CN212365941U

CN212365941U - Semiconductor diode packaging structure

Info

Publication number: CN212365941U
Application number: CN202021546393.3U
Authority: CN
Inventors: 叶惠东
Original assignee: Fuzhou Huacheng Semiconductor Technology Co ltd
Current assignee: Fuzhou Huacheng Semiconductor Technology Co ltd
Priority date: 2020-07-30
Filing date: 2020-07-30
Publication date: 2021-01-15
Anticipated expiration: 2030-07-30

Abstract

The utility model discloses a semiconductor diode packaging structure, including the workstation main part, the upper end surface of workstation main part is provided with protection machanism, protection machanism's upper end internal surface is provided with protection machanism, the lower extreme surface of workstation main part is provided with the bracing piece, the rear end surface of bracing piece is provided with the connecting rod. A semiconductor diode packaging structure, through the encapsulation operation panel of installation, the encapsulation operation panel mainly plays the installation and places the function, install the multiunit on the encapsulation operation panel and place the hole, can carry out the encapsulation work of multiunit diode, through the removal slider of installation, it can let the encapsulation operation panel realize gliding function to remove the slider, make things convenient for subsequent transport work, through the two sets of control handles that set up, two sets of control handles cooperate the use, can conveniently control the slip of encapsulation operation panel to reach the purpose that improves the device practicality.

Description

Semiconductor diode packaging structure

Technical Field

The utility model relates to a diode encapsulation field, in particular to semiconductor diode packaging structure.

Background

A diode is an electronic device made of a semiconductor material, and has a unidirectional conductivity, that is, when a forward voltage is applied to an anode and a cathode of the diode, the diode is turned on, and when a reverse voltage is applied to the anode and the cathode, the diode is turned off, so that the turning on and off of the diode is equivalent to the turning on and off of a switch.

When the existing packaging structure is installed and used, the operation structure of part of the packaging structure is single, the problem of inconvenient operation exists, corresponding protection structures are lacked in part of the packaging structure, and the lifting space exists.

SUMMERY OF THE UTILITY MODEL

The utility model provides a problem to the existence of above-mentioned prior art provides a semiconductor diode packaging structure.

The utility model discloses a following technical means realizes solving above-mentioned technical problem:

the utility model provides a semiconductor diode packaging structure, includes the workstation main part, the upper end surface of workstation main part is provided with operating device, operating device's upper end internal surface is provided with protection machanism, the lower extreme surface of workstation main part is provided with the bracing piece, the rear end surface of bracing piece is provided with the connecting rod.

Furthermore, the operating mechanism comprises a packaging operating board, a movable sliding block, a placing hole, a first control handle and a second control handle, the placing hole is formed in the packaging operating board, the movable sliding block is arranged at the front end of the packaging operating board, the first control handle is arranged at the upper end of the packaging operating board, and the second control handle is arranged at the upper end of the packaging operating board.

Furthermore, a placing groove is formed between the packaging operation board and the movable sliding block, and the outer surface of the front end of the packaging operation board is fixedly connected with the outer surface of the rear end of the movable sliding block through the placing groove.

Furthermore, a fixing adhesive is arranged between the first control handle and the packaging operation board, and the outer surface of the lower end of the first control handle is fixedly connected with the outer surface of the upper end of the packaging operation board through the fixing adhesive.

Furthermore, the protection mechanism comprises a packaging tube, an anti-interference magnetic ring and packaging threads, the anti-interference magnetic ring is arranged on the outer wall of the packaging tube, and the packaging threads are arranged inside the packaging tube.

Furthermore, a connecting groove is formed between the anti-interference magnetic ring and the packaging tube, and the inner surface of one side of the anti-interference magnetic ring is fixedly connected with the outer surface of one side of the packaging tube through the connecting groove.

The utility model has the advantages that: the technical proposal provides an operation structure for conveniently packaging a semiconductor diode, the packaging operation board mainly has the functions of installation and placement through the packaging operation board, a plurality of groups of placing holes are arranged on the packaging operation board, the packaging operation board can carry out the packaging work of a plurality of groups of diodes, the packaging operation board can realize the sliding function through the movable sliding block arranged, the subsequent conveying work is convenient, the two groups of control handles are arranged and matched for use, the sliding of the packaging operation board can be conveniently controlled, thereby achieving the aim of improving the practicability of the device, and the self-contained protection mechanism can provide a simple and practical protection structure, the anti-interference magnetic ring utilizes the low impedance reflected by the high-frequency interference of a ferrite core to effectively inhibit the high-frequency interference, the essence of the method is that the high-frequency interference generates vortex on the section of the magnetic ring, so that the high-frequency interference is released in a heat energy form, anti-interference protection is carried out, and the practicability of the device can be further improved.

Drawings

Fig. 1 is a schematic structural diagram of a semiconductor diode package structure according to the present invention;

fig. 2 is a schematic structural diagram of an operating mechanism in a semiconductor diode package structure according to the present invention;

fig. 3 is a schematic structural diagram of a protection mechanism in a semiconductor diode package structure according to the present invention;

fig. 4 is a schematic structural diagram of a worktable main body in a semiconductor diode package structure according to the present invention.

In the figure: 1. a table main body; 2. an operating mechanism; 3. a protection mechanism; 4. a support bar; 5. a connecting rod; 21. packaging the operation board; 22. moving the slide block; 23. placing holes; 24. a first control grip; 25. a second control grip; 31. packaging the tube; 32. an anti-interference magnetic ring; 33. the threads are encapsulated.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 1 to 4, a semiconductor diode package structure includes a table main body 1, an operating mechanism 2 is disposed on an upper outer surface of the table main body 1, a protection mechanism 3 is disposed on an upper inner surface of the operating mechanism 2, a support rod 4 is disposed on a lower outer surface of the table main body 1, and a connection rod 5 is disposed on a rear outer surface of the support rod 4.

The operating mechanism 2 comprises a packaging operating board 21, a movable slider 22, a placing hole 23, a first control handle 24 and a second control handle 25, the placing hole 23 is arranged inside the packaging operating board 21, the movable slider 22 is arranged at the front end of the packaging operating board 21, the first control handle 24 is arranged at the upper end of the packaging operating board 21, the second control handle 25 is arranged at the upper end of the packaging operating board 21, the packaging operating board 21 mainly plays a role in mounting and placing through the mounted packaging operating board 21, the packaging operating board 21 is provided with a plurality of groups of placing holes 23, the packaging operation of a plurality of groups of diodes can be carried out, the packaging operating board 21 can realize a sliding function through the mounted movable slider 22, the subsequent conveying operation is convenient, and the two groups of control handles are matched for use through the two groups of control handles, the sliding of the packaging operating board 21 can be conveniently controlled, thereby achieving the purpose of improving the practicability of the device.

A placing groove is arranged between the packaging operation plate 21 and the movable sliding block 22, and the outer surface of the front end of the packaging operation plate 21 is fixedly connected with the outer surface of the rear end of the movable sliding block 22 through the placing groove.

A fixing glue is arranged between the first control handle 24 and the packaging operation board 21, and the outer surface of the lower end of the first control handle 24 is fixedly connected with the outer surface of the upper end of the packaging operation board 21 through the fixing glue.

The protection mechanism 3 comprises a packaging pipe 31, an anti-interference magnetic ring 32 and packaging threads 33, the anti-interference magnetic ring 32 is arranged on the outer wall of the packaging pipe 31, the packaging threads 33 are arranged inside the packaging pipe 31, the anti-interference magnetic ring 32 is arranged through the anti-interference magnetic ring 32, the anti-interference magnetic ring 32 utilizes the low impedance reflected by the ferrite magnetic core to the high-frequency interference, the high-frequency interference is effectively inhibited, the essence is that the high-frequency interference generates vortex on the cross section of the magnetic ring, the high-frequency interference is released in a heat energy mode, anti-interference protection is carried out, and the practicability of the device can be further.

A connecting groove is arranged between the anti-interference magnetic ring 32 and the packaging tube 31, and the inner surface of one side of the anti-interference magnetic ring 32 is fixedly connected with the outer surface of one side of the packaging tube 31 through the connecting groove.

The working principle is as follows: when the device works, the packaging operation board 21 mainly plays a role in installation and placement through the installed packaging operation board 21, the packaging operation board 21 is provided with a plurality of groups of placement holes 23 for packaging a plurality of groups of diodes, the packaging operation board 21 can realize a sliding function through the installed movable slider 22, the movable slider 22 is convenient for subsequent conveying work, the packaging operation board 21 can be conveniently controlled to slide through the two groups of control handles, the two groups of control handles are matched for use, thereby achieving the purpose of improving the practicability of the device, the protection mechanism 3 can provide a simple and practical protection structure, the anti-interference magnetic ring 32 utilizes the high-frequency interference reflected by the ferrite magnetic core to effectively inhibit the high-frequency interference, and the fact is that the high-frequency interference generates vortex on the cross section of the magnetic ring, therefore, the high-frequency interference is released in a heat energy form, anti-interference protection is carried out, and the practicability of the device can be further improved.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

It is noted that, in this document, relational terms such as first and second, and the like, if any, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor diode packaging structure comprises a workbench main body (1), and is characterized in that: the outer surface of the upper end of the workbench main body (1) is provided with an operating mechanism (2), the inner surface of the upper end of the operating mechanism (2) is provided with a protection mechanism (3), the outer surface of the lower end of the workbench main body (1) is provided with a support rod (4), and the outer surface of the rear end of the support rod (4) is provided with a connecting rod (5).

2. The semiconductor diode package structure of claim 1, wherein: the operating mechanism (2) comprises a packaging operating board (21), a moving slide block (22), a placing hole (23), a first control handle (24) and a second control handle (25), wherein the placing hole (23) is formed in the packaging operating board (21), the moving slide block (22) is arranged at the front end of the packaging operating board (21), the first control handle (24) is arranged at the upper end of the packaging operating board (21), and the second control handle (25) is arranged at the upper end of the packaging operating board (21).

3. The semiconductor diode package structure of claim 2, wherein: a placing groove is formed between the packaging operation plate (21) and the movable sliding block (22), and the outer surface of the front end of the packaging operation plate (21) is fixedly connected with the outer surface of the rear end of the movable sliding block (22) through the placing groove.

4. The semiconductor diode package structure of claim 2, wherein: and a fixing adhesive is arranged between the first control handle (24) and the packaging operation board (21), and the outer surface of the lower end of the first control handle (24) is fixedly connected with the outer surface of the upper end of the packaging operation board (21) through the fixing adhesive.

5. The semiconductor diode package structure of claim 1, wherein: the protection mechanism (3) comprises a packaging tube (31), an anti-interference magnetic ring (32) and packaging threads (33), the anti-interference magnetic ring (32) is arranged on the outer wall of the packaging tube (31), and the packaging threads (33) are arranged inside the packaging tube (31).

6. The semiconductor diode package structure of claim 5, wherein: a connecting groove is formed between the anti-interference magnetic ring (32) and the packaging tube (31), and the inner surface of one side of the anti-interference magnetic ring (32) is fixedly connected with the outer surface of one side of the packaging tube (31) through the connecting groove.