CN212485292U

CN212485292U - Chip vacuum suction table

Info

Publication number: CN212485292U
Application number: CN202021367690.1U
Authority: CN
Inventors: 闫小改
Original assignee: Kakeconn Precision Technology Co ltd
Current assignee: Kakeconn Precision Technology Co ltd
Priority date: 2020-07-13
Filing date: 2020-07-13
Publication date: 2021-02-05
Anticipated expiration: 2030-07-13

Abstract

The utility model discloses a chip vacuum suction table, which comprises a base and an adsorption structure, wherein the adsorption structure is arranged in the middle of the upper surface of the base, the adsorption structure also comprises an adsorption box and an upper cover, and the adsorption box is in threaded connection with the upper cover; the utility model discloses a be equipped with first cavity, second cavity and third cavity, need not all cavities all take out into the negative pressure, can be according to the size of chip, take out into the negative pressure with the cavity of placing the district below that one of them needs to use can, play and save the effect that can the energy, first place the district, the district is placed to the second and the third is placed the district and can be placed different side length size's chip alone, and first place the district, the district is placed to the second and the third is placed the district and is passed through the intercombination, also can place different side length size's chip, therefore, even the side length size undersize of chip, also can avoid the vacuum adsorption workstation gas leakage phenomenon to appear, the needs of production have been satisfied.

Description

Chip vacuum suction table

Technical Field

The utility model relates to a platform technical field is inhaled in the vacuum, specifically is a platform is inhaled in chip vacuum.

Background

At a plurality of process flows of panel preparation, like base plate cutting, panel bonding and panel surface pad pasting etc. all need to adopt the vacuum adsorption workstation, fix the panel on the workstation earlier through evacuating device, carry out subsequent technology processing again, consequently, the chip also need place when processing and inhale bench at the vacuum and process, but, the current vacuum is inhaled the platform and is had some not enoughly, for example:

the side length size diverse of chip among the prior art, when with the chip of different side length sizes, if the side length size undersize of chip, the part suction opening that does not cover the chip on the workstation communicates with the external world, leads to the vacuum adsorption workstation to appear leaking gas the phenomenon, if the side length size of chip is too big, the workstation can not be fixed the chip completely, can not satisfy the needs of production.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a platform is inhaled in chip vacuum to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a chip vacuum suction table comprises a base and an adsorption structure, wherein the adsorption structure is installed in the middle of the upper surface of the base, the adsorption structure further comprises an adsorption box and an upper cover, the adsorption box is in threaded connection with the upper cover, a first cavity, a second cavity and a third cavity are arranged inside the adsorption box, one side of each of the first cavity, the second cavity and the third cavity is hermetically connected with a second air exhaust pipe, the middle of the upper surface of each second air exhaust pipe is fixedly connected with a control valve through a bolt, the other side of the middle of the upper surface of the base is fixedly connected with an air pump through a bolt, the input end of the air pump is hermetically connected with a hose, the other end of the hose is hermetically connected with a first air exhaust pipe, the other end of each second air exhaust pipe is hermetically connected with the first air exhaust pipe, a first placing area, a second placing area and a third placing area are arranged on the upper surface of the upper cover, the surface of the first placing area, the surface of the second placing area and the surface of the third placing area are provided with a plurality of air exhaust holes, one side of the base is fixedly connected with a controller through bolts, the controller is electrically connected with an external power supply, and the three control valves are electrically connected with the controller.

Preferably, the adsorption structure still includes the connecting rod, base upper surface middle part is rotated through the bearing and is connected with the connecting rod, bolt fixedly connected with brace table is passed through to the one end of connecting rod, brace table upper surface middle part both sides are all through bolt fixedly connected with electric telescopic handle, two electric telescopic handle's one end with the adsorption tank passes through bolt fixed connection, two electric telescopic handle with controller electric connection.

Preferably, rubber pads are adhered to the ends, contacting with the inner wall of the upper cover, of the first cavity, the second cavity and the third cavity.

Preferably, the first cavity has a side length equal to that of the first placement area, the second cavity has a side length equal to that of the second placement area, and the third cavity has a side length equal to that of the third placement area.

Preferably, the length dimension of the first placement area is not less than the sum of the length dimensions of the second placement area and the third placement area, and the width dimension of the second placement area is greater than the width dimension of the third placement area.

Preferably, the air exhaust holes are uniformly arranged.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model is provided with the first cavity, the second cavity and the third cavity, and controls the closing and opening of three different control valves respectively through the controller, the air in the different cavities can be pumped out, and then the chips with different side lengths can be placed in different placing areas without pumping all the cavities into negative pressure, and the cavity below one placing area to be used can be pumped into negative pressure according to the size of the chip, thereby saving energy, the first placing area, the second placing area and the third placing area can place the chips with different side lengths independently, and the chips with different side lengths can be placed in the first placing area, the second placing area and the third placing area through mutual combination, therefore, even if the side lengths of the chips are too small, the air leakage phenomenon of the vacuum adsorption workbench can be avoided, also can prevent because the length of side of chip size is too big, the workstation can not appear the condition that the chip is fixed completely, has satisfied the needs of production, in addition, through being equipped with electric telescopic handle, through controller control electric telescopic handle's lift, can control the lift of adsorption tank, and then can control the height that the chip was placed, the staff of being convenient for processes the chip.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic sectional view of the adsorption tank of the present invention;

FIG. 3 is a schematic view of the top-view cross-sectional structure of the adsorption box of the present invention;

fig. 4 is a schematic view of the top cover of the present invention.

In the figure: 1-a base; 11-a controller; 2-an adsorption structure; 21-a connecting rod; 22-a support table; 23-an electric telescopic rod; 24-an adsorption tank; 25-an air pump; 26-a hose; 27-a first extraction duct; 28-upper cover; 29-a first cavity; 210-a second cavity; 211-a third cavity; 212-a second extraction duct; 213-a control valve; 214-a first placement area; 215-a second placement area; 216-a third placement area; 217-air extraction hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a chip vacuum suction table comprises a base 1 and an adsorption structure 2, wherein the adsorption structure 2 is installed in the middle of the upper surface of the base 1, the adsorption structure 2 further comprises an adsorption box 24 and an upper cover 28, the adsorption box 24 is in threaded connection with the upper cover 28, a first cavity 29, a second cavity 210 and a third cavity 211 are arranged inside the adsorption box 24, one sides of the first cavity 29, one side of the second cavity 210 and one side of the third cavity 211 are respectively connected with a second air suction pipe 212 in a sealing mode, the middle of the upper surface of the second air suction pipe 212 is fixedly connected with a control valve 213 through a bolt, the type of the control valve 213 is PHS530S-03, the other side of the middle of the upper surface of the base 1 is fixedly connected with an air pump 25 through a bolt, the input end of the air pump 25 is connected with a hose 26 in a sealing mode, the length of the hose 26 is enough to meet the moving distance of the adsorption box 24, the other end, the other ends of the three second air suction pipes 212 are hermetically connected with the first air suction pipe 27, the upper surface of the upper cover 28 is provided with a first placing area 214, a second placing area 215 and a third placing area 216, the surfaces of the first placing area 214, the second placing area 215 and the third placing area 216 are provided with a plurality of air suction holes 217, one side of the base 1 is fixedly connected with a controller 11 through bolts, the model of the controller 11 is PLCS7-200, the controller 11 is electrically connected with an external power supply, the three control valves 213 are electrically connected with the controller 11, the controller 11 respectively controls the closing and opening of the three different control valves 213, so that air in different cavities can be sucked out, further chips with different side lengths and sizes can be placed in different placing areas, all cavities do not need to be sucked to have negative pressure, and according to the sizes of the chips, the adsorption structure 2 further comprises a connecting rod 21, the middle part of the upper surface of the base 1 is rotatably connected with the connecting rod 21 through a bearing, the angle of the adsorption box 24 can be adjusted by slightly rotating the connecting rod 21, the angle of a processed chip can be adjusted, and the operation of an operator is facilitated, one end of the connecting rod 21 is fixedly connected with a supporting table 22 through a bolt, two sides of the middle part of the upper surface of the supporting table 22 are fixedly connected with electric telescopic rods 23 through bolts, the model of each electric telescopic rod 23 is NKLA8, one end of each electric telescopic rod 23 is fixedly connected with the adsorption box 24 through a bolt, the two electric telescopic rods 23 are electrically connected with the controller 11, and the controller 11 controls the lifting of the electric telescopic rods 23, the lifting of the adsorption box 24 can be controlled, the placing height of the chip can be controlled, and the chip can be conveniently processed by a worker, rubber pads are adhered to one ends of the first cavity 29, the second cavity 210 and the third cavity 211, which are in contact with the inner wall of the upper cover 28, so that a closed space can be formed between the first cavity 210 and the first placing area 214, a closed space is formed between the second cavity 210 and the second placing area 215, a closed space is formed between the third cavity 211 and the third placing area 216, the side length of the first cavity 29 is equal to that of the first placing area 214, the side length of the second cavity 210 is equal to that of the second placing area 215, the side length of the third cavity 211 is equal to that of the third placing area 216, the length of the first placing area 214 is not less than the sum of the length of the second placing area 215 and the length of the third placing area 216, the first placing area 214, the second placing area 215 and the third placing area 216 can be used for placing chips with different side lengths independently, the first placing area 214, the second placing area 215 and the third placing area 216 are combined with each other to also be used for placing chips with different side lengths, the width of the second placing area 215 is larger than that of the third placing area 216, and the air suction holes 217 are uniformly arranged, so that the chips can be stressed uniformly when being adsorbed.

The working principle is as follows: when the chip placing device is used, a chip is placed on the surface of the upper cover 28, air in the first cavity 29, the second cavity 210 and the third cavity 211 is pumped out through the air pump 25 to form negative pressure, the chip can be adsorbed and fixed, the controller 11 controls the closing and opening of the three different control valves 213 respectively to pump out air in different cavities, and further, the chips with different side lengths can be placed in different placing areas, all the cavities are not required to be pumped into negative pressure, the cavity below one placing area needing to be used can be pumped into negative pressure according to the size of the chip to play a role in saving energy, the first placing area 214, the second placing area 215 and the third placing area 216 can be used for placing the chips with different side lengths independently, and the first placing area 214, the second placing area 215 and the third placing area 216 are combined with one another, also can place the chip of different length of side sizes, therefore, even the length of side size undersize of chip, also can avoid the vacuum adsorption workstation gas leakage phenomenon to appear, also can prevent because the length of side size of chip is too big, the workstation can not appear the condition that the chip is fixed completely, the needs of production have been satisfied, in addition, through being equipped with electric telescopic handle 23, through the lift of controller 11 control electric telescopic handle 23, can control the lift of absorption case 24, and then can control the height that the chip was placed, the staff of being convenient for processes the chip.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A chip vacuum chuck table, comprising:

a base (1);

an adsorption structure (2);

wherein the middle part of the upper surface of the base (1) is provided with an adsorption structure (2);

wherein, the adsorption structure (2) further comprises an adsorption box (24) and an upper cover (28), the adsorption box (24) is in threaded connection with the upper cover (28), a first cavity (29), a second cavity (210) and a third cavity (211) are arranged inside the adsorption box (24), one sides of the first cavity (29), the second cavity (210) and the third cavity (211) are all in sealing connection with a second air suction pipe (212), the middle part of the upper surface of the second air suction pipe (212) is fixedly connected with a control valve (213) through a bolt, the other side of the middle part of the upper surface of the base (1) is fixedly connected with an air pump (25) through a bolt, the input end of the air pump (25) is in sealing connection with a hose (26), the other end of the hose (26) is in sealing connection with a first air suction pipe (27), and the other ends of the second air suction pipes (212) are all in sealing connection with the first air suction pipe (27), the upper surface of upper cover (28) is provided with first district (214), second and the third district (216) of placing (215), first district (214) of placing, second place district (215) and the surface of third district (216) of placing all is provided with a plurality of aspirating hole (217), base (1) one side is through bolt fixedly connected with controller (11), controller (11) and external power source electric connection, three control valve (213) all with controller (11) electric connection.

2. The chip vacuum chuck as claimed in claim 1, wherein: the adsorption structure (2) further comprises:

a connecting rod (21);

wherein, base (1) upper surface middle part is connected with connecting rod (21) through the bearing rotation, bolt fixedly connected with brace table (22) is passed through to the one end of connecting rod (21), brace table (22) upper surface middle part both sides all are through bolt fixedly connected with electric telescopic handle (23), two the one end of electric telescopic handle (23) with adsorb case (24) and pass through bolt fixed connection, two electric telescopic handle (23) with controller (11) electric connection.

3. The chip vacuum chuck as claimed in claim 1, wherein: rubber pads are pasted at one ends of the first cavity (29), the second cavity (210) and the third cavity (211), which are in contact with the inner wall of the upper cover (28).

4. The chip vacuum chuck as claimed in claim 1, wherein: the first cavity (29) and the first placement area (214) are equal in side length size, the second cavity (210) and the second placement area (215) are equal in side length size, and the third cavity (211) and the third placement area (216) are equal in side length size.

5. The chip vacuum chuck as claimed in claim 1, wherein: the length dimension of the first placement area (214) is not less than the sum of the length dimensions of the second placement area (215) and the third placement area (216), and the width dimension of the second placement area (215) is greater than the width dimension of the third placement area (216).

6. The chip vacuum chuck as claimed in claim 1, wherein: the air pumping holes (217) are uniformly arranged.