CN212433567U - Radiating structure of direct-projection type full-sealed optical machine of single-chip liquid crystal projector - Google Patents
Radiating structure of direct-projection type full-sealed optical machine of single-chip liquid crystal projector Download PDFInfo
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- CN212433567U CN212433567U CN202021571180.6U CN202021571180U CN212433567U CN 212433567 U CN212433567 U CN 212433567U CN 202021571180 U CN202021571180 U CN 202021571180U CN 212433567 U CN212433567 U CN 212433567U
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- 230000003287 optical effect Effects 0.000 title claims abstract description 46
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 43
- 230000017525 heat dissipation Effects 0.000 claims abstract description 37
- 238000003384 imaging method Methods 0.000 claims abstract description 36
- 238000009423 ventilation Methods 0.000 claims description 19
- 239000011521 glass Substances 0.000 claims description 16
- 238000009413 insulation Methods 0.000 claims description 9
- 230000005855 radiation Effects 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000000428 dust Substances 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000002265 prevention Effects 0.000 abstract description 3
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000010992 reflux Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 241000276498 Pollachius virens Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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Abstract
The utility model discloses a single-chip liquid crystal projector direct projection type full-sealed optical machine heat dissipation structure, which comprises a first shell with openings at two ends, a light source system, a light source collector, an imaging system and a lens which are sequentially arranged along an optical axis, and a fan and a heat exchange radiator, wherein the imaging system is arranged in the first shell, one end of the first shell is sealed with the lens, and the other end of the first shell is sealed with the light source collector; a heat dissipation cavity is formed between the imaging system and the lens, the fan is arranged in the heat dissipation cavity, one end of the heat exchange radiator is arranged in the heat dissipation cavity, and the fan, the imaging system, the heat exchange radiator and the heat dissipation cavity are communicated in sequence to form an inner circulation airflow channel. The utility model provides a single-chip liquid crystal projector direct-projection type full-sealed optical machine heat dissipation structure, which has low manufacturing cost and good heat dissipation and dust prevention effects; high light utilization rate and good optical axis stability.
Description
Technical Field
The utility model relates to a single chip projector field especially discloses a single chip liquid crystal projector direct-throw formula totally enclosed ray apparatus heat radiation structure.
Background
A single chip liquid crystal projector is a projector which uses a full color TFT liquid crystal screen as a light valve, uses a Kohler lighting system with certain design, consists of a light source, a condenser lens, a front Fresnel lens, a liquid crystal screen, a rear Fresnel lens, a lens and the like, and forms images by projection and amplification. Since the end of the last 80 s and the beginning of the 90 s, many of the shortcomings, such as volume, luminous flux output, appearance, color, quality stability, etc., have been improved over the years of history that has been experienced.
However, since the transmittance of the liquid crystal screen is only 5-7% (depending on the manufacturer and model of the liquid crystal screen), the efficiency is only 5-7%, and the remaining 93-95% of light is totally concentrated on the liquid crystal screen and absorbed by the liquid crystal screen (about 1% of light is reflected by the liquid crystal screen), and is reflected in the form of heat, the temperature of the liquid crystal screen is very high, and forced heat dissipation by a fan is required to ensure that the temperature of the liquid crystal screen is lower than 70 ℃, so that all optical devices from the condenser lens to the lens cannot be sealed due to ventilation, and dust cannot be prevented. After the optical device is used for a certain time, deposited dust seriously causes the index of the projector to be reduced, after a serious person uses the projector for one year (about 3000 hours), the optical performance of the projector is inferior to 1/5 of a new projector, the projector is difficult to continue to use, and after the serious person works for about half a month, the whole machine must be disassembled to remove dust of optical devices such as a core imaging device liquid crystal screen, and the like, so that a consumer loses confidence on the single-chip projector because the maintenance is really complicated.
Therefore, the existing single-chip projector is troublesome in maintenance caused by dust accumulation in the later use process, and is a technical problem to be solved urgently.
SUMMERY OF THE UTILITY MODEL
The utility model provides a single chip liquid crystal projector direct-throw type totally enclosed light machine heat radiation structure aims at solving the loaded down with trivial details technical problem of maintenance that current single chip projector caused because of laying dust in the later stage use.
The utility model provides a single-chip liquid crystal projector direct projection type full-sealed optical machine heat dissipation structure, which comprises a first shell with openings at two ends, a light source system, a light source collector, an imaging system and a lens which are sequentially arranged along an optical axis, and a fan and a heat exchange radiator, wherein the imaging system is arranged in the first shell, one end of the first shell is sealed with the lens, and the other end of the first shell is sealed with the light source collector; a heat dissipation cavity is formed between the imaging system and the lens, the fan is arranged in the heat dissipation cavity, one end of the heat exchange radiator is arranged in the heat dissipation cavity, and the fan, the imaging system, the heat exchange radiator and the heat dissipation cavity are communicated in sequence to form an inner circulation airflow channel.
Further, the imaging system comprises a condensing lens, heat insulation glass, a display screen and an imaging lens which are sequentially arranged along an optical axis, and backflow grooves for guiding flow are arranged between the display screen and the fan and between the heat insulation glass and the fan.
Further, a first ventilation air duct is formed between the condensing lens and the heat insulation glass; a second ventilation air channel is formed between the heat insulation glass and the display screen; a third ventilation air channel is formed between the display screen and the imaging lens; the reflux groove is communicated with the first ventilation air channel, the second ventilation air channel and the third ventilation air channel respectively to form a reflux channel.
Furthermore, an incident polaroid is arranged on the heat-insulating glass, and an emergent polaroid is arranged on the display screen.
Further, the condenser lens is a fresnel lens.
Further, the display screen is a liquid crystal screen.
Further, the imaging lens is a fresnel lens.
Furthermore, the direct projection type full-sealed optical engine heat dissipation structure of the single-chip liquid crystal projector further comprises a light source radiator, and the light source radiator is arranged on one side of the light source system.
Furthermore, the direct projection type full-sealed optical engine heat dissipation structure of the single-chip liquid crystal projector further comprises a heat dissipation fan and a second shell, wherein one end of the second shell is sealed with the heat exchange radiator, and the other end of the second shell is sealed with the light source radiator.
Further, the light source radiator, the heat radiation fan and the heat exchange radiator are sequentially arranged in a straight line to form a straight-through closed type airflow channel.
The utility model discloses the beneficial effect who gains does:
the utility model provides a single chip liquid crystal projector direct projection type totally enclosed ray apparatus heat radiation structure adopts first casing, light source system, light source collector, imaging system, camera lens, fan and heat exchange radiator, through arranging light source system, light source collector, imaging system and camera lens along the optical axis in proper order, adopts the direct projection type to cancel the holophote, reduced material cost, reduced the loss of light amount (about 5%), improve the stability of optical axis; the ray apparatus adopts the leakproofness structure, prevents that dustproof, highlight leak outward, and inside heat adopts inside fan + inside and outside exchange radiator, reaches inside radiating effect. The utility model provides a single-chip liquid crystal projector direct-projection type full-sealed optical machine heat dissipation structure, which has low manufacturing cost and good heat dissipation and dust prevention effects; high light utilization rate and good optical axis stability.
Drawings
Fig. 1 is a schematic view of an internal three-dimensional structure of an embodiment of a direct-projection type hermetically-sealed optical engine heat dissipation structure of a single-chip liquid crystal projector according to the present invention;
fig. 2 is a schematic view of an internal three-dimensional structure of an embodiment of a direct-projection type hermetically-sealed optical engine heat dissipation structure of a single-chip liquid crystal projector according to the present invention;
fig. 3 is a schematic top view of an embodiment of a direct-projection type hermetically sealed optical engine heat dissipation structure of a single-chip liquid crystal projector.
The reference numbers illustrate:
10. a first housing; 20. a light source system; 30. a light source collector; 40. an imaging system; 50. a lens; 60. a fan; 70. a heat exchange radiator; 41. a condenser lens; 42. heat insulating glass; 43. a display screen; 44. an imaging lens; 80. a light source heat sink; 90. a heat radiation fan; 110. a second housing.
Detailed Description
In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.
As shown in fig. 1 and fig. 2, a first embodiment of the present invention provides a single-chip liquid crystal projector direct projection type fully-sealed light machine heat dissipation structure, which includes a first casing 10 with two open ends, a light source system 20, a light source collector 30, an imaging system 40 and a lens 50, a fan 60 and a heat exchange radiator 70, which are sequentially arranged along an optical axis, wherein the imaging system 40 is disposed in the first casing 10, one end of the first casing 10 is sealed with the lens 50, and the other end of the first casing 10 is sealed with the light source collector 30; a heat dissipation cavity is formed between the imaging system 40 and the lens 50, the fan 60 is arranged in the heat dissipation cavity, one end of the heat exchange radiator 70 is arranged in the heat dissipation cavity, and the fan 60, the imaging system 40, the heat exchange radiator 70 and the heat dissipation cavity are sequentially communicated to form an inner circulation airflow channel.
In the present embodiment, the optical path direct projection method is adopted, no mirror is provided, the light quantity utilization amount is increased by 5%, the material cost is reduced, and the accuracy of the optical axis is improved.
In the above structure, please see fig. 1 and 2, the imaging system 40 includes a condensing lens 41, a heat insulating glass 42, a display screen 43 and an imaging lens 44 sequentially arranged along an optical axis, and a return channel for guiding the flow is provided between the display screen 43 and the fan 60 and between the heat insulating glass 42 and the fan 60. Further, a first ventilation air duct is formed between the condensing lens 41 and the heat insulation glass 42; a second ventilation duct is formed between the heat insulation glass 42 and the display screen 43; a third ventilation duct is formed between the display screen 43 and the imaging lens 44; the reflux groove is communicated with the first ventilation air channel, the second ventilation air channel and the third ventilation air channel respectively to form a reflux channel. In this embodiment, an incident polarizer is disposed on the insulating glass 42, and an exit polarizer is disposed on the display panel 43. In the present embodiment, a fresnel lens is used for both the condenser lens 41 and the imaging lens 44. The display screen 43 is an LCD. In this embodiment, the heat dissipation effect of the LCD screen is optimized by arranging the air duct for diversion.
Referring to fig. 1 to fig. 3, the direct-projection type hermetically sealed optical engine heat dissipation structure of the single-chip liquid crystal projector according to the present embodiment further includes a light source heat sink 80, a heat dissipation fan 90 and a second housing 110, where the light source heat sink 80 is disposed on one side of the light source system 20. One end of the second housing 110 is sealed with the heat exchange heat sink 70, and the other end of the second housing 110 is sealed with the light source heat sink 80. Preferably, the light source radiator 80, the heat radiating fan 90 and the heat exchanging radiator 70 are sequentially arranged in a line to form a straight-through closed type air flow passage. In this embodiment, a straight-through closed airflow channel is adopted, and the fan 60 is used to make the airflow pass through the heat exchange radiator 70 and perform heat emission from the light source radiator 80, so as to take away heat.
The direct-projection type fully-sealed optical machine heat dissipation structure of the single-chip liquid crystal projector adopts the first shell, the light source system, the light source collector, the imaging system, the lens, the fan and the heat exchange radiator, and adopts the direct-projection type by sequentially arranging the light source system, the light source collector, the imaging system and the lens along the optical axis, so that a total reflector is cancelled, the material cost is reduced, the loss of light quantity is reduced (by about 5 percent), and the stability of the optical axis is improved; the ray apparatus adopts the leakproofness structure, prevents that dustproof, highlight leak outward, and inside heat adopts inside fan + inside and outside exchange radiator, reaches inside radiating effect. The single-chip liquid crystal projector direct-projection type fully-sealed optical machine heat dissipation structure provided by the embodiment of the invention has the advantages of low manufacturing cost and good heat dissipation and dust prevention effects; high light utilization rate and good optical axis stability.
While the preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the scope of the invention. It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A single-chip liquid crystal projector direct projection type totally-sealed optical machine heat dissipation structure is characterized by comprising a first shell (10) with two open ends, a light source system (20), a light source collector (30), an imaging system (40), a lens (50), a fan (60) and a heat exchange radiator (70), wherein the light source system (20), the light source collector (30), the imaging system (40) and the lens (50) are sequentially arranged along an optical axis, the imaging system (40) is arranged in the first shell (10), one end of the first shell (10) is sealed with the lens (50), and the other end of the first shell (10) is sealed with the light source collector (30); a heat dissipation cavity is formed between the imaging system (40) and the lens (50), the fan (60) is arranged in the heat dissipation cavity, one end of the heat exchange radiator (70) is arranged in the heat dissipation cavity, and the fan (60), the imaging system (40), the heat exchange radiator (70) and the heat dissipation cavity are sequentially communicated to form an inner circulation airflow channel.
2. The direct-projection type totally-enclosed optical engine heat-dissipating structure of a single-chip liquid crystal projector as claimed in claim 1,
imaging system (40) are including condensing lens (41), thermal-insulated glass (42), display screen (43) and imaging lens (44) that arrange along the optical axis in proper order, display screen (43) with be equipped with the return flume that is used for the water conservancy diversion between fan (60), and thermal-insulated glass (42) with between fan (60).
3. The direct-projection type totally-enclosed optical engine heat-dissipating structure of the single-chip liquid crystal projector as claimed in claim 2,
a first ventilation air duct is formed between the condensing lens (41) and the heat insulation glass (42); a second ventilation air channel is formed between the heat insulation glass (42) and the display screen (43); a third ventilation air channel is formed between the display screen (43) and the imaging lens (44); the backflow groove is communicated with the first ventilation air channel, the second ventilation air channel and the third ventilation air channel respectively to form a backflow channel.
4. The direct-projection type totally-enclosed optical engine heat-dissipating structure of the single-chip liquid crystal projector as claimed in claim 2,
an incident polaroid is arranged on the heat insulation glass (42), and an emergent polaroid is arranged on the display screen (43).
5. The direct-projection type totally-enclosed optical engine heat-dissipating structure of the single-chip liquid crystal projector as claimed in claim 2,
the condenser lens (41) is a Fresnel lens.
6. The direct-projection type totally-enclosed optical engine heat-dissipating structure of the single-chip liquid crystal projector as claimed in claim 2,
the display screen (43) is a liquid crystal screen.
7. The direct-projection type totally-enclosed optical engine heat-dissipating structure of the single-chip liquid crystal projector as claimed in claim 2,
the imaging lens (44) is a Fresnel lens.
8. The direct-projection type totally-enclosed optical engine heat-dissipating structure of the single-chip liquid crystal projector as claimed in claim 2,
the radiating structure of the single-chip liquid crystal projector direct-projection type full-sealed optical machine further comprises a light source radiator (80), and the light source radiator (80) is arranged on one side of the light source system (20).
9. The direct-projection type totally enclosed optical engine heat dissipating structure of single chip liquid crystal projector as claimed in claim 8,
the radiating structure of the single-chip liquid crystal projector direct projection type full-sealed optical machine further comprises a radiating fan (90) and a second shell (110), one end of the second shell (110) is sealed with the heat exchange radiator (70), and the other end of the second shell (110) is sealed with the light source radiator (80).
10. The direct-projection type totally-enclosed optical engine heat-dissipating structure of a single-chip liquid crystal projector as claimed in claim 9,
the light source radiator (80), the heat radiation fan (90) and the heat exchange radiator (70) are sequentially arranged in a straight line to form a straight-through closed type airflow channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021571180.6U CN212433567U (en) | 2020-07-31 | 2020-07-31 | Radiating structure of direct-projection type full-sealed optical machine of single-chip liquid crystal projector |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021571180.6U CN212433567U (en) | 2020-07-31 | 2020-07-31 | Radiating structure of direct-projection type full-sealed optical machine of single-chip liquid crystal projector |
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| CN212433567U true CN212433567U (en) | 2021-01-29 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112631053A (en) * | 2021-03-06 | 2021-04-09 | 深圳市源广浩电子有限公司 | DLP projection device |
| CN113900331A (en) * | 2021-09-30 | 2022-01-07 | 歌尔光学科技有限公司 | Projector optical machine |
| CN114594647A (en) * | 2022-03-31 | 2022-06-07 | 峰米(重庆)创新科技有限公司 | Projection optical machine and projection equipment |
| CN115016209A (en) * | 2022-04-18 | 2022-09-06 | 峰米(重庆)创新科技有限公司 | Heat radiation structure and projector |
-
2020
- 2020-07-31 CN CN202021571180.6U patent/CN212433567U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112631053A (en) * | 2021-03-06 | 2021-04-09 | 深圳市源广浩电子有限公司 | DLP projection device |
| CN112631053B (en) * | 2021-03-06 | 2021-12-07 | 深圳市源广浩电子有限公司 | DLP projection device |
| CN113900331A (en) * | 2021-09-30 | 2022-01-07 | 歌尔光学科技有限公司 | Projector optical machine |
| CN114594647A (en) * | 2022-03-31 | 2022-06-07 | 峰米(重庆)创新科技有限公司 | Projection optical machine and projection equipment |
| CN114594647B (en) * | 2022-03-31 | 2023-12-12 | 峰米(重庆)创新科技有限公司 | Projection ray apparatus and projection equipment |
| CN115016209A (en) * | 2022-04-18 | 2022-09-06 | 峰米(重庆)创新科技有限公司 | Heat radiation structure and projector |
| CN115016209B (en) * | 2022-04-18 | 2023-12-12 | 峰米(重庆)创新科技有限公司 | Heat radiation structure and projector |
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Denomination of utility model: A Single Chip LCD Projector Direct Projection Fully Sealed Light Machine Heat Dissipation Structure Granted publication date: 20210129 Pledgee: Agricultural Bank of China Limited Hunan Xiangjiang New Area Branch Pledgor: CHANGSHA CRE ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2024980009145 |