CN212460453U - Take memory bank for computer of protection casing - Google Patents
Take memory bank for computer of protection casing Download PDFInfo
- Publication number
- CN212460453U CN212460453U CN202021246035.0U CN202021246035U CN212460453U CN 212460453 U CN212460453 U CN 212460453U CN 202021246035 U CN202021246035 U CN 202021246035U CN 212460453 U CN212460453 U CN 212460453U
- Authority
- CN
- China
- Prior art keywords
- aluminum
- heat dissipation
- protective cover
- dissipation plate
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 48
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 230000017525 heat dissipation Effects 0.000 claims description 37
- 230000001681 protective effect Effects 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 abstract description 10
- 239000000428 dust Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 4
- NMFHJNAPXOMSRX-PUPDPRJKSA-N [(1r)-3-(3,4-dimethoxyphenyl)-1-[3-(2-morpholin-4-ylethoxy)phenyl]propyl] (2s)-1-[(2s)-2-(3,4,5-trimethoxyphenyl)butanoyl]piperidine-2-carboxylate Chemical compound C([C@@H](OC(=O)[C@@H]1CCCCN1C(=O)[C@@H](CC)C=1C=C(OC)C(OC)=C(OC)C=1)C=1C=C(OCCN2CCOCC2)C=CC=1)CC1=CC=C(OC)C(OC)=C1 NMFHJNAPXOMSRX-PUPDPRJKSA-N 0.000 description 16
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a take DRAM for computer of protection casing, including aluminium base guard shield, the DRAM, copper heating panel, aluminium base guard shield front portion is provided with the pyramid fin along vertical direction, the aluminium base guard shield back is provided with the chip heat conduction face, aluminium base guard shield back is provided with trapezoidal form guide block, be provided with set screw on the trapezoidal form guide block, aluminium base guard shield upper portion both sides are provided with draws the ear, both sides draw the ear to connect through the middle crossbeam that sets up, the crossbeam top is provided with copper heating panel fixed orifices, the crossbeam bottom is provided with DRAM fixed end, DRAM fixed end is provided with the department. The utility model discloses simple structure, convenient operation, the radiating effect is good, is convenient for maintain, and protection memory bank that can be better does not receive various debris pollutions such as dust.
Description
Technical Field
The utility model belongs to computer hardware field especially relates to a take memory bank for computer of protection casing.
Background
Computers are widely used, and the requirements for operation stability are gradually increased, so that hardware is a basic condition for ensuring stable operation. The computer memory bank in the prior art generally adopts natural heat dissipation without covering, has no protection, and has relatively reduced heat dissipation efficiency along with the increase of memory capacity under the premise of unchanged volume, and dust is extremely easy to attach to the memory bank, so that the service life of the memory bank is reduced after long-term use.
Therefore, it is necessary to design a computer memory bank with good heat dissipation effect and capable of protecting dust and impurities.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to overcome above-mentioned defect, provide a take memory bank for computer of protection casing, simple structure, convenient operation, the radiating effect is good, is convenient for maintain, and protection memory bank that can be better does not receive various debris pollutions such as dust.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a take memory strip for computer of protection casing, including aluminium base guard shield, the memory strip, copper heating panel, aluminium base guard shield front portion is provided with the pyramid fin along vertical direction, aluminium base guard shield back is provided with the chip heat conduction face, aluminium base guard shield back is provided with trapezoidal form guide block, be provided with set screw on the trapezoidal form guide block, aluminium base guard shield upper portion both sides are provided with draws the ear, both sides are drawn the ear and are connected through the middle crossbeam that sets up, the crossbeam top is provided with copper heating panel fixed orifices, the crossbeam bottom is provided with memory strip fixed end portion, memory strip fixed end portion is provided with 3 departments.
The copper heat dissipation plate comprises a first heat dissipation plate, a copper connecting plate and a second heat dissipation plate, round holes are formed in two sides of the copper connecting plate, the first heat dissipation plate is arranged on the upper portion of the copper connecting plate, and the second heat dissipation plate is arranged on the lower portion of the copper connecting plate.
Preferably, the aluminum-based shield is provided with 2 parallel blocks, and the copper heat dissipation plate is installed on the cross beam of the aluminum-based shield through a round hole by a screw.
Preferably, the memory bank is loaded into the lower part of the beam of the aluminum-based shield from bottom to top from the back of the aluminum-based shield, the inner side of the fixed end part of the memory bank is attached to the back of the memory bank, and the fixing screw on the aluminum-based shield is screwed into the threaded hole of the memory bank.
Preferably, the chip heat-conducting surface of the aluminum-based shield is closely attached to the chip on the memory strip and coated with heat-dissipating silica gel.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the heat dissipation effect of the memory bank is improved by closely attaching and coating heat dissipation silica gel on the chip heat conduction surface of the copper heat dissipation plate, the pyramid-shaped heat dissipation plate and the aluminum-based shield and the chip on the memory bank.
2. Simple structure, through setting up the set screw who sets up on lifting lug, trapezoidal form guide block and the trapezoidal form guide block, the memory bank installation, demolish the convenience.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a side assembly view of the present invention;
FIG. 3 is a schematic diagram of the memory bank structure of the present invention;
fig. 4 is the structural schematic diagram of the aluminum-based working protective cover of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Referring to fig. 1-4, a computer memory bank with a protective cover comprises an aluminum-based shield 1, a memory bank 2 and a copper heat dissipation plate 3, wherein a pyramid-shaped heat dissipation fin 11 is arranged at the front of the aluminum-based shield 1 along the vertical direction, a chip heat conduction surface 19 is arranged at the back of the aluminum-based shield 1, a trapezoidal guide block 12 is arranged at the back of the aluminum-based shield 1, a fixing screw 13 is arranged on the trapezoidal guide block 12, pull lugs 15 are arranged on two sides of the upper portion of the aluminum-based shield 1, the pull lugs 15 on two sides are connected through a cross beam 16 arranged in the middle, a copper heat dissipation plate fixing hole 18 is arranged at the top of the cross beam 16, a memory bank fixing end portion 14 is arranged at the.
The copper heat dissipation plate 3 comprises a first heat dissipation plate 31, a copper connection plate 32 and a second heat dissipation plate 33, wherein round holes 34 are formed in two sides of the copper connection plate 32, the first heat dissipation plate 31 is arranged on the upper portion of the copper connection plate 32, and the second heat dissipation plate 33 is arranged on the lower portion of the copper connection plate 33.
The aluminum-based shield 1 is provided with 2 parallel plates, and the copper heat dissipation plate 3 is mounted on the cross beam 16 of the aluminum-based shield 1 through a round hole 34 by screws.
The memory bank 2 is loaded into the lower part of the beam 16 of the aluminum-based shield 1 from bottom to top from the back part of the aluminum-based shield 1, the inner side of the memory bank fixing end part 14 is attached to the back surface of the memory bank 2, and the fixing screw 13 of the aluminum-based shield 1 is screwed into the threaded hole 21 of the memory bank 2.
In order to increase the heat dissipation speed of the memory bank 1, the chip heat conduction surface 19 of the aluminum-based shield 1 is closely attached to the chip 22 on the memory bank 1 and coated with heat dissipation silica gel.
The installation process comprises the following steps: the aluminum-based shield 1 with the memory bank 2 is installed in a slot in a computer, another aluminum-based shield 1 with the memory bank 2 is installed in parallel, finally a copper heat dissipation plate 3 is fixed on the cross beams 16 of the two aluminum-based shields 1 through copper heat dissipation plate fixing holes 18 on the cross beams 16 of the aluminum-based shield 1 through screws, and when the aluminum-based shield 1 needs to be detached, the aluminum-based shield 1 is held by hands, and the memory bank is integrally pulled out.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (4)
1. A computer memory bank with a protective cover comprises an aluminum-based protective cover, a memory bank and a copper heat dissipation plate;
the aluminum-based heat dissipation plate heat dissipation device is characterized in that a pyramid-shaped heat dissipation plate is arranged at the front part of an aluminum-based shield along the vertical direction, a chip heat conduction surface is arranged at the back of the aluminum-based shield, a trapezoidal guide block is arranged at the back of the aluminum-based shield, a fixing screw is arranged on the trapezoidal guide block, pull lugs are arranged on two sides of the upper part of the aluminum-based shield, the pull lugs on the two sides are connected through a cross beam arranged in the middle of the aluminum-based shield, a copper heat dissipation plate fixing hole is formed in the;
the copper heat dissipation plate comprises a first heat dissipation plate, a copper connecting plate and a second heat dissipation plate, round holes are formed in two sides of the copper connecting plate, the first heat dissipation plate is arranged on the upper portion of the copper connecting plate, and the second heat dissipation plate is arranged on the lower portion of the copper connecting plate.
2. The memory bank with the protective cover for the computer according to claim 1, wherein the aluminum-based protective cover is provided with 2 pieces in parallel, and the copper heat dissipation plate is installed on the cross beam of the aluminum-based protective cover through a round hole by a screw.
3. The memory stick with the protective cover for the computer, according to claim 1, is characterized in that the memory stick is loaded into the lower part of the beam of the aluminum-based protective cover from bottom to top from the back of the aluminum-based protective cover, the inner side of the fixed end part of the memory stick is attached to the back of the memory stick, and the fixing screw on the aluminum-based protective cover is screwed into the threaded hole of the memory stick.
4. The memory bar with protective cover for computer of claim 1, wherein the heat conducting surface of the chip of the aluminum-based protective cover is closely attached to the chip on the memory bar and coated with heat-dissipating silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021246035.0U CN212460453U (en) | 2020-07-01 | 2020-07-01 | Take memory bank for computer of protection casing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021246035.0U CN212460453U (en) | 2020-07-01 | 2020-07-01 | Take memory bank for computer of protection casing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212460453U true CN212460453U (en) | 2021-02-02 |
Family
ID=74463252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021246035.0U Expired - Fee Related CN212460453U (en) | 2020-07-01 | 2020-07-01 | Take memory bank for computer of protection casing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212460453U (en) |
-
2020
- 2020-07-01 CN CN202021246035.0U patent/CN212460453U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210202 |