CN210405461U - Circuit board, camera module and electronic equipment - Google Patents
Circuit board, camera module and electronic equipment Download PDFInfo
- Publication number
- CN210405461U CN210405461U CN201921423394.6U CN201921423394U CN210405461U CN 210405461 U CN210405461 U CN 210405461U CN 201921423394 U CN201921423394 U CN 201921423394U CN 210405461 U CN210405461 U CN 210405461U
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- Prior art keywords
- plate
- circuit board
- opening
- area
- rubber
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- 239000003292 glue Substances 0.000 claims abstract description 25
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 238000002955 isolation Methods 0.000 claims description 7
- 125000006850 spacer group Chemical group 0.000 claims description 7
- 230000003014 reinforcing effect Effects 0.000 claims description 6
- 239000010408 film Substances 0.000 description 11
- 239000010410 layer Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 239000013039 cover film Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000011435 rock Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 206010070834 Sensitisation Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
Images
Landscapes
- Camera Bodies And Camera Details Or Accessories (AREA)
- Studio Devices (AREA)
Abstract
The utility model relates to a circuit board, camera and electronic equipment. The circuit board includes: the first plate is provided with a mounting surface, a connecting surface and a first opening, wherein the mounting surface and the connecting surface are arranged in an opposite mode, and the first opening penetrates from the mounting surface to the connecting surface; the rubber isolating pad is provided with a second opening penetrating through the rubber isolating pad; the rubber isolating pad is connected with the connecting surface, and the second opening is opposite to the first opening; the second plate is connected with the surface of the rubber isolating pad far away from the first plate and is provided with a first area opposite to the second opening, a second area in contact with the rubber isolating pad and a third area opposite to the first plate in a spaced mode; and the connecting glue layer is arranged in the third area, is connected with the connecting surface and is used for connecting the first plate and the second plate together. Because the second district is equipped with and separates the cushion, so when the third district scribbled and establish the glue solution, the glue solution can not overflow to first district, can not form in first district and glue the piece, and then avoid setting up the photosensitive film and produce the interference, also can avoid appearing the gluey piece in first district like this and drop and get into the camera lens module, influence the problem of camera lens module work simultaneously.
Description
Technical Field
The utility model relates to a camera technical field especially relates to a circuit board, camera and electronic equipment.
Background
As shown in fig. 1, a circuit board used in a current camera module generally adopts an FPC board 1 (i.e. a flexible circuit board), and in order to ensure the strength of the FPC board 1, a reinforcing plate 2 is usually attached to the FPC board 1 by an adhesive method. In order to reduce the height of the camera module, a hollowed-out notch 11 is usually formed in the FPC board 1, and components such as a photosensitive film are disposed at the bottom of the notch 11 (i.e., disposed on the reinforcing plate 2). Because during the actual production, can set up fretwork breach 11 on FPC board 1 earlier, then bond FPC board 1 and stiffening plate 2 together, so glue 3 can overflow to breach 11 in when bonding FPC board 1 and stiffening plate 2, glue 3 solidification back stiffening plate 2 and the relative region of breach 11 can leave gluey piece 31 promptly, and these gluey pieces 31 can produce the interference to the equipment of sensitization piece, and then influence the formation of image quality of the module of making a video recording.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a circuit board, a camera module and an electronic device for solving the problem of overflow of glue solution to the region where the reinforcing plate is opposite to the notch.
A circuit board, comprising: the first plate is provided with a mounting surface, a connecting surface and a first opening, wherein the mounting surface and the connecting surface are arranged oppositely, and the first opening penetrates from the mounting surface to the connecting surface; the rubber isolating pad is provided with a second opening penetrating through the rubber isolating pad; the rubber isolating pad is connected with the connecting surface, and the second opening is opposite to the first opening; the second plate is connected with the surface of the rubber isolating pad, which is far away from the first plate, and is provided with a first area, a second area and a third area from inside to outside in sequence in the direction parallel to the second plate; the first area is opposite to the second opening, the second area is in contact with the rubber isolating pad, and the third area is opposite to the first plate at intervals; and the connecting glue layer is arranged in the third area, is connected with the connecting surface and is used for connecting the first plate and the second plate together.
The utility model discloses in, because the second district is equipped with and separates the cushion, so when the third district scribbles the glue solution, the glue solution can not overflow to first district, so the glue solution solidification can not form at first district when connecting the glue film and glue the piece, and then avoid producing the interference to setting up the photosensitive film, the gluey piece that also can avoid appearing first district simultaneously drops and gets into the camera lens module like this, and influences the problem of camera lens module work, provides the guarantee for the performance of camera module.
Further, the rubber separating pad is provided with a first surface and a second surface which are arranged oppositely, and a side surface connecting the first surface and the second surface; wherein the second opening penetrates from the first surface to the second surface, and the side surface is connected with the connecting glue layer, so that the rubber isolating pad can be more firmly installed,
furthermore, the rubber isolating pad is of an annular structure.
Furthermore, the second area is a first concave structure arranged on the second plate, and the rubber isolating pad is arranged in the first concave structure. The thickness of the whole circuit board can be reduced by the arrangement, so that the thickness of the camera module can be further reduced.
Furthermore, the first concave structure is matched with the rubber isolating pad, so that the rubber isolating pad is prevented from shaking in the first concave structure. Therefore, the rubber isolating pad and the second plate can be connected more firmly, and the installation of the rubber isolating pad can be conveniently positioned.
Furthermore, the first board is still including setting up the second indent structure of connecting the face, separate the cushion and install in the second indent structure, can further reduce the thickness of circuit board like this.
Furthermore, the second indent structure with separate the cushion and match, in order to avoid separate the cushion and be in rock in the second indent structure, and then make the connection counterpoint between first board and the second board more accurate.
Further, a projection of the inner surface of the first opening on the second plate coincides with a projection of the inner surface of the second opening on the second plate.
Further, the first plate is a flexible circuit board, and the second plate is a reinforcing plate of the flexible circuit board.
A camera module comprises; a circuit board as described in any one of the above; the photosensitive piece is arranged in the first area of the circuit board; and the lens module is arranged on the mounting surface of the circuit board, and the lens module is opposite to the photosensitive film.
An electronic device is characterized by comprising the camera module.
Drawings
FIG. 1 is a schematic diagram of a conventional circuit board stack;
fig. 2 is a schematic diagram of a camera module according to the present invention;
fig. 3 is a schematic structural view of the rubber isolating pad provided by the present invention;
fig. 4 is a schematic structural diagram of a second plate provided by the present invention;
fig. 5 is a schematic diagram of a stack of circuit boards according to the present invention;
fig. 6 is another schematic stacking diagram of circuit boards according to the present invention;
fig. 7 is a schematic structural diagram of the first plate according to the present invention.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention can be embodied in many different forms other than those specifically described herein, and it will be apparent to those skilled in the art that similar modifications can be made without departing from the spirit and scope of the invention, and it is therefore not to be limited to the specific embodiments disclosed below.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 2, an embodiment of the present invention provides a camera module 100, where the camera module 100 includes a circuit board 10, a photosensitive film 20 and a lens module 30, wherein the photosensitive film 20 and the lens module 30 are both disposed on the circuit board 10, and the lens module 30 is disposed opposite to the photosensitive film 20, so that light rays incident from the lens module 30 can be transmitted to the photosensitive film 20.
As shown in fig. 2, in the present embodiment, the circuit board 10 includes a first board 4, a second board 5, a spacer 6 and a connection glue layer 7. The first plate 4 has a mounting surface 41 and a connection surface 42 which are oppositely arranged, and a first opening 43 which penetrates from the mounting surface 41 to the connection surface 42. The rubber-insulated pad 6 has a second opening 61 penetrating through the rubber-insulated pad 6, wherein the rubber-insulated pad 6 is connected to the connecting surface 42, and the second opening 61 is opposite to the first opening 43. The second plate 5 is connected with the surface of the rubber separating pad 6 far away from the first plate 4, and is provided with a first area 51 opposite to the second opening 61, a second area 52 in contact with the rubber separating pad 6, and a third area 53 opposite to the first plate 4 at intervals, namely, the first area 51, the second area 52 and the third area 53 are sequentially arranged from inside to outside. The connection glue layer 7 is arranged in the third area 53 and is in contact with the connection face 42 of the first plate 4 for connecting the first plate 4 and the second plate 5 together, wherein, in the present embodiment, the connection glue layer 7 can fill the gap between the first plate 4 and the second plate 5, so that the first plate 4 and the second plate 5 are connected more firmly. In practical products, the lens module 30 is mounted on the mounting surface 41 of the first plate 4, and the photosensitive film 20 is mounted in the first region 51 of the second plate 5, so that the height of the whole camera module 100 can be reduced, which is beneficial to the miniaturization design of the camera module 100.
In this embodiment, the connection adhesive layer 7 is formed by curing adhesive, and during production, the adhesive-separating pad 6 may be first placed on the second area 52 of the second board 5, then the adhesive is coated on the third area 53 of the second board 5, and then the first board 4 is pressed on the adhesive, and the adhesive is cured to form the circuit board 10. Because the second area 52 is provided with the rubber separating pad 6, when the third area 53 is coated with the rubber solution, the rubber solution does not overflow to the first area 51, i.e. a rubber block is not formed in the first area 51, thereby avoiding interference in setting the photosensitive piece 20, and meanwhile, the problem that the rubber block of the first area 51 falls off to reach the photosensitive surface of the photosensitive piece 20 or enter the lens module 30 to influence the work of the camera module 100 can be avoided, thereby providing a guarantee for the performance of the camera module 100.
In the present embodiment, the first opening 43 is a closed loop structure, for example, the first opening 43 may be a circular hole. Of course, in other embodiments, the first opening 43 may also be an open ring structure, for example, the first opening 43 is a long slot extending to the edge of the first plate 4, and the long slot does not penetrate through the first plate 4 in the horizontal direction, in this embodiment, the first plate 4 is a flat plate, and the mounting surface 41 and the connecting surface 42 are both parallel to the horizontal direction.
As shown in fig. 2, in the present embodiment, the projection of the inner surface 431 of the first opening 43 on the second plate 5 coincides with the projection of the inner surface 611 of the second opening 61 on the second plate 5, and in the present embodiment, the first opening 43 is also a circular hole, and the first opening 43 and the second opening 61 are coaxially arranged and have the same diameter.
As shown in fig. 3, in the present embodiment, the adhesive separating pad 6 has a first surface 62 and a second surface 63 that are opposite to each other, and a side surface 64 connecting the first surface 62 and the second surface 63, wherein the second opening 61 penetrates from the first surface 62 to the second surface 63, and the side surface 64 of the adhesive separating pad 6 is connected to the connecting adhesive layer 7, that is, the adhesive separating pad 6 may also be adhered to the first board 4 and the second board 5 by an adhesive. Specifically, in the present embodiment, the rubber separating pad 6 is of a circular ring structure, that is, the rubber separating pad 6 is equivalent to a washer, the second opening 61 is a circular hole of the circular ring structure, and the first surface 62 and the second surface 63 are two end surfaces of the circular ring structure, respectively. Of course, in other embodiments, the rubber spacer 6 may also be a ring structure such as a square ring. In addition, when the first opening 43 is a long groove, the rubber-insulated pad 6 may also be a long groove extending to the edge of the rubber-insulated pad 6.
As shown in fig. 4, in the present embodiment, the second area 52 is a first concave structure 520 disposed on the second plate 5, and the rubber spacer 6 is mounted in the first concave structure 520 and protrudes a certain height from the first concave structure 520. Wherein, first inner concave structure 520 with separate the cushion 6 and match to avoid separating cushion 6 and rock (avoid separating cushion 6 and remove in the horizontal direction) in first inner concave structure 520, not only can make like this separate the more firm of being connected between cushion 6 and the second board 5, can also conveniently fix a position the installation that separates cushion 6, set up the thickness that can also reduce whole circuit board 10 like this simultaneously, thereby can further reduce the thickness of camera module 100.
Specifically, as shown in fig. 4 to fig. 6, in the present embodiment, the first concave structure 520 is an annular groove, an outer diameter of the annular groove is the same as an outer diameter of the rubber separating pad 6 (in the present embodiment, the rubber separating pad 6 is a circular ring structure), and an inner diameter of the annular groove is the same as an inner diameter of the rubber separating pad 6 (i.e., a diameter of the first opening 43).
Further, as shown in fig. 6, the first area 51 and the second area 52 form a blind hole, the inner diameter of the blind hole is the same as the outer diameter of the rubber spacer 6, and the bottom surface of the blind hole exposed from the rubber spacer 6 is the second area 52.
As shown in fig. 5 to 7, in the present embodiment, the first board 4 further includes a second concave structure 44 disposed on the connection surface 42, and the rubber spacer 6 is mounted in the second concave structure 44 to further reduce the thickness of the circuit board. Wherein, the second concave structure 44 is matched with the rubber separating pad 6 to avoid relative movement between the rubber separating pad 6 and the first plate 4 in the horizontal direction, so as to make the connection alignment between the first plate 4 and the second plate 5 more accurate. In addition, the second concave structure 44 may be disposed in the same manner as the first concave structure 520.
In this embodiment, the first board 4 is a flexible circuit board, the second board 5 is a reinforcing board of the flexible circuit board, and the connection glue layer 7 may be made of conductive glue. When the circuit board is a flexible circuit board, the outer side of the circuit board is attached with a cover film, the cover film needs to be removed in subsequent production, and the cover film is attached to both the mounting surface 41 and the connecting surface 42 of the first board 4, so that a part of the cover film on the connecting surface 42 can be remained to form the rubber isolation pad 6 when the cover film is removed in subsequent production. At this time, the adhesive solution applied to form the connection adhesive layer 7 is applied to the connection surface 42.
Of course, in other embodiments, the circuit board 10 may also be a PCB (i.e. a rigid circuit board), the first board 4 may be a protective film of the PCB, and the second board 5 is a substrate of the PCB, where the substrate includes a substrate and a circuit layer disposed on the substrate, the protective film is adhered to the circuit layer through the connection glue layer 7, and at this time, the connection glue layer 7 may be PP glue or AD glue.
The utility model also provides an electronic equipment, this electronic equipment has used above-mentioned arbitrary embodiment camera module 100 to improve electronic equipment's shooting effect. The electronic device can be a terminal product such as a smart phone and a tablet computer.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A circuit board, comprising:
the first plate is provided with a mounting surface, a connecting surface and a first opening, wherein the mounting surface and the connecting surface are arranged oppositely, and the first opening penetrates from the mounting surface to the connecting surface;
the rubber isolating pad is provided with a second opening penetrating through the rubber isolating pad; the rubber isolating pad is connected with the connecting surface, and the second opening is opposite to the first opening;
the second plate is connected with the surface of the rubber isolating pad, which is far away from the first plate, and the second plate is sequentially provided with a first area, a second area and a third area from inside to outside; the first area is opposite to the second opening, the second area is in contact with the rubber isolating pad, and the third area is opposite to the first plate at intervals; and
and the connecting glue layer is arranged in the third area and is used for filling the space between the first plate and the second plate so as to connect the first plate and the second plate together.
2. The circuit board of claim 1, wherein the adhesive separating pad has a first surface and a second surface which are opposite to each other, and a side surface connecting the first surface and the second surface; the second opening penetrates from the first surface to the second surface, and the side face is connected with the connecting glue layer.
3. The circuit board of claim 2, wherein the rubber spacer is a ring structure.
4. The circuit board of claim 1, wherein the second area is a first recessed structure disposed on the second board, and the adhesive isolation pad is mounted in the first recessed structure.
5. The circuit board of claim 4, wherein the first concave structure is matched with the rubber isolation pad to prevent the rubber isolation pad from shaking in the first concave structure.
6. The circuit board of claim 1, wherein the first board further comprises a second recessed structure disposed on the connection surface, and the adhesive isolation pad is mounted in the second recessed structure.
7. The circuit board of claim 6, wherein the second recessed structure is matched with the rubber isolation pad to prevent the rubber isolation pad from shaking in the second recessed structure.
8. The circuit board of claim 1, wherein a projection of an inner surface of the first opening on the second board coincides with a projection of an inner surface of the second opening on the second board; and/or
The first plate is a flexible circuit board, and the second plate is a reinforcing plate of the flexible circuit board.
9. A camera module is characterized by comprising;
a circuit board as claimed in any one of claims 1 to 8;
the photosensitive piece is arranged in the first area of the circuit board;
and the lens module is arranged on the mounting surface of the circuit board, and the lens module is opposite to the photosensitive film.
10. An electronic device, comprising the camera module of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921423394.6U CN210405461U (en) | 2019-08-29 | 2019-08-29 | Circuit board, camera module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921423394.6U CN210405461U (en) | 2019-08-29 | 2019-08-29 | Circuit board, camera module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210405461U true CN210405461U (en) | 2020-04-24 |
Family
ID=70341514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921423394.6U Expired - Fee Related CN210405461U (en) | 2019-08-29 | 2019-08-29 | Circuit board, camera module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210405461U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023272462A1 (en) * | 2021-06-29 | 2023-01-05 | 鹏鼎控股(深圳)股份有限公司 | Camera module having optical image stabilization function, and preparation method therefor |
-
2019
- 2019-08-29 CN CN201921423394.6U patent/CN210405461U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023272462A1 (en) * | 2021-06-29 | 2023-01-05 | 鹏鼎控股(深圳)股份有限公司 | Camera module having optical image stabilization function, and preparation method therefor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210618 Address after: 330096 no.1404, Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi Jinghao optics Co.,Ltd. Address before: 518100 Ophiguang Science Park, Huafa Section of Songbai Highway, Gongming Street, Guangming New District, Shenzhen City, Guangdong Province Patentee before: Ophiguang Group Co.,Ltd. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200424 |