CN212335195U - Semiconductor sequencing device - Google Patents

Abstract

The utility model discloses a semiconductor sequencing device belongs to gene sequencing technical field. The semiconductor sequencing device comprises: the converging block is provided with a first liquid inlet and a first liquid outlet; the chip assembly comprises a chip and a pressing block pressed on the chip, and a liquid inlet channel and a liquid outlet channel are arranged on the pressing block; the output end of the driving mechanism is connected with the confluence block, and the driving mechanism is used for driving the confluence block to be close to the chip assembly until the pressing block is pressed, so that the first liquid outlet of the confluence block is communicated with the liquid inlet channel of the pressing block, and the first liquid inlet of the confluence block is communicated with the liquid outlet channel of the pressing block; and a first sealing element is respectively arranged between the first liquid inlet and the liquid outlet channel and between the first liquid outlet and the liquid inlet channel. The utility model discloses a set up first sealing member and realize the good sealed between confluence piece and the briquetting.

Description

Semiconductor sequencing device

Technical Field

The utility model relates to a gene sequencing technical field especially relates to a semiconductor sequencing device.

Background

With the development of gene sequencing technology, the adoption of semiconductor technology to complete sequencing becomes a new research direction. Different from the traditional sequencing by adopting an optical principle, a DNA chain is fixed in a micropore of a semiconductor chip, a sequencing primer is extended under the action of polymerase along with the doping of a basic group, hydrogen ions are released, and the real-time interpretation of the basic group on a sequence to be sequenced is realized by detecting the hydrogen ions, so that the sequencing process is simpler, quicker and lower in cost.

The existing semiconductor sequencing process still needs manual sample loading to a chip on a sequencing platform, so that the sequencing efficiency is low, the sample loading precision is poor, the tightness of a liquid inlet part and a liquid outlet part of the chip is poor during testing, a reagent cannot effectively flow into micropores of the chip to complete testing, cleaning liquid cannot fully clean the chip or waste liquid cannot be timely discharged from the chip, mutual doping among the liquid occurs, and the accuracy of a final detection result is influenced.

Therefore, it is desirable to provide a semiconductor sequencing apparatus to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor sequencing device can realize the automation of appearance, accurate operation, fully seals the feed liquor department and the play liquid department of chip simultaneously, guarantees in liquid can effectively advance the chip, obtains accurate testing result.

In order to realize the purpose, the following technical scheme is provided:

a semiconductor sequencing device, comprising:

the converging block is provided with a first liquid inlet and a first liquid outlet;

the chip assembly comprises a chip and a pressing block pressed on the chip, and a liquid inlet channel and a liquid outlet channel are arranged on the pressing block;

the output end of the driving mechanism is connected with the confluence block, the driving mechanism is used for driving the confluence block to be close to the chip assembly until the pressing block is pressed, so that the first liquid outlet of the confluence block is communicated with the liquid inlet channel of the pressing block, the first liquid inlet of the confluence block is communicated with the liquid outlet channel of the pressing block, and then liquid can flow between the chip and the confluence block;

and a first sealing element is respectively arranged between the first liquid inlet and the liquid outlet channel and between the first liquid outlet and the liquid inlet channel.

Preferably, the pressing block is provided with two first sealing grooves, and the two first sealing elements are respectively arranged in one first sealing groove;

the liquid inlet channel and the liquid outlet channel penetrate through the pressing block to form a second liquid inlet and a second liquid outlet at the bottom of the corresponding first sealing groove.

Preferably, the driving mechanism comprises a frame, a driving motor and a screw nut pair, wherein the driving motor and the screw nut pair are arranged on the frame; the screw rod of the screw rod nut pair is connected to the output end of the driving motor, and the nut of the screw rod nut pair is connected with the confluence block through a first connecting frame.

Preferably, the semiconductor sequencing device further comprises a position detection mechanism, the position detection mechanism comprises a correlation type photoelectric switch and a light shielding plate, one of the correlation type photoelectric switch and the light shielding plate is arranged on the rack, the other one of the correlation type photoelectric switch and the light shielding plate is arranged on the first connecting rack, and when the light shielding plate moves relatively to a position between the transmitting end and the receiving end of the correlation type photoelectric switch, the correlation type photoelectric switch is triggered to generate a signal.

Preferably, the semiconductor sequencing device further comprises a guide mechanism, the guide mechanism comprises a guide hole formed in the rack and a guide rod arranged on the confluence block, the guide rod is arranged in the guide hole in a sliding mode, and the axial directions of the guide hole and the guide rod are consistent with the driving direction of the driving mechanism.

Preferably, the guide rod with be connected through bearing structure between the guiding hole, bearing structure is including locating bearing frame in the guiding hole with locate bearing in the bearing frame, the guide rod passes from top to bottom the bearing.

Preferably, a limiting plate is arranged at the top of the guide rod and can be abutted against the bearing seat so as to limit the displacement of the guide rod.

Preferably, the chip assembly further comprises a chip holder, the chip holder is sequentially communicated with a first groove and a second groove, and the chip is arranged in the second groove; a second sealing element is arranged between the chip and the pressing block;

the pressing block comprises a pressing block main body and an extension body protruding out of the pressing block main body, the pressing block main body is located in the first groove, and the extension body extends into the second groove; and a second sealing groove is formed in the bottom surface of the extension body, and the second sealing element is arranged in the second sealing groove.

Preferably, a limit step is arranged on the side wall of the second groove, and the extension body can abut against the limit step to limit the pressing distance of the pressing block.

Preferably, the chip assembly further comprises a circuit board arranged at the bottom of the chip holder, the chip is arranged to be in contact connection with the circuit board, and a third sealing element is arranged between the circuit board and the chip holder.

Compared with the prior art, the beneficial effects of the utility model are that:

the driving mechanism drives the confluence block to approach the chip assembly, and the first liquid inlet of the confluence block is communicated with the liquid inlet channel of the pressing block through the communication between the first liquid outlet of the confluence block and the liquid outlet channel of the pressing block, so that the liquid flows between the confluence block and the chip, the automatic and precise operation of the sample loading process is facilitated, and the testing efficiency is improved; simultaneously, a first sealing element is respectively arranged between the first liquid inlet and the liquid outlet channel and between the first liquid outlet and the liquid inlet channel, so that the first sealing element can be compressed when the pressing block is pressed by the confluence block, good sealing between the confluence block and the pressing block is realized, liquid can effectively enter and exit the chip, mutual doping between the liquid can not be leaked, and the accuracy of a test result is ensured.

Drawings

FIG. 1 is a schematic overall view of a semiconductor sequencing apparatus according to an embodiment of the present invention;

FIG. 2 is a rear view of a semiconductor sequencing device in an embodiment of the present invention;

FIG. 3 is an exploded view of a semiconductor sequencing device according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a junction block according to an embodiment of the present invention;

FIG. 5 is an exploded view of a chip module according to an embodiment of the present invention;

FIG. 6 is a schematic cross-sectional view of a chip assembly according to an embodiment of the invention;

fig. 7 is a schematic structural diagram of a pressing block at a first viewing angle according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram of a pressing block at a first viewing angle according to an embodiment of the present invention;

FIG. 9 is a schematic structural view of a chip holder according to an embodiment of the present invention;

fig. 10 is a second schematic cross-sectional view of a chip assembly according to an embodiment of the invention.

Reference numerals:

100-a semiconductor sequencing device;

10-a junction block; 20-a chip assembly; 30-a drive mechanism; 40-a first seal;

a-a liquid inlet channel; b-a liquid outlet channel;

11-a first liquid inlet; 12-a first liquid outlet; 13-an interface; 14-a pipe joint; 15-a guide bar; 16-a third link; 21-chip; 22-briquetting; 23-a chip holder; 24-a circuit board; 25-a second seal; 26-a third seal; 27-an electrode; 28-probe; 31-a frame; 32-a drive motor; 33-a screw rod; 34-a nut; 35-a first connecting frame;

151-limiting plate; 221-a second liquid inlet; 222-a second exit port; 223-a briquette body; 224-an extension; 231 — a first groove; 232-a second groove; 233-a third seal groove; 234 — a second via; 311-a pilot hole; 312-a bearing structure; 313-correlation type photoelectric switch; 314-a second connecting frame; 351-a light screen;

2231-a first seal groove; 2232-a first through hole; 2233-a receiving hole; 2241-a second seal groove; 2321-spacing step; 3121-a bearing seat; 3122-bearing.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description of the present invention and simplification of description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; either mechanically or electrically. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

Referring to fig. 1 to 3, the present embodiment provides a semiconductor sequencing apparatus, which specifically includes:

a manifold block 10, see fig. 4, on which a first inlet port 11 and a first outlet port 12 are provided;

the chip assembly 20, referring to fig. 5, fig. 6 and fig. 8, includes a chip 21 and a pressing block 22 pressed on the chip 21, wherein the pressing block 22 is provided with a liquid inlet channel a and a liquid outlet channel b;

the driving mechanism 30, referring to fig. 1, has an output end connected to the manifold block 10, and the driving mechanism 30 is configured to drive the manifold block 10 to approach the chip assembly 20 until the pressing block 22 is pressed, so that the first liquid outlet 12 of the manifold block 10 is communicated with the liquid inlet channel a of the pressing block 22, the first liquid inlet 11 of the manifold block 10 is communicated with the liquid outlet channel b of the pressing block 22, and further, liquid can flow between the chip 21 and the manifold block 10;

a first sealing element 40 is respectively arranged between the first liquid inlet 11 and the liquid outlet channel b and between the first liquid outlet 12 and the liquid inlet channel a.

The semiconductor sequencing device 100 provided by this embodiment drives the confluence block 10 to approach the chip assembly 20, and through the communication between the first liquid outlet 12 and the liquid inlet channel a and the communication between the first liquid inlet 11 and the liquid outlet channel b, the flow of liquid between the confluence block 10 and the chip 21 is realized, which is beneficial to realizing the automatic and precise operation of the sample loading process and improving the testing efficiency; meanwhile, the first sealing elements 40 are respectively arranged between the first liquid inlet 11 and the liquid outlet channel b and between the first liquid outlet 12 and the liquid inlet channel a, so that when the pressing block 22 is pressed on the confluence block 10, the first sealing elements 40 can be pressed, good sealing between the confluence block 10 and the pressing block 22 is realized, liquid can effectively enter and exit the chip 21, mutual doping between the liquid can not occur, and the accuracy of a test result is ensured.

Referring to fig. 3 and 4, a plurality of ports 13 are further disposed on the side wall of the manifold block 10, the ports 13 are communicated with the first liquid inlet 11 and the first liquid outlet 12 through liquid paths, each port 13 is provided with a pipe joint 14 and a corresponding valve, so that a reagent or a cleaning liquid accurately flows into the manifold block 10 from the corresponding port 13 and then flows to the chip 21 through the first liquid outlet 12, or waste liquid on the chip 21 flows into the manifold block 10 from the first liquid inlet 11 and flows into a waste liquid collecting container from the corresponding port 13. Optionally, 10 interfaces 13 are provided on the side wall of the busbar block 10.

Specifically, the driving mechanism 30 is used to drive the manifold block 10 toward or away from the chip assembly 20 in the first direction. Optionally, the first direction is a vertical direction, and the first liquid inlet 11 and the first liquid outlet 12 are disposed on the bottom surface of the manifold block 10; referring to fig. 6 and 8, the liquid inlet passage a and the liquid outlet passage b penetrate the pressing block 22 in the vertical direction to enable liquid to flow from the confluence block 10 into the chip 21. Further, referring to fig. 7, the liquid inlet channel a is formed with a second liquid inlet 221 on the top surface of the compact 22, and the liquid outlet channel b is formed with a second liquid outlet 222 on the top surface of the compact 22.

Referring to fig. 1-3, the driving mechanism 30 includes a frame 31 and a driving motor 32 disposed on the frame 31, the driving motor 32 is connected to the bus bar 10 through a screw-nut pair, so as to drive the bus bar 10 along a first direction; specifically, a screw 33 of the screw-nut pair is connected to an output end of the driving motor 32, a nut 34 of the screw-nut pair is connected with the manifold block 10, the driving motor 32 drives the screw 33 to rotate, and under the threaded fit of the screw 33 and the nut 34, the rotation torque of the driving motor 32 is converted into the linear motion of the manifold block 10. Alternatively, the bus bar 10 and the nut 34 are connected by a first connecting frame 35, the nut 34 is disposed on the top of the first connecting frame 35, the bus bar 10 is disposed on the bottom of the first connecting frame 35, and the bus bar 10 follows the first connecting frame 35 to complete linear movement. Of course, in some other embodiments, the driving mechanism 30 may be selected from other linear driving members such as a linear cylinder and a linear motor, as long as the linear movement of the manifold block 10 can be realized; the screw-nut pair has high transmission efficiency, high positioning precision and repeated positioning precision and long service life, so that the screw-nut pair can realize the accurate control of the linear movement of the manifold block 10 and can also ensure the good repeatability of the movement of the manifold block 10, and further the consistent pressure when the manifold block is pressed every time in the embodiment. Optionally, the frame 31 is an inverted U-shaped structure, and includes a top plate and side plates disposed at two ends of the top plate along the second direction, and the driving motor 32 is disposed on the top plate of the frame 31. The first direction is perpendicular to the second direction, and the second direction is a horizontal direction.

Further, the semiconductor sequencing apparatus 100 further includes a position detection mechanism for detecting the movement position of the manifold block 10. Alternatively, referring to fig. 2 and 3, the position detection mechanism includes a correlation type photoelectric switch 313 and a light shielding plate 351, one of which is disposed on the frame 31, and the other is disposed on the first connecting frame 35, when the light shielding plate 351 can move relatively to between the transmitting end and the receiving end of the correlation type photoelectric switch 313, the correlation type photoelectric switch 313 can be triggered to generate a signal, so that the system can know the moving position of the junction block 10 conveniently. In this embodiment, the opposite-type photoelectric switch 313 is disposed on the top plate of the frame 31 via the second connecting frame 314, and the light shielding plate 351 is disposed on the first connecting frame 35. In specific implementation, two position detection mechanisms may be provided, and are respectively used to detect the extreme positions in the uplink direction and the downlink direction of the manifold block 10, so as to avoid excessive deviation.

The semiconductor sequencing apparatus 100 further includes a guide mechanism for achieving precision in moving the manifold block 10 in the first direction. Alternatively, still referring to fig. 2 and 3, the guiding mechanism includes a guiding hole 311 formed in the frame 31 and a guiding rod 15 formed on the manifold block 10, the guiding rod 15 is slidably disposed in the guiding hole 311, and the axial directions of the guiding hole 311 and the guiding rod 15 are both consistent with the first direction, so that the manifold block 10 can be moved in the first direction during the moving process. Further, two guide mechanisms are provided in the second direction and symmetrically distributed with respect to the driving motor 32 to achieve uniform guiding of the bus bar 10. Further, a third connecting frame 16 is arranged on the bus bar 10, and the guide rods 15 of the two guide mechanisms are simultaneously connected to the third connecting frame 16, so that the movement consistency of the bus bar 10 is ensured. Optionally, the guide rod 15 is connected with the guide hole 311 through a bearing structure 312 to reduce the resistance of the guide rod 15 to move in the vertical direction, so as to ensure that the manifold block 10 slides smoothly; alternatively, the bearing structure 312 includes a bearing seat 3121 disposed in the guide hole 311 and a bearing 3122 disposed in the bearing seat 3121, and the guide rod 15 passes through the bearing 3122 from top to bottom. Referring to fig. 2, in order to prevent the guide rod 15 from being disengaged from the guide hole 311, a stopper plate 151 is provided at the top of the guide rod 15, and the stopper plate 151 can abut against the bearing housing 3121 to restrict downward displacement of the guide rod 15.

Further, referring to fig. 7, a first sealing groove 2231 is disposed at the top of the pressing block 22, and the first sealing element 40 is disposed in the first sealing groove 2231, so as to ensure that the first sealing element 40 is stably placed without displacement, thereby ensuring a corresponding sealing effect. In this embodiment, two first sealing grooves 2231 are provided, and two sealing members are respectively provided in one first sealing groove 2231; the second liquid inlet 221 and the second liquid outlet 222 are formed at the bottom of the corresponding first sealing groove 2231.

Referring to fig. 5, 6 and 9, the chip assembly 20 further includes a chip holder 23, the chip holder 23 is provided with a first groove 231 and a second groove 232 which are sequentially communicated from top to bottom, the chip 21 is disposed in the second groove 232, and the press block 22 is disposed in the first groove 231; further, a second sealing member 25 is arranged between the chip 21 and the pressing block 22, the pressing block 22 can further press the second sealing member 25, and liquid flowing onto the chip 21 is prevented from leaking out of a gap between the chip 21 and the pressing block 22 and can effectively reach a detection area of the chip 21. Optionally, referring to fig. 6 and 8, a second sealing groove 2241 is disposed on a bottom surface of the pressing block 22, and the second sealing element 25 is disposed in the second sealing groove 2241, so as to facilitate stable placement of the second sealing element 25. Further, the pressing block 22 comprises a pressing block main body 223 and an extension body 224 protruding from the pressing block main body 223, the pressing block main body 223 is located in the first groove 231, and the extension body 224 extends into the second groove 232, so that the pressing block 22 is close to the chip 21 as much as possible, the gap between the chip 21 and the pressing block 22 is reduced, and liquid leakage is avoided. Specifically, referring to fig. 7, a first seal groove 2231 is provided at the top of the compact body 223. A second seal groove 2241 is provided on the bottom surface of the extension body 224. Further, referring to fig. 6 and 9, a limiting step 2321 is arranged on the side wall of the second groove 232, and the extension 224 of the pressing block 22 can abut against the limiting step 2321, so that the pressing distance of the pressing block 22 is limited, and the pressing block 22 is prevented from being pressed down by too much force to cause pressure loss to the chip 21; when the pressing block 22 abuts against the limiting step 2321, the pressing block 22 runs in place, and the sealing element can be fully extruded to meet the sealing requirement.

With continued reference to fig. 5 and 6, the chip assembly 20 further includes a circuit board 24 disposed at the bottom of the chip holder 23, and the chip 21 is disposed in the second recess 232 and is in contact connection with the circuit board 24. The chip assembly 20 further includes electrodes 27 and probes 28, the electrodes 27 are disposed on the chip 21 for supplying a voltage to the solution in the wells of the chip 21, and the probes 28 are connected to the circuit board 24 and external electrical components for supplying power to the chip 21 and transmitting electrical signals. Further, referring to fig. 10, a first through hole 2232 is provided on the compact 22, and the electrode 27 protrudes from the first through hole 2232 to the outside; referring to fig. 5, 8, and 10, the second through hole 234 is formed in the chip holder 23, the accommodating hole 2233 is formed in the press block 22, the accommodating hole 2233 is communicated with the first through hole 2232, and the probe 28 extends from the second through hole 234 into the accommodating hole 2233 and further extends from the first through hole 2232 to the outside; alternatively, the electrode 27 has an L-shaped structure, and the first through-hole 2232 has an L-shaped structure, so that the first through-hole 2232 does not interfere with the liquid inlet channel a and the liquid outlet channel b of the compact 22.

Further, referring to fig. 5 and 6, a third sealing member 26 is disposed between the circuit board 24 and the chip carrier 23 to further improve the sealing of the chip 21 and prevent liquid from leaking from the bottom of the chip 21 or from entering the chip 21 from the bottom of the chip carrier 23. Optionally, a third sealing groove 233 is disposed at the bottom of the chip holder 23, and the third sealing member 26 is disposed in the third sealing groove 233.

In this embodiment, the first sealing element 40, the second sealing element 25 and the third sealing element 26 can be selected as sealing rings, and are made of elastic materials to achieve better sealing effect. Furthermore, the semiconductor sequencing apparatus 100 of the present embodiment further includes an apparatus main body, and the frame 31 of the driving mechanism 30 and the chip holder 23 of the chip module 20 are fixed to the apparatus main body, which facilitates the integrated and automated operation of the semiconductor sequencing apparatus 100.

It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

Claims (10)

1. A semiconductor sequencing apparatus, comprising:

the converging block (10) is provided with a first liquid inlet (11) and a first liquid outlet (12);

the chip assembly (20) comprises a chip (21) and a pressing block (22) pressed on the chip (21), wherein a liquid inlet channel (a) and a liquid outlet channel (b) are arranged on the pressing block (22);

the output end of the driving mechanism (30) is connected with the confluence block (10), the driving mechanism (30) is used for driving the confluence block (10) to be close to the chip assembly (20) until the pressing block (22) is pressed, so that the first liquid outlet (12) of the confluence block (10) is communicated with the liquid inlet channel (a) of the pressing block (22), the first liquid inlet (11) of the confluence block (10) is communicated with the liquid outlet channel (b) of the pressing block (22), and then liquid can flow between the chip (21) and the confluence block (10);

and a first sealing element (40) is respectively arranged between the first liquid inlet (11) and the liquid outlet channel (b) and between the first liquid outlet (12) and the liquid inlet channel (a).

2. The semiconductor sequencing apparatus of claim 1, wherein two first sealing grooves (2231) are disposed on the compact (22), and two first seals (40) are disposed in each of the first sealing grooves (2231);

the liquid inlet channel (a) and the liquid outlet channel (b) both penetrate through the pressing block (22) to form a second liquid inlet (221) and a second liquid outlet (222) at the bottom of the corresponding first sealing groove (2231).

3. The semiconductor sequencing apparatus of claim 1, wherein the driving mechanism (30) comprises a frame (31), a driving motor (32) arranged on the frame (31), and a screw nut pair; and a screw rod (33) of the screw rod nut pair is connected to the output end of the driving motor (32), and a nut (34) of the screw rod nut pair is connected with the confluence block (10) through a first connecting frame (35).

4. The semiconductor sequencing apparatus of claim 3, further comprising a position detection mechanism, wherein the position detection mechanism comprises a correlation photoelectric switch (314) and a light shielding plate (351), one of the correlation photoelectric switch (314) and the light shielding plate (351) is arranged on the rack (31), the other one of the correlation photoelectric switch (314) and the light shielding plate (351) is arranged on the first connecting rack (35), and when the light shielding plate (351) moves relatively to a position between the transmitting end and the receiving end of the correlation photoelectric switch (314), the correlation photoelectric switch (314) is triggered to generate a signal.

5. The semiconductor sequencing device according to claim 3, further comprising a guide mechanism, wherein the guide mechanism comprises a guide hole (311) formed in the frame (31) and a guide rod (15) formed on the manifold block (10), the guide rod (15) is slidably disposed in the guide hole (311), and the axial directions of the guide hole (311) and the guide rod (15) are consistent with the driving direction of the driving mechanism (30).

6. The semiconductor sequencing device of claim 5, wherein the guide rod (15) is connected with the guide hole (311) through a bearing structure (312), the bearing structure (312) comprises a bearing seat (3121) arranged in the guide hole (311) and a bearing (3122) arranged in the bearing seat (3121), and the guide rod (15) penetrates through the bearing (3122) from top to bottom.

7. Semiconductor sequencing device according to claim 6, characterized in that a limiting plate (151) is provided on top of the guide rod (15), said limiting plate (151) being capable of abutting against the bearing seat (3121) to limit the displacement of the guide rod (15).

8. The semiconductor sequencing device of claim 1, wherein the chip assembly (20) further comprises a chip holder (23), the chip holder (23) is provided with a first groove (231) and a second groove (232) which are communicated with each other in sequence, and the chip (21) is arranged in the second groove (232); a second sealing element (25) is arranged between the chip (21) and the pressing block (22);

the pressing block (22) comprises a pressing block main body (223) and an extension body (224) protruding out of the pressing block main body (223), the pressing block main body (223) is located in the first groove (231), and the extension body (224) extends into the second groove (232); set up second seal groove (2241) on the bottom surface of extension (224), second sealing member (25) are located in second seal groove (2241).

9. The semiconductor sequencing device of claim 8, wherein a limit step (2321) is arranged on a side wall of the second groove (232), and the extension body (224) can abut against the limit step (2321) to limit a pressing distance of the pressing block (22).

10. Semiconductor sequencing apparatus according to claim 8, wherein the chip assembly (20) further comprises a circuit board (24) disposed at the bottom of the chip holder (23), the chip (21) being in contact with the circuit board (24), a third seal (26) being disposed between the circuit board (24) and the chip holder (23).

Images