CN212485337U - Stable form slice triode structure - Google Patents

Stable form slice triode structure Download PDF

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Publication number
CN212485337U
CN212485337U CN202020943547.6U CN202020943547U CN212485337U CN 212485337 U CN212485337 U CN 212485337U CN 202020943547 U CN202020943547 U CN 202020943547U CN 212485337 U CN212485337 U CN 212485337U
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CN
China
Prior art keywords
sheet
conducting
conducting rod
triode
platform
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Expired - Fee Related
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CN202020943547.6U
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Chinese (zh)
Inventor
黄志军
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Heyuan Chuangji Electronic Technology Co ltd
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Heyuan Chuangji Electronic Technology Co ltd
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Priority to CN202020943547.6U priority Critical patent/CN212485337U/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601Structure
    • H01L2224/0603Bonding areas having different sizes, e.g. different heights or widths

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model provides a stable slice triode structure, which comprises an insulation packaging body, a first conductive pin, a second conductive pin, a third conductive pin and a triode chip, wherein the insulation packaging body comprises an insulation sealing cover and a heat dissipation insulating base, the heat dissipation insulating base is provided with a first accommodating groove, a second accommodating groove and a third accommodating groove, and a first insulating block and a second insulating block are fixed on the heat dissipation insulating base; two electrodes of the triode chip are respectively welded with a first conducting rod and a second conducting rod, one end of the first conducting rod is fixed with a first conducting column, the first conducting column is connected with the first platform sheet in a welding mode, a first insulating block is supported at the bottom of the first conducting rod, one end of the second conducting rod is fixed with a second conducting column, the second conducting column is connected with the second platform sheet in a welding mode, and the second insulating block is supported at the bottom of the second conducting rod. The utility model discloses can effectively improve overall structure's slimming degree, can also effectively improve heat dispersion, overall structure is stable firm.

Description

Stable form slice triode structure
Technical Field
The utility model relates to a triode specifically discloses a stable form thin slice triode structure.
Background
The triode, which is called a semiconductor triode entirely, is a semiconductor device for controlling current. The function of the device is to amplify a weak signal into an electric signal with a large amplitude value, and the device is also used as a contactless switch and is a core element of an electronic circuit.
The triodes generally comprise plug-in triodes and patch triodes, and in the modern society that miniaturized electronic products are more and more widely applied, the patch triodes have thinner appearance structures, so that the application frequency of the patch triodes is higher. In the prior art, the patch type triode mainly comprises an insulating packaging body, a triode chip and a conductive pin, wherein the conductive pin is connected with the triode chip through a lead, the insulating packaging body can be set to be thick enough for matching with a lead with an irregular shape, and the thinning degree is not enough.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a stable slice triode structure, which has a high thinning degree of the whole structure, a stable and firm structure, and good heat dissipation performance, in order to solve the problems in the prior art.
In order to solve the prior art problems, the utility model discloses a stable slice triode structure, which comprises an insulation packaging body, a first conductive pin, a second conductive pin, a third conductive pin and a triode chip, wherein the first conductive pin comprises a first platform sheet, a first bending sheet and a first welding foot sheet which are integrally formed, the second conductive pin comprises a second platform sheet, a second bending sheet and a second welding foot sheet, the third conductive pin comprises a third platform sheet, a third bending sheet and a third welding foot sheet which are integrally formed, the insulation packaging body comprises an insulation sealing cover and a heat dissipation insulation seat, the heat dissipation insulation seat is provided with a first accommodating groove, a second accommodating groove and a third accommodating groove, the first platform sheet is embedded into the first accommodating groove, the second platform sheet is embedded into the second accommodating groove, the third platform sheet is embedded into the third accommodating groove, the first insulation block and the second insulation block are fixed on the heat dissipation insulation seat, the thickness in the triode core is D;
the bottom electrode of the triode chip is welded on the third platform sheet, the first conducting rod and the second conducting rod are respectively welded on two electrodes at the top of the triode chip, the bottom of one end, away from the triode chip, of the first conducting rod is fixedly provided with a first conducting column, the first conducting column is connected with the first platform sheet in a welding mode, the first insulating block is supported at the bottom of the first conducting rod, the bottom of one end, away from the triode chip, of the second conducting rod is fixedly provided with a second conducting column, the second conducting column is connected with the second platform sheet in a welding mode, and the second insulating block is supported at the bottom of the second conducting rod;
the first conducting rod, the first conducting column, the second conducting rod and the second conducting column are regular prisms, the widths of the first conducting rod, the first conducting column, the second conducting rod and the second conducting column are D, and D is not less than 0.5D and not more than D.
Furthermore, the heat dissipation insulating base is an insulating ceramic base.
Furthermore, a first clamping groove is formed in the bottom of the first accommodating groove, a first clamping strip is integrally formed at the bottom of the first platform piece, and the first clamping strip is located in the first clamping groove; a second clamping groove is formed in the bottom of the second accommodating groove, a second clamping strip is integrally formed at the bottom of the second platform sheet, and the second clamping strip is located in the second clamping groove; the bottom of the third accommodating groove is provided with a third clamping groove, the bottom of the third platform sheet is integrally formed with a third clamping strip, and the third clamping strip is positioned in the third clamping groove.
Furthermore, a first limiting groove is formed in the first insulating block, and the first conducting rod is clamped in the first limiting groove; the second insulating block is provided with a second limiting groove, and the second conducting rod is clamped in the second limiting groove.
Furthermore, the upper surfaces of the first platform sheet, the second platform sheet, the third platform sheet and the heat dissipation insulating base are coplanar, the heights of the first conductive column and the second conductive column are both H, and H is equal to D.
Furthermore, one end of the first conducting rod close to the triode chip is provided with a first welding yielding hole, and one end of the second conducting rod close to the triode chip is provided with a second welding yielding hole.
The utility model has the advantages that: the utility model discloses a stable form thin slice triode structure is provided with special chamber structure and the electrically conductive connection structure that holds, electrically conductive pin inlays in heat dissipation insulating seat, not only can effectively improve overall structure's slimming degree, can also effectively improve heat dispersion, the conducting rod of structure rule can effectively reduce the required thickness of insulating encapsulation lid with leading electrical pillar to further improve overall structure's slimming degree, in addition, the cooperation collets support and spacing, triode overall structure is stable firm.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic view of the split structure of the present invention.
The reference signs are: the package comprises an insulating package body 10, an insulating cover 11, a heat dissipation insulating base 20, a first accommodating groove 21, a first clamping groove 211, a second accommodating groove 22, a second clamping groove 221, a third accommodating groove 23, a third clamping groove 231, a first insulating block 24, a first limiting groove 241, a second insulating block 25, a second limiting groove 251, a first conductive pin 30, a first platform sheet 31, a first clamping strip 311, a first bending sheet 32, a first welding pin sheet 33, a second conductive pin 40, a second platform sheet 41, a second clamping strip 411, a second bending sheet 42, a second welding pin sheet 43, a third conductive pin 50, a third platform sheet 51, a third clamping strip 511, a third bending sheet 52, a third welding pin sheet 53, a triode chip 60, a first conductive rod 61, a first conductive column 611, a first welding abdicating hole 612, a second conductive rod 62, a second conductive rod 621, and a second welding abdicating hole 622.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
Refer to fig. 1 and 2.
The embodiment of the utility model discloses a stable form thin slice triode structure, including insulating packaging body 10, first conductive pin 30, second conductive pin 40, third conductive pin 50 and triode chip 60, the three electrodes of triode chip 60 are base, collector and emitter respectively, the collector is set up in the bottom of triode chip 60 under the normal condition, base and emitter are set up in the top of triode chip 60, first conductive pin 30 and second conductive pin 40 and third conductive pin 50 are Z-shaped structure, first conductive pin 30 includes integrated into one piece's first platform piece 31, first bending piece 32 and first welding foot piece 33, second conductive pin 40 includes second platform piece 41, second bending piece 42 and second welding foot piece 43, third conductive pin 50 includes integrated into one piece's third platform piece 51, third bending piece 52 and third welding foot piece 53, the insulating package 10 includes an insulating cover 11 and a heat-dissipating insulating base 20, the heat-dissipating insulating base 20 is provided with a first receiving groove 21, a second receiving groove 22 and a third receiving groove 23 which are arranged at intervals, the first platform sheet 31 is embedded in the first receiving groove 21, the second platform sheet 41 is embedded in the second receiving groove 22, the third platform sheet 51 is embedded in the third receiving groove 23, the heat-dissipating insulating base 20 is fixed with a first insulating block 24 and a second insulating block 25, the first insulating block 24 is located between the first receiving groove 21 and the third receiving groove 23, the second insulating block 25 is located between the second receiving groove 22 and the third receiving groove 23, preferably, the first insulating block 24 and the second insulating block 25 are integrated with the heat-dissipating insulating base 20, and the thickness in the triode chip 60 is D;
the bottom electrode of the triode chip 60 is welded on the third platform sheet 51, the first conducting rod 61 and the second conducting rod 62 are respectively welded on two electrodes at the top of the triode chip 60, the bottom of the first conducting rod 61 far away from one end of the triode chip 60 is fixed with a first conducting post 611, the first conducting rod 61 and the first conducting post 611 are of an integrated structure, the first conducting post 611 is connected with the first platform sheet 31 in a welded manner, the first insulating block 24 is supported at the bottom of the first conducting rod 61, the bottom of the second conducting rod 62 far away from one end of the triode chip 60 is fixed with a second conducting post 621, the second conducting rod 62 and the second conducting post 621 are of an integrated structure, the second conducting post 621 is connected with the second platform sheet 41 in a welded manner, and the second insulating block 25 is supported at the bottom of the second conducting rod 62;
the first conductive rod 61, the first conductive column 611, the second conductive rod 62 and the second conductive column 621 are regular prisms, the widths of the first conductive rod 61, the first conductive column 611, the second conductive rod 62 and the second conductive column 621 are D, and D is not less than 0.5D and not more than D, so that the first conductive rod 61, the first conductive column 611, the second conductive rod 62 and the second conductive column 621 are ensured to have sufficient mechanical strength, and the conductive rod is strong in rigidity and not easy to deform.
During production and manufacturing, the three conductive pins are clamped in the three accommodating grooves in an embedded mode, the conductive rods and the conductive columns are welded at corresponding positions through solder paste, and finally injection molding is carried out on the conductive rods and the conductive columns to obtain the insulating sealing cover 11. The conductive pins are embedded in the heat dissipation insulating base 20, the first conductive rod 61 cannot be arched upwards, the thickness of the triode can be effectively reduced, and the requirements of modern electronic products on light and thin design can be met; the cross sections of the conductive rod and the conductive column are large enough, the rigid conductive rod and the rigid conductive column are not easy to bend in the injection molding process, the mechanical resistance is strong, the stability and the firmness of the whole structure can be effectively ensured, and the problem of short circuit caused by bending of the connecting structure can be avoided; in addition, the bottom of conducting rod still supports spacingly through the insulating block, can further avoid the conducting rod and the emergence short circuit of the contact of third conductive pin 50, overall structure's good reliability, the insulating block can also effectively improve and insulating closing cap 11 between each side area of contact to effectively improve the fastness of structure between insulating radiating seat and the insulating closing cap 11.
In this embodiment, the heat dissipation insulating base 20 is an insulating ceramic base, and the insulating ceramic base has good insulating property and heat dissipation performance, so that the heat dissipation performance of the whole triode structure can be effectively improved.
In this embodiment, the first locking groove 211 is disposed at the bottom of the first accommodating groove 21, the first locking bar 311 is integrally formed at the bottom of the first platform sheet 31, and the first locking bar 311 is located in the first locking groove 211; a second clamping groove 221 is formed at the bottom of the second accommodating groove 22, a second clamping strip 411 is integrally formed at the bottom of the second platform sheet 41, and the second clamping strip 411 is positioned in the second clamping groove 221; the tank bottom of the third accommodating tank 23 is provided with a third clamping groove 231, the bottom of the third platform sheet 51 is integrally formed with a third clamping strip 511, the third clamping strip 511 is positioned in the third clamping groove 231, and through the matching of the clamping strip and the clamping groove, the firmness of the connecting structure between the conductive pin and the heat dissipation insulating base 20 can be further improved, so that the whole structure of the triode is stable and firm, and the shock resistance is strong.
In this embodiment, the first insulating block 24 is provided with a first limiting groove 241, and the first conductive rod 61 is clamped in the first limiting groove 241; be equipped with second spacing groove 251 on the second insulating block 25, second conducting rod 62 joint is in second spacing groove 251, carries on spacingly through the spacing groove to the conducting rod, can further ensure that the position of conducting rod is stable firm, and difficult skew avoids the triode inner structure to appear virtual joint scheduling problem.
In this embodiment, the upper surface of the first platform piece 31, the upper surface of the second platform piece 41, the upper surface of the third platform piece 51 and the upper surface of the heat dissipation insulating base 20 are coplanar, that is, the first platform piece 31 and the thickness are equal to the depth of the first accommodating groove 21, the second platform piece 41 and the thickness are equal to the depth of the second accommodating groove 22, the third platform piece 51 and the thickness are equal to the depth of the third accommodating groove 23, the heights of the first conductive pillar 611 and the second conductive pillar 621 are both H, and H is D, that is, the conductive rod is directly attached to the electrode on the top of the triode chip 60, which can effectively improve the stability of the overall structure.
Based on the above embodiment, the end of the first conducting rod 61 close to the triode chip 60 is provided with the first welding abdicating hole 612, the end of the second conducting rod 62 close to the triode chip 60 is provided with the second welding abdicating hole 622, and the soldering tin passes through the welding abdicating hole to connect the conducting rod and the electrode at the top of the triode chip 60, so that the welding structure is firmer, and the welding operation is more convenient.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (6)

1. A stable slice triode structure comprises an insulation packaging body (10), a first conductive pin (30), a second conductive pin (40), a third conductive pin (50) and a triode chip (60), wherein the first conductive pin (30) comprises a first platform sheet (31), a first bent sheet (32) and a first welding pin sheet (33) which are integrally formed, the second conductive pin (40) comprises a second platform sheet (41), a second bent sheet (42) and a second welding pin sheet (43), the third conductive pin (50) comprises a third platform sheet (51), a third bent sheet (52) and a third welding pin sheet (53) which are integrally formed, the stable slice triode structure is characterized in that the insulation packaging body (10) comprises an insulation sealing cover (11) and a heat dissipation insulation seat (20), and a first accommodating groove (21), a second accommodating groove (22) and a third accommodating groove (23) are arranged on the heat dissipation insulation seat (20), the first platform piece (31) is embedded into the first accommodating groove (21), the second platform piece (41) is embedded into the second accommodating groove (22), the third platform piece (51) is embedded into the third accommodating groove (23), a first insulating block (24) and a second insulating block (25) are fixed on the heat dissipation insulating base (20), and the thickness in the triode chip (60) is D;
the bottom electrode of the triode chip (60) is welded on the third platform sheet (51), a first conducting rod (61) and a second conducting rod (62) are respectively welded on two electrodes at the top of the triode chip (60), a first conducting column (611) is fixed at the bottom of one end, away from the triode chip (60), of the first conducting rod (61), the first conducting column (611) is connected with the first platform sheet (31) in a welding mode, the first insulating block (24) is supported at the bottom of the first conducting rod (61), a second conducting column (621) is fixed at the bottom of one end, away from the triode chip (60), of the second conducting rod (62), the second conducting column (621) is connected with the second platform sheet (41) in a welding mode, and the second insulating block (25) is supported at the bottom of the second conducting rod (62);
the first conducting rod (61), the first conducting post (611), the second conducting rod (62) and the second conducting post (621) are regular prisms, the widths of the first conducting rod (61), the first conducting post (611), the second conducting rod (62) and the second conducting post (621) are D, and D is greater than or equal to 0.5D and less than or equal to D.
2. A stabilized foil triode structure according to claim 1, wherein the heat-dissipating and insulating mount (20) is an insulating ceramic mount.
3. The stable type thin-sheet triode structure according to claim 1, wherein a first locking groove (211) is formed at the bottom of the first accommodating groove (21), a first locking bar (311) is integrally formed at the bottom of the first platform sheet (31), and the first locking bar (311) is located in the first locking groove (211); a second clamping groove (221) is formed in the bottom of the second accommodating groove (22), a second clamping strip (411) is integrally formed at the bottom of the second platform sheet (41), and the second clamping strip (411) is located in the second clamping groove (221); the bottom of the third accommodating groove (23) is provided with a third clamping groove (231), a third clamping strip (511) is integrally formed at the bottom of the third platform sheet (51), and the third clamping strip (511) is positioned in the third clamping groove (231).
4. The stable type slice triode structure according to claim 1, wherein the first insulation block (24) is provided with a first limiting groove (241), and the first conductive rod (61) is clamped in the first limiting groove (241); a second limiting groove (251) is formed in the second insulating block (25), and the second conducting rod (62) is clamped in the second limiting groove (251).
5. The stable sheet triode structure according to claim 1, wherein the upper surfaces of the first platform sheet (31), the second platform sheet (41), the third platform sheet (51) and the heat dissipation insulating base (20) are coplanar, and the heights of the first conductive pillar (611) and the second conductive pillar (621) are H, H ═ D.
6. A stabilized foil triode structure according to claim 5, wherein one end of the first conducting rod (61) close to the triode chip (60) is provided with a first welding abdication hole (612), and one end of the second conducting rod (62) close to the triode chip (60) is provided with a second welding abdication hole (622).
CN202020943547.6U 2020-05-28 2020-05-28 Stable form slice triode structure Expired - Fee Related CN212485337U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020943547.6U CN212485337U (en) 2020-05-28 2020-05-28 Stable form slice triode structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020943547.6U CN212485337U (en) 2020-05-28 2020-05-28 Stable form slice triode structure

Publications (1)

Publication Number Publication Date
CN212485337U true CN212485337U (en) 2021-02-05

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020943547.6U Expired - Fee Related CN212485337U (en) 2020-05-28 2020-05-28 Stable form slice triode structure

Country Status (1)

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CN (1) CN212485337U (en)

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Address after: 517300 No. 10-4, Shenzhen Bao'an (Longchuan) industrial transfer industrial park, Dengyun Town, Longchuan County, Heyuan City, Guangdong Province

Patentee after: HEYUAN CHUANGJI ELECTRONIC TECHNOLOGY Co.,Ltd.

Address before: No. 10-4, Shenzhen Nanshan (Longchuan) industrial transfer park, Heyuan City, Guangdong Province, 517300

Patentee before: HEYUAN CHUANGJI ELECTRONIC TECHNOLOGY Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20210205