CN211858684U - High-efficient radiating LED paster support - Google Patents
High-efficient radiating LED paster support Download PDFInfo
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- CN211858684U CN211858684U CN202020465344.0U CN202020465344U CN211858684U CN 211858684 U CN211858684 U CN 211858684U CN 202020465344 U CN202020465344 U CN 202020465344U CN 211858684 U CN211858684 U CN 211858684U
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- heat dissipation
- pad
- water
- heating panel
- water cooling
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Abstract
The utility model relates to a SMD support technical field of LED lamp and LED, concretely relates to high-efficient radiating LED paster support, including a frame platform, the top of a frame platform is equipped with the even pad that sets up of a plurality of, and the inside bottom of every pad all is equipped with the heating panel, and the bottom of every heating panel is equipped with heat dissipation mechanism respectively, and one side of a frame platform is equipped with the lateral part extension board, is equipped with water-cooling mechanism on the lateral part extension board, and the output of water-cooling mechanism respectively with the internal connection of every heating panel, this equipment can carry out high-efficient automatic heat dissipation through the water-cooling, improves production efficiency.
Description
Technical Field
The utility model relates to a SMD support technical field of LED lamp and LED, concretely relates to high-efficient radiating LED paster support.
Background
With the increasing maturity and development of LED lighting technology, LEDs have become a new type of light source and are widely used in various fields. The LED lamp with the actual lighting effect is manufactured by a complex process, wherein the LED chip is attached to the support, the support is called as an LED patch support, the heat dissipation effect of the single-chip LED patch support in the prior art is poor, heat can be dissipated only within a waiting time during heat dissipation, and the processing efficiency is influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high-efficient radiating LED paster support, this equipment can carry out high-efficient automatic heat dissipation through the water-cooling, improves production efficiency.
To achieve the purpose, the utility model adopts the following technical proposal:
the utility model provides a high-efficient radiating LED paster support, includes the pallet, the top of pallet is equipped with the even pad that sets up of a plurality of, and the inside bottom of every pad all is equipped with the heating panel, and the bottom of every heating panel is equipped with heat dissipation mechanism respectively, and one side of pallet is equipped with the lateral part and extends the board, is equipped with water cooling mechanism on the lateral part extension board, the output of water cooling mechanism respectively with the internal connection of every heating panel.
Preferably, every the pad all is the cuboid structure, and the top of pad is for opening the structure, and the heating panel is the level and sets up in the inside bottom of pad, and the top of heating panel flushes with the inside bottom surface of pad, and the upper end of pad is seted up to domatic to the inside extension of pad, and the inside upper end of pad is equipped with the pore that a plurality of evenly set up.
Preferably, each of the heat dissipation plates is made of a metal material.
Preferably, the water cooling mechanism comprises a water pump, a heat exchanger and a water cooling pipe, the bottom of each heat dissipation plate is provided with a water cooling chip, the water cooling pipe is connected with the inside of each water cooling chip, the water cooling chips of the water cooling pipe are connected with each heat dissipation plate, the water pump and the heat exchanger are installed at the top of the side extension plate respectively, and two ends of the water cooling pipe are communicated with the inside of the water pump and the inside of the heat exchanger respectively.
Preferably, each heat dissipation mechanism all includes the fan, and the fan is the level and is located the below of water-cooling chip, and the fan passes through the bottom fixed connection of fixed bolster and pad.
Preferably, each heat dissipation mechanism further comprises an insulating cover, the insulating cover is arranged at the bottom of the support platform corresponding to the bonding pad, the insulating cover is fixedly installed at the bottom of the support platform, the fan, the water cooling chip and the heat dissipation plate are respectively located inside the insulating cover, and a through hole for avoiding the water cooling pipe is formed in the insulating cover.
The utility model has the advantages that: a high-efficient radiating LED paster support, during heat dissipation, through water pump and heat exchanger, the cold water after changing passes through each water-cooling chip respectively through the water-cooling pipe, carry on the water-cooling heat dissipation through the heating panel in each pad respectively through each water-cooling chip, because the heating panel is the metal material to form, can adopt red copper, brass and stainless steel, preferably red copper, make the radiating effect better, the domatic increase heat dissipation space that sets up, and can make the better diffusion of hot gas through each pore on the pad, make the heat dissipation quicker, while each heating panel carries on the water-cooling heat dissipation through the water-cooling chip, start each fan, drive the cold airflow of water-cooling more fast through the fan and carry on the heat dissipation to the heating panel, when each heating panel carries on water-cooling and fan heat dissipation respectively, the insulating boot that sets up makes the air conditioning concentrate and dispel the heat to the heating panel direction, the production efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below. It is obvious that the drawings described below are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a schematic perspective view of a first embodiment of the present invention;
fig. 2 is a schematic perspective view illustrating a second embodiment of the present invention;
fig. 3 is a schematic view of a partial three-dimensional structure according to an embodiment of the present invention;
fig. 4 is a schematic partial perspective view of a heat dissipation mechanism according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a partial three-dimensional structure of a heat dissipation mechanism according to an embodiment of the present invention.
In the figure: 1-a support table; 2-a pad; 3-a heat dissipation plate; 4-a lateral extension plate; 5-slope surface; 6-pores; 7-a water pump; 8-a heat exchanger; 9-a water-cooling pipe; 10-water cooling the chip; 11-a fan; 12-insulating cover.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; for a better understanding of the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not indicated or implied that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are used only for illustrative purposes and are not to be construed as limiting the present patent, and the specific meaning of the terms will be understood by those skilled in the art according to the specific circumstances.
In the description of the present invention, unless otherwise explicitly specified or limited, the term "connected" or the like, if appearing to indicate a connection relationship between the components, is to be understood broadly, for example, as being either a fixed connection, a detachable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through one or more other components or may be in an interactive relationship with one another. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-5 a high-efficient radiating LED paster support that shows, including pallet 1, the top of pallet 1 is equipped with the even pad 2 that sets up of a plurality of, and the inside bottom of every pad 2 all is equipped with heating panel 3, and the bottom of every heating panel 3 is equipped with heat dissipation mechanism respectively, and one side of pallet 1 is equipped with lateral part extension board 4, is equipped with water cooling mechanism on the lateral part extension board 4, the output of water cooling mechanism respectively with the internal connection of every heating panel 3.
Every pad 2 all is the cuboid structure, and the top of pad 2 is for opening the structure, and heating panel 3 is the inside bottom that the level set up at pad 2, and the top of heating panel 3 flushes with the inside bottom surface of pad 2, and the domatic 5 of 2 inside extensions of pad is seted up to the upper end of pad 2, and the inside upper end of pad 2 is equipped with the pore 6 that a plurality of evenly set up, and the domatic 5 heat dissipation spaces that increase of setting to can make the better diffusion of steam through every pore 6 on pad 2, make the heat dissipation faster.
The material of each heat dissipation plate 3 is made of metal materials, and the heat dissipation plates 3 are made of metal materials, so that red copper, brass and stainless steel can be adopted, and red copper is preferred, so that the heat dissipation effect is better.
The water-cooling mechanism includes water pump 7, heat exchanger 8 and water-cooling tube 9, the bottom of every heating panel 3 is equipped with water-cooling chip 10 respectively, water-cooling tube 9 and the internal connection of every water-cooling chip 10, water-cooling chip 10 and every heating panel 3 of water-cooling tube 9 are connected, the top at lateral part extension plate 4 is installed respectively to water pump 7 and heat exchanger 8, the both ends of water-cooling tube 9 communicate with the inside of water pump 7 and heat exchanger 8 respectively, during the heat dissipation, through water pump 7 and heat exchanger 8, the cold water after will changing passes through every water-cooling chip 10 respectively through water-cooling tube 9, carry out the water-cooling heat dissipation with heating panel 3 in every pad 2 respectively through every water-cooling chip.
Every heat dissipation mechanism all includes fan 11, and fan 11 is the below that the level is located water-cooling chip 10, and fan 11 passes through the bottom fixed connection of fixed bolster and pad 2, and when every heating panel 3 carries out water-cooling heat dissipation through water-cooling chip 10, starts every fan 11, drives the more quick heating panel 3 with heat dissipation of water-cooled cold airflow through fan 11.
Every heat dissipation mechanism still all includes insulating boot 12, and insulating boot 12 sets up in the bottom of mounting bracket 1 with pad 2 corresponds, and insulating boot 12 fixed mounting is in the bottom of mounting bracket 1, and fan 11, water-cooling chip 10 and heating panel 3 are located the inside of insulating boot 12 respectively, are equipped with the perforation that is used for dodging water-cooled tube 9 on the insulating boot 12, and when every heating panel 3 carries out water-cooling and fan 11 heat dissipation respectively, the insulating boot 12 that sets up makes air conditioning concentrate and dispel the heat to heating panel 3 direction.
The working principle is as follows: during heat dissipation, the converted cold water passes through each water-cooling chip 10 through the water-cooling pipe 9 through the water pump 7 and the heat exchanger 8, the heat dissipation plate 3 in each bonding pad 2 is water-cooled by each water-cooled chip 10, because the heat dissipation plate 3 is made of metal material, red copper, brass and stainless steel can be adopted, preferably red copper, the heat dissipation effect is better, the slope surface 5 is arranged to increase the heat dissipation space, and the hot air can be better diffused through each fine hole 6 on the pad 2, the heat dissipation is faster, while each heat dissipation plate 3 is water-cooled by the water-cooled chip 10, each fan 11 is started, the fan 11 drives the water-cooled cold airflow to more rapidly radiate the heat dissipation plate 3, and when each heat dissipation plate 3 is respectively cooled by water and the fan 11, the arranged insulating cover 12 enables the cold air to be concentrated to radiate towards the heat dissipation plate 3.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a high-efficient radiating LED paster support which characterized in that: including support table (1), the top of support table (1) is equipped with pad (2) that a plurality of evenly set up, and the inside bottom of every pad (2) all is equipped with heating panel (3), and the bottom of every heating panel (3) is equipped with heat dissipation mechanism respectively, and one side of support table (1) is equipped with lateral part extension board (4), is equipped with water-cooling mechanism on lateral part extension board (4), the output of water-cooling mechanism respectively with the internal connection of every heating panel (3).
2. The efficient heat dissipation LED patch holder according to claim 1, wherein: every pad (2) all are the cuboid structure, and the top of pad (2) is open structure, and heating panel (3) are the level and set up in the inside bottom of pad (2), and the top of heating panel (3) flushes with the inside bottom surface of pad (2), and the upper end of pad (2) is seted up domatic (5) to the inside extension of pad (2), and the inside upper end of pad (2) is equipped with pore (6) that a plurality of evenly set up.
3. An efficient heat dissipation LED patch holder as recited in claim 2, wherein: the material of each heat dissipation plate (3) is made of metal materials.
4. An efficient heat dissipating LED patch holder as claimed in claim 3, wherein: the water cooling mechanism comprises a water pump (7), a heat exchanger (8) and a water cooling pipe (9), wherein the bottom of each heat dissipation plate (3) is provided with a water cooling chip (10) respectively, the water cooling pipe (9) is connected with the inside of each water cooling chip (10), the water cooling chips (10) of the water cooling pipes (9) are connected with each heat dissipation plate (3), the water pump (7) and the heat exchanger (8) are installed at the top of the side extension plate (4) respectively, and the two ends of each water cooling pipe (9) are communicated with the inside of the water pump (7) and the inside of the heat exchanger (8) respectively.
5. The efficient heat dissipation LED patch holder according to claim 4, wherein: every heat dissipation mechanism all includes fan (11), and fan (11) are the below that the level is located water-cooling chip (10), and fan (11) pass through the bottom fixed connection of fixed bolster and pad (2).
6. The efficient heat dissipation LED patch holder according to claim 5, wherein: each heat dissipation mechanism further comprises an insulating cover (12), the insulating cover (12) is arranged at the bottom of the support platform (1) and corresponds to the bonding pad (2), the insulating cover (12) is fixedly installed at the bottom of the support platform (1), the fan (11), the water cooling chip (10) and the heat dissipation plate (3) are respectively located inside the insulating cover (12), and a through hole used for avoiding the water cooling pipe (9) is formed in the insulating cover (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020465344.0U CN211858684U (en) | 2020-04-02 | 2020-04-02 | High-efficient radiating LED paster support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020465344.0U CN211858684U (en) | 2020-04-02 | 2020-04-02 | High-efficient radiating LED paster support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211858684U true CN211858684U (en) | 2020-11-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020465344.0U Expired - Fee Related CN211858684U (en) | 2020-04-02 | 2020-04-02 | High-efficient radiating LED paster support |
Country Status (1)
| Country | Link |
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| CN (1) | CN211858684U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113725123A (en) * | 2021-08-31 | 2021-11-30 | 广东良友科技有限公司 | Internal packaging equipment for automatic LED surface mount device support and packaging method thereof |
-
2020
- 2020-04-02 CN CN202020465344.0U patent/CN211858684U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113725123A (en) * | 2021-08-31 | 2021-11-30 | 广东良友科技有限公司 | Internal packaging equipment for automatic LED surface mount device support and packaging method thereof |
| CN113725123B (en) * | 2021-08-31 | 2023-08-29 | 广东良友科技有限公司 | Internal packaging equipment for automatic LED patch bracket and packaging method thereof |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201103 |