CN212324216U

CN212324216U - Electronic device

Info

Publication number: CN212324216U
Application number: CN202021322983.8U
Authority: CN
Inventors: 张宪栋; 彭伟
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2020-07-07
Filing date: 2020-07-07
Publication date: 2021-01-08
Anticipated expiration: 2030-07-07

Abstract

The embodiment of the application provides electronic equipment, which comprises a main board support, a camera supporting component and a heat insulation layer. The camera supporting assembly is at least partially arranged on the main board support, a heat insulation layer is arranged between the camera supporting assembly and the main board support, and the heat insulation layer can effectively prevent heat generated by a main board of the electronic equipment from being transferred to the camera supporting assembly through the main board support. The electronic equipment that this application embodiment provided through camera supporting component with set up between the mainboard support the insulating layer, the heat process that can avoid electronic equipment's mainboard to produce the mainboard support to the transmission of camera supporting component has guaranteed electronic equipment's normal stable shooting, has improved user's shooting experience.

Description

Electronic device

Technical Field

The application relates to the technical field of communication equipment, in particular to electronic equipment.

Background

In recent years, with the continuous development of communication technology, intelligent electronic devices have experienced a rapid development. User requirements for the performance of electronic devices are gradually increasing, and more electronic devices have diversified functions and high processing speed.

Along with the increase of electronic equipment function and processing speed, electronic equipment's calorific capacity is also bigger and bigger, and especially it is most serious with the inside mainboard of electronic equipment generates heat, and the support of mainboard generally chooses for use metal material, and the heat that the mainboard produced can transmit to the camera through the support rapidly, leads to the camera to decorate the circle and generate heat, influences user experience.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides electronic equipment to solve the problem that a camera shooting assembly of the existing electronic equipment is overheated.

In order to solve the above problems, the following technical solutions are adopted in the present application:

in a first aspect, an embodiment of the present application provides an electronic device, including:

a main board support;

the camera supporting assembly is at least partially arranged on the main board bracket;

a heat insulation layer is arranged between the camera supporting component and the main board bracket.

The technical scheme adopted by the embodiment of the application can achieve the following beneficial effects:

the embodiment of the application provides electronic equipment, which comprises a main board support, a camera supporting component and a heat insulation layer. The camera supporting component is at least partially arranged on the main board support, and a heat insulation layer is arranged between the camera supporting component and the main board support. According to the electronic equipment provided by the embodiment of the application, the thermal insulation layer is arranged between the camera supporting component and the main board support, so that heat generated by a main board of the electronic equipment can be prevented from passing through the main board support to the camera supporting component.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a schematic partial split structure diagram of an electronic device according to an embodiment of the present disclosure;

fig. 2 is a schematic partial-split structure diagram of another electronic device according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a main board bracket and a thermal insulation layer of an electronic device according to an embodiment of the present disclosure;

fig. 4 is a cross-sectional view of a main board bracket and camera support assembly mounting structure of an electronic device according to an embodiment of the present disclosure;

FIG. 5 is an enlarged view of a portion of FIG. 4;

fig. 6 is a schematic structural diagram of a thermal insulation layer of an electronic device according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of a camera support assembly and a thermal insulation layer of another electronic device according to an embodiment of the present disclosure;

fig. 8 is a cross-sectional view of a motherboard bracket and camera support assembly mounting structure of another electronic device according to an embodiment of the present application;

FIG. 9 is an enlarged view of a portion of FIG. 8;

fig. 10 is a schematic structural diagram of a thermal insulation layer of another electronic device according to an embodiment of the present disclosure;

fig. 11 is a schematic structural diagram illustrating a camera support assembly and a thermal insulation layer of another electronic device according to an embodiment of the present application;

fig. 12 is a cross-sectional view of a motherboard bracket and camera support assembly mounting structure of another electronic device according to an embodiment of the present application;

FIG. 13 is an enlarged view of a portion of FIG. 12;

fig. 14 is a schematic structural diagram of a thermal insulation layer of another electronic device according to an embodiment of the present application.

Description of reference numerals:

1-a main board support; 2-a camera support assembly; 3-a heat insulation layer; 31-through hole.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

Technical solutions disclosed in the embodiments of the present application are described in detail below with reference to the accompanying drawings.

Referring to fig. 1 to 14, an embodiment of the present application provides an electronic device, including:

mainboard support 1, camera supporting component 2 and insulating layer 3.

Mainboard support 1 can adopt metal material to make, mainboard support 1 can provide the fine support of electronic equipment's mainboard prevents that the mainboard from taking place to rock, can avoid other subassemblies to the extrusion of mainboard moreover. The camera supporting component 2 is at least partially arranged on the main board support 1, specifically, one side or part of the camera supporting component 2 is arranged on the main board support 1, or the camera supporting component 2 is integrally arranged on the main board support 1, the camera supporting component 2 specifically can be a camera decorating ring or a camera shell, and in order to play a good role in supporting and protecting a camera, the camera supporting component 2 can also be made of a metal material; since the motherboard of the electronic device generates high heat during operation, the heat is transferred to the surrounding components through the motherboard bracket 1, for example, the heat is transferred to the camera supporting component 2, which may cause the temperature of the camera to be too high, and seriously affect the shooting effect and experience of the electronic device. Therefore, the heat insulation layer 3 is arranged between the camera supporting component 2 and the main board support 1, so that heat generated by the main board can be effectively prevented from being transferred to the camera supporting component 2 through the main board support 1.

The electronic equipment that this application embodiment provided through camera supporting component 2 with set up between the mainboard support 1 insulating layer 3 can avoid the heat process that electronic equipment's mainboard produced mainboard support 1 to camera supporting component 2 transmits, has guaranteed electronic equipment's normal shooting, has improved user's shooting experience.

In addition, the heat insulation layer 3 can also be arranged between other components close to the main board support 1 and the main board support 1, for example, a sound production component and the like, so that the components near the main board support 1 can be effectively prevented from being overheated, and the normal operation of the electronic equipment is ensured.

Optionally, the thermal conductivity of the thermal insulation layer 3 is less than 0.2W/m.k.

Specifically, materials with a thermal conductivity lower than 0.2W/m.k are generally called low thermal conductivity materials, such as resin materials like PU, PP, PMMA, or PET (Polyethylene terephthalate), which can perform a good thermal insulation or heat preservation function. The heat insulation layer 3 can be made of the resin material with good heat insulation effect, and the heat insulation layer 3 can be made of a PET (polyethylene terephthalate) sheet, wherein the PET sheet can be specifically made of a PET material, and the PET material can be APET, RPET and PETG. The PET material still has excellent physical and mechanical properties within a wide temperature range, the long-term use temperature can reach 120 ℃, the electrical insulation property is excellent, even under high temperature and high frequency, the electrical property, the creep resistance, the fatigue resistance, the friction resistance and the dimensional stability are good, the heat conductivity coefficient of the PET material is less than 0.19W/m.K, and the PET material has excellent heat insulation and heat preservation effects.

Optionally, referring to fig. 1 and 6, the thermal insulation layer 3 is provided with a plurality of through holes 31. Specifically, the thermal insulation layer 3 includes a thermal insulation main body layer provided with a thermal insulation material and the through hole 31 provided on the thermal insulation main body layer, the thermal insulation main body layer physically isolates the main board support 1 from the camera support assembly 2, and the lower thermal conductivity of the thermal insulation layer 3 can effectively prevent heat generated by the main board from being transferred to the camera support assembly 2 through the main board support 1. In addition, the through holes 31 may be uniformly distributed on the thermal insulation layer 3, specifically, the through holes 31 may be uniformly arranged on the thermal insulation main body layer, and the arrangement of the through holes 31 may reduce the weight of the thermal insulation layer 3 on one hand, and may utilize the air in the through holes 31 for thermal insulation on the other hand, and the air also has a lower thermal conductivity. Through-hole 31 with the cooperation on thermal-insulated main part layer can be avoided mainboard support 1 with under the prerequisite of camera supporting component 2 contact, play fine thermal-insulated effect.

Optionally, referring to fig. 3 to 5, the thermal insulation layer 3 is adhered to the surface of the main board bracket 1 close to the camera support assembly 2.

Specifically, referring to fig. 4, the lower end of the right side wall of the camera supporting component 2 is close to the main board support 1, the surface area of the main board support 1 is far larger than the area of the lower end surface of the right side wall of the camera supporting component 2, the thermal insulation layer 3 is bonded to the surface of the main board support 1 close to the camera supporting component 2, the area of the thermal insulation layer 3 can be set to be larger than the area of the lower end surface of the right side wall of the camera supporting component 2, so that the lower end surface of the right side wall of the camera supporting component 2 can be well separated from the main board support 1, and the temperature of the camera supporting component 2 is guaranteed to be within a normal use range.

Optionally, referring to fig. 7 to 13, the thermal insulation layer 3 is adhered to the end of the camera support assembly 2 close to the main board bracket 1.

Specifically, the tip of camera supporting component 2 is close to the surface setting of mainboard support 1, and the terminal surface area of 2 tip of camera supporting component is less than far away the surface area of mainboard support 1, will insulating layer 3 bond in camera supporting component 2 is close to the tip of mainboard support 1 can be guaranteeing mainboard support 1 with on the basis of the thermal-insulated effect between the camera supporting component 2, reduce the use amount of insulating layer 3. In addition, the area of the heat insulating layer 3 may be set larger than the area of the end surface of the end portion, for example, the heat insulating layer 3 covers the end surface and the side surface of the end portion, which may further improve the heat insulating efficiency.

Optionally, the cross-sectional shape of the thermal insulation layer 3 is L-shaped, T-shaped, U-shaped, or O-shaped.

The cross-sectional shape of the thermal insulation layer 3 can be designed according to the end structure of the camera supporting component 2 close to the main board bracket 1. Specifically, referring to fig. 7, 8, 9 and 10, the cross-sectional shape of the thermal insulation layer 3 is L-shaped, one side of the thermal insulation layer 3 is bonded to the end surface of the end portion of the camera support assembly 2, and the other side of the thermal insulation layer 3 is bonded to the side surface of the end portion of the camera support assembly 2, which is equivalent to forming an L-shaped enclosure on the end portion of the camera support assembly 2, so that the thermal insulation effect between the motherboard bracket 1 and the camera support assembly 2 can be ensured. In addition, the cross section of the heat insulation layer 3 may be U-shaped, and the heat insulation layer 3 may be bonded to the end face of the end portion of the camera support assembly 2 and the side faces of both sides, so that the heat insulation efficiency between the main board bracket 1 and the camera support assembly 2 may be further improved.

Alternatively, referring to fig. 11 to 14, the thermal insulation layer 3 is arranged in a ring shape.

Specifically, the side of the camera supporting assembly 2 facing the main board support 1 may be an annular side, and an end surface of the annular side is close to the surface of the main board support 1. The heat insulation layer 3 is arranged in a ring shape, so that the heat insulation layer 3 is arranged corresponding to the end surface of the ring-shaped side edge, as shown in fig. 12 and 13, so that the ring-shaped side edge can be effectively separated from the main board support 1, and the heat insulation effect between the main board support 1 and the camera support assembly 2 is ensured.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. An electronic device, comprising:

a main board bracket (1);

the camera supporting component (2), camera supporting component (2) at least part set up in on mainboard support (1), be provided with insulating layer (3) between camera supporting component (2) and mainboard support (1).

2. The electronic device according to claim 1, characterized in that the thermal conductivity of the thermal insulation layer (3) is less than 0.2W/M.K.

3. The electronic apparatus according to claim 1, wherein the heat insulating layer (3) is a resin heat insulating layer.

4. The electronic device according to claim 1, characterized in that the thermally insulating layer (3) is provided with a plurality of through holes (31).

5. The electronic device according to claim 4, characterized in that a plurality of said through holes (31) are evenly distributed over said thermally insulating layer (3).

6. The electronic device according to claim 1, wherein the thermal insulation layer (3) is adhered to the surface of the main board support (1) close to the camera support assembly (2).

7. The electronic device according to claim 1, characterized in that the thermal insulation layer (3) is adhered to the end of the camera support assembly (2) close to the motherboard bracket (1).

8. The electronic device according to claim 7, characterized in that the area of the thermally insulating layer (3) is larger than the area of the end face of the end portion.

9. The electronic device according to claim 8, wherein the thermal insulation layer (3) has an L-shaped, T-shaped, U-shaped, or O-shaped cross-section.

10. The electronic device according to claim 1 or 7, characterized in that the thermally insulating layer (3) is arranged in a ring shape.