions of effective heating, cooling and temperature equalization of the battery are realized.
A welding ring 6 structure is designed between the lower-layer collecting pipe 203 and each heat dissipation plate, the whole welding area is increased, the structural strength of the welding ring can be improved, and the liquid leakage risk is reduced.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

1. A liquid cooling panel, comprising: the heat-dissipating plate comprises an upper collecting pipe, a heat-dissipating plate and a lower collecting pipe;
the lower end of the heat dissipation plate is fixed and communicated with the lower collecting pipe, and the lower collecting pipe is provided with a liquid outlet;
the upper collecting pipe comprises an upper layer collecting pipe, a flow isolating plate and a lower layer collecting pipe, the upper layer collecting pipe is provided with a liquid inlet, the flow isolating plate is provided with a plurality of flow dividing holes, and the lower layer collecting pipe is fixed to and communicated with the upper end of the heat dissipation plate.
2. The liquid cold plate of claim 1, wherein a weld ring is disposed between said lower manifold and said heat sink, said weld ring being welded to said lower manifold and said heat sink, respectively.
3. The liquid cooled plate of claim 2, wherein the weld ring comprises:
the first end face is used for being attached to the lower-layer collecting pipe;
and the second end face is used for being attached to the radiating plate.
4. The liquid cooled plate of claim 1, wherein said plate is provided in a plurality of parallel spaced apart plates.
5. The liquid cooled plate of claim 1, wherein a plurality of passages are provided in the heat sink plate.
6. The liquid cold plate of claim 1, wherein said lower manifold is connected to said heat sink plate by welding.
7. The liquid cooled plate of claim 1, wherein the heat spreader plate is harmonica shaped.
8. The liquid cooled plate of claim 2, wherein the upper manifold, the heat sink, the lower manifold, and the weld ring are all aluminum or an aluminum alloy.
9. The liquid cold plate of claim 1, wherein said upper manifold has a rectangular, square, circular or semi-circular cross-section;
the cross section of the lower-layer collecting pipe is rectangular, square, circular or semicircular.
10. A battery comprising the liquid-cooled panel according to any one of claims 1 to 9.
CN202021300636.5U 2020-07-06 2020-07-06 Liquid cooling plate and battery Active CN212485408U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021300636.5U CN212485408U (en) 2020-07-06 2020-07-06 Liquid cooling plate and battery

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021300636.5U CN212485408U (en) 2020-07-06 2020-07-06 Liquid cooling plate and battery

Publications (1)

Publication Number Publication Date
CN212485408U true CN212485408U (en) 2021-02-05

Family

ID=74456976

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021300636.5U Active CN212485408U (en) 2020-07-06 2020-07-06 Liquid cooling plate and battery

Country Status (1)

Country Link
CN (1) CN212485408U (en)

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