CN212481753U - Super calculation center for heat pump recovery - Google Patents
Super calculation center for heat pump recovery Download PDFInfo
- Publication number
- CN212481753U CN212481753U CN201821821931.8U CN201821821931U CN212481753U CN 212481753 U CN212481753 U CN 212481753U CN 201821821931 U CN201821821931 U CN 201821821931U CN 212481753 U CN212481753 U CN 212481753U
- Authority
- CN
- China
- Prior art keywords
- chip
- insulating liquid
- pump
- heat
- condenser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000011084 recovery Methods 0.000 title claims abstract description 10
- 239000007788 liquid Substances 0.000 claims abstract description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000012530 fluid Substances 0.000 claims abstract description 6
- 239000003507 refrigerant Substances 0.000 description 8
- 238000001816 cooling Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/27—Relating to heating, ventilation or air conditioning [HVAC] technologies
- Y02A30/274—Relating to heating, ventilation or air conditioning [HVAC] technologies using waste energy, e.g. from internal combustion engine
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Other Air-Conditioning Systems (AREA)
Abstract
The utility model provides a super calculation center is retrieved to heat pump belongs to super calculation center field. The device comprises an insulating liquid circulating pump, a chip heat conduction box, a chip, a plate heat exchanger, a throttle valve, a compressor, a condenser and a water pump; the interior of the chip heat conduction box is filled with insulating liquid, and chips are fixedly arranged on the upper surface and the lower surface in a staggered manner, so that a cavity of the chip heat conduction box forms a snake-shaped fluid channel; the insulating liquid circulating pump, the chip heat conduction box and the plate heat exchanger are sequentially connected in a closed loop mode through an insulating liquid circulating pipe; the plate heat exchanger, the throttle valve, the condenser and the compressor are sequentially connected in a closed loop mode through pipelines; the condenser is connected with an external water demand place through a water pump. The utility model adopts the liquid convection heat transfer, the chip is intensively soaked in the insulating liquid, the volume is small, and the chip is convenient to maintain and replace; the heat pump is utilized to lift the water temperature, so that heat recovery is realized and energy is saved.
Description
Technical Field
The utility model belongs to super calculation center field relates to a super calculation center is retrieved to heat pump.
Background
The existing supercomputing center must have a huge water cooling system due to the heat dissipation of the chip, which inevitably brings inconvenience to the following aspects: firstly, the volume is large, and the water-cooling coil heat conduction blocks are adopted among the chips, so that the occupied space is large; secondly, the chips are troublesome to replace and maintain, the chips are tightly and fixedly installed by adopting the heat conducting blocks of the water-cooling coil pipes, and the chips can be replaced only by detaching the heat conducting blocks when the chips are to be replaced; thirdly, the chip emits a large amount of low-grade heat which is difficult to utilize, and the heat is discharged to the atmosphere, so that the waste is caused, and even the heat pollution is caused.
SUMMERY OF THE UTILITY MODEL
In order to solve the defects of the prior art, the utility model aims to provide a heat pump recovery super computing center. Liquid convection heat exchange is adopted, the chips are densely soaked in the insulating liquid, the size is small, and the chips are convenient to maintain and replace; the heat pump is utilized to lift the water temperature, so that heat recovery is realized and energy is saved.
The technical scheme of the utility model:
a heat pump recovery super computing center comprises an insulating liquid circulating pump, a chip heat conduction box, a chip, a plate heat exchanger, a throttle valve, a compressor, a condenser and a water pump; the interior of the chip heat conduction box is filled with insulating liquid, and chips are fixedly arranged on the upper surface and the lower surface in a staggered manner, so that a cavity of the chip heat conduction box forms a snake-shaped fluid channel; the insulating liquid circulating pump, the chip heat conduction box and the plate heat exchanger are sequentially connected in a closed loop mode through an insulating liquid circulating pipe; the plate heat exchanger, the throttle valve, the condenser and the compressor are sequentially connected in a closed loop mode through pipelines; the condenser is connected with an external water demand place through a water pump.
The working principle is as follows: under the action of the insulating liquid circulating pump 1, insulating liquid flows through a snake-shaped fluid channel in the chip heat conduction box 2, takes away heat in the chip 3 and transfers the heat to a refrigerant in the plate heat exchanger 4; the refrigerant is internally circulated under the action of the compressor 6, the refrigerant is firstly evaporated and refrigerated inside the plate heat exchanger 4 to absorb heat in the insulating liquid, then the refrigerant is circulated to the condenser 7 to be condensed and released heat to heat water in the condenser 7, and after the water temperature in the condenser 7 is increased, high-temperature hot water is circulated to a place needing the high-temperature hot water under the action of the water pump 8.
The utility model has the advantages that: liquid convection heat exchange is adopted, the chips are densely soaked in the insulating liquid, the size is small, and the chips are convenient to maintain and replace; the heat pump is utilized to lift the water temperature, so that heat recovery is realized and energy is saved.
Drawings
FIG. 1 is a schematic diagram of a heat pump recovery supercomputing center.
In the figure: 1 an insulating liquid circulating pump; 2, a chip heat conduction box; 3, a chip; 4, a plate heat exchanger; 5, a throttle valve; 6, a compressor; 7, a condenser; 8 water pump.
Detailed Description
The technical solution of the present invention is further explained below according to the specific embodiments.
A heat pump recovery super computing center comprises an insulating liquid circulating pump 1, a chip heat conduction box 2, a chip 3, a plate type heat exchanger 4, a throttle valve 5, a compressor 6, a condenser 7 and a water pump 8; the chip heat conduction box 2 is filled with insulating liquid, and the chips 3 are fixedly arranged on the upper surface and the lower surface in a staggered manner, so that a chamber of the chip heat conduction box 2 forms a snake-shaped fluid channel; the insulating liquid circulating pump 1, the chip heat conduction box 2 and the plate heat exchanger 4 are sequentially connected in a closed loop mode through insulating liquid circulating pipes; the plate heat exchanger 4, the throttle valve 5, the condenser 7 and the compressor 6 are sequentially connected in a closed loop mode through pipelines; the condenser 7 is connected with an external water demand place through a water pump 8.
The working principle is as follows: under the action of the insulating liquid circulating pump 1, insulating liquid flows through a snake-shaped fluid channel in the chip heat conduction box 2, takes away heat in the chip 3 and transfers the heat to a refrigerant in the plate heat exchanger 4; the refrigerant is internally circulated under the action of the compressor 6, the refrigerant is firstly evaporated and refrigerated inside the plate heat exchanger 4 to absorb heat in the insulating liquid, then the refrigerant is circulated to the condenser 7 to be condensed and released heat to heat water in the condenser 7, and after the water temperature in the condenser 7 is increased, high-temperature hot water is circulated to a place needing the high-temperature hot water under the action of the water pump 8.
Claims (1)
1. A heat pump recovery super computing center is characterized by comprising an insulating liquid circulating pump (1), a chip heat conduction box (2), a chip (3), a plate type heat exchanger (4), a throttle valve (5), a compressor (6), a condenser (7) and a water pump (8); the interior of the chip heat conduction box (2) is filled with insulating liquid, and the chips (3) are fixedly arranged on the upper surface and the lower surface in a staggered manner, so that a chamber of the chip heat conduction box (2) forms a snake-shaped fluid channel; the insulating liquid circulating pump (1), the chip heat conduction box (2) and the plate heat exchanger (4) are sequentially connected in a closed loop mode through an insulating liquid circulating pipe; the plate heat exchanger (4), the throttle valve (5), the condenser (7) and the compressor (6) are sequentially connected in a closed loop mode through pipelines; the condenser (7) is connected with an external water demand place through a water pump (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821821931.8U CN212481753U (en) | 2018-11-06 | 2018-11-06 | Super calculation center for heat pump recovery |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821821931.8U CN212481753U (en) | 2018-11-06 | 2018-11-06 | Super calculation center for heat pump recovery |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212481753U true CN212481753U (en) | 2021-02-05 |
Family
ID=74415155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821821931.8U Expired - Fee Related CN212481753U (en) | 2018-11-06 | 2018-11-06 | Super calculation center for heat pump recovery |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212481753U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109186126A (en) * | 2018-11-06 | 2019-01-11 | 江南大学 | A kind of heat pump recycling supercomputing center |
-
2018
- 2018-11-06 CN CN201821821931.8U patent/CN212481753U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109186126A (en) * | 2018-11-06 | 2019-01-11 | 江南大学 | A kind of heat pump recycling supercomputing center |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210205 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |