CN212412042U - Semiconductor substrate - Google Patents
Semiconductor substrate Download PDFInfo
- Publication number
- CN212412042U CN212412042U CN202020808548.XU CN202020808548U CN212412042U CN 212412042 U CN212412042 U CN 212412042U CN 202020808548 U CN202020808548 U CN 202020808548U CN 212412042 U CN212412042 U CN 212412042U
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- CN
- China
- Prior art keywords
- water
- cooling
- semiconductor substrate
- gear
- water cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a semiconductor substrate, which comprises a water cooling tank, a semiconductor substrate, a water cooling pipe, a power interface and an air suction cup, wherein the water cooling tank is fixedly connected on the semiconductor substrate, the water cooling pipe is fixedly connected on the semiconductor substrate, the interfaces at the two ends of the water cooling pipe are fixedly connected with the water cooling tank, the power interface is fixed at the rear part of the water cooling tank through wire connection, the air suction cup is fixedly connected at the side part of the semiconductor substrate, when the substrate starts to work, the water cooling liquid on the water cooling pipe contacts the substrate to take away most of heat, the clamping device of the water cooling pipe interface can ensure the falling-off problem of the water cooling pipe, the water-cooling pipes distributed on the substrate also resist partial light, so that the light area of the substrate is reduced, the probability that the substrate loses conductivity is reduced, and the air suction cups arranged on the side of the substrate can be fixedly connected without punching.
Description
Technical Field
The utility model relates to a semiconductor field, specific is a semiconductor substrate.
Background
The semiconductor substrate is a basic material for manufacturing the PCB, a required circuit pattern is obtained by selectively processing hole processing, electroless copper plating, electrolytic copper plating, etching and the like, and the semiconductor substrate has the functions of conductivity, insulation and support, but the substrate needs to be fixedly connected by punching in use, so that the production time is prolonged, and a user needs to assemble or disassemble the substrate too much trouble in use.
SUMMERY OF THE UTILITY MODEL
To the above problem, the utility model provides a semiconductor substrate.
In order to achieve the above purpose, the present invention is realized by the following technical solution: the utility model provides a semiconductor substrate, its structure includes water-cooling tank, semiconductor substrate, water-cooling tube, power source, air chuck, water-cooling tank fixed connection is on the semiconductor substrate, water-cooling tube fixed connection is in the semiconductor substrate, water-cooling tube both ends interface and water-cooling tank fixed connection, power source electric wire connection is in the water-cooling tank rear, air chuck fixed connection is in semiconductor substrate side, inside water-cooling pump, water-cooling export, the water-cooling entry of mainly being equipped with of water-cooling tank, water pipe binding clasp, water-cooling pump fixed connection is in water-cooling tank and electric wire connection in power source, water-cooling export and water-cooling entry difference fixed connection are in the water-cooling pump, water pipe binding clasp fixed connection is in water-cooling export and water-cooling entry.
Further, the water pipe clamp mainly is equipped with female gear, son gear, gear stick, presss from both sides tight pole, gear pole, spring, female gear fixed connection is in the gear stick, son gear and female gear clearance fit, press from both sides tight pole clearance fit gear stick, gear pole fixed connection is in water-cooling export and water-cooling entry, and spring fixed connection is in the gear pole.
Furthermore, the secondary gear and the primary gear are fixedly connected to the water cooling tank, and the clamping rod is movably matched with the water cooling tank.
Advantageous effects
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses the semiconductor substrate is through setting up water cooling plant on the base plate, when the base plate begins work, the water-cooling tank on the base plate begins to work, thereby most heat is taken away through the contact base plate to the water-cooling liquid on the water-cooling pipe, the clamping device of water-cooling pipe interface can guarantee the problem that drops of water-cooling pipe, and the water-cooling pipe that distributes on the base plate has also kept out partial illumination, make the illumination area that the base plate receives reduce, the probability that the base plate loses conductivity has been reduced, the air sucking disc that is equipped with in the base plate side can need not to punch just can carry out fixed connection, the risk that the base plate receives when punching has been eliminated, the installation of also convenience of customers in the use is dismantled simultaneously.
Drawings
Fig. 1 is a schematic structural diagram of a semiconductor substrate according to the present invention.
Fig. 2 is the internal structure schematic diagram of the water cooling tank of the present invention.
Fig. 3 is an internal structure schematic diagram of the water-cooling pump of the present invention.
Fig. 4 is the structural schematic diagram of the water-cooling tube interface clamping device of the present invention.
In the figure: the water cooling device comprises a water cooling box-1, a semiconductor substrate-2, a water cooling pipe-3, a power interface-4, an air sucker-5, a water cooling pump-11, a water cooling outlet-12, a water cooling inlet-13, a water pipe clamp-14, a female gear-A, a sub gear-B, a gear rod-C, a clamping rod-D, a gear rod-E and a spring-F.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some embodiments, not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention based on the embodiments of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Examples
As shown in fig. 1-4, the present invention provides a semiconductor substrate, which comprises a water cooling tank 1, a semiconductor substrate 2, a water cooling tube 3, a power interface 4, and an air chuck 5, the water cooling tank 1 is fixedly connected on the semiconductor substrate 2, the water cooling tube (3) is fixedly connected on the semiconductor substrate 2, the interfaces at the two ends of the water cooling pipe 3 are fixedly connected with the water cooling tank 1, the power supply interface 4 is connected with the rear part of the water cooling tank 1 through an electric wire, the air suction cup 5 is fixedly connected with the side of the semiconductor substrate 2, the water cooling tank 1 is internally and mainly provided with a water cooling pump 11, a water cooling outlet 12, a water cooling inlet 13 and a water pipe clamp 14, water-cooling pump 11 fixed connection is in water-cooling tank 1 and connection of electric lines in power source 4, water-cooling export 12 and water-cooling entry 13 are fixed connection in water-cooling pump 11 respectively, water pipe binding clasp 14 fixed connection is in water-cooling export 12 and water-cooling entry 13.
Wherein, water pipe binding clasp 14 mainly is equipped with female gear A, sub-gear B, gear stick C, presss from both sides tight pole D, gear stick E, spring F, female gear A fixed connection is in gear stick C, sub-gear B and female gear A clearance fit, press from both sides tight pole D clearance fit gear stick C, gear stick E fixed connection is in water-cooling export 12 and water-cooling entry 13, spring F fixed connection is in gear stick E.
The secondary gear B and the primary gear A are fixedly connected to the water cooling tank 1, and the clamping rod D is movably matched with the water cooling tank 1.
The working principle of the present invention is explained as follows:
the utility model fixes the semiconductor substrate 2 by the air sucker 5, the water-cooling tube 3 is connected with the water-cooling outlet 12 and the water-cooling inlet 13, the gear rod E on the water tube clamper 14 contracts backwards to drive the gear rod C, the master gear A on the gear rod C drives the sub-gear B, the sub-gear B drives the clamping rod D to clamp the water-cooling tube 2 downwards to prevent falling off, the water-cooling pump 11 in the water-cooling box 1 works by connecting the power interface 4, the water-cooling liquid in the water-cooling tube 3 starts to flow and takes away the heat generated when the semiconductor substrate 2 works, when the semiconductor substrate 2 stops working, the power interface 4 of the water-cooling box 1 is stopped, the water-cooling liquid in the water-cooling tube 3 does not flow, the water-cooling tube 3 distributed on the semiconductor substrate 2 also blocks partial illumination, the illumination area received by the semiconductor substrate 2 is reduced, the conductivity probability of the semiconductor substrate 2 is reduced, the air suction cups 5 arranged on the lateral sides of the semiconductor substrate 2 can be fixedly connected without punching, so that the risks borne by the semiconductor substrate 2 during punching are eliminated, and convenience is brought to users for mounting and dismounting in the using process.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (3)
1. The utility model provides a semiconductor substrate, its structure includes water-cooling case (1), semiconductor substrate (2), water-cooling tube (3), power source (4), air chuck (5), its characterized in that:
the water cooling box (1) is fixedly connected to the semiconductor substrate (2), the water cooling tube (3) is fixedly connected to the semiconductor substrate (2), interfaces at two ends of the water cooling tube (3) are fixedly connected with the water cooling box (1), the power supply interface (4) is connected to the rear of the water cooling box (1) through an electric wire, and the air sucker (5) is fixedly connected to the side of the semiconductor substrate (2);
inside water-cooling pump (11), water-cooling export (12), water-cooling entry (13) of mainly being equipped with of water-cooling case (1), water pipe binding clasp (14), water-cooling pump (11) fixed connection is in water-cooling case (1) and connection by wire in power source (4), water-cooling export (12) and water-cooling entry (13) are fixed connection in water-cooling pump (11) respectively, water pipe binding clasp (14) fixed connection is in water-cooling export (12) and water-cooling entry (13).
2. A semiconductor substrate according to claim 1, wherein: water pipe binding clasp (14) mainly are equipped with female gear (A), sub-gear (B), gear rod (C), press from both sides tight pole (D), gear rod (E), spring (F), female gear (A) fixed connection is in gear rod (C), sub-gear (B) and female gear (A) clearance fit, press from both sides tight pole (D) clearance fit gear rod (C), gear rod (E) fixed connection is in water-cooling export (12) and water-cooling entry (13), spring (F) fixed connection in gear rod (E).
3. A semiconductor substrate according to claim 2, wherein: the secondary gear (B) and the primary gear (A) are fixedly connected to the water cooling tank (1), and the clamping rod (D) is movably matched with the water cooling tank (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020808548.XU CN212412042U (en) | 2020-05-15 | 2020-05-15 | Semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020808548.XU CN212412042U (en) | 2020-05-15 | 2020-05-15 | Semiconductor substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212412042U true CN212412042U (en) | 2021-01-26 |
Family
ID=74376883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020808548.XU Expired - Fee Related CN212412042U (en) | 2020-05-15 | 2020-05-15 | Semiconductor substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212412042U (en) |
-
2020
- 2020-05-15 CN CN202020808548.XU patent/CN212412042U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210126 Termination date: 20210515 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |