CN212443628U - Chip wire bonding machine - Google Patents
Chip wire bonding machine Download PDFInfo
- Publication number
- CN212443628U CN212443628U CN202020858516.0U CN202020858516U CN212443628U CN 212443628 U CN212443628 U CN 212443628U CN 202020858516 U CN202020858516 U CN 202020858516U CN 212443628 U CN212443628 U CN 212443628U
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- CN
- China
- Prior art keywords
- sleeve
- fixedly connected
- chip
- wire bonding
- base
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000002123 temporal effect Effects 0.000 claims abstract description 4
- 238000005192 partition Methods 0.000 claims description 9
- 125000006850 spacer group Chemical group 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 6
- 239000011521 glass Substances 0.000 abstract description 5
- 230000003028 elevating effect Effects 0.000 abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model discloses a chip bonding wire machine, the on-line screen storage device comprises a base, top one side fixedly connected with bonding wire machine body of base, and one side fixed mounting of bonding wire machine body has the bonding wire pen, the upper end of base is connected with the connecting rod, is fixed connection between the top of its connecting rod and bonding wire pen, and one side fixed mounting of connecting rod has the sight glass, elevating system is installed on the top of base, and elevating system's temporal part including the sleeve pipe, a plurality of through-holes have been seted up to sheathed tube inner wall both sides, and the sheathed tube inside activity has cup jointed the loop bar, the surperficial both sides difference fixedly connected with sleeve of loop bar. The utility model discloses in, under elevating system's effect, through pressing T type pole, make T type pole remove the sheathed tube inside, the bonding wire pen and the sight glass that connect on loop bar and the loop bar will move down, and the sight glass of being convenient for observes the position of the required bonding wire of chip, makes things convenient for the accurate nature when bonding wire pen bonding wire chip.
Description
Technical Field
The utility model relates to a bonding wire machine technical field especially relates to a chip bonding wire machine.
Background
The wire bonding machine comprises a gold wire machine, an aluminum wire machine and an ultrasonic wire bonding machine, the most popular common wire bonding machine in the field of ASM copper wire bonding is that the CONNX machine of KS has very high efficiency, and the most popular non-OE machine of aluminum wire is the Morse.
The height required when current chip bonding wire machine is unable fast and stable's regulation bonding wire when using, and also be inconvenient for carry out the bonding wire to the all-round of chip, when bonding wire to the chip, also unable fine fix it, lead to the chip skew to appear and lead to the fact the error.
Therefore, there is a need to provide a new chip wire bonding machine to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a quick and stable's chip bonding wire machine of height-adjusting.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a chip wire bonding machine comprises a base, wherein a wire bonding machine body is fixedly connected to one side of the top end of the base, a wire bonding pen is fixedly mounted on one side of the wire bonding machine body, a connecting rod is connected to the upper end of the base, the connecting rod is fixedly connected with the top end of the wire bonding pen, an observation mirror is fixedly mounted on one side of the connecting rod, a lifting mechanism is mounted at the top end of the base, the temporal part of the lifting mechanism comprises a sleeve, a plurality of through holes are formed in two sides of the inner wall of the sleeve, a loop bar is movably sleeved in the sleeve, sleeves are respectively and fixedly connected to two sides of the surface of the loop bar, a reset spring is fixedly connected to the inner part of each sleeve, a T-shaped rod is fixedly connected to the other side of the reset spring, the T-shaped rod is movably connected with the inner part of each through hole, a clamping structure is formed between each, and a pressing mechanism is installed at the top end of the adjusting mechanism.
As a further description of the above technical solution:
the T-shaped rod forms an elastic telescopic structure with the sleeve through the return spring, and the sleeve is symmetrical about the central axis of the loop bar.
As a further description of the above technical solution:
the inside of adjustment mechanism is including the spout, and is connected for the gomphosis between the top of spout and base is inside, the inside cup joint of spout is inserted and is equipped with the slider, and the top fixedly connected with axis of rotation of slider, the inside of axis of rotation is rotated and is linked there is the bracing piece, and the baffle is installed on the top of bracing piece.
As a further description of the above technical solution:
the support rod forms a rotating structure through the rotating shaft and the sliding block, and the rotating shaft forms a sliding structure through the sliding block and the sliding groove.
As a further description of the above technical solution:
hold-down mechanism's inside is including two baffles, and is fixed connection between the both sides of baffle and the baffle, the top fixedly connected with connecting plate of baffle, and the inside threaded connection of connecting plate has the hand to twist the bolt, the hand is twisted the bolt and is passed connecting plate fixedly connected with rubber slab, and is connected between the top of rubber slab and baffle.
As a further description of the above technical solution:
the connecting plates are symmetrical about the central axis of the partition plate, and the baffle plates are symmetrical about the central axis of the partition plate.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:
1. the utility model discloses in, under elevating system's effect, through pressing T type pole, make T type pole remove the sheathed tube inside, the bonding wire pen and the sight glass that connect on loop bar and the loop bar will move down, and the sight glass of being convenient for observes the position of the required bonding wire of chip, makes things convenient for the accurate nature when bonding wire pen bonding wire chip.
2. The utility model discloses in, under adjustment mechanism's effect, rotate in the inside of axis of rotation through the connecting rod, can make the chip on the baffle that the connecting rod is connected rotate, make the chip can the omnidirectional accept the bonding wire, the slider of axis of rotation hub connection slides in the inside of spout, makes the chip on the baffle that the dwang of axis of rotation top is connected also remove, is convenient for remove the below of bonding wire pen with the chip, carries out the bonding wire.
3. The utility model discloses in, under hold-down mechanism's effect, twist the bolt through rotating the hand, make the hand twist bolted connection's rubber slab remove to the direction of chip, fix the chip between two rubber slabs, be convenient for cause the unnecessary error when welding the wire to the chip, the rubber slab has certain toughness, when fixing the chip, has also played certain guard action to the chip.
Drawings
Fig. 1 is a schematic structural view of the chip wire bonding machine of the present invention;
fig. 2 is a schematic structural view of the lifting mechanism of the chip wire bonding machine of the present invention;
FIG. 3 is an enlarged schematic view of the structure at A in FIG. 2;
fig. 4 is a schematic structural diagram of the pressing mechanism of the chip wire bonding machine of the present invention.
Illustration of the drawings:
1. a base; 2. a wire bonding machine body; 3. a wire bonding pen; 4. a connecting rod; 5. an observation mirror; 6. a lifting mechanism; 601. a sleeve; 602. a through hole; 603. a loop bar; 604. a sleeve; 605. a return spring; 606. a T-shaped rod; 7. an adjustment mechanism; 701. a chute; 702. a slider; 703. a rotating shaft; 704. a support bar; 705. a partition plate; 8. a hold-down mechanism; 801. a baffle plate; 802. a connecting plate; 803. screwing the bolt by hand; 804. A rubber plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1 to 4, the utility model relates to a chip wire bonding machine, which comprises a base 1, wherein one side of the top end of the base 1 is fixedly connected with a wire bonding machine body 2, one side of the wire bonding machine body 2 is fixedly provided with a wire bonding pen 3, the upper end of the base 1 is connected with a connecting rod 4, the connecting rod 4 is fixedly connected with the top end of the wire bonding pen 3, one side of the connecting rod 4 is fixedly provided with an observation mirror 5, the top end of the base 1 is provided with a lifting mechanism 6, the temporal part of the lifting mechanism 6 comprises a sleeve 601, two sides of the inner wall of the sleeve 601 are provided with a plurality of through holes 602, the sleeve 603 is movably sleeved in the sleeve 601, two sides of the surface of the sleeve 603 are respectively and fixedly connected with a sleeve 604, the inner part of the sleeve 604 is fixedly connected with a reset spring 605, the other side of the reset spring 605 is fixedly connected with a T-shaped rod 606, and, the T-shaped rod 606 and the sleeve 601 form a clamping structure through the through hole 602, the adjusting mechanism 7 is installed at the bottom end of the base 1, the pressing mechanism 8 is installed at the top end of the adjusting mechanism 7, the observation mirror 5 has an amplifying effect, a chip on the partition plate 705 can be clearly seen through the observation mirror 5, and wire bonding of the wire bonding pen 3 to the chip is facilitated.
The T-shaped rod 606 and the sleeve 604 form an elastic telescopic structure through the return spring 605, the sleeve 604 is symmetrical about the central axis of the sleeve rod 603, the sleeve rod 603 moves downwards by pressing the T-shaped rod 606 to enter the sleeve 601, and the wire bonding pen 3 and the observation mirror 5 are also driven to move downwards, so that the observation of the observation mirror 5 on a chip is facilitated, and the wire bonding of the wire bonding pen 3 on the chip is also facilitated.
The inside of adjustment mechanism 7 is including spout 701, and is connected for the gomphosis between the top of spout 701 and base 1 is inside, the inside cup joint of spout 701 is inserted and is equipped with slider 702, and the top fixedly connected with axis of rotation 703 of slider 702, the inside of axis of rotation 703 is rotated and is linked with bracing piece 704, and the baffle 705 is installed on the top of bracing piece 704, through the axis of rotation 703 that bracing piece 704 is connected, bracing piece 704 can rotate in the inside of axis of rotation 703, is convenient for the omnidirectional carries out the bonding wire to the chip, bracing piece 704 and baffle 705 on the axis of rotation 703 have certain weight, and under the condition that does not receive external force, the part on the axis of rotation 703 can not appear rotating to and slider 702 of its below also can not slide in spout 701.
The supporting rod 704 forms a rotating structure through the rotating shaft 703 and the sliding block 702, the rotating shaft 703 forms a sliding structure through the sliding block 702 and the sliding groove 701, the sliding block 702 connected through the rotating shaft 703 slides inside the sliding groove 701, the position of a wire required by a chip can be conveniently moved to the position below the wire bonding pen 3, the wire bonding pen can be calibrated through observation of the observation mirror 5, and the working efficiency of the chip during wire bonding can be conveniently improved.
Hold-down mechanism 8's inside is including two baffles 801, and be fixed connection between baffle 705's both sides and the baffle 801, baffle 801's top fixedly connected with connecting plate 802, and the inside threaded connection of connecting plate 802 has hand-screw bolt 803, hand-screw bolt 803 passes connecting plate 802 fixedly connected with rubber slab 804, and is connected between the top of rubber slab 804 and baffle 705, and through the rotation of hand-screw bolt 803, the rubber slab 804 that can make hand-screw bolt 803 connect fixes the chip, is convenient for when the bonding wire to the chip, prevents that the skew from appearing in the chip, causes unnecessary error.
Further, the connecting plate 802 is symmetrical about the central axis of the partition 705, the baffle 801 is symmetrical about the central axis of the partition 705, and the rubber plate 804 has certain toughness, so that when the chip is fixed, the rubber plate 804 plays a certain protection role on the chip.
When the device is used, a chip is manually placed on the partition 705, the rubber plate 804 connected with the hand-screwed bolt 803 is moved towards the chip by the rotation of the hand-screwed bolt 803, the chip is fixed between the two rubber plates 804, the rubber plates 804 have certain toughness and cannot damage the chip, the slider 702 connected with the rotating shaft 703 below the supporting rod 704 slides in the sliding groove 701 by pulling the supporting rod 704, the position needing wire bonding is moved to the position below the wire bonding pen 3 and the observation mirror 5, the T-shaped rod 606 enters the sleeve 601 by pressing the T-shaped rod 606, the sleeve rod 603 and the wire bonding pen 3 and the observation mirror 5 connected on the sleeve rod 603 move downwards, whether the position needing wire bonding is right below the wire bonding pen 3 is found by the observation of the observation mirror 5, if not, the adjustment can be carried out by the sliding of the slider 702 connected with the rotating shaft 703 below the supporting rod 704 in the sliding groove 701, the wire bonding pen 3 can accurately perform wire bonding on the position of a wire to be bonded on a chip, and the chip on the partition plate 705 above the supporting rod 704 can perform wire bonding in all directions by rotating the supporting rod 704 in the rotating shaft 703.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. A chip wire bonding machine is characterized by comprising a base (1), wherein one side of the top end of the base (1) is fixedly connected with a wire bonding machine body (2), one side of the wire bonding machine body (2) is fixedly provided with a wire bonding pen (3), the upper end of the base (1) is connected with a connecting rod (4), the connecting rod (4) is fixedly connected with the top end of the wire bonding pen (3), the top end of the base (1) is provided with a lifting mechanism (6), the temporal part of the lifting mechanism (6) comprises a sleeve (601), two sides of the inner wall of the sleeve (601) are provided with a plurality of through holes (602), the sleeve (603) is movably sleeved in the sleeve (601), two sides of the surface of the sleeve (603) are respectively and fixedly connected with a sleeve (604), the inside of the sleeve (604) is fixedly connected with a reset spring (605), the other side of the reset spring (605) is fixedly connected with a T-shaped rod, and be swing joint between the inside of T type pole (606) and through-hole (602), constitute the block structure between T type pole (606) pass through-hole (602) and sleeve pipe (601), adjustment mechanism (7) are installed to the bottom of base (1), hold-down mechanism (8) are installed on the top of adjustment mechanism (7).
2. The die bonder of claim 1, wherein the T-bar (606) is elastically retractable with respect to the sleeve (604) by a return spring (605), and the sleeve (604) is symmetrical with respect to a central axis of the loop bar (603).
3. The chip wire bonding machine according to claim 1, wherein the inside of the adjusting mechanism (7) comprises a sliding groove (701), the sliding groove (701) is connected with the inside of the top end of the base (1) in a fitting manner, a sliding block (702) is inserted into the sliding groove (701) in a sleeved manner, a rotating shaft (703) is fixedly connected to the top end of the sliding block (702), a supporting rod (704) is rotatably connected to the inside of the rotating shaft (703), and a partition plate (705) is installed at the top end of the supporting rod (704).
4. The die wire bonder of claim 3, wherein the support shaft (704) is rotatably coupled to the slider (702) through a rotation shaft (703), and the rotation shaft (703) is slidably coupled to the slide slot (701) through the slider (702).
5. The chip wire bonding machine according to claim 1, wherein the inside of the pressing mechanism (8) comprises two baffles (801), two sides of each baffle (705) are fixedly connected with the baffles (801), a connecting plate (802) is fixedly connected to the top end of each baffle (801), a hand-screwed bolt (803) is connected to the inner thread of each connecting plate (802), the hand-screwed bolt (803) penetrates through the connecting plate (802) to be fixedly connected with the rubber plate (804), and the rubber plate (804) is connected with the top end of each baffle (705).
6. The chip bonding machine of claim 5, wherein the connecting plate (802) is symmetrical about a central axis of the spacer (705), and the baffle (801) is symmetrical about the central axis of the spacer (705).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020858516.0U CN212443628U (en) | 2020-05-21 | 2020-05-21 | Chip wire bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020858516.0U CN212443628U (en) | 2020-05-21 | 2020-05-21 | Chip wire bonding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212443628U true CN212443628U (en) | 2021-02-02 |
Family
ID=74481650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020858516.0U Active CN212443628U (en) | 2020-05-21 | 2020-05-21 | Chip wire bonding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212443628U (en) |
-
2020
- 2020-05-21 CN CN202020858516.0U patent/CN212443628U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210923 Address after: 215400 55 laoliuhe Road, Chengxiang Town, Taicang City, Suzhou City, Jiangsu Province Patentee after: Dingxin microelectronics technology (Taicang) Co.,Ltd. Address before: 215400 55 laoliuhe Road, Chengxiang Town, Taicang City, Suzhou City, Jiangsu Province Patentee before: Suzhou Lipps Electronic Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231017 Address after: Floor 4, No. 88 Tonggang Road, Changshu Economic and Technological Development Zone, Suzhou City, Jiangsu Province, 215400 Patentee after: Dingxin Microelectronics (Suzhou) Co.,Ltd. Address before: 215400 55 laoliuhe Road, Chengxiang Town, Taicang City, Suzhou City, Jiangsu Province Patentee before: Dingxin microelectronics technology (Taicang) Co.,Ltd. |