CN212365018U

CN212365018U - Side fingerprint module

Info

Publication number: CN212365018U
Application number: CN202020990696.8U
Authority: CN
Inventors: 刘艳秋
Original assignee: Kunshanqiu Titanium Biometric Technology Co Ltd
Current assignee: Kunshanqiu Titanium Biometric Technology Co Ltd
Priority date: 2020-06-03
Filing date: 2020-06-03
Publication date: 2021-01-15
Anticipated expiration: 2030-06-03

Abstract

The utility model provides a side fingerprint module, includes fingerprint chip and the circuit substrate who laminates with the fingerprint chip, fingerprint chip and circuit substrate electric connection, and the fingerprint chip includes the lower surface, and circuit substrate includes first upper surface, and the lower surface forms the laminating coverage area with first upper surface laminating, forms on lower surface and/or the first upper surface and dodges the recess, along the thickness direction of circuit substrate, dodges the recess at least part and overlaps with the laminating coverage area. The utility model discloses a side fingerprint module can improve the sealed protective properties of pad to can also increase the tensile effect of pulling out between fingerprint chip and the circuit substrate.

Description

Side fingerprint module

Technical Field

The utility model relates to a terminal technology field, in particular to side fingerprint module.

Background

Along with the rapid development of the mobile internet era, the integrated functionality of the mobile phone is more complete, nowadays, the size of the screen has also developed to a critical point, and in order to pursue a better visual effect, another form of appearance innovation-full screen is produced. The coming of the full-face screen inevitably causes the innovation and the update of the fingerprint identification technology, and one of the design schemes is to place the fingerprint on the side edge of the mobile phone to form a side face fingerprint scheme.

At present, traditional fingerprint module structure includes: fingerprint protective layer, fingerprint chip and fingerprint circuit base plate, wherein, the fingerprint protective layer covers on the fingerprint chip surface, the fingerprint chip is fixed in on the fingerprint circuit base plate through conducting material, the sealed protection conducting material of glue is adopted around the fingerprint circuit base plate, however, present traditional fingerprint chip design all is double pad design, the fingerprint circuit base plate need contain double pad, lead to fingerprint circuit base plate width only slightly narrow and fingerprint chip, the edge does not have enough space to draw the glue sealed, can only be partial to one side with the pad design, reserve sufficient space on the other side, adopt "one" font or "L" shape to draw gluey, remaining most do not draw gluey position and can only rely on glue self mobility to realize pad parcel protection.

However, since the gap between the fingerprint chip and the fingerprint circuit substrate is small, the fluidity of the glue is poor or no glue flows into the gap, so that the glue cannot wrap the bonding pad well or even does not wrap the bonding pad, the sealing protection performance of the bonding pad and the drawing test of the fingerprint chip are greatly affected, and the actual manufacturing process has great risk of failure.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a side fingerprint module can improve the sealed protection performance of pad to can also increase the tensile effect of pulling out between fingerprint chip and the circuit substrate.

The utility model provides a side fingerprint module, including fingerprint chip and with the circuit substrate of fingerprint chip laminating, fingerprint chip and circuit substrate electric connection, fingerprint chip include the lower surface, and circuit substrate includes first upper surface, and the lower surface forms the laminating coverage area with first upper surface laminating, forms on lower surface and/or the first upper surface and dodges the recess, along circuit substrate thickness direction, dodges recess at least part and laminating coverage area and overlaps.

Further, the fingerprint chip is including dodging recess and first pad, dodging recess and first pad and all setting up on the lower surface, dodging one side of recess and being close to first pad, dodging the edge that the other side of recess extended to the fingerprint chip.

Further, the avoiding grooves are located on two sides of the first bonding pad.

Furthermore, the first bonding pads are multiple, and the first bonding pads are arranged at intervals.

Further, the avoiding groove is in a strip shape or an arc shape.

Furthermore, a plurality of avoiding grooves are formed, and the avoiding grooves are arranged at intervals.

Furthermore, the avoiding groove comprises an oblique angle, and the oblique angle is arranged at the glue inlet of the avoiding groove.

Furthermore, the circuit substrate further comprises a second bonding pad, the first bonding pad is electrically connected with the second bonding pad, and the avoidance groove is close to the second bonding pad.

Further, the side fingerprint module still includes the adhesive, and fingerprint chip and circuit substrate all become flat rectangular form, and the cross section of fingerprint chip is greater than the laminating coverage area, and the lower surface is equipped with the adhesive and forms first glue region in being close to marginal position, dodges to be equipped with the adhesive in the recess and forms the second glue region, and first glue region and second glue region intercommunication.

Furthermore, along the thickness direction of the circuit substrate, at least partial positions on the peripheral surface of the circuit substrate are provided with adhesive glue and form a glue covering area.

The utility model discloses a fingerprint chip of side fingerprint module is including dodging the recess, when beating to glue, and partly bonding glue will flow in dodging in the recess to form new glue coverage area, dodge the recess and increased the packing volume that the bonding was glued and the coverage area that the bonding was glued, the bonding glue can wrap up the pad better, has consequently improved the sealed protective properties of pad, and make the laminating power between fingerprint chip and the circuit substrate stronger, greatly increased the anti-tensile effect of pulling out.

Drawings

Fig. 1 is a schematic structural view of a side fingerprint module according to a first embodiment of the present invention.

Fig. 2 is a schematic top view of the lower surface of the fingerprint chip according to the first embodiment of the present invention.

Fig. 3 is a schematic top view of a first upper surface of a circuit substrate according to a first embodiment of the present invention.

Fig. 4 is a schematic view illustrating distribution of the adhesive on the fingerprint chip according to the first embodiment of the present invention.

Fig. 5 is a schematic structural diagram of a side fingerprint module according to a second embodiment of the present invention.

Fig. 6 is a schematic top view of a lower surface of a fingerprint chip according to a second embodiment of the present invention.

Fig. 7 is a schematic structural diagram of a side fingerprint module according to a third embodiment of the present invention.

Fig. 8 is a schematic top view of a lower surface of a fingerprint chip according to a third embodiment of the present invention.

Fig. 9 is a schematic structural diagram of a side fingerprint module according to a fourth embodiment of the present invention.

Fig. 10 is a schematic top view of a first upper surface of a circuit board according to a fourth embodiment of the present invention.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

Fig. 1 is a schematic structural view of a side fingerprint module according to a first embodiment of the present invention. As shown in fig. 1, the side fingerprint module 10a includes a fingerprint chip 12a, a circuit board 13a attached to the fingerprint chip 12a, and an adhesive (not shown), the adhesive is connected between the fingerprint chip 12a and the circuit board 13a, the fingerprint chip 12a is electrically connected to the circuit board 13a, the fingerprint chip 12a and the circuit board 13a are attached to form an attachment coverage area, the fingerprint chip 12a forms an avoiding groove 125a on the surface attached to each other, and the avoiding groove 125a at least partially overlaps the attachment coverage area along the thickness direction of the circuit board 13 a.

Fig. 2 is a schematic top view of the lower surface of the fingerprint chip according to the first embodiment of the present invention. As shown in fig. 1 and 2, the fingerprint chip 12a is in a flat and long shape, and specifically, the fingerprint chip 12a further includes a second upper surface 121, a lower surface 122, a first pad 123, and a fingerprint protection layer 124. The second upper surface 121 is opposite to the lower surface 122, the second upper surface 121 is located above the lower surface 122, the avoiding groove 125a and the first pad 123 are both disposed on the lower surface 122 of the fingerprint chip 12a, and the fingerprint protection layer 124 is disposed on the second upper surface 121 of the fingerprint chip 12a, further, the fingerprint protection layer 124 may be specifically a film, a metal plating layer, etc., but not limited thereto, one side of the avoiding groove 125a is close to the first pad 123, and the other side extends to the edge of the fingerprint chip 12a, so as to form a glue inlet for avoiding the groove 125 a. In the present embodiment, the avoiding groove 125a facilitates the glue flowing, thereby increasing the glue feeding amount and the glue coverage area, and the lower surface 122 is used for being attached to the circuit substrate 13 a.

As shown in fig. 2, two avoidance grooves 125a are provided, the avoidance grooves 125a are respectively located on two sides of the first pad 123, and the avoidance grooves 125a are in a strip shape, but not limited thereto, for example, the avoidance grooves 125a may also be in an arc shape. The number of the first pads 123 is plural, and the first pads 123 are spaced apart from each other, and specifically, the first pads 123 are arranged in a row, but not limited thereto, and the arrangement of the first pads 123 can be freely selected according to actual situations.

Fig. 3 is a schematic top view of a first upper surface of a circuit substrate according to a first embodiment of the present invention. As shown in fig. 1 and 3, the circuit substrate 13a is a flat and long strip, the circuit substrate 13a includes a second pad 131 and a first upper surface 132, the second pad 131 is disposed on the first upper surface 132, specifically, the second pad 131 is plural, the second pads 131 are disposed at intervals, more specifically, the second pads 131 are arranged in a row, but not limited thereto, and the arrangement of the second pads 131 can be freely selected according to actual conditions. The first upper surface 132 is used for being attached to the lower surface 122 of the fingerprint chip 12a, the first bonding pads 123 are electrically connected with the second bonding pads 131, each first bonding pad 123 is correspondingly connected with one second bonding pad 131, the avoidance groove 125a is close to the second bonding pad 131, at least a part of the outer peripheral surface of the circuit substrate 13a is provided with adhesive glue and forms a glue covering area 101, and the glue covering area 101 seals a gap between the fingerprint chip 12a and the circuit substrate 13a to achieve the effect of protecting the bonding pads. In the embodiment, each first pad 123 and the corresponding second pad 131 can be electrically connected through a conductive material and can perform a fixing function, and the conductive material is preferably, but not limited to, a solder paste.

Fig. 4 is a schematic view illustrating distribution of the adhesive on the fingerprint chip according to the first embodiment of the present invention. As shown in fig. 1 and 4, the cross section of the fingerprint chip 12a is larger than the attachment coverage area, the lower surface 122 is provided with an adhesive glue near the edge to form a first glue area 102, the avoiding groove 125a is provided with the adhesive glue to form a second glue area 103, and the first glue area 102 is communicated with the second glue area 103. When gluing, a part of the adhesive glue flows into the avoiding groove 125a to form the second glue area 103, the avoiding groove 125a increases the filling amount of the adhesive glue and the covering area of the adhesive glue, and the adhesive glue can better wrap the first bonding pad 123 and the second bonding pad 131, so that the sealing protection performance of the first bonding pad 123 and the second bonding pad 131 is improved, the bonding force between the fingerprint chip 12a and the circuit substrate 13a is stronger, and the anti-pulling effect is greatly increased.

Second embodiment

Fig. 5 is a schematic structural diagram of a side fingerprint module according to a second embodiment of the present invention. As shown in fig. 5, the structure of the side fingerprint module 10b of the present embodiment is substantially the same as that of the side fingerprint module 10a of the first embodiment, except that the structure of the escape groove 125b of the present embodiment is different from that of the escape groove 125a of the first embodiment.

Fig. 6 is a schematic top view of a lower surface of a fingerprint chip according to a second embodiment of the present invention. As shown in fig. 5 and 6, the avoiding groove 125b is provided with an oblique angle 1251, the oblique angle 1251 is disposed at the glue inlet of the avoiding groove 125b and is distributed at two ends of the avoiding groove 125b, specifically, the oblique angles 1251 are symmetrically distributed, but not limited thereto, the oblique angle 1251 enlarges the glue inlet area of the avoiding groove 125b, which facilitates glue injection, and further improves efficiency, and the specific angle of the oblique angle 1251 can be freely selected according to actual conditions, preferably, the angle of the oblique angle 1251 is 45 °.

The working principle of the side fingerprint module 10b of this embodiment is the same as that of the side fingerprint module 10a of the first embodiment, and the specific description thereof refers to the working principle of the side fingerprint module 10a of the first embodiment, which is not further described herein.

Third embodiment

Fig. 7 is a schematic structural diagram of a side fingerprint module according to a third embodiment of the present invention. As shown in fig. 7, the structure of the side fingerprint module 10c of the present embodiment is substantially the same as that of the side fingerprint module 10b of the second embodiment, except that the structure of the escape groove 125c of the present embodiment is different from that of the escape groove 125b of the second embodiment.

Fig. 8 is a schematic top view of a lower surface of a fingerprint chip according to a third embodiment of the present invention. As shown in fig. 7 and 8, a plurality of the avoiding grooves 125c are provided, a part of the avoiding grooves 125c is located on one side of the first land 123, another part of the avoiding grooves 125c is located on the other side of the first land 123, the avoiding grooves 125c are arranged at intervals, and the avoiding grooves 125c are all in a strip shape, but not limited thereto.

Fourth embodiment

Fig. 9 is a schematic structural diagram of a side fingerprint module according to a fourth embodiment of the present invention. As shown in fig. 9, the structure of the side fingerprint module 10d of the present embodiment is substantially the same as that of the side fingerprint module 10c of the third embodiment, except that the structure of the circuit board 13b of the present embodiment is different from that of the circuit board 13a of the third embodiment.

Fig. 10 is a schematic top view of a first upper surface of a circuit board according to a fourth embodiment of the present invention. As shown in fig. 9 and 10, the circuit substrate 13b further includes an avoiding groove 125c, the avoiding groove 125c is disposed on the first upper surface 132, a part of the avoiding groove 125c is located on one side of the second land 131, another part of the avoiding groove 125c is located on the other side of the second land 131, the avoiding grooves 125c are disposed at intervals, and each avoiding groove 125c is in a strip shape, but not limited thereto. The avoiding grooves 125c on the fingerprint chip 12c and the circuit substrate 13b increase the filling amount of the adhesive and the covering area of the adhesive, and the adhesive can better wrap the first bonding pad 123 and the second bonding pad 131, so that the sealing protection performance of the first bonding pad 123 and the second bonding pad 131 is improved, the bonding force between the fingerprint chip 12c and the circuit substrate 13b is stronger, and the anti-pulling effect is greatly increased.

The utility model discloses a

side fingerprint module

10a, 10b, 10c, 10 d's

fingerprint chip

12a, 12b, 12c is including

dodging recess

125a, 125b, 125c, when beating to glue, some bonding glue will flow in

dodge recess

125a, 125b, in 125c, in order to form new glue coverage area,

dodge recess

125a, 125b, 125c has increased the packing volume of bonding glue and the area covered of bonding glue, bonding glue can wrap up the pad better, consequently, the sealed protective properties of pad has been improved, and make

fingerprint chip

12a, 12b, 12c and circuit substrate 13a, laminating force between 13b is stronger, greatly increased the anti-tensile effect of pulling out.

In this document, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms can be understood in a specific case to those of ordinary skill in the art.

As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including not only those elements listed, but also other elements not expressly listed.

The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the details of the above embodiments, and the technical concept of the present invention can be within the scope of the present invention, and can be modified to various simple variants, and these simple variants all belong to the protection scope of the present invention. The various features described in the foregoing detailed description may be combined in any suitable manner without departing from the scope of the invention. In order to avoid unnecessary repetition, the present invention does not separately describe various possible combinations.

Claims

1. The utility model provides a side fingerprint module, its characterized in that, including the fingerprint chip and with the circuit substrate of fingerprint chip laminating, the fingerprint chip with circuit substrate electric connection, the fingerprint chip includes the lower surface, circuit substrate includes first upper surface, the lower surface with first upper surface laminating forms laminating coverage area, the lower surface and/or form on the first upper surface and dodge the recess, follow circuit substrate thickness direction, dodge the recess at least partially with laminating coverage area overlaps.

2. The side fingerprint module of claim 1, wherein the fingerprint chip comprises the avoiding groove and a first pad, the avoiding groove and the first pad are both disposed on the lower surface, one side of the avoiding groove is close to the first pad, and the other side of the avoiding groove extends to an edge of the fingerprint chip.

3. The side fingerprint module of claim 2, wherein the relief groove is located on both sides of the first pad.

4. The side fingerprint module of claim 2 wherein said first pads are a plurality of pads, said first pads being spaced apart from each other.

5. The side fingerprint module of claim 1, wherein the relief groove is in the shape of a strip or an arc.

6. The side fingerprint module of claim 1, wherein the number of the avoiding grooves is plural, and the avoiding grooves are spaced apart from each other.

7. The side fingerprint module of claim 1, wherein the relief groove comprises a bevel, and the bevel is disposed at a glue inlet of the relief groove.

8. The side fingerprint module of claim 2, wherein the circuit substrate further comprises a second pad, the first pad is electrically connected to the second pad, and the relief groove is adjacent to the second pad.

9. The side fingerprint module of claim 1, further comprising an adhesive, wherein the fingerprint chip and the circuit substrate are shaped as a flat strip, the fingerprint chip has a cross section larger than the attachment coverage area, the lower surface is provided with the adhesive near an edge and forms a first glue area, the avoiding groove is provided with the adhesive and forms a second glue area, and the first glue area is communicated with the second glue area.

10. The side fingerprint module of claim 9, wherein the adhesive is disposed on the outer peripheral surface of the circuit substrate at least partially along the thickness direction of the circuit substrate to form a glue covered area.