CN212399034U - Intelligent crystal face machine - Google Patents

Abstract

The application discloses brilliant face machine of intelligence. The intelligent crystal face machine comprises a body support, a moving assembly, a polishing assembly, a power supply module and a control module. The intelligent crystal face machine is characterized in that the movable assembly is installed on one side, close to the ground, of the body support, the intelligent crystal face machine is moved through the movable assembly, the polishing assembly is movably arranged on one side, close to the ground, of the body support, the movable assembly and the movable assembly are arranged at intervals and used for nursing ground stone materials, the power supply module is respectively electrically connected with the movable assembly and the polishing assembly and used for supplying power to the polishing assembly and the movable assembly, and the control module is respectively electrically connected with the polishing assembly and the movable assembly and used for controlling the intelligent crystal face machine to automatically work under the unmanned control. In the intelligent crystal face machine of this application, through control module and polishing subassembly and removal subassembly electric connection to control removes the subassembly and removes, and control polishing subassembly polishes the ground stone material, makes intelligent crystal face machine need not the automatic execution ground stone material nursing task of manual operation ground.

Description

Intelligent crystal face machine

Technical Field

The application relates to the technical field of robots, in particular to an intelligent crystal face machine.

Background

In order to ensure that the ground on which the stone is laid is bright and tidy, the stone is usually cared by a stone care device. In the related art, the stone nursing equipment needs to be operated manually, but the stone nursing equipment is generally complex to operate, requires professional training of a user, has high requirements on the user, and is seriously dependent on the operation of the user in terms of cleaning effect. Therefore, the unmanned stone nursing equipment is a problem to be solved urgently.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present application is directed to solving, at least to some extent, one of the problems in the related art. Therefore, the purpose of the application is to provide an intelligent wafer surface machine.

The intelligent crystal face machine of the embodiment of the application comprises:

a body support;

the moving assembly is movably mounted on one side, close to the ground, of the body support, and the intelligent wafer machine moves through the moving assembly;

the polishing assembly is movably arranged on one side, close to the ground, of the body support, is arranged at an interval with the moving assembly and is used for nursing ground stones;

the power supply module is arranged in the body bracket and is electrically connected with the movable assembly and the polishing assembly respectively so as to supply power to the polishing assembly and the movable assembly; and

and the control module is electrically connected with the moving assembly, the polishing assembly and the power supply module respectively and is used for controlling the intelligent wafer machine to automatically work under the unmanned control.

In the brilliant face machine of intelligence of this application implementation, through setting up body support, removal subassembly, polishing subassembly, power module and control module, at the brilliant face machine of intelligence execution cleaning task in-process, control module can control removal subassembly and polishing subassembly to remove the subassembly and remove under control module control, polishing subassembly nurses ground stone material under control module, so, the brilliant face machine of intelligence can be under unmanned control automatic work.

In some embodiments, the body support comprises a bottom plate, a top plate, a partition plate and a plurality of supporting columns, wherein the partition plate is arranged between the bottom plate and the top plate at intervals, the top plate is arranged on one side of the bottom plate far away from the ground, and the supporting columns fixedly connect the bottom plate, the partition plate and the top plate.

In some embodiments, the body support further includes a mounting structure disposed on a side of the base plate adjacent to the ground, and the moving assembly includes:

the guide wheel is arranged at the traveling end of the bottom plate;

a drive wheel mounted on the mounting structure.

So, through setting up leading wheel and drive wheel, the advancing direction is adjusted to the brilliant face machine accessible leading wheel of intelligence to remove through the drive wheel.

In some embodiments, the intelligent wafer surface machine further comprises an inductor, the inductor is arranged at the advancing end of the body support and is fixedly connected with the bottom plate, and the intelligent wafer surface machine avoids obstacles according to the inductor.

So, through setting up the inductor, the brilliant face machine of intelligence can detect the barrier at the removal in-process to keep away the barrier, guaranteed the safety of the brilliant face machine of intelligence.

So, through setting up bottom plate, roof, baffle and support column, and make removal subassembly, polishing subassembly and control module can install on body support.

In some embodiments, the intelligent wafer machine further comprises a spray assembly comprising:

the liquid storage tank is arranged on the top plate;

the spray head is arranged at the advancing end of the intelligent crystal face machine, is fixedly connected with the bottom plate and is used for spraying the liquid stored in the liquid storage tank to the ground;

the connecting pipe is connected with the spray head, and the liquid storage tank is used for conveying liquid to the spray head for spraying through the connecting pipe.

So, spray the subassembly through the setting, when intelligent crystal face machine carries out clean task, can be used for the liquid of cleaning or nursing to spray to ground in with the liquid reserve tank by the shower nozzle to improve the nursing effect of polishing subassembly to ground stone material, avoided dust pollution simultaneously.

In certain embodiments, the spray head and the connection tube comprise a plurality, and the spray assembly further comprises:

and the liquid spraying pump is arranged on the top plate and is connected with the liquid storage tank, and the liquid spraying pump is used for adjusting the flow rate of liquid.

And the distribution valve is arranged on the top plate and is connected with the liquid spraying pump, and the liquid spraying pump is connected with a plurality of connecting pipes through the distribution valve.

So, through setting up hydrojet pump and distribution valve for liquid in the liquid reserve tank can be sprayed to ground by a plurality of shower nozzles simultaneously, still can adjust the speed that the shower nozzle sprayed liquid to ground.

In some embodiments, the polishing assembly comprises:

the driving assembly comprises a driving part and a fixing part, the driving assembly is fixed on the partition plate through the fixing part, and the driving part extends from the fixing part to the ground and penetrates through the bottom plate;

the main body plate is arranged on one side, close to the ground, of the bottom plate and is connected with the driving part;

polishing piece, the activity sets up in the main part board one side that is close to ground, polishing subassembly passes through polishing piece nurses the stone material on ground.

So, polishing subassembly is through setting up drive assembly, main part board and polishing piece, and drive assembly accessible fixed part drives main part board and polishing piece and is close to or keep away from ground. Therefore, when the intelligent crystal face machine does not need to care the stone on the ground, the polishing component can be separated from the ground, and interference to the intelligent crystal face machine in the moving process is avoided.

In some embodiments, the polishing assembly further comprises:

the balancing weight, balancing weight detachably install in on the main part board to be used for adjusting polishing piece is to ground stone material nursing dynamics.

So, through setting up the balancing weight to adjust in order to adapt to different ground stones to polishing assembly, guarantee that the robot can both reach the nursing effect of preferred to different ground stones.

In some embodiments, the intelligent wafer machine further comprises:

the cleaning assembly is arranged on one side, away from the advancing end, of the body support and comprises a connecting piece, and the cleaning assembly is detachably arranged on the mounting structure through the connecting piece and used for cleaning the ground.

Therefore, the cleaning assembly is arranged, the garbage generated in the process of nursing the ground stone by the polishing assembly can be removed, the intelligent crystal face machine can also perform a cleaning task on the ground without paving the stone, and the application range of the intelligent crystal face machine is expanded.

In some embodiments, the intelligent wafer machine further comprises a lifting mechanism, the lifting mechanism comprising:

the push rod motor is arranged on the bottom plate;

the connecting rope comprises two ends, one end of the connecting rope is connected with the push rod motor, the other end of the connecting rope is connected with the connecting piece, and the push rod motor drives the cleaning assembly to be close to or far away from the ground through the connecting rope.

So, lead to and set up lifting mechanism for clean subassembly can break away from ground with clean subassembly when carrying out non-clean task, in order to avoid causing the interference to the removal of intelligent brilliant face machine.

In the brilliant face machine of intelligence of this application, through setting up the body support, remove the subassembly, polishing subassembly and control module, carry out the clean task in-process at the brilliant face machine of intelligence, control module can control removing subassembly and polishing subassembly to remove the subassembly and can remove under control module control, polishing subassembly can nurse ground under control module, so, the brilliant face machine of intelligence can carry out clean task automatically, and need not the manual work and operate.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of an intelligent wafer machine according to an embodiment of the present application;

fig. 2 is a schematic view of another structure of the intelligent wafer machine according to the embodiment of the present application;

FIG. 3 is a schematic diagram of a polishing assembly according to an embodiment of the present application;

FIG. 4 is a schematic view of a portion of the X in FIG. 2 according to an embodiment of the present application;

FIG. 5 is a schematic cross-sectional view of a polishing assembly according to an embodiment of the present application;

FIG. 6 is a schematic structural diagram of a weight member according to an embodiment of the present disclosure;

fig. 7 is a schematic view of another structure of the intelligent wafer machine according to the embodiment of the present application;

fig. 8 is a schematic view of another structure of the intelligent wafer machine according to the embodiment of the present application;

FIG. 9 is a schematic structural view of a wiper assembly according to an embodiment of the present disclosure;

FIG. 10 is a schematic mechanical view of a roller brush assembly and a dust push assembly in accordance with an embodiment of the present disclosure;

FIG. 11 is a schematic view of another construction of a roller brush assembly and a dust push assembly in accordance with an embodiment of the present application;

FIG. 12 is a schematic cross-sectional view of a roller brush assembly and a dust push assembly according to an embodiment of the present disclosure.

Description of the main element symbols:

the polishing machine comprises a body bracket 10, a bottom plate 11, a mounting frame 111, a partition plate 12, a mounting part 121, a mounting groove 1211, a top plate 13, a support column 14, a mounting structure 15, a mounting hole 151, a moving assembly 20, a guide wheel 21, a driving wheel 22, a polishing assembly 30, a driving assembly 31, a fixing part 311, a fixing rod 3111, a driving part 312, a main body plate 32, an open groove 321, a limiting hole 322, a connecting hole 323, a polishing piece 33, a working plate 331, a nursing pad 332, a rotating motor 34, a rotating part 341, a balancing weight 35, a guide post 351, a control module 40, a handle 50, a mounting part 51, a holding part 52, a power module 60, a spraying assembly 70, a liquid storage tank 71, a spraying head 72, a liquid spraying pump 73, a distribution valve 74, a cleaning assembly 80, a connecting piece 81, a mounting plate 811, a mounting lug 812, a water sucking pull assembly 82, a water collecting piece 821, a water sucking pipe 822, A rotating roller 8311, a side plate 8312, a dust push cloth 832, a driving roller 833, a connecting plate 834, a rolling brush assembly 84, a housing 841, a groove 8411, a rolling brush 842, a dust collection box 843, a lifting mechanism 90, a push rod motor 91, a telescopic part 911, a pulley 92, a mounting seat 921, a rotating wheel 922 and a sensor 110;

the intelligent wafer machine 100.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Places such as market, office building all adopt the stone material to lay ground in many, in order to guarantee that the ground of laying the stone material is bright clean and tidy, need stone material nursing equipment to nurse ground usually.

In the related art, the stone nursing equipment needs to be operated manually, however, the stone nursing equipment is generally large in size and complex to operate, and requires professional training of a user, so that the requirement on the user is high. In addition, the polishing nursing process can only depend on the judgment of a user, the nursing result is difficult to control, the nursing effect seriously depends on the operation of the user, and the efficiency is low. In addition, dust pollution generated in the nursing process is easy to cause harm to users.

Referring to fig. 1 and 2, an embodiment of the present application provides an intelligent wafer machine 100. The intelligent wafer machine 100 comprises a body support 10, a moving assembly 20, a polishing assembly 30 and a control module 40. Wherein, remove subassembly 20 and install in the one side that body support 10 is close to ground, intelligent brilliant face machine 100 removes through removing subassembly 20, and polishing subassembly 30 activity sets up in the one side that body support 10 is close to ground, and with remove subassembly 20 interval setting for nurse the ground stone material, control module 40 respectively with polishing subassembly 30 and remove subassembly 20 electric connection, be used for controlling intelligent brilliant face machine 100 automatic execution cleaning task.

Specifically, the intelligent wafer machine 100 may be a floor polishing sander, a sweeper, a floor mopping machine, or the like. The body frame 10 is substantially rectangular and spaced from and parallel to the ground. The moving assembly 20 is movably disposed on one side of the body support 10 close to the ground to support the body support 10, the moving assembly 20 can rotate relative to the body support 10, and the intelligent wafer machine 100 moves through the moving assembly 20. Polishing assembly 30 sets up in the one side that body support 10 is close to ground vertically and movably, and with the setting of removal subassembly 20 interval, the brilliant face machine 100 accessible polishing assembly 30 of intelligence nurses the ground of having laid the stone material. The control module 40 is mounted on the body frame 10 and electrically connected to the moving assembly 20 and the polishing assembly 30, respectively. The control module 40 can control the operation and stop of the intelligent wafer machine 100 and the switching of the working modes. The control module 40 is internally provided with a navigation system, and the control module 40 can also determine the real-time position of the intelligent wafer surface machine 100 and generate an operation path plan according to the navigation system, and can control the moving assembly 20 and the polishing assembly 30 according to the operation path plan, so that the intelligent wafer surface machine 100 can move and execute a cleaning task according to the operation path plan when executing the cleaning task.

The intelligent wafer machine 100 further comprises a handle 50, wherein the handle 50 is installed on one side of the body support 10 far away from the ground. The handle 50 includes a mounting member 51 and a grip portion 52. Wherein the mounting member 51 has a substantially circular ring shape, and the handle 50 is mounted to the top of the body frame 10 through the mounting member 51. The holding portion 52 is substantially semi-annular, is disposed on a side of the mounting member 51 away from the ground and away from the advancing end, and is fixedly connected to the mounting member 51, where the advancing end refers to an end facing the advancing direction during the movement of the intelligent wafer machine 100. The user can operate the smart wafer bonder 100 through the grip 52.

Further, the intelligent wafer machine 100 further comprises a power module 60, and the power module 60 is installed in the body support 10. The power module 60 is electrically connected to the moving assembly 20, the polishing assembly 30 and the control module 40, respectively, to supply power to the polishing assembly 30, the moving assembly 20 and the control module 40.

To sum up, in the brilliant face machine 100 of intelligence of this application, through setting up body support 10, removal subassembly 20, polishing subassembly 30 and control module 40, at the brilliant face machine 100 execution cleaning task in-process of intelligence, control module 40 can control removal subassembly 20 and polishing subassembly 30 to removal subassembly 20 removes under control module 40 control, and polishing subassembly 30 nurses ground under control module 40. Therefore, the intelligent crystal face machine 100 can automatically work under the unmanned control, manual operation is avoided, the nursing effect of the intelligent crystal face machine 100 on ground stone materials can be guaranteed, and the efficiency is improved.

In some embodiments, the body support 10 includes a bottom plate 11, a top plate 13, a partition plate 12 disposed between the bottom plate 11 and the top plate 13, and a plurality of supporting pillars 14, wherein the top plate 13 is disposed on a side of the bottom plate 11 away from the ground, and the supporting pillars 14 fixedly connect the bottom plate 11, the partition plate 12, and the top plate 13.

Specifically, the body support includes a bottom plate 11, a top plate 13, a partition plate 12 and a support column 14. The bottom plate 11, the top plate 13 and the partition plate 12 are arranged in parallel and at intervals in the vertical direction. The bottom plate 11 is arranged in parallel on one side close to the ground, the top plate 13 is arranged on one side of the bottom plate 11 far from the ground, and the partition plate 12 is arranged between the bottom plate 11 and the top plate 13. The bottom plate 11, the top plate 13 and the partition plate 12 may be made of metal or plastic.

The support column 14 includes a plurality of, substantially elongated, members. The support columns 14 can be divided into two groups, each group comprises a plurality of support columns 14, one group is vertically arranged between the bottom plate 11 and the partition plate 12 to fixedly connect the bottom plate 11 and the partition plate 12 into a whole, and the other group is vertically arranged between the partition plate 12 and the top plate 13 to fixedly connect the partition plate 12 and the top plate 13 into a whole. The connection method of the support column 14, the bottom plate 11, the partition plate 12, and the top plate 13 is not limited, and the support column may be connected by welding, riveting, screwing, or the like.

The power module 60 is disposed between the partition plate 12 and the top plate 13 and fixed to the partition plate 12. The handle 50 is attached to the top plate 13 on the side away from the ground by an attachment 51.

Referring further to fig. 1 and 2, in some embodiments, the body frame 10 further includes a mounting structure 15, the mounting structure 15 is disposed on a side of the bottom plate 11 close to the ground, and the moving assembly 20 includes a guide wheel 21 and a driving wheel 22. A guide wheel 21 is mounted to the forward end of the base plate 11 and a drive wheel 22 is mounted to the mounting structure 15.

Specifically, the mounting structure 15 is vertically disposed on one side of the bottom plate 11 close to the ground, and is fixedly connected to the bottom plate 11. The mounting structures 15 comprise two, and the two mounting structures 15 are arranged in parallel at intervals. The moving assembly 20 comprises a driving wheel 22 and a guiding wheel 21, the driving wheel 22 and the guiding wheel 21 are in contact with the ground, and the intelligent wafer machine 100 is supported and moved by the driving wheel 22 and the guiding wheel 21. The guide wheel 21 is arranged at the proceeding end of the intelligent wafer machine 100 and is movably arranged on the bottom plate 11, and the guide wheel 21 can rotate in any direction in the horizontal direction. The drive wheel 22 comprises two wheels, each mounted on two mounting structures 15. The control module 40 can control the rotation of the driving wheel 22 to adjust the rotation speed of the driving wheel 22, so as to control the moving speed of the intelligent wafer machine 100. In addition, the control module 40 can also control the rotation of the guide wheel 21 to adjust the horizontal rotation direction of the guide wheel 21, so as to change the traveling direction of the intelligent wafer machine 100. The drive wheel 22 may be an in-wheel motor. In this way, by providing the guide wheel 21 and the driving wheel 22, the intelligent wafer machine 100 can automatically move to any position point for cleaning when executing a cleaning task.

In some embodiments, the intelligent wafer surface machine 100 further includes an inductor 110, the inductor 110 is disposed at the advancing end of the body support 10 and is fixedly connected to the bottom plate 11, and the intelligent wafer surface machine 100 avoids the obstacle according to the inductor 110.

Specifically, the sensor 110 may be an image sensor, a distance sensor, a laser radar, or the like, and is installed at one end of the base plate 11 facing the traveling method. For obtaining data information of obstacles in the traveling direction of the intelligent wafer machine 100. The sensor 110 is electrically connected to the control module 40. When the intelligent wafer surface machine 100 performs a cleaning task, the sensor 110 may acquire obstacle information in the traveling direction of the intelligent wafer surface machine 100 and transmit the obstacle information to the control module 40, so that the control module 40 generates a control command according to the obstacle information to control the moving assembly 20 or the polishing assembly 30. For example, when the sensor 110 acquires that there is an obstacle in the moving direction of the intelligent wafer machine 100, the control module 40 replans the moving path according to the position information of the obstacle, and then controls the moving assembly 20 to change the moving direction so as to avoid the obstacle.

In some examples, control module 40 may also process data information obtained by sensors 110 to generate a build map. In the process that the intelligent wafer machine 100 moves in an area such as a shopping mall, an office building, a warehouse or a square, the sensor 110 acquires environmental information around the intelligent wafer machine 100. The control module 40 further performs instant positioning and mapping (SLAM) on the environmental information acquired by the sensor 110, and finally generates a constructed map. In this way, the control module 40 can generate a job path plan according to the constructed map, so that the intelligent wafer machine 100 can automatically perform a cleaning task.

In some embodiments, the intelligent wafer machine 100 comprises a spraying assembly 70, and the spraying assembly 70 comprises a liquid storage tank 71, a spray head 72 and a connecting pipe (not shown). Wherein, the storage box is installed on the top plate 13, and the nozzle 72 is arranged at the advancing end of the intelligent wafer machine 100 and is fixedly connected with the bottom plate 11. For spraying the liquid stored in the reservoir 71 to the ground.

Specifically, the control module 40 is also electrically connected to the spraying assembly 70 to control the spraying assembly 70 to spray the liquid onto the ground. The reservoir 71 is substantially cylindrical, but may be rectangular, conical or irregular. The liquid storage tanks 71 are vertically arranged on one side of the top plate 13 far away from the ground. The liquid storage tanks 71 include a plurality of tanks each storing a cleaning agent, a curing agent, a wax removing agent, a cleaning water, or other care agents.

The nozzle 72 is substantially a cylindrical body and is vertically disposed at the advancing end of the intelligent wafer machine 100. The base plate 11 further includes a mounting bracket 111 extending toward the ground, the mounting bracket 111 being disposed at a side near the traveling end, and the nozzle 72 being mounted on the mounting bracket 111.

The connection tube includes two ends, one end of which is communicated with the nozzle 72 and the other end of which is communicated with the liquid storage tank 71. Under the control of the control module 40, the liquid stored in the liquid storage tank 71 can be delivered to the spray head 72 through the connection pipe to be sprayed on the ground. For example, when the intelligent crystal face machine 100 nurses the ground through the polishing assembly 30, the control module 40 may control the liquid storage tank 71 containing the waxing agent to be conveyed to the spray head 72 through the connecting pipe to spray to the ground, so that the polishing assembly 30 may wax the stone on the ground.

In some embodiments, spray head 72 and connecting tubing comprise a plurality, and spray assembly 70 further comprises a spray pump 73 and a dispensing valve 74. A spray pump 73 and a distribution valve 74 are installed on the top plate 13, the spray pump 73 is connected to the reservoir tank 71 for adjusting the flow rate of the liquid, and the spray pump 73 is connected to a plurality of connection pipes through the distribution valve 74.

Specifically, a plurality of spray heads 72 are arranged side by side, each spray head 72 has a corresponding connecting pipe connected thereto, and the number of spray heads 72 and connecting pipes is not limited, and may be, for example, 4, 6, or 8. Spray pump 73 and dispensing valve 74 are both mounted on the side of top plate 13 remote from the floor. The plurality of liquid injection pumps 73 are provided, each liquid injection pump 73 corresponds to one liquid storage tank 71, each liquid injection pump 73 comprises an outlet and an inlet, and the liquid injection pumps 73 are communicated with the corresponding liquid storage tanks 71 through the inlets. The distribution valve 74 includes a plurality of distribution valves 74, and one spray pump 73 is provided for each distribution valve 74. Each of the distribution valves 74 includes an inlet and a plurality of outlets, wherein the inlet of the distribution valve 74 communicates with the outlet of the spray pump 73. The plurality of outlets of the distribution valve 74 are connected to a plurality of connection pipes. The liquid in the liquid tank 71 flows into the liquid jet pump 73 from the inlet of the liquid jet pump 73, flows into the distribution valve 74 from the outlet, flows out uniformly to the plurality of connection pipes from the plurality of outlets of the distribution valve 74, and is finally sprayed to the ground by the plurality of spray heads 72.

Further, the control module 40 is electrically connected to the liquid-jet pump 73, and the control module 40 can control the opening or the opening of the liquid-jet pump 73 to control the outflow of the liquid from the liquid-jet head 72, and control the liquid-jet pump 73 to change the flow rate of the output liquid, so as to adapt to different scenes. For example, in some examples, the control module 40 controls the spray pump 73 such that the spray pump 73 sprays a total amount of the treatment agent of 10 milliliters every 30 seconds. Thus, by arranging the liquid spraying pump 73 and the distribution valve 74, the liquid in the liquid storage tank 71 can be sprayed to the ground by the plurality of spray heads 72 at the same time, the liquid spraying range is expanded, and meanwhile, the speed of spraying the liquid to the ground by the spray heads 72 can be adjusted according to different actual scenes.

Referring to fig. 3, 4 and 5, in some embodiments, polishing assembly 30 includes a driving assembly 31, a main body plate 32 and a polishing element 33. The driving assembly 31 includes a driving portion 312 and a fixing portion 311, the driving assembly 31 is fixed on the partition 12 through the fixing portion 311, and the driving portion 312 extends from the fixing portion 311 to the ground and is connected to the main body plate 32 through the bottom plate 11. The main body plate 32 is disposed on the ground side of the bottom plate 11. The polishing member 33 is movably disposed on one side of the main body plate 32 close to the ground, and the polishing assembly 30 treats the ground stones through the polishing member 33.

The driving assembly 31 is vertically installed on the body bracket 10 and electrically connected to the control module 40. The driving assembly 31 includes a driving portion 312 and a fixing portion 311, and the driving portion 312 may be a push rod motor. The partition 12 includes a mounting portion 121, and the mounting portion 121 includes a mounting groove 1211, and the mounting groove 1211 is substantially a kidney-shaped groove.

The fixing portion 311 includes a fixing rod 3111 detachably disposed and a through hole, and the fixing rod 3111 passes through the through hole and is inserted into the mounting groove 1211 of the mounting portion 121, so that the fixing portion 311 is mounted on the mounting portion 121. The fixing portion 311 is movable in a vertical direction to a small extent around the fixing lever 3111. The base plate 11 includes a through groove (not shown), and the driving portion 312 extends from the fixing portion 311 toward the ground in a direction perpendicular to the ground and passes through the through groove.

The main body plate 32 is movably disposed on one side of the bottom plate 11 close to the ground, the main body plate 32 includes an open slot 321, the open slot 321 is disposed on one side of the main body plate 32 away from the ground, the driving portion 312 extends into the open slot 321 to be connected to the main body plate 32, and a specific connection manner does not set any limitation.

Further, the control module 40 can control the driving part 312 to move, so as to drive the main body plate 32 and the polishing element 33 to approach or depart from the ground. When the polishing assembly 30 is in operation, the driving part 312 is controlled to move down to a predetermined height, so that the polishing member 33 is attached to the ground for polishing. When the polishing assembly 30 is not in operation, the driving part 312 is controlled to move to lift to a predetermined height, so as to prevent the polishing member 33 from colliding with a ground obstacle during the movement of the intelligent wafer machine 100.

In the process of the polishing assembly 30 attaching to the ground through the polishing member 33 to care for the stone on the ground, if the ground is not good and presses against the polishing member, the fixing portion 311 can swing around the fixing rod 3111 to the mounting portion 121 within a small range, so that the polishing assembly 30 is inevitably damaged.

The polishing members 33 are substantially circular and movably disposed on one side of the main body plate 32 close to the ground, and the number of the polishing members 33 may be one or multiple, and is not limited specifically, in this application, the number of the polishing members 33 is two. The polishing assembly 30 further includes a rotating motor 34, the rotating motor 34 is mounted on the main body plate 32, the rotating motor 34 is connected to the polishing member 33 to drive the polishing member 33 to rotate for polishing and nursing the ground, and the rotating motor 34 is further electrically connected to the control module 40. The rotating motor 34 may be provided in one number to simultaneously drive the plurality of polishing members 33 to rotate, or may be provided in a plurality of numbers, each rotating motor 34 driving one polishing member 33.

Further, the rotating motor 34 includes a rotating portion 341, and the main body plate 32 further includes a through hole disposed in the vertical direction, and the rotating portion 341 is disposed through the through hole. The polishing member 33 includes a working plate 331 and a nursing pad 332, wherein the nursing pad 332 is used for nursing the floor stones. The work tray 331 and the nursing pad 332 are substantially circular in configuration. The working plate 331 is disposed on one side of the nursing pad 332 close to the main body plate 32, the working plate 331 is mounted on the rotating portion 341, and the rotating portion 341 can drive the working plate 331 to rotate in the horizontal direction. The nursing pad 332 is detachably mounted on the work tray 331. The nursing pad 332 and the working plate 331 are specifically installed in a non-limiting manner, and for example, the nursing pad 332 may be installed on the working plate 331 by using a hook and loop fastener. It can be understood that the care pad 332 may be worn due to the contact between the care pad 332 and the floor during the care process of the floor stone, thereby affecting the care effect of the care pad 332. Therefore, in order to ensure the nursing effect of the nursing pad 332, the nursing pad 332 needs to be replaced frequently, and in order to ensure that the nursing pad 332 can achieve the optimal nursing state in different scenes, the nursing pad 332 with different specifications and sizes may need to be adopted according to different scenes. Thus, the nursing pad 332 can be easily replaced by detachably mounting the nursing pad 332 on the work plate 331. Further, in other examples, the work plate 331 may also be equipped with a removable brush plate, dust cart, or the like, to replace the nursing pad 332, such that the polishing assembly 30 may be used to clean a floor with a brush plate, dust cart, or the like.

Furthermore, the control module 40 is further configured to control the rotating motor 34, and when the polishing assembly 30 works, the rotating portion 341 is controlled to rotate to adjust the rotating speed of the nursing pad 332, so as to ensure that the nursing pad 332 can achieve a better nursing effect when the polishing nursing pad 332 polishes and nurses the floor stones.

In this way, by providing the driving assembly 31, the main body plate 32 and the polishing element 33, the driving assembly 31 can drive the main body plate 32 and the polishing element 33 to approach or depart from the ground through the fixing portion 311. Therefore, when the intelligent crystal face machine 100 does not need to care for stone on the ground, the polishing assembly 30 can be separated from the ground, and interference to the intelligent crystal face machine 100 in the moving process is avoided.

Referring to fig. 6, in some embodiments, the polishing assembly 30 further includes a weight block 35, and the weight block 35 is detachably mounted on the main body plate 32 for adjusting the nursing strength of the polishing machine to the ground stone.

It will be appreciated that the stone used to lay the floor may include a variety of stones, such as marble, granite, or artificial marble, and the like, and that different stones may bear different levels of abrasion force on the polishing assembly 30, for example, in some scenarios, too much abrasion force of the polishing assembly 30 may cause the floor stone to crack or wear during the nursing process, and in other scenarios, too little abrasion force of the polishing assembly 30 may not achieve the nursing effect and affect the finish of the floor stone. Because polishing subassembly 30 is through polishing piece 33 and ground contact, the weight of intelligent brilliant face machine 100 is big more, pressure to ground is then big more, and then polishing piece 33 the dynamics of polishing to the ground stone material is also big more, and installs on main part board 32 through balancing weight 35 detachable, also promptly, increase or demolish balancing weight 35 on main part board 32 in order to adjust the pressure of intelligent brilliant face machine 100 to the ground stone material, and then can adjust the dynamics of polishing piece 33 to polishing of ground stone material. If the pressure of the intelligent crystal face machine 100 on the ground stone is required to be increased to increase the polishing force of the polishing piece 33 on the ground stone, the balancing weight 35 can be installed on the main body plate 32, and then the polishing piece 33 can achieve a better effect when nursing the ground stone. If the pressure of the intelligent crystal face machine 100 on the ground needs to be reduced to reduce the polishing force of the polishing piece 33 on the stone on the ground, the counterweight block 35 can be detached from the main body plate 32 to reduce the pressure of the intelligent crystal face machine 100 on the ground, and then the polishing force of the polishing piece 33 on the ground is reduced to avoid damaging the ground.

In addition, the weight 35 can adjust the grinding force of the polishing assembly 30 on the ground, and also change the rotation speed of the polishing member 33, if the weight 35 is added to the main body plate 32, the rotation speed of the polishing member 33 is reduced, and conversely, if the weight 35 mounted on the main body plate 32 is removed, the rotation speed of the polishing member 33 is increased.

Specifically, the main body plate 32 includes a plurality of limiting holes 322 and connecting holes 323, and the limiting holes 322 and the connecting holes 323 are circular holes and are disposed at intervals at an end of the main body plate 32. The weight 35 includes a plurality of guide posts 351 and a release member (not shown). The guide post 351 is a rod-shaped body, and is disposed in cooperation with the limiting hole 322, and the diameter of the guide post 351 is smaller than the limiting hole 322, so that the guide post 351 can be inserted into the limiting hole 322 to limit the weight block 35 on the main body plate 32 when the weight block 35 is mounted. The connecting hole 323 is matched with the dismounting member, and the balancing weight 35 is detachably mounted on the connecting hole 323 through the dismounting member. It can be understood that the counterweight 35 is detachably mounted on the limiting hole 322 and the connecting hole 323 of the main body plate 32 through the guide pillar 351 and the dismounting member, and since the counterweight 35 has a certain weight, the weight of the counterweight 35 makes the guide pillar 351 and the dismounting member stressed in the direction perpendicular to the ground, which may result in bending deformation of the guide pillar 351 and the dismounting member, and further affects the dismounting of the counterweight 35 on the main body plate 32. Therefore, the counterweight 35 is provided with the plurality of guide pillars 351 and the dismounting member, so that the bending deformation of the guide pillars 351 and the dismounting member can be avoided, and the convenience of dismounting the counterweight 35 on the main body plate 32 can be ensured.

Further, the counterweight block 35 may include a plurality of counterweight blocks 35, each of the counterweight blocks 35 includes a plurality of guide posts 351 and a mounting member, and the main body plate 32 includes a limiting hole 322 and a mounting member connected to the plurality of counterweight blocks 35, so as to increase or decrease the counterweight blocks 35 according to different ground scenes. It can be understood that, because the ground surface paved with different stones has different grinding force bearing capacities for the intelligent crystal face machine 100, in order to enable the intelligent crystal face machine 100 to adapt to different scenes as much as possible, the pressure of the intelligent crystal face machine 100 on the ground surface can be adjusted by increasing or decreasing the number of the counter weights 35 mounted on the main body plate 32, so that the polishing assembly 30 achieves the best care effect.

Further, the weight 35 is substantially semi-annular, but the weight 35 may also be circular, rectangular or other irregular shapes, and the specific shape is not limited. The balancing weight 35 can be an iron block, a lead block or a copper block with large density so as to reduce the volume, and the balancing weight 35 is not easy to damage or deform.

So, install on main part board 32 through setting up balancing weight 35 detachable to the user can increase or alleviate balancing weight 35 according to the scene of difference, in order to adjust the polishing subassembly 30 to the dynamics of polishing on ground in order to adapt to different scenes. Therefore, the intelligent crystal face machine 100 can achieve a better nursing effect when the intelligent crystal face machine nurses the ground stones in different scenes, and user experience is improved.

Referring to fig. 7 and 8, in some embodiments, the intelligent wafer machine 100 further comprises a cleaning assembly 80. The cleaning assembly 80 is disposed on one side of the body support 10 away from the traveling end, the cleaning assembly 80 includes a connecting member 81, and the cleaning assembly 80 is detachably mounted on the mounting structure 15 through the connecting member 81 for cleaning the floor.

Specifically, two mounting structure 15 are all including mounting hole 151, and mounting hole 151 can be screw hole, circular port, quad slit or irregular shape hole etc. and the restriction is not established to concrete shape, and in this application, mounting hole 151 is the circular port.

The connector 81 includes a mounting plate 811 and a mounting lug 812 bent to protrude from the mounting plate 811. The connecting member 81 may be formed by assembling the mounting plate 811 and the mounting lug 812, or by integrally processing them. The mounting ears 812 are provided with through holes that mate with the mounting holes 151, the through holes being circular holes, and a detachable rotating pin inserted into the through holes and the mounting holes 151 to connect the cleaning assembly 80 to the mounting structure 15. The cleaning assembly 80 is rotatable relative to the mounting structure 15 about a rotation pin. The pivot pin is removable from the through-hole and mounting hole 151 to disconnect the connector 81 from the mounting structure 15.

In this manner, the cleaning assembly 80 can be removably mounted to the mounting structure 15 and rotated relative to the mounting structure 15 by the provision of the mounting holes 151 and the attachment 81.

Referring to fig. 8, in some embodiments, the intelligent wafer machine 100 further includes a lifting mechanism 90, and the lifting mechanism 90 includes a push rod motor 91 and a connecting rope. Wherein, push rod motor 91 installs on bottom plate 11, connects the rope and includes both ends, and one end is connected with push rod motor 91, and the other end is connected with cleaning assembly 80, and push rod motor 91 drives cleaning assembly 80 through connecting the rope and is close to or keeps away from ground.

It can be understood that, since the cleaning assembly 80 contacts the ground during the cleaning process to remove the ground garbage, if the intelligent wafer machine 100 is cleaned and performs other tasks, for example, the intelligent wafer machine 100 executes a charging command, the cleaning assembly 80 contacts the ground during the movement of the intelligent wafer machine 100 to generate friction resistance, which affects the normal movement of the intelligent wafer machine 100 and may cause abrasion of the cleaning assembly 80. Therefore, by providing the lifting mechanism 90, after the cleaning assembly 80 completes the cleaning task, the lifting mechanism 90 can drive the cleaning assembly 80 to be separated from the ground, so as to prevent the cleaning assembly 80 from contacting the ground.

Specifically, the lifting mechanism 90 includes a push rod motor 91, a connecting rope, and a pulley 92. Wherein, push rod motor 91 and pulley 92 all install in the one side that bottom plate 11 is close to ground, and pulley 92 sets up between two mounting structure 15, and push rod motor 91 sets up in the one side that pulley 92 is close to and carries out the end, and the connecting rope can adopt wear-resisting materials such as steel wire, nylon or polymer fiber. The push rod motor 91 comprises an expansion part 911, one end of a connecting rope is connected with the expansion part 911, and the other end of the connecting rope passes through the pulley 92 to wind the connecting rope on the pulley 92 and is detachably connected with the cleaning assembly 80.

Further, the pulley 92 includes a mounting seat 921 and a rotating wheel 922, the pulley 92 is mounted on the bottom plate 11 through the mounting seat 921, the rotating wheel 922 is rotatably mounted on the mounting seat 921, the connecting rope is wound on the rotating wheel 922, and the rotating wheel 922 can rotate relative to the mounting seat 921 under the driving of the connecting rope.

The control module 40 is further electrically connected to the push rod motor 91, and the control module 40 can control the movement of the telescopic portion 911. After the cleaning assembly 80 completes the cleaning task, the control module 40 controls the telescopic portion 911 to move, and the connecting rope fixed to the telescopic portion 911 drives the cleaning assembly 80 to rotate around the rotating pin relative to the mounting structure 15, so as to be separated from the ground. Thus, by arranging the lifting mechanism 90, the cleaning assembly 80 can be separated from the ground when the intelligent wafer surface machine 100 is in a non-working state, and the influence of the cleaning assembly 80 on the movement of the intelligent wafer surface machine 100 is avoided.

Referring to FIG. 9, in some embodiments, the cleaning assembly 80 includes a wiper assembly 82. The water absorption rake assembly 82 is arranged on one side of the intelligent crystal face machine 100 far away from the advancing end and connected with the connecting piece 81, and the water absorption rake assembly 82 is used for removing sewage on the ground.

Specifically, the intelligent wafer surface machine 100 further includes a sewage chamber (not shown in the figure) installed on the body support 10.

The suction rake assembly 82 comprises a water collecting member 821, a suction pipe 822, a supporting wheel 823 and an obstacle avoidance wheel 824. Wherein, the piece 821 that catchments is the arc, and circumference sets up in the one side that the end was kept away from to connecting piece 81, and the relative connecting piece 81 of picking up water rotates in the horizontal direction. The suction pipe 822 includes two ends, one end of which is communicated with the sewage chamber and the other end of which is inserted into the connecting member 81, so that the ground is communicated with the sewage chamber. The water collecting member 821 is used for collecting sewage on the ground, so that the sewage is sucked into the sewage chamber by the suction pipe 822. The support wheel 823 contacts the ground to support the entire wiper assembly 82. The obstacle avoidance wheel 824 may include a plurality of wheels, and some obstacle avoidance wheels 824 are symmetrically disposed at an end of the water collection member 821 and are installed at a side of the water collection member 821 far away from the ground, so that when the water absorption and raking assembly 82 collides with an obstacle, the obstacle can be avoided through the obstacle avoidance wheels 824, and thus the water absorption and raking assembly 82 is prevented from being damaged.

Referring to fig. 10, 11-12, in some embodiments, the cleaning assembly 80 includes a dust pushing assembly 83, the dust pushing assembly 83 is connected to the connecting rope, the dust pushing assembly 83 includes a dust pushing cloth 832, and the dust pushing assembly 83 cleans the floor through the dust pushing cloth 832.

Specifically, the dust pushing assembly 83 includes a dust pushing bracket 831, a dust pushing cloth 832, a driving roller 833 and a connecting plate 834. In some embodiments, dust pushing assembly 83 may not include drive roller 833.

The dust push assembly 83 is connected to the connection cord by a connection plate 834. Dust push support 831 is substantially a trapezoid, although in other embodiments, dust push support 831 can be a cone, trapezoid, or other irregular shape. The dust pushing support 831 includes a rotating roller 8311 and two side plates 8312 arranged at intervals. The rotating roller 8311 includes a plurality of rollers disposed between the two side plates 8312 to connect the two side plates 8312 together, the rotating roller 8311 can rotate relative to the side plates 8312, and the dust pushing support 831 is mounted on the connecting plate 834 through the side plates 8312 to connect with the connecting plate 834.

The dust cloth 832 is rotatably sleeved on the plurality of rotating rollers 8311, the material of the dust cloth 832 can be collodion, superfine fiber, cotton sliver, absorbent fiber and the like, and the material is not limited specifically, and the dust cloth 832 is used for adsorbing garbage on the ground.

The driving roller 833 is disposed in parallel to the side of the dust pushing bracket 831 near the traveling end. The drive roller 833 and one of the rotating rollers 8311 cooperate to nip the dust cloth 832. Under a preset condition, the driving roller 833 drives the dust pushing cloth 832 to rotate around the dust pushing bracket 831 to replace the contact surface of the dust pushing cloth 832 and the ground. Therefore, the dust pushing assembly 83 can automatically replace the contact surface of the dust pushing cloth 832 and the ground, and the cleaning effect of the dust pushing assembly 83 is ensured.

In certain embodiments, the cleaning assembly 80 includes a roller brush assembly 84, and the roller brush assembly 84 is fixedly coupled to the coupling member 81 for sweeping the floor.

Specifically, the roller brush assembly 84 can be used alone or in combination with the dirt pushing assembly 83 or the water scooping assembly 82. For example, in the present application, the roller brush assembly 84 can be used with the dust push assembly 83, and the roller brush assembly 84 can be disposed on a side of the dust push assembly 83 near the travel end.

The roll brush assembly 84 includes a housing 841, a roll brush 842, and a dust collection bin 843. Wherein the dust push assembly 83 is connected to the housing 841 of the roll brush assembly 84 through the connection plate 834 to be formed in one body. The housing 841 is fixedly connected to the mounting plate 811 of the connector 81. The housing 841 includes a groove 8411 with an opening facing the ground, the rolling brush 842 and the dust collection box 843 are arranged in parallel and are accommodated in the groove 8411, and the rolling brush 842 is close to the advancing end side of the housing 841 in the groove 8411. The end of the rolling brush 842 is movably connected with the housing 841, the rolling brush 842 can rotate in the groove 8411, when the cleaning assembly 80 works, the rolling brush 842 is contacted with the ground, and garbage is rolled into the groove 8411 and falls into the dust collecting box 843 in the rotating process.

The roller brush 842 is substantially cylindrical and has brush strips on the surface of the roller brush 842, which brush strips are in contact with the floor during cleaning. When the number of the rolling brushes 842 is one, and the rolling brush 842 rotates counterclockwise under the condition that the rolling brush assembly 84 is clean, the rolling brush 842 rolls the garbage on the ground into the groove 8411 from one side of the rolling brush 842 close to the advancing end through the brush strip, and then the garbage falls into the dust collection box 843. When the number of the roll brushes 842 is two, in the case of cleaning the roll brush assembly 84, the rotation directions of the roll brushes 842 are opposite to each other so that the garbage is caught between the roll brushes 842 and then falls into the dust box 843.

In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: numerous changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. An intelligent crystal face machine is characterized by comprising:

a body support;

the moving assembly is movably mounted on one side, close to the ground, of the body support, and the intelligent wafer machine moves through the moving assembly;

the polishing assembly is movably arranged on one side, close to the ground, of the body support, is arranged at an interval with the moving assembly and is used for nursing ground stones;

the power supply module is arranged in the body bracket and is electrically connected with the movable assembly and the polishing assembly respectively so as to supply power to the polishing assembly and the movable assembly; and

and the control module is electrically connected with the moving assembly, the polishing assembly and the power supply module respectively, and is used for controlling the intelligent wafer machine to automatically work under the unmanned control.

2. The intelligent wafer machine of claim 1, further comprising a spray assembly, the spray assembly comprising:

the liquid storage tank is arranged on the body bracket;

the sprayer is arranged at the advancing end of the intelligent crystal face machine and used for spraying the nursing agent stored in the liquid storage tank to the ground;

the connecting pipe is connected with the spray head, and the liquid storage tank is used for conveying the nursing agent to the spray head for spraying through the connecting pipe.

3. The intelligent wafer machine of claim 2, wherein the spray head comprises a plurality of spray heads, the spray assembly further comprising:

the liquid spraying pump is arranged on the body bracket, is connected with the liquid storage tank and is used for pumping the nursing agent out of the liquid storage tank;

and the distribution valve is arranged on the body bracket and is connected with the liquid spraying pump, and the nursing agent is uniformly distributed to the plurality of spray heads through the distribution valve.

4. The intelligent wafer machine as claimed in claim 1, wherein the body support comprises a partition plate and a bottom plate located below the partition plate, the partition plate is provided with an installation part on the side located on the ground, and the installation part is provided with a waist-shaped groove which is substantially vertical to the ground.

5. The intelligent wafer machine of claim 4, wherein the polishing assembly comprises:

the driving assembly comprises a driving part and a fixing part connected with the driving part, and the driving assembly is fixed on the mounting part of the partition plate through the fixing part;

the main body plate is arranged on one side of the bottom plate close to the ground and is connected with the driving part;

the polishing piece is movably arranged on one side, close to the ground, of the main body plate, the driving assembly drives the polishing piece to be far away from or attached to the ground, and the polishing assembly is used for nursing the ground stone through the polishing piece.

6. The intelligent wafer machine as claimed in claim 5, wherein the fixing part is provided with a fixing rod and a horizontal through hole, the fixing rod passes through the through hole and is inserted into the waist-shaped groove of the mounting part, and the fixing part can move slightly along a vertical direction.

7. The intelligent wafer machine of claim 5, wherein the polishing assembly further comprises:

the rotating motor is arranged on the main body plate and used for driving the polishing piece to rotate in the horizontal direction so as to nurse the ground stone;

the polishing piece comprises a working disk and a nursing pad detachably arranged on the working disk, and the polishing piece is basically in a circular arrangement and is one or more.

8. The intelligent wafer machine of claim 5, wherein the main body plate is provided with a limiting hole and a connecting hole, and the polishing assembly further comprises:

the balancing weight comprises a guide pillar matched with the limiting hole and a dismounting piece corresponding to the connecting hole, and the balancing weight with a preset quantity or preset weight is arranged on the main body plate through the dismounting piece.

9. The intelligent wafer machine of claim 4, further comprising:

the cleaning assembly is arranged on one side, away from the advancing end, of the body support and comprises a connecting piece, and the cleaning assembly is detachably arranged on the body support through the connecting piece and used for cleaning the ground.

10. The intelligent wafer machine of claim 9, further comprising a lifting mechanism, the lifting mechanism comprising:

the push rod motor is arranged on the bottom plate;

the connecting rope comprises two ends, one end of the connecting rope is connected with the push rod motor, the other end of the connecting rope is connected with the cleaning assembly, and the push rod motor drives the cleaning assembly to be close to or far away from the ground through the connecting rope.

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