CN212435395U - Wireless charger of electronic equipment and radiator - Google Patents

Abstract

The embodiment of the application discloses a wireless charger for electronic equipment, which is used for improving the wireless charging efficiency of the electronic equipment. The embodiment of the application comprises the following steps: the device comprises a cold guide plate, a power interface, a wireless charging module, a semiconductor refrigeration piece and a heat dissipation module; the power supply interface is respectively coupled with the wireless charging module and the semiconductor refrigerating sheet; the cold guide plate includes: first lead cold face and second and lead cold face, first lead cold face is used for laminating electronic equipment, the cold face is led to the second covers semiconductor refrigeration piece works as when power source connects the circular telegram, wireless charging module does electronic equipment charges, semiconductor refrigeration piece is right electronic equipment refrigerates, the heat dissipation module group is right semiconductor refrigeration piece dispels the heat.

Description

Wireless charger of electronic equipment and radiator

Technical Field

The embodiment of the application relates to the field of electronic equipment accessories, in particular to a wireless charger and a radiator for electronic equipment.

Background

With the continuous popularization of electronic devices and the development of wireless charging technologies, users have made higher and higher requirements on the convenience of charging electronic devices, and wireless charging gradually becomes a new trend.

In order to improve charging efficiency, high-power fast-charging and high-power wireless chargers are derived, however, since the wireless chargers need higher power, and the high power means that a larger heat value is brought, so that the temperature of the wireless chargers and electronic devices is increased, and the excessively high temperature will affect the charging efficiency, even cause damage to the chargers or electronic devices. For example: when the wireless charger charges for the cell-phone, for improving charge rate, the work of high load will be carried out to wireless charger inside, this can bring higher calorific capacity, and then with heat transfer to cell-phone, make the cell-phone temperature rise, when the temperature reaches certain threshold value, for protecting the inside components and parts of cell-phone, the cell-phone can reduce charging power by a wide margin and continue to rise with the limiting temperature, this charging efficiency that can make wireless charging reduces by a wide margin, consequently, the charging efficiency of wireless charger among the prior art scheme is low, user experience has been influenced.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a wireless charger of electronic equipment and electronic equipment radiator for reduce the electronic equipment and take place because the high temperature reduces the condition of charging power when carrying out wireless charging, greatly improve charge efficiency, promote user experience.

The application provides in a first aspect a wireless charger for an electronic device, comprising: the device comprises a cold guide plate, a power interface, a wireless charging module, a semiconductor refrigeration piece and a heat dissipation module; the power supply interface is respectively coupled with the wireless charging module and the semiconductor refrigerating sheet; the cold guide plate includes: first lead cold face and second and lead cold face, first lead cold face is used for laminating electronic equipment, the cold face is led to the second covers semiconductor refrigeration piece works as when power source connects the circular telegram, wireless charging module does electronic equipment charges, semiconductor refrigeration piece is right electronic equipment refrigerates, the heat dissipation module group is right semiconductor refrigeration piece dispels the heat.

Optionally, the wireless charging module is attached to the middle of the second cold conducting surface, and when the power interface is powered on, the semiconductor refrigerating sheet refrigerates the wireless charging module.

Optionally, the heat dissipation module includes: a heat radiation fan and heat radiation fins; the heat dissipation fins are provided with through holes to form accommodating spaces, the heat dissipation fans are accommodated in the through holes, and the heat dissipation fans are coupled with the power interfaces; when the power interface is electrified, the heat dissipation fan is matched with the heat dissipation fins to dissipate heat of the semiconductor refrigeration sheet.

Optionally, the wireless charger of the electronic device further includes: a heat-conducting plate, the heat-conducting plate comprising: the heat-conducting plate is used for matching the heat-radiating fins and the heat-radiating fan to radiate the semiconductor refrigeration piece.

Optionally, the wireless charger of the electronic device further includes: the heat insulation plate is arranged between the heat conduction plate and the wireless charging module and used for blocking the heat conduction plate from transferring heat to the wireless charging module.

A second aspect of the present application provides an electronic device heat sink, comprising: the cooling device comprises a cold conducting plate, a semiconductor refrigerating plate and a power supply module, wherein the power supply module is coupled with the semiconductor refrigerating plate; the cold guide plate includes: first lead cold face and second and lead cold face, first lead cold face is used for laminating electronic equipment, the cold face is led to the second covers the semiconductor refrigeration piece, works as when electronic equipment is carrying out wireless charging, the power module is connected with wireless charger, makes the semiconductor refrigeration piece does electronic equipment provides the refrigeration.

Optionally, the power supply module is attached to the middle of the second cold conducting surface.

Optionally, the electronic device heat sink further includes: the cooling fan is coupled with the power supply module, and when the electronic equipment is wirelessly charged, the cooling fan is matched with the cooling fins to cool the semiconductor chilling plate.

Optionally, the heat dissipation fins are provided with a first through hole and a second through hole to form an accommodating space, the heat dissipation fan is accommodated in the first through hole, and the second through hole is used for accommodating the wireless charger when the electronic device is wirelessly charged.

Optionally, the electronic device heat sink further includes: a heat-conducting plate, the heat-conducting plate comprising: the heat-conducting plate is used for matching the heat-radiating fan and the heat-radiating fins to radiate the heat of the semiconductor refrigerating sheet.

According to the technical scheme, the embodiment of the application has the following beneficial effects:

the application provides an among the wireless charger of electronic equipment, be provided with heat dissipation module, semiconductor refrigeration piece and lead the cold drawing, when providing wireless charging for electronic equipment, semiconductor refrigeration piece refrigerates electronic equipment through leading the cold drawing, and discharge the heat through heat dissipation module, still provide initiative refrigeration for electronic equipment, and then can reduce the temperature when electronic equipment charges, the condition that has reduced electronic equipment and has reduced charging power because the temperature is too high when carrying out wireless charging takes place, greatly improved charge efficiency, user experience has been promoted.

Drawings

FIG. 1 is a schematic diagram of a wireless charger for an electronic device;

FIG. 2 is a schematic diagram of a wireless charger for an electronic device;

FIG. 3 is another schematic diagram of a wireless charger for an electronic device;

FIG. 4 is another schematic diagram of a wireless charger for an electronic device;

FIG. 5 is another schematic diagram of a wireless charger for an electronic device;

FIG. 6 is a schematic diagram of a heat sink assembly for an electronic device;

FIG. 7 is a schematic diagram of a heat sink for an electronic device;

FIG. 8 is another schematic diagram of a heat sink for an electronic device;

FIG. 9 is another schematic diagram of a heat sink for an electronic device;

fig. 10 is another schematic diagram of the heat sink of the electronic device.

Detailed Description

In the present application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used only for explaining relative positional relationships between the respective members or components, and do not particularly limit specific mounting orientations of the respective members or components.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In addition, the structures, the proportions, the sizes, and the like, which are illustrated in the accompanying drawings and described in the present application, are intended to be considered illustrative and not restrictive, and therefore, not limiting, since those skilled in the art will understand and read the present application, it is understood that any modifications of the structures, changes in the proportions, or adjustments in the sizes, which are not necessarily essential to the practice of the present application, are intended to be within the scope of the present disclosure without affecting the efficacy and attainment of the same.

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1 and fig. 2, a first aspect of the present application provides a heat sink for an electronic device, including:

the device comprises a cold conducting plate 1, a power interface 2, a wireless charging module 3, a semiconductor refrigerating plate 4 and a heat radiating module 5; the power interface 2 is respectively coupled with the wireless charging module 3 and the semiconductor refrigerating sheet 4; the cold conduction plate 1 includes: the first cold surface 11 and the second cold surface 12 are led, the first cold surface 11 is used for attaching to an electronic device, the second cold surface 12 covers the semiconductor refrigeration sheet 4, when the power interface 2 is powered on, the wireless charging module 3 charges the electronic device, the semiconductor refrigeration sheet 4 refrigerates the electronic device, and the heat dissipation module 5 dissipates heat of the semiconductor refrigeration sheet 4.

In practical application, wireless module 3 that charges can include circuit board and wireless charging coil, power source 2 can be fixed in on the circuit board and with circuit board electric connection, and then heat dissipation module 5 and semiconductor refrigeration piece 4 can respectively with circuit board electric connection to supply power through the circuit board. The number of the semiconductor refrigeration pieces 4 can be one or at least two; when the power interface is powered on, the wireless charging module 3 wirelessly charges the mobile phone, one end of the semiconductor refrigeration piece 4 close to the mobile phone is a cold end, one end close to the heat dissipation module 5 is a hot end, the cold end of the semiconductor refrigeration piece 4 absorbs heat of the mobile phone through the cooling plate 1, and the hot end diffuses the heat out through the heat dissipation module 5, the wireless charger of the electronic equipment can provide the mobile phone with the active refrigeration effect when charging the mobile phone, thereby reducing the charging power caused by over-high temperature during charging, the mobile phone can be flatly placed on the first cold conducting surface 11 to be attached to the cooling plate 1, the second cold conducting surface 12 of the cold conducting plate 1 covers the semiconductor refrigeration sheet 4, make the cell-phone back put on the charger by keeping flat, both can promote charge efficiency, also can increase area of contact, and then promote the refrigeration effect of cooling plate 1.

Optionally, wireless module 3 that charges pastes in the middle part of second cold face 12 that leads, when power interface 2 circular telegram, semiconductor refrigeration piece 4 refrigerates wireless module 3 that charges.

In practical application, when wireless charger charges for electronic equipment, because wireless charger often has higher power, so calorific capacity is great, wireless charging coil is fragile components and parts, the high temperature that the great calorific capacity arouses can cause the damage of charging coil, based on this, in the embodiment of this application, wireless module 3 that charges is laminated in the middle part of leading cold drawing 1's second cold face 12, the electronic equipment radiator is when carrying out wireless charging for electronic equipment, semiconductor refrigeration piece 4 not only refrigerates electronic equipment, still refrigerate wireless module 3 that charges through leading cold drawing 1, make wireless module 3's that charges temperature can control lowerly, it causes the condition of damage to take place because the high temperature to reduce wireless module 3 that charges. In the actual charging process, the electronic equipment is often kept flat in the middle of the cold conduction plate 1, the frequency of the middle of the cold conduction plate 1 and the attachment of the electronic equipment is also high, and the wireless charging module 3 is arranged in the middle of the cold conduction plate 1, so that the wireless charging efficiency can be further improved.

Optionally, referring to fig. 3, the heat dissipation module 5 includes: a heat radiation fan 51 and heat radiation fins 52; the heat dissipation fins 52 are provided with through holes 521 to form an accommodation space, the heat dissipation fan 51 is accommodated in the through holes 521, and the heat dissipation fan 51 is coupled with the power interface 2; when the power interface 2 is powered on, the heat dissipation fan 51 cooperates with the heat dissipation fins to dissipate heat of the semiconductor cooling fins 4.

In practical application, wireless module 3 that charges can be provided with circuit board and charging coil, the circuit board can with charging coil, semiconductor refrigeration piece 4 and radiator fan 51 electric connection, charging coil can provide wireless charging for the cell-phone, 2 circular telegrams of power source, can be through the circuit board to radiator fan 51 and semiconductor refrigeration piece 4, furthermore, the wireless charger of electronic equipment that this application embodiment provided can also be provided with temperature sensor, temperature sensor and circuit board electric connection, temperature sensor can last or the temperature of intermittent type nature monitoring cell-phone, and can feed back the temperature of monitoring to the circuit board, the circuit board is according to the operating condition of its temperature control radiator fan 51 of feedback and semiconductor refrigeration piece 4. For example: when the mobile phone starts to be wirelessly charged, the wireless charger and the heat productivity of the mobile phone at the moment are low, the temperature sensor senses the temperature of the mobile phone at the moment and feeds the temperature back to the circuit board, the circuit board can reduce the refrigeration power of the semiconductor refrigeration piece 4 or reduce the rotating speed of the cooling fan, the power consumption of the electronic equipment radiator can be reduced, or the semiconductor refrigeration piece 4 is directly closed, condensation caused by too low temperature inside the mobile phone is prevented, when the mobile phone runs a large-scale network game, the heat productivity of the mobile phone is large, at the moment, the temperature sensed by the temperature sensor is high, the circuit board can increase the refrigeration power of the semiconductor refrigeration piece 4, and the rotating speed of the cooling fan 51 can be increased. The radiator of the electronic equipment can adapt to more scenes, and the user experience is improved. The number of the temperature sensors can be multiple, the monitored temperature can be fed back to the circuit board, and the circuit board can adjust the working states of the semiconductor chilling plate 4 and the cooling fan 51 according to the temperature fed back by any one or more temperature sensors, so that the control is more accurate.

In the embodiment of the present application, the heat dissipation module 5 is provided with the heat dissipation fan 51 and the heat dissipation fins 52, the heat dissipation fan 51 supplies power through the power interface 2, when providing heat dissipation for the electronic device, the heat dissipation fins 52 absorb heat emitted from the hot end of the semiconductor cooling fin 4, the heat dissipation fan 51 can enhance air flow around the heat dissipation fins 52, and perform heat diffusion on the heat dissipation fins 52, so as to diffuse the heat to the outside air more quickly, thereby greatly improving the heat dissipation efficiency. The heat dissipation fins 52 are further provided with through holes 521 for accommodating the heat dissipation fan 51, so that the hot air carrying heat can be directly exhausted to the outside of the heat sink, the heat dissipation effect is further enhanced, the internal space of the heat sink of the electronic device can be saved, and the volume is reduced. The number of the heat dissipation fans 51 may be one or more, for example: when the number of the heat dissipation fans 51 is two, the number of the semiconductor chilling plates 4 may be two, and then the through holes 521 are formed at corresponding positions of the lower portions of the semiconductor chilling plates 4, so that the heat dissipation effect is better.

Optionally, referring to fig. 4, the electronic device heat sink is further provided with a heat conducting plate 6, and the heat conducting plate 6 includes: the first heat conducting surface is attached to the semiconductor refrigeration sheet 4, the second heat conducting surface covers the heat dissipation fins 52, and the heat conducting plate 6 is used for matching the heat dissipation fins 52 and the heat dissipation fan 51 to dissipate heat of the semiconductor refrigeration sheet 4.

The heat conducting plate 6 is arranged between the heat radiating fins 52 and the semiconductor chilling plates 4, so that the direct heat absorption area of the heat radiating fins 52 can be enlarged, the heat absorption of the semiconductor chilling plates 4 is accelerated, the heat emitted by the hot ends of the semiconductor chilling plates 4 is transferred to the heat radiating fins 52 more quickly, the heat accumulation at the hot ends of the semiconductor chilling plates 4 is reduced, and the better heat dissipation effect is realized. The heat conducting plate 6 mainly plays a role of heat transfer and needs to have certain heat conductivity, so the material of the heat conducting plate 6 may be glass, graphene, or the like, and is not limited herein.

Optionally, referring to fig. 5, the wireless charger of the electronic device is further provided with a heat insulation plate 7, the heat insulation plate 7 is disposed between the heat conduction plate 6 and the wireless charging module 3, and the heat insulation plate 7 is used for blocking the heat conduction plate 6 from transferring heat to the wireless charging module.

In practical application, wireless module 3 that charges can set up in heat-conducting plate 6 top, hug closely in leading cold drawing 1, the heat-conducting plate can rise after absorbing the heat of 4 hot junctions of semiconductor refrigeration piece, it can be to wireless module 3 that charges with the heat transfer this moment, influence wireless module 3 normal work that charges, for the separation heat to the wireless module 3 transmission that charges, this application embodiment is provided with heat insulating board 7 between heat-conducting plate 6 and wireless module 3 that charges, a transmission for limiting the heat, further protect wireless module 3 that charges, the reliability of the wireless charger of electronic equipment has been improved.

The above embodiments describe the wireless charger for electronic devices provided in the first aspect of the present application, and the electronic device heat sink in the present application will be described in detail below with reference to the accompanying drawings.

Referring to fig. 6 and 7, a second aspect of the present application provides a heat sink for electronic equipment, including: the refrigerator comprises a cold conducting plate 101, a semiconductor refrigerating plate 102 and a power supply module 103, wherein the power supply module 103 is coupled with the semiconductor refrigerating plate 102; the cold conducting plate 101 includes: first lead cold face 1011 and second lead cold face 1012, first lead cold face 1011 and be used for laminating electronic equipment, and second leads cold face 1012 and covers semiconductor refrigeration piece 102, when electronic equipment is carrying out wireless charging, power module 103 is connected with wireless charger for semiconductor refrigeration piece 102 provides the refrigeration for electronic equipment.

In the embodiment of the present application, the electronic device is provided with the power supply module 103 and the semiconductor cooling plate 102, and can radiate heat for the electronic device when the electronic device is wirelessly charged, for example: when the cell-phone is carrying out wireless charging, the user can keep flat the electronic equipment radiator in wireless charger top, then keep flat the cell-phone in electronic equipment radiator top, this moment, power module 103 is connected with wireless charger, make wireless charger supply power for the electronic equipment radiator, power module 103 supplies power for semiconductor refrigeration piece 102 again, and then make semiconductor refrigeration piece 102 refrigerate the cell-phone through leading cold drawing 101, it has first cold face 1011 and second to lead cold face 1012 to lead cold drawing 101, first cold face 1011 and the laminating of electronic equipment of leading, can make the cell-phone can be kept flat in electronic equipment radiator top, promote wireless charging effect, and can increase the area of contact with the cell-phone, reinforcing refrigeration effect. In the embodiment of the application, the electronic equipment is provided with the semiconductor refrigeration piece 102, and the semiconductor refrigeration piece 102 can provide the active refrigeration effect for the electronic equipment when the electronic equipment is wirelessly charged after the power supply module 103 supplies power, so that the situation that the charging power is reduced due to overhigh temperature when the electronic equipment is wirelessly charged is reduced, and the charging efficiency is greatly improved.

Optionally, power module 103 laminates in the middle part of second cold face 1012, in practical application, wireless charger need be for power module 103 power supply, consequently, power module 103 will produce certain heat, thermal gathering may produce the influence to power module 103's normal work, in the embodiment of the present application, laminate power module 103 in second cold face 1012, make semiconductor refrigeration piece 102 can refrigerate power module 103 through leading cold plate 101, electronic equipment is in carrying out wireless charging process, the electronic equipment that the embodiment of the present application provided not only can refrigerate electronic equipment, can also refrigerate electronic equipment radiator itself, the reliability of electronic equipment radiator has been promoted.

Optionally, referring to fig. 8, the electronic device heat sink provided in the present application is further provided with a heat dissipation fan 104 and heat dissipation fins 105, the heat dissipation fan 104 is coupled with the power supply module 103, and when the electronic device is wirelessly charged, the heat dissipation fan 104 cooperates with the heat dissipation fins 105 to dissipate heat of the semiconductor cooling fins 102.

In practical application, the cold end of the semiconductor refrigeration sheet 102 refrigerates the electronic device through the cold conducting plate 101, and the hot end of the semiconductor refrigeration sheet sends out heat.

Optionally, referring to fig. 9, the heat dissipation fin 105 is provided with a first through hole 1051 and a second through hole 1052 to form an accommodation space, the heat dissipation fan 104 is accommodated in the first through hole 1051, and the second through hole 1052 is used for accommodating a wireless charger when the electronic device is wirelessly charged.

In the embodiment of the present application, on one hand, the first through holes 1052 formed in the heat dissipation fins 105 can accommodate the heat dissipation fan 104, so that the internal space of the electronic device heat sink occupied by the heat dissipation fan 104 is reduced, and the volume of the electronic device heat sink is smaller. On the other hand, heat radiation fins are provided with second through-hole 1052, in the practical use process, when the electronic device is wirelessly charged, the wireless charger can be placed in second through-hole 1052, further, the wireless charger can be attached to second cold guide surface 1012 of cold guide plate 1, the distance between the electronic device and the wireless charger when charging is reduced, the second cold guide surface 1012 and the wireless charger can also provide a refrigeration effect for the wireless charger, and, because the wireless charger is placed in the through-hole of heat radiation fins 105, heat radiation fan 104 can strengthen the air flow around the wireless charger, further enhance the heat radiation effect, reduce the occurrence of damage of the wireless charger due to over-high temperature, and improve the charging efficiency and reliability.

Optionally, referring to fig. 10, the electronic device heat sink in the embodiment of the present application may further include a heat conducting plate 106, where the heat conducting plate 106 includes: the first heat conducting surface is attached to the semiconductor refrigeration sheet, the second heat conducting surface covers the heat dissipation fins, and the heat conducting plate 106 is used for matching with the heat dissipation fan 104 and the heat dissipation fins 106 to dissipate heat of the semiconductor refrigeration sheet 102. The heat conducting plate 106 is arranged between the heat radiating fins 105 and the semiconductor chilling plates 102, so that the direct heat absorption area of the heat radiating fins 105 can be enlarged, the heat absorption of the semiconductor chilling plates 2 is accelerated, the heat emitted by the hot ends of the semiconductor chilling plates 2 is transferred to the heat radiating fins 105 more quickly, the heat is reduced from being gathered at the hot ends of the semiconductor chilling plates 2, and a better heat dissipation effect is realized. The heat conducting plate 106 mainly plays a role of heat transfer and needs to have a certain thermal conductivity, and therefore, the material of the heat conducting plate 106 may be glass, graphene, or the like, and is not limited herein.

In practical application, power module 103 can be provided with circuit board and charging coil, the circuit board can with the charging coil, semiconductor refrigeration piece 102 and radiator fan 104 electric connection, the charging coil can be connected with wireless charger, and be semiconductor refrigeration piece 102 and radiator fan 104 power supply through the circuit board, furthermore, power module 103 can also include temperature sensor, temperature sensor and circuit board electric connection, temperature sensor can feed back the temperature that senses to the circuit board, the circuit board can be according to the temperature adjustment semiconductor refrigeration piece 102 of feedback and radiator fan 104's operating condition, for example: when the mobile phone starts to be wirelessly charged, the heat productivity of the wireless charger and the mobile phone at the moment is low, the temperature sensor senses that the temperature of the mobile phone at the moment is low and feeds the temperature back to the circuit board, the circuit board can reduce the refrigeration power of the semiconductor refrigeration piece 102 or reduce the rotating speed of the cooling fan, and then the power consumption of the electronic equipment radiator can be reduced, when the mobile phone runs a large-scale network game, the heat productivity of the mobile phone is large, at the moment, the temperature sensed by the temperature sensor is high, the circuit board can increase the refrigeration power of the semiconductor refrigeration piece 102, and the rotating speed of the cooling fan 104 can be increased. The radiator of the electronic equipment can adapt to more scenes, and the user experience is improved.

Power module 103 can also be provided with the battery that can store the electric quantity, battery and charging coil and circuit board electric connection, and the charging coil is being connected the back with wireless charger, and the charging coil can be with electric quantity input to the battery in, and the battery can be through the circuit board or directly to semiconductor refrigeration piece 102 and radiator fan 104 power supply after storing the electric quantity, for example: when the mobile phone does not need to be charged, the electronic equipment radiator can be independently charged, the electric quantity is further stored in the battery, when the mobile phone is wirelessly charged, the battery can directly supply power for all components in the radiator, the wireless charger only needs to wirelessly charge the mobile phone, the load of the wireless charger is reduced, the heat productivity can be further reduced, and the heat dissipation efficiency and the charging efficiency are further improved.

It is intended that the foregoing description of the disclosed embodiments enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A wireless charger for an electronic device, comprising: the device comprises a cold guide plate, a power interface, a wireless charging module, a semiconductor refrigeration piece and a heat dissipation module; the power supply interface is respectively coupled with the wireless charging module and the semiconductor refrigerating sheet; the cold guide plate includes: first lead cold face and second and lead cold face, first lead cold face is used for laminating electronic equipment, the cold face is led to the second covers semiconductor refrigeration piece works as when power source connects the circular telegram, wireless charging module does electronic equipment charges, semiconductor refrigeration piece is right electronic equipment refrigerates, the heat dissipation module group is right semiconductor refrigeration piece dispels the heat.

2. The wireless charger of claim 1, wherein the wireless charging module is attached to the second cold conducting surface, and when the power interface is powered on, the semiconductor cooling plate cools the wireless charging module.

3. The wireless charger for electronic devices of claim 1, wherein said heat sink module comprises: a heat radiation fan and heat radiation fins; the heat dissipation fins are provided with through holes to form accommodating spaces, the heat dissipation fans are accommodated in the through holes, and the heat dissipation fans are coupled with the power interfaces; when the power interface is electrified, the heat dissipation fan is matched with the heat dissipation fins to dissipate heat of the semiconductor refrigeration sheet.

4. The wireless charger for electronic devices of claim 3, further comprising: a heat-conducting plate, the heat-conducting plate comprising: the heat-conducting plate is used for matching the heat-radiating fins and the heat-radiating fan to radiate the semiconductor refrigeration piece.

5. The wireless charger for electronic devices of claim 4, further comprising: the heat insulation plate is arranged between the heat conduction plate and the wireless charging module and used for blocking the heat conduction plate from transferring heat to the wireless charging module.

6. An electronic device heat sink, comprising: the cooling device comprises a cold conducting plate, a semiconductor refrigerating plate and a power supply module, wherein the power supply module is coupled with the semiconductor refrigerating plate; the cold guide plate includes: first lead cold face and second and lead cold face, first lead cold face is used for laminating electronic equipment, the cold face is led to the second covers the semiconductor refrigeration piece, works as when electronic equipment is carrying out wireless charging, the power module is connected with wireless charger, makes the semiconductor refrigeration piece does electronic equipment provides the refrigeration.

7. The electronic device heat sink of claim 6, wherein the power module is attached to the second cold conducting surface.

8. The electronic device heat sink of claim 6, further comprising: the cooling fan is coupled with the power supply module, and when the electronic equipment is wirelessly charged, the cooling fan is matched with the cooling fins to cool the semiconductor chilling plate.

9. The heat sink for electronic devices as claimed in claim 8, wherein the heat dissipating fins are provided with a first through hole in which the heat dissipating fan is received and a second through hole for receiving the wireless charger when the electronic device is wirelessly charged to form a receiving space.

10. The electronic device heat sink of claim 8, further comprising: a heat-conducting plate, the heat-conducting plate comprising: the heat-conducting plate is used for matching the heat-radiating fan and the heat-radiating fins to radiate the heat of the semiconductor refrigerating sheet.

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