CN212373688U - External heat flow simulation device for microsatellite - Google Patents
External heat flow simulation device for microsatellite Download PDFInfo
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- CN212373688U CN212373688U CN202020338461.0U CN202020338461U CN212373688U CN 212373688 U CN212373688 U CN 212373688U CN 202020338461 U CN202020338461 U CN 202020338461U CN 212373688 U CN212373688 U CN 212373688U
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- external heat
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Abstract
The utility model discloses an external heat flow simulator for a microsatellite, which comprises a supporting frame and a heating component; the heating assembly is fixed in the supporting frame; the heating component comprises a heating substrate, a heat conducting sheet arranged on the first side of the heating substrate and a plurality of heaters arranged on the second side of the heating substrate; wherein the first side is directed towards the microsatellite. The utility model discloses a plate-shaped heating element who evenly generates heat has strengthened the homogeneity of thermal current, simple structure, easily processing, and the overall cost is lower.
Description
Technical Field
The utility model relates to an outer heat flow simulation field especially relates to an outer heat flow analogue means for microsatellite.
Background
The simulation of the external heat flow in the satellite heat balance test is very critical. Inaccuracy of external heat flow (heat flow uniformity and magnitude) simulation brings great errors to the heat balance test result, and the effectiveness of the heat balance test is affected.
The satellite heat balance test external heat flow simulation device is generally divided into a contact type external heat flow simulation device and a non-contact type external heat flow simulation device. The contact type external heat flow simulation device is generally that an electric heater is stuck on the outer surface of a satellite; the non-contact external heat flow simulation devices are various, such as a solar simulator, an infrared heating cage, an infrared lamp array and the like.
The contact type external heat flow simulation device can not be used for providing external heat flow of a heat dissipation surface of a satellite in a normal way due to the fact that the surface state of the satellite is changed. In the non-contact external heat flow simulation device, a solar simulator mainly simulates solar radiation, and the solar simulator has the defect that the solar simulator cannot replace earth infrared radiation and solar sailboards to simulate the infrared heat radiation of satellites; the infrared heating cage and the infrared lamp array have uneven structural forms, so that the uniformity of the provided external heat flow is poor.
Therefore, the prior art still lacks a non-contact external heat flow simulation device with good heat flow uniformity.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an outer thermal current analogue means for microsatellite for solve the poor problem of non-contact outer thermal current analogue means's heat flow homogeneity among the prior art.
In order to solve the problems, the utility model discloses an external heat flow simulator for a micro satellite, which comprises a supporting frame and a heating component; the heating assembly is fixed in the supporting frame; the heating component comprises a heating substrate, a heat conducting sheet arranged on the first side of the heating substrate and a plurality of heaters arranged on the second side of the heating substrate; wherein the first side is directed towards the microsatellite.
Optionally, the number of the heating assemblies corresponds to the number of the surfaces to be heated of the microsatellite.
Optionally, the distance between the plurality of heaters is 10-20 mm, and the plurality of heaters are connected in series or in parallel.
Optionally, the heating assembly further comprises a baffle, and the baffle is connected with the heating substrate and forms a box structure with an opening on one side with the heating substrate.
Optionally, the baffle is connected with the heating substrate through a connecting piece.
Optionally, the external heat flow simulator for a microsatellite further comprises a temperature sensor for measuring the temperature of the heating assembly.
Optionally, the external heat flow simulation device for the microsatellite further comprises a data acquisition instrument, and the data acquisition instrument is electrically connected with the temperature sensor.
Optionally, the external heat flow simulation device for a microsatellite further comprises a control module, a first end of the control module is connected with the data acquisition instrument, and a second end of the control module is connected with the heater.
Optionally, the external heat flow simulation device for the microsatellite further comprises a power supply.
Optionally, the heating substrate is an aluminum plate, the heat conducting sheet is a graphite film, and the heater is a polyimide film electric heating sheet.
Compared with the prior art, the technical scheme of the utility model following beneficial effect has:
the utility model discloses an outer thermal current analogue means for microsatellite adopts the plate-shaped heating element who evenly generates heat, has strengthened the homogeneity of thermal current, simple structure, easily processing, and the overall cost is lower.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an alternative external heat flow simulator for a microsatellite according to an embodiment of the present application;
FIG. 2 is a schematic diagram of an alternative heating assembly in accordance with embodiments of the present application;
FIG. 3 is a schematic structural diagram of an alternative external thermal flow simulator for a microsatellite according to an embodiment of the present application;
FIG. 4 is a schematic structural diagram of an alternative connector according to embodiments of the present application;
fig. 5 is a schematic structural view of an alternative connector according to an embodiment of the present application.
The following is a supplementary description of the drawings:
1-a support frame; 2-a heating assembly; 201-a heat generating substrate; 202-heat conducting fins; 203-a heater; 204-a baffle; 3-a data acquisition instrument; 4-a control module; 5-power supply.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with at least one implementation of the invention is included. In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," and the like are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or described herein.
Referring to fig. 1-2, fig. 1 is a schematic structural diagram of an alternative external heat flow simulator for a microsatellite according to the present invention, where the external heat flow simulator for a microsatellite in fig. 1 includes a supporting frame 1 and a heating assembly 2; the heating component 2 is fixed in the supporting frame 1; fig. 2 is a schematic structural diagram of an alternative heating assembly of the present invention, in fig. 2, the heating assembly 2 includes a heat-generating substrate 201, a heat-conducting fin 202 disposed on a first side of the heat-generating substrate 201, and a plurality of heaters 203 disposed on a second side of the heat-generating substrate 201; wherein, the first side of the heating substrate 201 faces the microsatellite.
Specifically, the supporting frame 1 can be made of an aluminum alloy section, an industrial aluminum section 30 x 30 or 40 x 40 is selected, and the supporting frame is spliced and assembled through section connecting pieces according to the space position requirement of the heating assembly 2 and the satellite, wherein the aluminum alloy section is an industrial mature product, has a simple structure and is easy to process, so the material and processing cost is low; the heating substrate 201 is made of an aluminum alloy plate with the thickness of 1-2 mm, the length and the width of the heating substrate are expanded by 3-5mm according to the projection size of a satellite, the heat conducting sheet 202 is made of a high heat conducting graphite film with the thickness of 0.5-1 mm, the length and the width of the heat conducting sheet are consistent with those of the heating substrate 201, the heat conducting sheet is preferably high heat conducting graphene or pyrolytic graphite, the in-plane heat conducting coefficient is larger than 1000W/(m.K), and the heat conducting sheet is bonded to the first side of the heating substrate 201 through; adopt lighter and thinner, the less aluminum alloy plate of specific heat capacity to reduce heating device's thermal inertia, reach the effect that outer hot flow heating device temperature is very fast to respond when the heat balance test switches the operating mode, its self material hemisphere emissivity of high heat conduction graphite film is greater than 0.9, has strengthened the coefficient of heat conductivity in the aluminum alloy plate face, has improved the homogeneity of thermal current, and need not additionally to spray hot accuse black lacquer to aluminum alloy plate.
As an alternative embodiment, the number of heating assemblies 2 corresponds to the number of the surfaces to be heated of the microsatellite, two heating assemblies 2 are shown in fig. 1, in practice, the number of heating assemblies 2 is not particularly limited, and may be set according to the surfaces to be heated of the microsatellite, if the number of the surfaces to be heated is one, one heating assembly 2 may be correspondingly set, and if the number of the surfaces to be heated is four, four heating assemblies 2 may be correspondingly set.
As an alternative embodiment, the pitch of the heaters 203 is 10 to 20mm, the heaters 203 are connected in series or in parallel, fig. 2 only shows the case where the heaters 203 are connected in series, and it can be understood that, in practical application, the heaters 203 may be matched with different connection modes according to actual needs.
As an optional embodiment, the heating assembly 2 further includes a baffle 204, the plurality of baffles 204 are connected to the heat-generating substrate 201, and form a box structure with an open side with the heat-generating substrate 201, as shown in fig. 1, the baffles 204 are disposed around the heat-generating substrate 201 to form a box structure with an open side, where the baffles 204 are aluminum alloy plates, it can be understood that the number of the baffles 204 is not particularly limited, and may be four, or more, as long as it can achieve the purpose of forming a box structure with an open side with the heat-generating substrate 201.
As an optional implementation manner, the baffle 204 is connected with the heating substrate 201 through a connecting member, and the material of the connecting member is preferably polytetrafluoroethylene, polyimide, glass fiber reinforced plastic, and the like, and mainly functions to connect aluminum alloy plates and reduce heat conduction between the aluminum alloy plates; fig. 4 is a schematic structural diagram of an alternative connection component of the present invention, and fig. 5 is a schematic structural diagram of another alternative connection component of the present invention, it should be noted that the specific structure of the connection component is not particularly limited as long as it can achieve the purpose of connecting different aluminum alloy plates.
As an alternative embodiment, the baffle 204 employs the heating assemblies 2, a plurality of heating assemblies 2 are connected to form an open-faced box structure, and specifically, five heating assemblies 2 are spliced to form an open-faced box structure, and the five heating assemblies 2 are connected by a connector shown in fig. 4 and 5, which can reduce heat conduction between the heating assemblies 2, so that different heating assemblies 2 can be independently and stably controlled in different temperature ranges to provide different external heat flows for the satellite surface.
As an optional implementation manner, the external thermal current simulation apparatus for a microsatellite according to the present invention further includes a temperature sensor for measuring the temperature of the heating assembly 2, preferably a T-type thermocouple, and is adhered to the outside of the heat generating substrate 201 by silicone rubber near the heater 203.
As an optional implementation mode, the utility model discloses an outer thermal current analogue means for microsatellite still includes data acquisition instrument 3, like fig. 3 the utility model relates to an optional outer thermal current analogue means for microsatellite's structural schematic diagram shows, 3 electric connection temperature sensor of data acquisition instrument for gather temperature sensor's the signal of telecommunication.
As an optional implementation mode, the utility model discloses an outer thermal current analogue means for microsatellite still includes control module 4, like fig. 3 the utility model relates to an optional outer thermal current analogue means for microsatellite's structural schematic diagram shows, control module 4's first end is connected data acquisition instrument 3, control module 4's second end is connected heater 203, wherein, the preferred hardware equipment of control module 4 of computer, control software's effect is according to the temperature that data acquisition instrument 3 transmitted and is set for the temperature with the target and carry out the comparison and control whether heater 203 works to reach the function that the control generates heat base plate 201 temperature.
As an optional implementation manner, the external thermal current simulator for microsatellite of the present invention further comprises a power supply 5, as shown in fig. 3. the structural schematic diagram of the external thermal current simulator for microsatellite of the present invention is shown, the power supply 5 is used for supplying power to the heater 203, preferably 150V, 5A dc programmable power supply.
The utility model discloses an outer thermal current analogue means for microsatellite, its theory of operation is for adjusting the temperature of base plate 2 that generates heat through control module 4, heating element 2, temperature sensor and data acquisition appearance 3, and the realization is applyed and is controlled the outer thermal current when microsatellite heat balance is experimental, and this method also can be applied to in the big satellite heat balance is experimental simultaneously.
The heating substrate 201 in the heating component 2 is designed and assembled in a partition mode according to the external heat flow application requirements of different regions of the satellite, the graphite heat conducting sheet 202 is pasted on the surface of the heating substrate 201 to play the role of uniform temperature and heat flow, the hemispherical emissivity of the heating substrate 201 is enhanced, the process that the surface of a conventional heat radiation plate needs to be sprayed with thermal control black paint is saved, and the processing time and the cost are optimized; the connecting sheet is made of a material with low heat conductivity coefficient, so that heat conduction between the heating substrates 201 and the baffle 204 is reduced, and the effect of zone temperature control is realized.
The utility model discloses an outer heat flow analogue means for microsatellite need carry out the thermal current after the production assembly is accomplished and marks the experiment, obtain the temperature of generating heat base plate 201 and radiate the relation between the radiation heat flow (adiabatic type bolometer temperature) that the satellite surface actual measurement arrived through demarcating, verify both temperature differences through the experiment within 3 ℃, the thermal current difference of production can be controlled within 5%, consequently in the actual test process, this outer heat flow analogue means for microsatellite need not additionally install adiabatic type bolometer on the satellite surface, implementation time and equipment cost have been saved.
The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations are also considered as the protection scope of the present invention.
Claims (10)
1. An external heat flow simulator for microsatellites, characterized by comprising a supporting frame (1) and a heating assembly (2);
the heating assembly (2) is fixed in the supporting frame (1);
the heating assembly (2) comprises a heating substrate (201), a heat conducting sheet (202) arranged on the first side of the heating substrate (201), and a plurality of heaters (203) arranged on the second side of the heating substrate (201);
wherein the first side is directed towards the microsatellite.
2. External heat flow simulation device for microsatellites according to claim 1, characterised in that the number of heating assemblies (2) corresponds to the number of faces to be heated of the microsatellite.
3. The external heat flow simulator for a microsatellite according to claim 2, wherein the plurality of heaters (203) are spaced at intervals of 10 to 20mm, and the plurality of heaters (203) are connected in series or in parallel.
4. The external heat flow simulator for microsatellites according to claim 2, wherein the heating assembly (2) further comprises a baffle plate (204), and the baffle plate (204) is connected with the heat-generating substrate (201) and forms an open-faced box structure with the heat-generating substrate (201).
5. The external heat flow simulator for a microsatellite according to claim 4, wherein said baffle plate (204) is connected to said heat-generating substrate (201) by a connector.
6. External heat flow simulation device for microsatellites according to claim 1, further comprising a temperature sensor for measuring the temperature of the heating assembly (2).
7. The external heat flow simulator for microsatellites according to claim 6, further comprising a data collector (3), wherein the data collector (3) is electrically connected to the temperature sensor.
8. The external heat flow simulator for microsatellites according to claim 7, further comprising a control module (4), wherein a first end of the control module (4) is connected to the data collector (3), and a second end of the control module (4) is connected to the heater (203).
9. External heat flow simulation device for microsatellites according to claim 1, characterised by comprising a power supply (5).
10. The external heat flow simulator for a microsatellite according to claim 1, wherein said heat generating substrate (201) is an aluminum plate, said heat conducting sheet (202) is a graphite film, and said heater (203) is a polyimide film electric heating sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020338461.0U CN212373688U (en) | 2020-03-17 | 2020-03-17 | External heat flow simulation device for microsatellite |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020338461.0U CN212373688U (en) | 2020-03-17 | 2020-03-17 | External heat flow simulation device for microsatellite |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212373688U true CN212373688U (en) | 2021-01-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020338461.0U Active CN212373688U (en) | 2020-03-17 | 2020-03-17 | External heat flow simulation device for microsatellite |
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| Country | Link |
|---|---|
| CN (1) | CN212373688U (en) |
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- 2020-03-17 CN CN202020338461.0U patent/CN212373688U/en active Active
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