CN212410644U

CN212410644U - Vacuum high-low temperature semiconductor device test probe station

Info

Publication number: CN212410644U
Application number: CN202020744010.7U
Authority: CN
Inventors: 李喜荣
Original assignee: Hangzhou Yuanfeng Testing Technology Co ltd
Current assignee: Hangzhou Yuanfeng Testing Technology Co ltd
Priority date: 2020-05-08
Filing date: 2020-05-08
Publication date: 2021-01-26
Anticipated expiration: 2030-05-08

Abstract

The utility model discloses a high low temperature semiconductor device test probe station in vacuum, including the supporting bench body and four supporting legs, four the supporting leg is installed at the bottom four corners outer wall of the supporting bench body through the bolt respectively, the equal fixed mounting in top four corners outer wall of the supporting bench body has the bracing piece, and the top outer wall fixed mounting of four bracing pieces has same roof support, the equal fixed mounting in both ends outer wall of roof support bottom has first backup pad, and the bottom outer wall of two first backup pads has all seted up first recess, and the inner wall fixed mounting of two first recesses has electronic guide rail, and the equal sliding connection in bottom outer wall of two electronic guide rails has electronic slider. The utility model discloses a be provided with the second backup pad to be provided with light and camera in the second backup pad, conveniently throw light on to the internal environment of support housing through the light, shoot the record through the camera to test effect, improved the accuracy that detects.

Description

Vacuum high-low temperature semiconductor device test probe station

Technical Field

The utility model relates to a semiconductor device tests technical field, specifically is a high low temperature semiconductor device test probe platform in vacuum.

Background

The semiconductor device is an electronic device with the conductivity between a good electric conductor and an insulator, and the special electric characteristics of a semiconductor material are utilized to complete specific functions, so that the semiconductor device can be used for generating, controlling, receiving, converting, amplifying signals and carrying out energy conversion.

In the production research and development process of high-altitude semiconductor devices, the test of various environments needs to be carried out on the high-altitude semiconductor devices, so that the high-altitude semiconductor devices can be normally used, a test probe station can be used, the conventional test table cannot be used for conveniently replacing the test environment according to test requirements in the using process, and meanwhile, the problem of incomplete test still exists, so that the problem is solved by designing a novel vacuum high-low temperature semiconductor device test probe station.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high low temperature semiconductor device test probe platform in vacuum to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a vacuum high-low temperature semiconductor device test probe station comprises a supporting platform body and four supporting legs, wherein the four supporting legs are respectively arranged on the outer walls of the four corners at the bottom of the supporting platform body through bolts, the outer walls of the four corners at the top of the supporting platform body are respectively fixedly provided with a supporting rod, the outer walls at the top of the four supporting rods are respectively fixedly provided with a same supporting top plate, the outer walls at the two ends of the bottom of the supporting top plate are respectively fixedly provided with a first supporting plate, the outer walls at the bottom of the two first supporting plates are respectively provided with a first groove, the inner walls of the two first grooves are respectively fixedly provided with an electric guide rail, the outer walls at the bottom of the two electric guide rails are respectively connected with an electric slider in a sliding manner, the outer walls at the bottom of the two electric sliders are respectively fixedly provided with, the supporting platform is characterized in that a supporting shell is fixedly mounted on the outer wall of the center of the top of the supporting platform body, the outer walls of the periphery of the top of the supporting shell are provided with the same sealing groove, a second rubber pad is fixedly mounted on the inner wall of the sealing groove, and the outer walls of the periphery of the bottom of the sealing cover plate are fixedly provided with the same first rubber pad.

As the utility model discloses the preferred scheme of vacuum high low temperature semiconductor device test probe platform, the feed inlet has been seted up to the bottom outer wall that supports casing one end, and the top outer wall of feed inlet has the feeding lid through hinged joint.

As the utility model discloses the preferred scheme of vacuum high low temperature semiconductor device test probe platform, the top outer wall of support casing one side has seted up first opening, and first open-ended inner wall fixed mounting has the second backup pad, the top outer wall fixed mounting of second backup pad one side has the light, the bottom outer wall fixed mounting of second backup pad one side has the camera.

As the utility model discloses the preferred scheme of vacuum high low temperature semiconductor device test probe platform, the bottom outer wall fixed mounting who supports casing one side has the blast pipe, and the top outer wall fixed mounting of blast pipe has the vacuum pump.

As the utility model discloses the preferred scheme of vacuum high low temperature semiconductor device test probe platform, the outer wall fixed mounting of bottom center of the supporting bench body has the rotation motor, and rotates the output shaft fixed mounting of motor and have the dwang, the top outer wall fixed mounting of dwang has the fourth backup pad.

As the utility model discloses the preferred scheme of vacuum high low temperature semiconductor device test probe platform, the top both sides outer wall of fourth backup pad all has the clamp splice through torsional spring hinged joint, and the equal fixed mounting of one end outer wall of two clamp splices has the rubber head.

As the utility model discloses the preferred scheme of vacuum high low temperature semiconductor device test probe platform, the bottom outer wall fixed mounting of sealed apron has the third backup pad, and the bottom outer wall of third backup pad sets up the mounting hole that the equidistance set up.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model has the advantages of being scientific and reasonable in structure, convenience safe in utilization:

(1) the sealing cover plate is arranged at the top of the supporting shell, the electric telescopic rod and the electric guide rail are arranged on the sealing cover plate, the sealing cover plate can be driven by the electric telescopic rod to move up and down, the sealing cover plate is driven by the electric sliding block to move left and right, the opening and closing of the sealing cover plate are facilitated, meanwhile, the third support plate is arranged at the bottom of the sealing cover plate, and the mounting hole is formed in the bottom of the third support plate, so that devices creating environments such as high temperature, low temperature, vacuum, magnetic field, illumination, particle irradiation and the like can be conveniently mounted on the third support plate, the testing effect is facilitated, and the convenience in mounting and dismounting the devices is effectively improved;

(2) through being provided with the second backup pad to be provided with light and camera in the second backup pad, conveniently throw light on to the internal environment who supports the casing through the light, shoot the record through the camera to test effect, improved the accuracy that detects.

(3) The rotating motor is arranged at the bottom of the supporting platform body, the rotating motor drives the fourth supporting plate to rotate, the semiconductor device which needs to be tested and is used in the high altitude is placed on the fourth supporting plate, and then the rotating motor can drive the semiconductor device to rotate, so that the comprehensive sufficiency of the test is improved, and the test effect is improved.

Drawings

Fig. 1 is a schematic structural view of the whole of the present invention;

FIG. 2 is a schematic view of the sealing cover plate of the present invention in a partial front cross-sectional view;

fig. 3 is a schematic view of a partial front cross-sectional structure of a fourth supporting plate and a rotating motor according to the present invention;

fig. 4 is a schematic view of the first support plate and the electric guide rail of the present invention in a partial front cross-sectional view;

fig. 5 is a schematic view of a partial front sectional structure of the second supporting plate of the present invention.

In the figure: 1. supporting legs; 2. a feeding cover; 3. a supporting table body; 4. a support bar; 5. a support housing; 6. sealing the cover plate; 7. supporting a top plate; 8. an electric telescopic rod; 9. a first support plate; 10. a second support plate; 11. a vacuum pump; 12. an exhaust pipe; 13. mounting holes; 14. a third support plate; 15. a first rubber pad; 16. a second rubber pad; 17. rotating the motor; 18. rotating the rod; 19. a clamping block; 20. a rubber head; 21. a fourth support plate; 22. an electric slider; 23. a fifth support plate; 24. an electric rail; 25. an illuminating lamp; 26. a camera is provided.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: a technical scheme of a vacuum high-low temperature semiconductor device test probe station comprises a supporting table body 3 and four supporting legs 1, wherein the four supporting legs 1 are respectively installed on the outer walls of the four corners of the bottom of the supporting table body 3 through bolts, the outer walls of the four corners of the top of the supporting table body 3 are all connected with supporting rods 4 through bolts, the outer walls of the top of the four supporting rods 4 are connected with a same supporting top plate 7 through bolts, the outer walls of the two ends of the bottom of the supporting top plate 7 are all connected with first supporting plates 9 through bolts, the outer walls of the bottom of the two first supporting plates 9 are respectively provided with a first groove, the inner walls of the two first grooves are connected with electric guide rails 24 through bolts, the outer walls of the bottom of the two electric guide rails 24 are respectively connected with electric sliders 22 in a sliding manner, the outer walls of the bottoms of the two electric sliders 22, and the outer wall of the bottom of the electric telescopic rod 8 is connected with a sealing cover plate 6 through bolts, the outer wall of the center of the top of the supporting platform body 3 is connected with a supporting shell 5 through bolts, the outer wall around the top of the supporting shell 5 is provided with a same sealing groove, the inner wall of the sealing groove is connected with a second rubber pad 16 through bolts, and the outer wall around the bottom of the sealing cover plate 6 is connected with a same first rubber pad 15 through bolts.

Preferably, the outer wall of the bottom of one end of the supporting shell 5 is provided with a feeding hole, and the outer wall of the top of the feeding hole is connected with a feeding cover 2 through a hinge.

Preferably, the top outer wall of one side of the supporting shell 5 is provided with a first opening, the inner wall of the first opening is connected with the second supporting plate 10 through a bolt, the top outer wall of one side of the second supporting plate 10 is connected with the illuminating lamp 25 through a bolt, and the bottom outer wall of one side of the second supporting plate 10 is connected with the camera 26 through a bolt.

Preferably, an exhaust pipe 12 is bolted to the bottom outer wall of one side of the support case 5, and a vacuum pump 11 is bolted to the top outer wall of the exhaust pipe 12.

Preferably, the outer wall of the center of the bottom of the supporting table body 3 is connected with a rotating motor 17 through a bolt, the output shaft of the rotating motor 17 is connected with a rotating rod 18 through a bolt, and the outer wall of the top of the rotating rod 18 is connected with a fourth supporting plate 21 through a bolt.

Preferably, the outer walls of two sides of the top of the fourth supporting plate 21 are both connected with the clamping blocks 19 through torsion spring hinges, and the outer walls of one ends of the two clamping blocks 19 are both connected with the rubber heads 20 through bolts.

Preferably, the outer wall of the bottom of the sealing cover plate 6 is connected with a third supporting plate 14 through a bolt, and the outer wall of the bottom of the third supporting plate 14 is provided with mounting holes 13 arranged at equal intervals.

The working principle is as follows: the utility model discloses a control mode is controlled through the controller, and the control circuit of controller can realize through the simple programming of technical staff in this field, and the supply of power also belongs to the common general knowledge in this field, and the utility model discloses mainly be used for protecting mechanical device, so the utility model discloses no longer explain control mode and circuit connection in detail.

When the device is used, a user firstly puts a semiconductor device used at high altitude on the fourth supporting plate 21 through the feeding hole, then the electric telescopic rod 8 drives the sealing cover plate 6 to ascend, the sealing cover plate 6 is moved out from the top of the device by the electric sliding block 22, then the devices needing to create environments such as high temperature, low temperature, vacuum, magnetic field, illumination, particle irradiation and the like are sequentially and independently fixedly arranged on the third supporting plate 14, then the sealing cover plate 6 is reset, the sealing cover plate 6 is pressed on the supporting shell 5 to realize effective sealing of the supporting shell 5, then the vacuum pump 11 is started, the vacuum pump 11 vacuumizes the inside of the supporting shell 5, the devices creating environments such as high temperature, low temperature, vacuum, magnetic field, illumination, particle irradiation and the like on the third supporting plate 14 are started to test the devices, the devices are shot by the camera 26, and illumination is provided by the illuminating lamp 25, the fourth supporting plate 21 is driven to rotate by the rotating motor 17, so that the detection sufficiency is improved.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high low temperature semiconductor device test probe platform in vacuum, includes supporting stage body (3) and four supporting legs (1), its characterized in that: the four supporting legs (1) are respectively installed on the outer walls of the four corners of the bottom of the supporting table body (3) through bolts, the supporting rods (4) are fixedly installed on the outer walls of the four corners of the top of the supporting table body (3), the same supporting top plate (7) is fixedly installed on the outer walls of the four supporting rods (4), the first supporting plates (9) are fixedly installed on the outer walls of the two ends of the bottom of the supporting top plate (7), first grooves are formed in the outer walls of the bottom of the two first supporting plates (9), electric guide rails (24) are fixedly installed on the inner walls of the two first grooves, electric sliders (22) are connected to the outer walls of the bottom of the two electric guide rails (24) in a sliding mode, the same fifth supporting plate (23) is fixedly installed on the outer wall of the bottom of the fifth supporting plate (23), and electric telescopic, and the bottom outer wall fixed mounting of electric telescopic handle (8) has sealed apron (6), the outer wall fixed mounting in the middle of the top of the supporting bench body (3) has supporting shell (5), and the outer wall all around at supporting shell (5) top has seted up same seal groove, and the inner wall fixed mounting of seal groove has second rubber pad (16), the outer wall fixed mounting all around of sealed apron (6) bottom has same first rubber pad (15).

2. The vacuum high and low temperature semiconductor device test probe station of claim 1, wherein: the feed inlet has been seted up to the bottom outer wall of support casing (5) one end, and there is feed cover (2) top outer wall of feed inlet through hinged joint.

3. The vacuum high and low temperature semiconductor device test probe station of claim 1, wherein: the utility model discloses a lamp support, including support casing (5), first opening has been seted up to the top outer wall of support casing (5) one side, and first open-ended inner wall fixed mounting has second backup pad (10), the top outer wall fixed mounting of second backup pad (10) one side has light (25), the bottom outer wall fixed mounting of second backup pad (10) one side has camera (26).

4. The vacuum high and low temperature semiconductor device test probe station of claim 1, wherein: the bottom outer wall of one side of the supporting shell (5) is fixedly provided with an exhaust pipe (12), and the top outer wall of the exhaust pipe (12) is fixedly provided with a vacuum pump (11).

5. The vacuum high and low temperature semiconductor device test probe station of claim 1, wherein: the outer wall fixed mounting of bottom center of the supporting bench body (3) has rotation motor (17), and the output shaft fixed mounting who rotates motor (17) has dwang (18), the top outer wall fixed mounting of dwang (18) has fourth backup pad (21).

6. The vacuum high and low temperature semiconductor device test probe station of claim 5, wherein: the outer walls of two sides of the top of the fourth supporting plate (21) are respectively connected with a clamping block (19) through a torsion spring hinge, and a rubber head (20) is fixedly mounted on the outer wall of one end of each of the two clamping blocks (19).

7. The vacuum high and low temperature semiconductor device test probe station of claim 1, wherein: the outer wall of the bottom of the sealing cover plate (6) is fixedly provided with a third supporting plate (14), and the outer wall of the bottom of the third supporting plate (14) is provided with mounting holes (13) which are arranged equidistantly.