CN212420665U - A exempt from to dismantle probe and grind flat device for ultrasonic wave heat-sealing machine - Google Patents
A exempt from to dismantle probe and grind flat device for ultrasonic wave heat-sealing machine Download PDFInfo
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- CN212420665U CN212420665U CN202021076383.8U CN202021076383U CN212420665U CN 212420665 U CN212420665 U CN 212420665U CN 202021076383 U CN202021076383 U CN 202021076383U CN 212420665 U CN212420665 U CN 212420665U
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- sealing machine
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Abstract
The utility model provides a disassembly-free probe grinding device for an ultrasonic heat sealing machine, which comprises a connecting plate, wherein the connecting plate is connected with a fixed plate, a mounting plate is fixedly arranged on the fixed plate, a positioning plate is arranged in the mounting plate in a sliding way, and an adjusting mechanism is arranged in the mounting plate and matched with the positioning plate; the positioning plate is provided with a fine adjustment piece, the fine adjustment piece is provided with two groups of chucks, and an installation groove is formed between the two groups of chucks. The utility model discloses an install the connecting plate on the casing of ultrasonic wave heat-sealing machine, insert the mounting groove with the probe afterwards in, rotating adjusting screw removes the front and back position of locating plate, according to actual conditions at last, through the position of loosening bolt regulation fine setting piece, carries out high-speed mill flat processing to the mill of heat-sealing machine lower part, and overall structure design is simple, in the aspect of the use, need not to get off the whole dismantlement of heat-sealing machine lower part mill and grind flat processing.
Description
Technical Field
The utility model relates to a technical field of ultrasonic wave heat-sealing machine especially relates to a exempt from to dismantle probe and grind flat device for ultrasonic wave heat-sealing machine.
Background
The ultrasonic heat sealing machine utilizes high-frequency oscillation to transmit sound waves to a welding surface of a working surface through a welding head, instantly generates friction on molecules of a workpiece, and reaches a plastic melting point, so that solid materials are rapidly dissolved, and rapid heat sealing is realized.
SUMMERY OF THE UTILITY MODEL
To needs regularly with the whole dismantlement of mill, carry and polish on the lathe, it is very troublesome, influence production efficiency's technical problem, the utility model provides a dismantle-free probe grinds paper-back edition and puts for ultrasonic wave heat-sealing machine.
In order to solve the above problem, the technical scheme of the utility model is so realized:
a disassembly-free probe grinding device for an ultrasonic heat sealing machine comprises a connecting plate, wherein the connecting plate is connected with a fixed plate, an installation plate is fixedly arranged on the fixed plate, a positioning plate is arranged in the installation plate in a sliding mode, an adjusting mechanism is arranged in the installation plate, and the adjusting mechanism is matched with the positioning plate; the positioning plate is provided with a fine adjustment piece, the fine adjustment piece is provided with two groups of chucks, and an installation groove is formed between the two groups of chucks.
Preferably, the adjusting mechanism comprises an adjusting screw rod, the adjusting screw rod is arranged in the mounting plate in a penetrating manner, the end part of the adjusting screw rod is movably arranged in the push plate, and the push plate is arranged in the mounting plate in a sliding manner; the rear portion of the positioning plate is fixedly provided with a sliding plate, the sliding plate is arranged in the mounting plate in a sliding mode and fixedly connected with the limiting mechanism, and the sliding plate is matched with the push plate.
Preferably, a T-shaped sliding groove is formed in the mounting plate, and the push plate and the sliding plate are arranged in the T-shaped sliding groove in a sliding mode.
Preferably, the limiting mechanism comprises a limiting spring, one end of the limiting spring is fixed in the mounting plate, and the other end of the limiting spring is fixedly connected with the sliding plate.
Preferably, the fine tuning piece is provided with at least two groups of connecting holes, and the connecting holes are detachably connected with the positioning plate through gaskets and bolts.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses an install the connecting plate on the casing of ultrasonic wave heat-sealing machine, insert the mounting groove with the probe afterwards in, rotating adjusting screw removes the front and back position of locating plate, according to actual conditions at last, through the position of loosening bolt regulation fine setting piece, carries out high-speed mill flat processing to the mill of heat-sealing machine lower part, and overall structure design is simple, and convenient to use need not to get off the whole dismantlement of heat-sealing machine lower part mill and carries out mill flat processing, has saved a large amount of time.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic view of the internal structure of the mounting plate in fig. 1.
Fig. 3 is a schematic view illustrating the installation of the positioning plate in fig. 1.
Fig. 4 is a schematic view of the installation of the chuck of fig. 1.
In the figure, 1 is a connecting plate, 2 is a positioning plate, 21 is a sliding plate, 22 is a limiting spring, 3 is a fine adjustment sheet, 31 is a connecting hole, 4 is a fixing plate, 5 is a mounting plate, 6 is an adjusting screw, 61 is a push plate, and 7 is a chuck.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without any creative effort belong to the protection scope of the present invention.
As shown in figures 1 and 2, the disassembly-free probe grinding device for the ultrasonic heat-sealing machine comprises a connecting plate 1, wherein the connecting plate 1 is connected with a fixing plate 4, a mounting plate 5 is fixedly arranged on the fixing plate 4, a positioning plate 2 is arranged in the mounting plate 5 in a sliding manner, a fine tuning plate 3 is arranged on the positioning plate 2, two groups of chucks 7 are arranged on the fine tuning plate 3, a mounting groove is arranged between the two groups of chucks 7, at least two groups of connecting holes 31 are arranged on the fine tuning plate 3, the connecting holes 31 are detachably connected with the positioning plate 2 through gaskets and bolts, after loosening a bolt in a connecting hole, the fine tuning piece is in a loosening state, and a worker adjusts the fine tuning piece up and down according to the actual abrasion degree of the grinding disc, the polishing head placed in the mounting groove can fully polish the edge of the grinding disc to be level, and after the position is adjusted and determined, the fine tuning sheet is fixed on the positioning plate by tightening the bolt.
As shown in fig. 3, the rear portion of the positioning plate 2 is fixedly provided with a sliding plate 21, the sliding plate 21 is slidably disposed on the mounting plate 5, the sliding plate 21 is fixedly connected with a limiting mechanism, the limiting mechanism comprises a limiting spring 22, one end of the limiting spring 22 is fixed in the mounting plate 5, the other end of the limiting spring 22 is fixedly connected with the sliding plate 21, and the limiting spring is convenient for smooth sliding when the sliding plate is adjusted.
As shown in fig. 4, an adjusting mechanism is arranged in the mounting plate 5, the adjusting mechanism is matched with the positioning plate 2, the adjusting mechanism includes an adjusting screw 6, the adjusting screw 6 is arranged in the mounting plate 5 in a penetrating manner, an internal thread hole is arranged in the mounting plate, the adjusting screw is arranged in the internal thread hole in a penetrating manner, the end part of the adjusting screw 6 is movably arranged in the push plate 61, the push plate 61 is arranged in the mounting plate 5 in a sliding manner, the sliding plate 21 is matched with the push plate 61, a T-shaped chute is arranged in the mounting plate 5, and both the push plate 61 and the sliding; through installing the connecting plate on the casing of ultrasonic wave heat-sealing machine, insert the mounting groove with the probe afterwards in, position around rotating adjusting screw removes the locating plate, according to actual conditions at last, through the position of loosening bolt regulation fine setting piece, grind the flat processing at a high speed to the mill of heat-sealing machine lower part, overall structure design is simple, and convenient to use need not to grind the flat processing with whole dismantlement of heat-sealing machine lower part mill, has saved a large amount of time.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A disassembly-free probe grinding device for an ultrasonic heat sealing machine is characterized by comprising a connecting plate (1), wherein the connecting plate (1) is connected with a fixing plate (4), a mounting plate (5) is fixedly arranged on the fixing plate (4), a positioning plate (2) is arranged in the mounting plate (5) in a sliding manner, an adjusting mechanism is arranged in the mounting plate (5), and the adjusting mechanism is matched with the positioning plate (2); the positioning plate (2) is provided with a fine adjustment piece (3), the fine adjustment piece (3) is provided with two groups of chucks (7), and an installation groove is formed between the two groups of chucks (7).
2. The disassembly-free probe grinding device for the ultrasonic heat-sealing machine is characterized in that the adjusting mechanism comprises an adjusting screw rod (6), the adjusting screw rod (6) is arranged in the mounting plate (5) in a penetrating way, the end part of the adjusting screw rod (6) is movably arranged in the push plate (61), and the push plate (61) is arranged in the mounting plate (5) in a sliding way; the rear portion of the positioning plate (2) is fixedly provided with a sliding plate (21), the sliding plate (21) is arranged in the mounting plate (5) in a sliding mode, the sliding plate (21) is fixedly connected with the limiting mechanism, and the sliding plate (21) is matched with the push plate (61).
3. The disassembly-free probe grinding device for the ultrasonic heat-sealing machine is characterized in that a T-shaped sliding groove is formed in the mounting plate (5), and the push plate (61) and the sliding plate (21) are arranged in the T-shaped sliding groove in a sliding manner.
4. The disassembly-free probe grinding device for the ultrasonic heat-sealing machine is characterized in that the limiting mechanism comprises a limiting spring (22), one end of the limiting spring (22) is fixed in the mounting plate (5), and the other end of the limiting spring (22) is fixedly connected with the sliding plate (21).
5. The disassembly-free probe grinding device for the ultrasonic heat-sealing machine according to claim 1, wherein the trimming plate (3) is provided with at least two groups of connecting holes (31), and the connecting holes (31) are detachably connected with the positioning plate (2) through gaskets and bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021076383.8U CN212420665U (en) | 2020-06-12 | 2020-06-12 | A exempt from to dismantle probe and grind flat device for ultrasonic wave heat-sealing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021076383.8U CN212420665U (en) | 2020-06-12 | 2020-06-12 | A exempt from to dismantle probe and grind flat device for ultrasonic wave heat-sealing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212420665U true CN212420665U (en) | 2021-01-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021076383.8U Active CN212420665U (en) | 2020-06-12 | 2020-06-12 | A exempt from to dismantle probe and grind flat device for ultrasonic wave heat-sealing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212420665U (en) |
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2020
- 2020-06-12 CN CN202021076383.8U patent/CN212420665U/en active Active
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