CN212420006U - Circuit board moves and carries mechanism - Google Patents
Circuit board moves and carries mechanism Download PDFInfo
- Publication number
- CN212420006U CN212420006U CN202021189339.8U CN202021189339U CN212420006U CN 212420006 U CN212420006 U CN 212420006U CN 202021189339 U CN202021189339 U CN 202021189339U CN 212420006 U CN212420006 U CN 212420006U
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- rotating shaft
- circuit board
- reflow soldering
- transfer mechanism
- rack
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Abstract
The utility model discloses a circuit board transferring mechanism, which comprises a frame, wherein the frame is provided with a groove and a first notch for fixing the circuit board transferring mechanism; the first rotating shaft and the second rotating shaft are rotatably arranged on the rack; the conveying belt is sleeved on the first rotating shaft and the second rotating shaft respectively; the first rotating shaft is in linkage arrangement with a conveying mechanism on reflow soldering equipment; according to the circuit board transfer mechanism, the first rotating shaft, the second rotating shaft and the conveyor belt are arranged in a matched mode, when the circuit board is transmitted from the connecting table guide rail to the reflow soldering guide rail, the first rotating shaft is driven by the chain of the conveying mechanism of the reflow soldering equipment to synchronously rotate, the process that the circuit board is transferred from the guide rail of the reflow soldering equipment to the reflow soldering mesh belt is automatically achieved, manual operation does not need to be additionally arranged, and labor cost is saved; meanwhile, the transfer mechanism is driven by the aid of the conveying mechanism of the reflow soldering equipment, and a driving mechanism does not need to be additionally arranged, so that cost is saved.
Description
Technical Field
The utility model relates to a technical field of circuit board processing specifically is a circuit board moves and carries mechanism.
Background
At present, in the actual process of processing the circuit board, the circuit board enters a reflow soldering furnace, and the two modes are that firstly, a connecting table guide rail and a reflow soldering guide rail are directly connected, and the circuit board directly passes through the furnace through the guide rail; and secondly, manually sending the circuit board to be subjected to reflow soldering on the connection table into a reflow soldering furnace. When a thin board (0.6 mm) or a PCB with multiple V cuts is produced, in order to prevent the circuit board after reflow soldering from deforming, a second method is adopted, and more workers are arranged to transfer the circuit board from a guide rail of a docking station to a mesh belt of a reflow soldering furnace before the reflow soldering furnace to pass through the furnace;
thus, each time such a thin or multi-V cut panel is produced, one more person needs to be arranged to participate in the production process, which causes the following problems:
firstly, the operation of workers is increased, the benefit is not increased, and the labor cost is increased; secondly, the worker configuration is compact at present, the person cannot be arranged for a long time, the management difficulty is increased due to temporary arrangement, and the rhythm of other procedures is influenced.
SUMMERY OF THE UTILITY MODEL
Accordingly, it is necessary to provide a low-cost and efficient circuit board transfer mechanism.
A circuit board transfer mechanism comprises
The circuit board transferring and loading mechanism comprises a rack, wherein a groove and a first notch are formed in the rack and used for fixing the circuit board transferring and loading mechanism on reflow soldering equipment;
the first rotating shaft and the second rotating shaft are rotatably arranged on the rack;
the conveying belt is sleeved on the first rotating shaft and the second rotating shaft respectively;
the first rotating shaft is in linkage with a conveying mechanism on the reflow soldering equipment.
In one embodiment, two pins are respectively arranged at two ends of the first rotating shaft, and the pins are axially symmetrically arranged on the first rotating shaft.
In one embodiment, the circuit board transfer mechanism further comprises a mounting piece, and a second notch is formed in the mounting piece.
In one embodiment, the first rotating shaft and the second rotating shaft are provided with annular grooves and blocking pieces, and the mounting pieces are abutted against the blocking pieces.
In one embodiment, the rack is provided with a mounting hole, a mounting part is arranged in the mounting hole, and two ends of the first rotating shaft and the second rotating shaft penetrate through the mounting part.
In one embodiment, the groove is a semi-circular groove.
According to the circuit board transfer mechanism, the first rotating shaft, the second rotating shaft and the conveyor belt are arranged in a matched mode, when a circuit board is transmitted from the connecting table guide rail to the reflow soldering guide rail, the circuit board can be directly transferred by the transfer mechanism, the first rotating shaft is driven by the chain of the conveying mechanism of the reflow soldering equipment to synchronously rotate, the second rotating shaft is driven by the conveyor belt to synchronously rotate, the circuit board is directly transmitted to the reflow soldering mesh belt, the circuit board transfer process from the guide rail of the reflow soldering equipment to the reflow soldering mesh belt is automatically achieved, manual operation is not needed to be additionally arranged, and labor cost is saved; meanwhile, the transfer mechanism is driven by the aid of the conveying mechanism of the reflow soldering equipment, and a driving mechanism does not need to be additionally arranged, so that cost is saved.
Drawings
Fig. 1 is an assembly structure diagram of a circuit board transfer mechanism according to an embodiment of the present invention.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in FIG. 1, a circuit board transferring mechanism comprises
A circuit board transfer mechanism comprises
The circuit board transferring and mounting device comprises a rack 100, wherein a groove 110 and a first notch 120 are formed in the rack 100 and used for fixing a circuit board transferring and mounting mechanism on reflow soldering equipment;
a first rotating shaft 200 and a second rotating shaft 300, wherein the first rotating shaft 200 and the second rotating shaft 300 are rotatably mounted on the rack 100;
the conveyor belt 400 is sleeved on the first rotating shaft 200 and the second rotating shaft 300 respectively;
the first rotating shaft 200 is linked with a conveying mechanism on the reflow soldering equipment.
The conveying mechanism of the existing reflow soldering equipment has a two-layer conveying structure, the upper layer is a reflow soldering guide rail, the lower layer is a reflow soldering mesh belt, the reflow soldering guide rail and the reflow soldering mesh belt are connected with a reflow soldering furnace for synchronous rotation, and the reflow soldering mesh belt has the effect that if a circuit board drops on the reflow soldering guide rail, the reflow soldering mesh belt can be directly conveyed into the reflow soldering furnace after being caught by the reflow soldering mesh belt. The circuit board moves and carries the mechanism and installs on reflow soldering equipment and be located between the reflow soldering guide rail, first pivot 200 highly with reflow soldering equipment's the height phase adaptation of the platform guide rail of plugging into, the height of second pivot 300 top is slightly higher than reflow soldering guipure height of reflow soldering mechanism by 10mm, make the circuit board of plugging into platform guide rail conveying from reflow soldering equipment carry the mechanism through the circuit board and convey to reflow soldering guipure on, and then convey the circuit board to the reflow soldering stove in through the reflow soldering guipure, carry out reflow soldering to the circuit board.
The rack 100 is fixed on the rotating shaft and the outer wall of the reflow soldering device through the groove 110 and the first notch 120, so that the stability of installation is stronger, and the transfer mechanism is prevented from falling off from the reflow soldering device.
When the circuit board is conveyed, the conveying mechanism of the reflow soldering equipment conveys the circuit board to the transfer mechanism, the conveying mechanism of the reflow soldering equipment drives the first rotating shaft 200 to rotate, the first rotating shaft 200 drives the second rotating shaft 300 to synchronously rotate through the conveying belt 400, and the circuit board is conveyed to the mesh belt of the reflow soldering mechanism.
Thus, the circuit board transfer mechanism is arranged by matching the first rotating shaft 200, the second rotating shaft 300 and the conveyor belt 400, when a circuit board is transmitted from a connecting table guide rail to a reflow soldering guide rail, the circuit board is directly loaded by the transfer mechanism, the first rotating shaft 200 is driven by a chain of a conveying mechanism of reflow soldering equipment to synchronously rotate, the second rotating shaft 300 is driven by the conveyor belt 400 to synchronously rotate, the circuit board is directly transmitted to the reflow soldering mesh belt, the process that the circuit board is transferred from the guide rail of the reflow soldering equipment to the reflow soldering mesh belt is automatically realized, manual operation is not needed to be additionally arranged, and the labor cost is saved; meanwhile, the transfer mechanism is driven by the aid of the conveying mechanism of the reflow soldering equipment, and a driving mechanism does not need to be additionally arranged, so that cost is saved.
In one embodiment, two pins 210 are respectively disposed at two ends of the first rotating shaft 200, and the pins 210 are disposed on the first rotating shaft in an axisymmetric manner.
The pins 210, the two ends of which are symmetrical about the axis, can be installed in the small holes of the rotating shaft of the conveying mechanism of the reflow soldering device, and the rotating shaft can easily roll when the chain rotates, so as to drive the first rotating shaft 200 to synchronously rotate.
Therefore, the two pins 210 are driven to rotate by the rotating shaft of the conveying mechanism, so as to drive the first rotating shaft 200 to synchronously rotate, a driving device is not additionally provided for the circuit board transferring mechanism, and the cost is saved.
In one embodiment, the circuit board transferring mechanism further includes a mounting piece 500, and a second notch 510 is formed in the mounting piece 500; the first rotating shaft 200 and the second rotating shaft 300 are provided with an annular groove 310 and a blocking piece 320, and the mounting piece 500 is abutted against the blocking piece 320.
In one embodiment, the rack 100 is provided with a mounting hole 130, a mounting part 140 is provided in the mounting hole 130, and two ends of the first rotating shaft 200 and the second rotating shaft 300 are inserted into the mounting part 140.
When the first rotating shaft 200 and the second rotating shaft 300 are installed, two ends of the first rotating shaft 200 and the second rotating shaft 30 are respectively placed on the installation part 140, and the shape of the installation part 140 is matched with the shape of the first rotating shaft 200 and the second rotating shaft 300. The diameter of the mounting member 140 is slightly larger than the diameter of the first rotating shaft 200 and the second rotating shaft 300, so that the first rotating shaft 200 and the second rotating shaft 300 can rotate freely in the mounting member 140. The mounting piece 500 is sleeved on the annular grooves 310 of the first rotating shaft 200 and the second rotating shaft 300 from the second notch 510, and two ends of the mounting piece 500 are abutted against the annular grooves 310, the mounting piece 500 is mounted on the side surface of the rack 100, and the blocking piece 320 is abutted against the mounting piece 500, so that the first rotating shaft 200 and the second rotating shaft 300 are prevented from falling off from the rack 100.
The blocking piece 320 is integrally formed with the first rotating shaft 200 or the second rotating shaft 300.
It can be understood that the size of the second notch 510 is slightly larger than the diameter of the first rotating shaft 200 or the second rotating shaft 300 except the annular groove 310, so that the first rotating shaft 200 or the second rotating shaft 300 can be installed in the installation sheet 500.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (6)
1. A circuit board moves and carries mechanism which characterized in that: comprises that
The circuit board transferring and loading mechanism comprises a rack, wherein a groove and a first notch are formed in the rack and used for fixing the circuit board transferring and loading mechanism on reflow soldering equipment;
the first rotating shaft and the second rotating shaft are rotatably arranged on the rack;
the conveying belt is sleeved on the first rotating shaft and the second rotating shaft respectively;
the first rotating shaft is in linkage with a conveying mechanism on the reflow soldering equipment.
2. The circuit board transfer mechanism according to claim 1, wherein: two pins are respectively arranged at two ends of the first rotating shaft, and the pins are arranged on the first rotating shaft in an axial symmetry manner.
3. The circuit board transfer mechanism according to claim 1, wherein: the circuit board moves and carries mechanism still includes the installation piece, set up the second breach on the installation piece.
4. The circuit board transfer mechanism according to claim 3, wherein: the first rotating shaft and the second rotating shaft are provided with annular grooves and blocking pieces, and the mounting pieces are abutted to the blocking pieces.
5. The circuit board transfer mechanism according to claim 1, wherein: the rack is provided with a mounting hole, a mounting piece is arranged in the mounting hole, and two ends of the first rotating shaft and the second rotating shaft penetrate through the mounting piece.
6. The circuit board transfer mechanism according to claim 1, wherein: the groove is a semicircular groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021189339.8U CN212420006U (en) | 2020-06-24 | 2020-06-24 | Circuit board moves and carries mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021189339.8U CN212420006U (en) | 2020-06-24 | 2020-06-24 | Circuit board moves and carries mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212420006U true CN212420006U (en) | 2021-01-29 |
Family
ID=74281222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021189339.8U Active CN212420006U (en) | 2020-06-24 | 2020-06-24 | Circuit board moves and carries mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212420006U (en) |
-
2020
- 2020-06-24 CN CN202021189339.8U patent/CN212420006U/en active Active
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