CN212324329U - Bluetooth earphone - Google Patents
Bluetooth earphone Download PDFInfo
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- CN212324329U CN212324329U CN202021404041.4U CN202021404041U CN212324329U CN 212324329 U CN212324329 U CN 212324329U CN 202021404041 U CN202021404041 U CN 202021404041U CN 212324329 U CN212324329 U CN 212324329U
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Abstract
The utility model relates to a bluetooth headset, including earphone mainboard and antenna module, the earphone mainboard is provided with mainboard ground, and the antenna module includes: a ceramic antenna formed with a capacitance and provided with a distributed inductance, the capacitance and the distributed inductance forming an LC oscillation circuit; one end of the first grounding wire is connected with the grounding end of the ceramic antenna, and the other end of the first grounding wire is connected with the mainboard ground; a second ground line, one end of which is connected to the ground terminal of the ceramic antenna and the other end of which is connected to the main board ground, wherein the extending direction of the first ground line is different from the extending direction of the second ground line; a matching network connected to a feed end of the ceramic antenna. The utility model is used for improve antenna performance among the current bluetooth headset.
Description
Technical Field
The utility model relates to an electroacoustic equipment technical field, concretely relates to bluetooth headset.
Background
An antenna is an essential component of a communication device, and is an important wireless device for transmitting and receiving electromagnetic waves when the communication device communicates with a base station. When the electromagnetic wave transmitting antenna is transmitted by communication equipment, the antenna is responsible for converting an electric signal into electromagnetic wave to radiate out, and simultaneously can convert a received electromagnetic wave into an electric signal in time and transmit the electric signal to a radio frequency signal processing module in the communication equipment.
The Bluetooth headset is the mainstream development direction of the existing wearable products, in particular to a TWS (True Wireless Stereo) Bluetooth headset, the product is small in size, multifunctional and convenient to carry, more and more people are used to call and listen to music by using the TWS headset, therefore, the requirement of a user on the experience of the headset is higher and higher, the requirement is mainly expressed in tone quality and music listening continuity, the music continuity and the antenna performance have a part of relevance, but the requirement is limited by the miniaturization size of the Bluetooth headset, and the good antenna design difficulty is large.
Disclosure of Invention
The utility model provides a bluetooth headset for improve antenna performance among the current bluetooth headset.
In order to solve the technical problem, the utility model provides a following technical scheme solves:
the application relates to a bluetooth headset, including the earphone mainboard, its characterized in that, the earphone mainboard is provided with mainboard ground, bluetooth headset still includes: an antenna assembly, comprising: a ceramic antenna formed with a capacitance and provided with a distributed inductance, the capacitance and the distributed inductance forming an LC oscillation circuit; one end of the first grounding wire is connected with the grounding end of the ceramic antenna, and the other end of the first grounding wire is connected with the mainboard ground; a second ground line, one end of which is connected to the ground terminal of the ceramic antenna and the other end of which is connected to the main board ground, wherein the extending direction of the first ground line is different from the extending direction of the second ground line; a matching network connected to a feed end of the ceramic antenna.
In some embodiments of the present application, the antenna assembly further comprises: a clearance zone disposed at a periphery of the ceramic antenna.
In some embodiments of the present application, the motherboard includes a first portion and a second portion connected to each other; a first part of the main board ground is located on the antenna assembly side, and one end of the first ground line is connected to the first part; the bluetooth headset further includes: and one end of the FPC board and one end of the second grounding wire are respectively connected with the second part of the main board ground, and the FPC board is positioned on the other side of the antenna component.
In some embodiments of the present application, the headset main board further comprises: the main control board, the first part of the said main board ground is formed in the periphery of the said main control board, and the said main control board and the said first part form the first area; the first region is located on one side of the antenna assembly; the second portion of the main ground is located at the top or bottom of the antenna assembly.
In some embodiments of the present application, the first region is a rectangular region, and a length of the rectangular region is equal to a projection length of the FPC board in a direction parallel to a direction in which the length of the rectangular region is located.
In some embodiments of the present application, a length of the rectangular region and a projected length of the FPC board in the length direction are both equal to a quarter wavelength.
Compared with the prior art, the utility model discloses a bluetooth headset's advantage and beneficial effect are:
utilize the inside equivalent electric capacity of ceramic antenna and the distributed inductance who sets up, form LC tank circuit, this tank circuit is connected with mainboard ground respectively through first earth connection and second earth connection, form the potential difference, produce the outside radiant energy of vibration electromagnetic wave radiation signal, and the extending direction of first earth connection is opposite with the extending direction of second earth connection, the radiating area of ceramic antenna has been improved, promote the radiation performance of antenna, and ceramic antenna is a miniaturized antenna who is suitable for the bluetooth device to use, accord with bluetooth headset's miniaturized volume.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the embodiments of the present invention or the description of the prior art will be briefly described below, and it is obvious that the drawings described below are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a structural diagram of an embodiment of the bluetooth headset of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In order to achieve both the miniaturization of the bluetooth headset and the good antenna performance, as shown in fig. 1, the present embodiment relates to a bluetooth headset 10, which includes a headset main board and an antenna assembly, where the antenna assembly includes a ceramic antenna 4, a first ground line 3, a second ground line 5, and a matching network 6. All of the components in the bluetooth headset 10 may be carried by a PCB board (not shown).
The earphone main board comprises a main control board 1 and a main board ground 2, wherein the main board ground 2 comprises a first part A and a second part B which are connected with each other in the embodiment; the main control board 11 is selected as a chip, and the first portion a is formed at the outer circumference of the main control board 1.
A first portion a of main board ground 2 is located on one side (e.g., the left side) of the antenna assembly and a second portion B of main board ground 2 is located on the bottom, top, or other side (e.g., the right side) of the antenna assembly.
A capacitor can be formed in the ceramic antenna 4, and a distributed inductor is arranged on the ceramic antenna 4, and the capacitor and the distributed inductor form an LC oscillating circuit.
One end of the first ground line 3 is connected to the ground terminal of the ceramic antenna 4, and the other end is connected to the main board ground 2, specifically, in the present embodiment, the other end of the first ground line 3 is connected to the first portion a of the main board ground 2, that is, the extending direction of the first ground line 3 is from the ceramic antenna 4 to the left side.
One end of the second ground line 5 is connected to the ground terminal of the ceramic antenna 4, and the other end is connected to the main board ground 2, specifically, in the present embodiment, the other end of the second ground line 5 is connected to the second portion B of the main board ground 2, that is, the second ground line 5 extends from the ceramic antenna 4 to the top, bottom or right side thereof.
The feed end of the ceramic antenna 4 is connected to a matching network 6 through a signal line 8, which is used to adjust the impedance to match the frequency band of the ceramic antenna 4.
The LC oscillating circuit forms a potential difference through the first grounding wire 3 and the second grounding wire 5 to generate an oscillating electromagnetic wave radiation signal and radiate energy outwards, and the first grounding wire 3 and the second grounding wire 5 are respectively connected with the main board ground 2 towards different directions, so that the radiation area is increased, and the radiation performance of the ceramic antenna 3 is improved.
In addition, for the antenna component, a clearance area is formed around the ceramic antenna 3, which is beneficial to improving the radiation efficiency of the ceramic antenna 3.
In this embodiment, the bluetooth headset 10 further includes an FPC board 7, which is disposed at the other end (e.g., right side) of the antenna assembly, at which time the second portion B of the main board ground 2 is disposed on top of the antenna assembly.
The FPC board 7 is connected to the main board ground 2, and specifically, in the present embodiment, one end of the FPC board 7 is connected to the second portion B of the main board ground 2, that is, the second ground line 5 communicates with the FPC board 7 through the second portion B of the main board ground 2, which further increases the radiation area.
With continued reference to fig. 1, the main control board 1 and the first portion a of the main board ground 2 form a first area, which is entirely located on the left side of the antenna assembly, the first area being a rectangular area.
In order to achieve better antenna radiation efficiency, in the present embodiment, as shown in fig. 1, the length d1 of the first region is equal to the projection length d2 of the FPC board 7 in the direction parallel to the direction in which the length of the first region is located. Preferably, d1= d2 and is equal to a quarter wavelength, the wavelength corresponding to a frequency of 2.4 GHz.
This embodiment increases the radiation area through at ceramic antenna 4 and first earth connection 3 and second earth connection 5, promotes the antenna radiation performance, and ceramic antenna 4 is small, more is suitable for using in the miniaturized bluetooth headset, and cooperates and adjusts matching network 6, realizes ceramic antenna 4's debugging matching.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (6)
1. The utility model provides a bluetooth headset, includes the earphone mainboard, its characterized in that, the earphone mainboard is provided with mainboard ground, bluetooth headset still includes:
an antenna assembly, comprising:
a ceramic antenna formed with a capacitance and provided with a distributed inductance, the capacitance and the distributed inductance forming an LC oscillation circuit;
one end of the first grounding wire is connected with the grounding end of the ceramic antenna, and the other end of the first grounding wire is connected with the mainboard ground;
a second ground line, one end of which is connected to the ground terminal of the ceramic antenna and the other end of which is connected to the main board ground, wherein the extending direction of the first ground line is different from the extending direction of the second ground line;
a matching network connected to a feed end of the ceramic antenna.
2. The bluetooth headset of claim 1, wherein the antenna assembly further comprises:
a clearance zone disposed at a periphery of the ceramic antenna.
3. The bluetooth headset of claim 1, wherein the motherboard includes a first portion and a second portion connected to each other;
a first part of the main board ground is located on the antenna assembly side, and one end of the first ground line is connected to the first part;
the bluetooth headset further includes:
and one end of the FPC board and one end of the second grounding wire are respectively connected with the second part of the main board ground, and the FPC board is positioned on the other side of the antenna component.
4. The bluetooth headset of claim 3, wherein the headset motherboard further comprises:
the main control board, the first part of the said main board ground is formed in the periphery of the said main control board, and the said main control board and the said first part form the first area;
the first region is located on one side of the antenna assembly;
the second portion of the main ground is located at the top or bottom of the antenna assembly.
5. The Bluetooth headset of claim 4, wherein the first area is a rectangular area, and the length of the rectangular area is equal to the projection length of the FPC board in the length direction parallel to the direction of the length of the rectangular area.
6. The bluetooth headset according to claim 5, wherein the length of the rectangular region and the projected length of the FPC board in the length direction are each equal to a quarter wavelength.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021404041.4U CN212324329U (en) | 2020-07-16 | 2020-07-16 | Bluetooth earphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021404041.4U CN212324329U (en) | 2020-07-16 | 2020-07-16 | Bluetooth earphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212324329U true CN212324329U (en) | 2021-01-08 |
Family
ID=74034580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021404041.4U Active CN212324329U (en) | 2020-07-16 | 2020-07-16 | Bluetooth earphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212324329U (en) |
-
2020
- 2020-07-16 CN CN202021404041.4U patent/CN212324329U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221128 Address after: 266104 No. 500, Songling Road, Laoshan District, Qingdao, Shandong Patentee after: GOERTEK TECHNOLOGY Co.,Ltd. Address before: 261031 north of Yuqing street, east of Dongming Road, high tech Zone, Weifang City, Shandong Province (Room 502, Geer electronics office building) Patentee before: GoerTek Optical Technology Co.,Ltd. |