CN212471049U

CN212471049U - Grinding and polishing machine for semiconductor material

Info

Publication number: CN212471049U
Application number: CN202021312808.0U
Authority: CN
Inventors: 罗贺义
Original assignee: Sunteam Electronic Technology Co ltd
Current assignee: Sunteam Electronic Technology Co ltd
Priority date: 2020-07-07
Filing date: 2020-07-07
Publication date: 2021-02-05
Anticipated expiration: 2030-07-07

Abstract

The utility model discloses a semiconductor material grinding and polishing machine, including first bottom plate, transfer line, slider and guide arm, the second bottom plate is installed on the top of first bottom plate, and second bottom plate top intermediate position department sets up and runs through to the inside second recess of second bottom plate, the first recess that runs through to the second bottom plate inside is all seted up on second recess both ends top, and the inside one end of first recess is installed and is run through the inside electric telescopic handle of child second recess. This semiconductor material grinding and polishing machine promotes the fourth device shell through electric telescopic handle and removes, drives rubber baffle through the fourth device shell simultaneously and contacts semiconductor material, drives the hinge ejector pin through rubber baffle after rubber baffle contacts semiconductor material and extrudees the spring for the device is difficult for producing the skew when using, makes the device can improve the practicality of device when using.

Description

Grinding and polishing machine for semiconductor material

Technical Field

The utility model relates to a semiconductor production technical field specifically is semiconductor material grinding and polishing machine.

Background

With the continuous progress of science and technology, a semiconductor which is a material with conductivity between a conductor and an insulator at normal temperature is widely used in the development process of science and technology, the importance of the semiconductor is very great from the viewpoint of science and technology or economic development, and the traditional grinding and polishing machine for semiconductor materials can basically meet the use requirements of people, but certain problems still exist, and the specific problems are as follows:

1. most of the grinding and polishing machines for semiconductor materials in the current market have poor clamping effect when in use, and the semiconductor materials on the device are easy to deviate, so that the use of the device is influenced, and the practicability of the grinding and polishing machine is reduced;

2. most semiconductor material lapping and polishing machines in the market at present need change the grinding apparatus that grinds polishing to the semiconductor according to what different will when using, all comparatively trouble when changing the grinding apparatus for the availability factor of device is low when using.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor material grinds burnishing machine to the practicality that proposes among the solution above-mentioned background is low and the problem that the availability factor is low.

In order to achieve the above object, the utility model provides a following technical scheme: the semiconductor material grinding and polishing machine comprises a first bottom plate, a transmission rod, a sliding block and a guide rod, wherein a second bottom plate is installed at the top end of the first bottom plate, a second groove penetrating into the second bottom plate is formed in the middle position of the top end of the second bottom plate, first grooves penetrating into the second bottom plate are formed in the top ends of the two ends of each second groove, an electric telescopic rod penetrating into the second groove of a child is installed at one end of the inner portion of each first groove, a fifth device shell is installed on one side of the top end of the second bottom plate, a second motor is installed inside the second bottom plate at the bottom end of the fifth device shell, a lead screw is installed at the output end of the second motor through a bearing, a nut block is arranged on the outer side of the lead screw, a top plate penetrating through the top end of the fifth device shell is installed at the top end of the nut block, the first device shell is installed at the, and the rotating groove penetrating through the fixed shell is formed in the top end of the fixed shell, a third motor is installed at one end, far away from the first device shell, of the fixed shell, and a rotating block penetrating through the rotating groove is installed at the output end of the polishing wheel through a bearing.

Preferably, the top of commentaries on classics piece is installed first motor, and the first motor output is installed through the bearing and is run through to the transfer line of commentaries on classics piece bottom.

Preferably, a fourth device shell is installed at one end of the electric telescopic rod in the second groove, guide rods are vertically installed at the bottom end of the inner portion of the fourth device shell, springs are arranged in the middle of the outer sides of the guide rods, and sliding blocks are arranged on the top ends of the springs and the outer sides of the guide rods at the bottom ends of the springs.

Preferably, a second device shell is installed at the bottom end of the transmission rod, and a sliding groove penetrating into the second device shell is formed in the outer side of the second device shell.

Preferably, the one end that electric telescopic handle was kept away from to the slider all articulates there is articulated ejector pin, and the articulated ejector pin one end of keeping away from electric telescopic handle articulates there is the rubber baffle.

Preferably, the inside slip of spout is provided with the screw ring, and the equidistant meshing of screw ring one end has the screw thread jack catch that runs through to the inside of second device shell, the screw ring is kept away from the one end of screw thread jack catch and is installed the third device shell, the inside throwing aureola that runs through to second device shell bottom that is provided with of second device shell.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the fourth device shell is pushed to move through the electric telescopic rod by installing the fourth device shell, the electric telescopic rod and the rubber baffle, meanwhile, the rubber baffle is driven by the fourth device shell to contact with the semiconductor material, and after the rubber baffle contacts with the semiconductor material, the hinged ejector rod is driven by the rubber baffle to extrude the spring, so that the device is not easy to deviate when in use, and the practicability of the device can be improved when in use;

2. meanwhile, the third device shell, the polishing wheel and the threaded ring are arranged, the threaded ring is driven by the third device shell to replace the hole, the threaded clamping jaw is driven to move when the threaded ring rotates, and the polishing wheel can be quickly disassembled and replaced when the threaded clamping jaw moves, so that the use efficiency of the device is improved when the device is used;

3. the device rotates through third motor drive commentaries on classics piece through installing commentaries on classics piece, first motor and third motor simultaneously, drives the throwing aureola when changeing the piece and carries out the adjustment of angle, rotates through first motor drive throwing aureola simultaneously for different angles that the device can be better when using are adjusted.

Drawings

FIG. 1 is a front view of the cross-sectional structure of the present invention;

FIG. 2 is a schematic front view of the present invention;

FIG. 3 is a schematic left side view of the cross-sectional structure of the present invention;

FIG. 4 is a left side view of the structure of the present invention;

FIG. 5 is an enlarged view of the portion A of FIG. 1 according to the present invention;

fig. 6 is an enlarged schematic view of a portion B in fig. 3 according to the present invention.

In the figure: 1. a first base plate; 2. a second base plate; 3. a first device housing; 4. fixing the housing; 5. rotating the groove; 6. rotating the block; 7. a first motor; 8. a second device housing; 9. a third device housing; 10. a fourth device housing; 11. an electric telescopic rod; 12. a first groove; 13. a rubber baffle; 14. a second groove; 15. a second motor; 16. a nut block; 17. a screw rod; 18. a top plate; 19. a transmission rod; 20. a third motor; 21. a polishing wheel; 22. a slider; 23. a guide bar; 24. a mandril is hinged; 25. a spring; 26. a threaded ring; 27. a chute; 28. a threaded jaw; 29. a fifth device housing.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-6, the present invention provides an embodiment: the semiconductor material grinding and polishing machine comprises a first bottom plate 1, a transmission rod 19, a sliding block 22 and a guide rod 23, wherein the top end of the first bottom plate 1 is provided with a second bottom plate 2, and the middle position of the top end of the second bottom plate 2 is provided with a second groove 14 penetrating into the second bottom plate 2;

a fourth device shell 10 is installed at one end of an electric telescopic rod 11 in the second groove 14, guide rods 23 are vertically installed at the bottom ends of the inner portions of the fourth device shell 10, springs 25 are arranged in the middle positions of the outer sides of the guide rods 23, sliding blocks 22 are arranged at the top ends of the springs 25 and the outer sides of the guide rods 23 at the bottom ends, and the springs 25 on the outer sides of the guide rods 23 are extruded through the sliding blocks 22 when the device is used, so that the device can better prevent a semiconductor from being damaged when the semiconductor is clamped;

one end of the sliding block 22, which is far away from the electric telescopic rod 11, is hinged with a hinged ejector rod 24, and one end of the hinged ejector rod 24, which is far away from the electric telescopic rod 11, is hinged with a rubber baffle 13, so that the hinged ejector rod 24 can be pressurized through the rubber baffle 13 when the device is used, and meanwhile, the sliding block 22 is driven to extrude the spring 25, so that the device can better prevent the semiconductor from being damaged when in use;

the top ends of the two ends of the second groove 14 are both provided with a first groove 12 penetrating into the second bottom plate 2, one end of the interior of the first groove 12 is provided with an electric telescopic rod 11 penetrating into the interior of the child second groove 14, one side of the top end of the second bottom plate 2 is provided with a fifth device shell 29, the bottom end of the fifth device shell 29 is provided with a second motor 15 inside the second bottom plate 2, the model of the second motor 15 can be MSME-5AZG1, the output end of the second motor 15 is provided with a screw rod 17 through a bearing, the outer side of the screw rod 17 is provided with a nut block 16, the top end of the nut block 16 is provided with a top plate 18 penetrating through the top end of the fifth device shell 29, the top end of the top plate 18 is provided with a first device shell 3, one end of the first device shell 3 is provided with a fixed shell 4, the top end of the fixed shell 4 is provided with a rotary groove 5 penetrating through the fixed shell 4, one end of the fixed, the type of the third motor 20 can be FY42EM150A, and the output end of the polishing wheel 21 is provided with a rotating block 6 penetrating into the rotating groove 5 through a bearing;

the top end of the rotating block 6 is provided with a first motor 7, the type of the first motor 7 can be SST43D2120, the output end of the first motor 7 is provided with a transmission rod 19 penetrating to the bottom end of the rotating block 6 through a bearing, the transmission rod 19 can be driven to rotate by the first motor 7 when the polishing device is used, and when the transmission rod 19 rotates, the polishing wheel 21 can be driven to rotate and grind, so that the polishing device can better perform power transmission;

the bottom end of the transmission rod 19 is provided with a second device shell 8, the outer side of the second device shell 8 is provided with a sliding chute 27 penetrating into the second device shell 8, and when the polishing wheel 21 is used, the polishing wheel can be clamped by an auxiliary device through the sliding chute 27 arranged on the second device shell 8;

the inside slip of spout 27 is provided with screw ring 26, and the equidistant meshing of screw ring 26 one end has the screw thread jack catch 28 that runs through to the inside of second device shell 8, screw ring 26 is kept away from the one end of screw thread jack catch 28 and is installed third device shell 9, the inside polishing wheel 21 that runs through to the 8 bottom of second device shell that is provided with of second device shell 8, can drive screw ring 26 through third device shell 9 and rotate when using, it presss from both sides tight polishing wheel 21 to drive screw thread jack catch 28 simultaneously, make the device can be more convenient when using change polishing wheel 21.

The working principle is as follows: when the semiconductor material grinding and polishing machine is used, a power supply is externally connected to the device, the electric telescopic rod 11 in the first groove 12 drives the fourth device shell 10 to move, the rubber baffle 13 is driven to move when the fourth device shell 10 moves, meanwhile, the semiconductor material is contacted through the rubber baffle 13, the rubber baffle 13 extrudes the hinged ejector rod 24 after the rubber baffle 13 is contacted with the semiconductor material, and the sliding block 22 is driven to extrude the spring 25 outside the guide rod 23 after the hinged ejector rod 24 is extruded, so that the semiconductor material can be better fixed when the device is used, and meanwhile, the material is prevented from being damaged;

the angle adjustment is carried out by driving the rotating block 6 through the third motor 20, after the angle adjustment is finished, the driving rod 19 is driven to rotate through the first motor 7, the second device shell 8 is driven to rotate when the driving rod 19 rotates, the polishing wheel 21 is driven to grind the semiconductor material when the second device shell 8 rotates, the lead screw 17 is driven to rotate through the second motor 15, the nut block 16 is driven to move when the lead screw 17 rotates, the top plate 18 is driven to lift through the nut block 16, the first device shell 3 is driven to lift when the top plate 18 lifts in the lifting process, the grinding depth can be better adjusted according to requirements when the device is used, when the polishing wheel 21 needs to be replaced, the third device shell 9 is rotated, the threaded ring 26 is driven to rotate through the third device shell 9, drive screw thread jack catch 28 simultaneously and remove and change the installation to throwing aureola 21, do above the utility model discloses a whole theory of operation.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. Semiconductor material lapping and polishing machine, including first bottom plate (1), transfer line (19), slider (22) and guide arm (23), its characterized in that: a second bottom plate (2) is installed at the top end of the first bottom plate (1), a second groove (14) penetrating into the second bottom plate (2) is formed in the middle position of the top end of the second bottom plate (2), first grooves (12) penetrating into the second bottom plate (2) are formed in the top ends of the two ends of each second groove (14), an electric telescopic rod (11) penetrating into the second groove (14) of a child is installed at one end of the inner portion of each first groove (12), a fifth device shell (29) is installed on one side of the top end of the second bottom plate (2), a second motor (15) is installed inside the second bottom plate (2) at the bottom end of each fifth device shell (29), a lead screw (17) is installed at the output end of each second motor (15) through a bearing, a nut block (16) is arranged on the outer side of each lead screw (17), a top plate (18) penetrating through the top end of each fifth device shell (29) is installed at the top end of each nut block, and first device shell (3) are installed on the top of roof (18), and fixed shell (4) are installed to the one end of first device shell (3), and set up rotary trough (5) that run through fixed shell (4) on fixed shell (4) top, third motor (20) are installed to the inside one end of keeping away from first device shell (3) of fixed shell (4), and throw aureola (21) output and install through to rotary trough (5) inside commentaries on classics piece (6) through the bearing.

2. The semiconductor material grinding and polishing machine according to claim 1, characterized in that: first motor (7) are installed on the top of commentaries on classics piece (6), and first motor (7) output is installed through bearing and is run through to transfer line (19) of piece (6) bottom.

3. The semiconductor material grinding and polishing machine according to claim 1, characterized in that: fourth device shell (10) is installed to the one end of inside electric telescopic handle (11) of second recess (14), and all vertical guide arm (23) of installing in the inside bottom of fourth device shell (10), the intermediate position department in guide arm (23) outside is provided with spring (25), and the outside of spring (25) top and bottom guide arm (23) all is provided with slider (22).

4. The semiconductor material grinding and polishing machine according to claim 2, characterized in that: the bottom end of the transmission rod (19) is provided with a second device shell (8), and the outer side of the second device shell (8) is provided with a sliding groove (27) penetrating into the second device shell (8).

5. The semiconductor material grinding and polishing machine according to claim 3, characterized in that: the one end that electric telescopic handle (11) was kept away from in slider (22) all articulates there is articulated ejector pin (24), and articulated ejector pin (24) keep away from the one end of electric telescopic handle (11) and articulate there is rubber baffle (13).

6. The semiconductor material grinding and polishing machine according to claim 4, characterized in that: the inside slip of spout (27) is provided with screw ring (26), and screw ring (26) one end equidistant meshing has and runs through to the inside screw thread jack catch (28) of second device shell (8), screw ring (26) are kept away from the one end of screw thread jack catch (28) and are installed third device shell (9), inside burnishing wheel (21) that runs through to second device shell (8) bottom that is provided with of second device shell (8).