CN212425933U - TP double faced adhesive and glue fixing assembly and electronic equipment - Google Patents

TP double faced adhesive and glue fixing assembly and electronic equipment Download PDF

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Publication number
CN212425933U
CN212425933U CN202020550570.9U CN202020550570U CN212425933U CN 212425933 U CN212425933 U CN 212425933U CN 202020550570 U CN202020550570 U CN 202020550570U CN 212425933 U CN212425933 U CN 212425933U
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China
Prior art keywords
glue
double
faced adhesive
adhesive tape
double faced
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Active
Application number
CN202020550570.9U
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Chinese (zh)
Inventor
何炳强
邓和军
黄琼进
杜军红
汤肖迅
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Shanghai Longcheer Technology Co Ltd
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Shanghai Longcheer Technology Co Ltd
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Priority to CN202020550570.9U priority Critical patent/CN212425933U/en
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Abstract

The application discloses subassembly and electronic equipment are fixed to TP double faced adhesive tape and glue, should fix the subassembly and include: TP double faced adhesive tape and glue, be equipped with the chamfer structure in the terminal surface department of TP double faced adhesive tape, apply between this chamfer structure glue with carry out TP double faced adhesive tape between the glue is fixed. The electronic equipment comprises the TP double-faced adhesive and an adhesive fixing component. TP double faced adhesive tape and glue seam crossing in this application, the double faced adhesive tape terminal surface adopts the chamfer structure, even the glue volume also can not spill over the preceding shell outward appearance face when many, prevents that TP double faced adhesive tape and glue seam crossing from appearing the gap to can improve the salt spray reliability test qualification rate of complete machine.

Description

TP double faced adhesive and glue fixing assembly and electronic equipment
Technical Field
The application relates to a TP double faced adhesive and glue fixing assembly and an electronic device.
Background
The structure of the joint M between the existing TP double-sided adhesive tape 10 and the glue 20 is shown in fig. 1, wherein the end surface of the TP double-sided adhesive tape 10 is relatively flat, and when the amount of the glue 20 is large, the glue is easy to overflow onto the appearance surface of the front shell 30, which results in poor appearance of the whole machine. When the amount of the glue 20 is small, a gap is easily formed between the TP double faced adhesive tape 10 and the glue 20 at the seam M, and salt fog can enter the whole machine from the gap during a salt fog reliability test, so that the function of the whole machine is failed, and the salt fog reliability test is unqualified.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects or shortcomings of the prior art, the technical problem to be solved by the application is to provide the TP double-faced adhesive and glue fixing component and the electronic equipment.
In order to solve the technical problem, the application is realized by the following technical scheme:
the application provides a subassembly is fixed to TP double faced adhesive tape and glue, includes: TP double faced adhesive tape and glue, be equipped with the chamfer structure in the terminal surface department of TP double faced adhesive tape, apply between this chamfer structure glue with carry out TP double faced adhesive tape between the glue is fixed.
Further, the TP double-faced adhesive tape and glue fixing assembly is characterized in that the chamfer angle of the chamfer angle structure is more than or equal to 90 degrees.
Further, the TP double-sided adhesive tape and glue fixing assembly is characterized in that the setting thickness of the free end of the chamfering structure is smaller than that of the TP double-sided adhesive tape.
Further, the TP double-sided adhesive tape and glue fixing assembly is characterized in that the bottom surface of the chamfer structure and the bottom surface of the TP double-sided adhesive tape are on the same horizontal plane.
Further, the above TP double faced adhesive tape and glue fixing component, wherein the TP double faced adhesive tape and the chamfering structure are in an integrated structure.
Further, above-mentioned TP double faced adhesive tape and glue fixed subassembly, wherein, TP double faced adhesive tape and the outside of glue still is equipped with preceding shell.
The application also provides an electronic device, which comprises the TP double-faced adhesive and the adhesive fixing component.
Compared with the prior art, the method has the following technical effects:
TP double faced adhesive tape and glue seam crossing in this application, the double faced adhesive tape terminal surface adopts the chamfer structure, even the glue volume also can not spill over the preceding shell outward appearance face when many, prevents that TP double faced adhesive tape and glue seam crossing from appearing the gap to can improve the salt spray reliability test qualification rate of complete machine.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1: the structure schematic diagram of a TP double-faced adhesive and glue fixing component in the prior art;
FIG. 2: the application TP double faced adhesive and glue fixing component has a schematic structural diagram.
Detailed Description
The conception, specific structure and technical effects of the present application will be further described in conjunction with the accompanying drawings to fully understand the purpose, characteristics and effects of the present application.
As shown in fig. 2, in one embodiment of the present application, an assembly for fixing TP double-sided tape 10 and glue 20 includes: TP double faced adhesive tape 10 and glue 20, be equipped with chamfer structure 11 at the terminal surface department of TP double faced adhesive tape 10, apply between this chamfer structure 11 glue 20 in order to carry out the fixed between TP double faced adhesive tape 10 and glue 20. In the seam M between the TP double-sided tape 10 and the glue 20 of the embodiment, the end face of the double-sided tape 10 adopts the chamfer structure 11, so that the outer appearance surface of the front shell 30 cannot overflow even when the glue 20 is in a large amount, the seam M between the TP double-sided tape 10 and the glue 20 is prevented from generating a gap, and the salt spray reliability test qualification rate of the whole machine can be improved.
In the embodiment, the chamfer angle of the chamfer structure 11 is more than or equal to 90 degrees.
Further, the thickness of the free end of the chamfering structure 11 is smaller than the thickness of the TP double-sided tape 10, so as to form the chamfering structure 11.
Further, the bottom surface of the chamfering structure 11 and the bottom surface of the TP double-sided tape 10 are on the same horizontal plane, so that the surface of the front case 30, which will be described below, is relatively flat, which is convenient for mass production and processing.
In this embodiment, the TP double-sided tape 10 and the chamfering structure 11 are integrally formed, and the integrally formed structure is convenient for batch processing and production.
Wherein, the outer sides of the TP double-sided adhesive tape 10 and the glue 20 are further provided with a front shell 30.
Through the above technical solution of this embodiment, as shown in fig. 1, in the prior art, the appearance fraction defective of the seam M between the TP double-sided tape 10 and the glue 20 due to glue overflow is about 0.5%, and the seam fraction defective of the seam M between the TP double-sided tape 10 and the glue 20 is about 1%.
The application also provides an electronic device, which comprises the TP double-sided adhesive tape 10 and the glue 20 fixing component.
The TP double-sided tape 10 and glue 20 fixing components referred to therein are described in detail above and will not be described herein.
The electronic device includes, but is not limited to, electronic products such as a smart phone, a tablet computer, a video camera, a camera, and the like.
According to the salt spray reliability testing device, the situation that the appearance of the whole machine is poor due to the fact that glue overflows to the appearance face of the front shell can be avoided, and the situation that salt spray reliability testing is unqualified due to the fact that salt spray enters the whole machine from the gap when the gap appears at the joint of the double faced adhesive tape and the glue can be effectively avoided. TP double faced adhesive tape and glue seam crossing in this application, the double faced adhesive tape terminal surface adopts the chamfer structure, even the glue volume also can not spill over the preceding shell outward appearance face when many, prevents that TP double faced adhesive tape and glue seam crossing from appearing the gap to can improve the salt spray reliability test qualification rate of complete machine. Therefore, the method has good market application prospect.
The above embodiments are merely to illustrate the technical solutions of the present application and are not limitative, and the present application is described in detail with reference to preferred embodiments. It will be understood by those skilled in the art that various modifications and equivalent arrangements may be made in the present invention without departing from the spirit and scope of the present invention and shall be covered by the appended claims.

Claims (7)

1. The utility model provides a subassembly is fixed to TP double faced adhesive and glue which characterized in that includes: TP double faced adhesive tape and glue, be equipped with the chamfer structure in the terminal surface department of TP double faced adhesive tape, apply between this chamfer structure glue with carry out TP double faced adhesive tape between the glue is fixed.
2. The TP double-faced adhesive and glue fixing assembly according to claim 1, wherein the chamfer angle of the chamfer structure is greater than or equal to 90 degrees.
3. The TP double-sided adhesive and glue fixture assembly of claim 1 or 2, wherein a thickness of a free end of the chamfered structure is less than a thickness of the TP double-sided adhesive.
4. The TP double-sided adhesive and glue fixture assembly of claim 1 or 2, wherein the bottom surface of the chamfer structure is level with the bottom surface of the TP double-sided adhesive.
5. The TP double-sided adhesive and glue fixing assembly according to claim 1, wherein the TP double-sided adhesive and the chamfering structure are integrally formed.
6. The TP double-faced adhesive and glue fixing assembly according to claim 1, 2 or 5, characterized in that a front shell is further arranged on the outer side of the TP double-faced adhesive and the glue.
7. An electronic device comprising the TP double-sided adhesive and glue fixing assembly of any one of claims 1 to 6.
CN202020550570.9U 2020-04-14 2020-04-14 TP double faced adhesive and glue fixing assembly and electronic equipment Active CN212425933U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020550570.9U CN212425933U (en) 2020-04-14 2020-04-14 TP double faced adhesive and glue fixing assembly and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020550570.9U CN212425933U (en) 2020-04-14 2020-04-14 TP double faced adhesive and glue fixing assembly and electronic equipment

Publications (1)

Publication Number Publication Date
CN212425933U true CN212425933U (en) 2021-01-29

Family

ID=74297975

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020550570.9U Active CN212425933U (en) 2020-04-14 2020-04-14 TP double faced adhesive and glue fixing assembly and electronic equipment

Country Status (1)

Country Link
CN (1) CN212425933U (en)

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