CN212305919U - Electronic assembly - Google Patents

Abstract

The embodiment of the utility model discloses electronic component. The electronic component includes: the mainboard module comprises a printed circuit board, a control unit and a first connecting piece, wherein the printed circuit board is used for bearing the control unit and the first connecting piece and providing electric connection; the sensor module comprises a flexible circuit board, a sensor and a second connecting piece, wherein the flexible circuit board is used for bearing the sensor and the second connecting piece and providing electrical connection; a support structure for supporting the motherboard module, wherein the physical and electrical connections between the motherboard module and the sensor module are achieved via the electrical and physical connections between the first and second connectors. The utility model discloses utilize the printed circuit board of different shapes and the flexible circuit board of different shapes to splice to realize structural more nimble, design have more individualized electronic component.

Description

Electronic assembly

Technical Field

The utility model relates to an electronic component makes the field, particularly, relates to an electronic component.

Background

With the advent of the 5G era, the use scenes of electronic components are richer and more flexible, and at the moment, electronic components with more flexible structures and more personalized appearance designs need to be provided so as to meet the user requirements in various use scenes.

SUMMERY OF THE UTILITY MODEL

Based on this, the present invention aims to provide an electronic component, and a manufacturing method, a drawing method and a drawing system of the electronic component.

To achieve the object, according to an aspect of the present invention, there is provided an electronic component including:

the mainboard module comprises a printed circuit board, a control unit and a first connecting piece, wherein the printed circuit board is used for bearing the control unit and the first connecting piece and providing electric connection;

the sensor module comprises a flexible circuit board, a sensor and a second connecting piece, wherein the flexible circuit board is used for bearing the sensor and the second connecting piece and providing electrical connection;

a support structure for supporting the motherboard module,

wherein the physical and electrical connections between the motherboard module and the sensor module are achieved via the electrical and physical connections between the first and second connectors.

In some embodiments, the support structure includes a base and a support disposed on the base for carrying and electrically connecting with the motherboard module.

In some embodiments, the first connecting member and the second connecting member respectively include a magnetic paste and a connecting wire, the magnetic paste is used for realizing physical connection between the two, and the connecting wire is used for realizing electrical connection between the two.

In some embodiments, the first connector and the second connector respectively comprise a buckle and a connecting wire, the physical connection between the two is realized through the buckle action, and the electrical connection between the two is realized through the connecting wire.

In some embodiments, the first connector and the second connector are physically connected at a set angle of inclination.

In some embodiments, the flexible circuit board further has a redundant area in addition to the sensor, and the redundant area is implemented with one or more of the following modeling modes: hollow out, bending and folding.

In some embodiments, the sensor module is a plurality of, and the plurality of sensor modules are disposed around the motherboard module.

In some embodiments, the shape of the main board module is an n-polygon, the first connecting member and the second connecting member form interconnection units, the number of the interconnection units and the number of the sensor modules are both equal to n, each sensor module is connected to the main board module on one side of the n-polygon via an interconnection structure, where n is greater than or equal to 3.

In some embodiments, a first surface of the printed circuit board is provided with the control unit, and a second surface of the printed circuit board opposite to the first surface is provided with a plurality of connection points via which the motherboard module is electrically connected with the support structure.

In some embodiments, a USB interface and a power supply are disposed within the support structure.

In some embodiments, the printed circuit board is further provided with auxiliary components.

The embodiment of the utility model provides an electronic component utilizes the printed circuit board of different shapes and the flexible circuit board of different shapes to splice to realize structural more nimble, design have more individualized electronic component. Further, various designated moldings are realized on the flexible circuit board by utilizing the flexible characteristics of the flexible circuit board.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent by describing embodiments of the present invention with reference to the following drawings, in which:

fig. 1a is a three-dimensional block diagram of an electronic assembly according to an embodiment of the invention;

FIGS. 1b-1c are three-dimensional block diagrams of a variation of the embodiment shown in FIG. 1 a;

FIG. 2 is an exploded view of the electronic assembly shown in FIG. 1 a;

FIG. 3a is a schematic plan view of the molding module shown in FIG. 1 a;

FIG. 3b is a schematic rear view of the motherboard module shown in FIG. 1 a;

FIG. 3c is a variation of the embodiment of the stent structure shown in FIG. 1 a;

FIGS. 4a-4c provide a multi-angle tile module for use as an interconnect structure and three connection methods;

fig. 5 is a block diagram of a terminal device for implementing a mapping system of an embodiment of the present invention;

FIG. 6 is a detailed block diagram of the second drawing module shown in FIG. 5;

fig. 7 is a prototype design drawing of a graphical interface of a graphics system of an embodiment of the invention;

fig. 8 is a flow chart of a method of charting an embodiment of the present invention;

fig. 9 is a flowchart of a drawing method according to an embodiment of the present invention.

Detailed Description

The present invention will be described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth in detail. It will be apparent to those skilled in the art that the present invention may be practiced without these specific details. Well-known methods, procedures, and procedures have not been described in detail so as not to obscure the present invention. The figures are not necessarily drawn to scale.

Fig. 1a is a three-dimensional structure diagram of an electronic assembly according to an embodiment of the present invention. FIGS. 1b-1c are three-dimensional block diagrams of variations of the embodiment shown in FIG. 1 a. As described above, the electronic component is shaped like a flower. In the electronic assembly shown in fig. 1a, there are six petals and one sensor is provided on each petal; in the electronic assembly shown in FIG. 1b, there are six petals, but only four petals have sensors disposed thereon; in the electronic assembly shown in fig. 1c, there are four petals and one sensor is located on each petal. The electronic assembly described above can be used in device works and design product appearance according to the artist's requirements.

Fig. 2 is an exploded view of the electronic assembly shown in fig. 1 a. Fig. 3a is a schematic plan view of a molding module included in the electronic assembly shown in fig. 1 a. Referring to fig. 2 and 3a, the electronic assembly shown comprises a moulding module 10, a support 21 and a base 22.

The molding module 10 includes a main board module and a sensor module. The motherboard module includes a bottom board 11, a control unit 12, and a plurality of first connectors 13, and a first wiring structure, not shown. The sensor module includes a plurality of second connectors 14, a plurality of sensors 15, a plurality of flexible circuit boards 16, and a second wiring structure, not shown. Of course, it is also possible to design a fully redundant flexible circuit board, as shown in fig. 1b, which does not carry any sensors and is only used to ensure aesthetic appearance.

The base plate 11 may be a printed circuit board (bare plate) made of an insulating resin substrate and a metal foil for supporting and electrically connecting the respective components in the electronic component. Specifically, the base plate 11 may be a single-sided copper-clad substrate, a double-sided copper-clad substrate, or a laminated substrate obtained by laminating a prepreg and a copper foil and heating and pressing the laminate. The bottom plate 11 may also be provided with a through hole (not shown) penetrating the bottom plate 11. In the case of a substrate with one side covered with copper, the through hole functions to electrically connect a conductor circuit formed on the upper surface of the base plate 11 to a connection point of the lower surface of the base plate, and to receive various signals through the connection point. Of course, a single-sided copper-clad substrate may not include a via, and a conductor circuit disposed on an upper surface of the substrate may be electrically connected to a bonding pad to receive various signals. For a double-sided copper-clad substrate, the via hole functions to electrically connect a conductor circuit formed on the upper surface of the base plate 11 to a conductor circuit formed on the lower surface of the base plate, and to connect to a pad to receive various signals. The pads may be disposed at edge positions of the upper surface or the lower surface of the substrate. In this embodiment, the base plate 11 may be a substrate with one surface coated with copper.

The control unit 12 is a core component of the electronic assembly and is used for controlling the sensor to work according to the received signal. The control unit 12 is fixed to the base plate 11, for example, by Surface Mounted Technology (Surface Mounted Technology) and electrically connected to the base plate 11. The control unit 12 may be a processor, a graphics processor, a microcontroller, a microprocessor, a digital signal processor, or a processor customized for a particular purpose. The control unit 12 is located at a central position of the base plate 11 and is electrically connected to the first connection 13 via a first wiring structure. The first wiring structure may be provided by a conductor circuit of the printed circuit board 11, or a conductor pattern may be additionally provided as the first wiring structure. A plurality of auxiliary components 17, such as capacitive resistors, may be provided around the control unit 12 as needed. The electrical connection of the auxiliary component 17 to the other components is likewise provided by the first wiring structure.

The first connecting member 13 is fixed to the base plate 11, and the first connecting member 13 may be fixed to the base plate 11 by welding, for example. The second connector 14 is fixed to the flexible circuit board 16, and the second connector 14 may be fixed to the flexible circuit board 16 by soldering, for example. The sensor 15 is fixed to the flexible circuit board 16, and the sensor 15 may be fixed to the flexible circuit board 16 by soldering, for example. The sensor 15 is electrically connected to the second connection 14 via a second wiring structure and thus to the control unit 12.

The first connecting member 13 and the second connecting member 14 constitute an interconnecting structure. First, a physical connection between the sensor module and the motherboard module is achieved via an interconnect structure to resist stress between the sensor module and the backplane. Secondly, the electrical connection between the sensor module and the main board module is realized through the interconnection structure so as to realize the signal transmission between the sensor module and the main board module.

The interconnect structure may be implemented in a variety of ways. For example, the physical connection between the two can be realized by welding, bonding, snapping, hinging, pinning, bonding, magnetic sticking and the like. For the electrical connection between the two, the connection line between the two can be used. For example, a magnetic module with connecting wires is used to realize the physical connection and the electrical connection between the magnetic module and the magnetic module. Referring to fig. 4a-4c, each tile module includes tiles and connecting wires, the tiles are magnetically connected together, and then the internal connecting wires are used to electrically connect the two connectors. As shown in the figure, the tilt angle of each tile is different, 180 degrees (angle to horizontal) for the tile in FIG. 4a, 90 degrees for the tile in FIG. 4b, and 45 degrees for the tile in FIG. 4 c. Thus, the tile modules of FIGS. 4a-4c respectively achieve physical connections in the horizontal direction, physical connections in the vertical direction, and physical connections at an angle of 45 degrees. And the electric connection between the two magnetic paste modules is realized through the connecting wire in the magnetic paste modules.

The sensor 15 may be a simple sensor such as a temperature and humidity sensor or a gravity sensor, or may be a complex sensor including a camera or a microphone. Meanwhile, a module to which the sensor belongs can be provided with a low-current response circuit such as a buzzer, an LED lamp string and an OLED display screen, so that the flexibility of the whole circuit structure is ensured, and the input and output dimensions are increased.

The flexible circuit board 16 and the backplane 11 may or may not be in the same plane. The flexible circuit board 16 and the bottom plate 11 are not in the same plane, i.e. the flexible circuit board 16 and the bottom plate 11 have a set inclination angle (e.g. 45 degrees or 60 degrees). Thus, the sensor module consisting of the flexible circuit board 16, the sensors 15, the second wiring structure 19 and the second connectors 14 relies entirely on the physical connection provided by the interconnect structure to resist stress of the bed sensor module with the base plate 11.

The second wiring structure between the sensor 15 and the second connection member 14 may be formed using a conductor circuit included in the flexible circuit board 16. Of course, instead of using a flexible circuit board to carry the sensor, a carrying structure made of other flexible materials, such as a carrying structure made of fiber materials, may be used, so that it is necessary to additionally provide a connecting wire on the surface of the carrying structure to electrically connect the sensor 15 and the second connecting member 14.

As can be seen from fig. 1a-1c, a plurality of sensor modules consisting of a flexible circuit board 16, a sensor 15, a second wiring structure and a second connection member are arranged around the centrally located control unit 12. In this example, the flexible circuit board for carrying the sensor is trapezoidal for aesthetic reasons, but may have other shapes, such as circular arc, square, and rectangle, and the bottom plate for carrying the control unit is hexagonal, but may have other shapes.

The support 21 and the base 22 constitute a support structure for supporting the motherboard module. In the figure, the stand 21 takes a shape of a 'y' for supporting the base plate 11 and transmitting various signals to the control unit 12 on the base plate. The base 22 is used for supporting the stand 21 and supplying various signals to the control unit 12 on the base board, a power supply 221 is provided inside the base 22 to supply power to the main board module via a power supply connection line (not shown) provided inside the stand 21, and a USB interface 211 is provided in a bottom area of the stand 21 to connect with an external computer and receive a digital signal from the computer, which is transmitted to the main board module via a signal connection line (not shown) provided inside the stand. Of course, the support structure may also take other shapes, for example, the support structure shown in fig. 3c is adopted, and the support structure shown in fig. 3c is based on the embodiment modification produced by the embodiment, which is not limited by the present invention.

Fig. 3b is a schematic back view of a motherboard module included in the electronic component shown in fig. 1 a. Since the base plate 11 is a substrate with one surface coated with copper, only a plurality of connection points 20 are provided on the back surface of the motherboard module, and the positions of the plurality of connection points may be positions of through holes of the base plate 11, and the control unit 12 on the upper surface of the base plate 11 is electrically connected to the connection points 20 via the through holes. The connection point 20 is electrically connected to a connection point 23 provided on the bracket 21.

It should be noted that the electronic components provided in the above embodiments are only used for exemplary description of the present invention, and are not used to limit the specific structure of the electronic components provided in the present invention. In fact, the utility model provides an electronic component key lies in utilizing the printed circuit board of various shapes (bear various components and parts simultaneously) and the flexible circuit board of the various shapes of adaptation (bear various components and parts simultaneously) to realize that the structure is more nimble, more individualized electronic component in the design.

Further, in the above-described embodiments, various moldings may be implemented thereon using the flexible feature of the flexible circuit board. For example, each flexible circuit board 16 may be bent at different angles so that the inclination angles of each flexible circuit board 16 and the chassis 11 are different from each other. Different patterns may also be provided on each flexible circuit board 16. Considering that the sensor module on the market is generally 32 wires, and the common part size of the capacitance resistor does not influence the bending structure of the flexible circuit board in the size of 5cm, the limited modeling of the flexible circuit board does not influence the electrical characteristics of the flexible circuit board and the sensor. The electronic assembly provided by the above embodiment can be fully implemented and produces economic benefits in the market segment.

Further, the utility model discloses still provide a manufacturing method for make electronic component. The manufacturing method specifically includes the following steps.

And step S1, providing a mainboard module and at least one sensor module meeting the design requirements. It is understood that the main board module and the sensor module in this embodiment have the same structure as the above-described embodiment, that is, the main board module includes a printed circuit board, a control unit and a first connecting member, the printed circuit board is used for carrying the control unit and the first connecting member and providing electrical connection, the sensor module includes a flexible circuit board, a sensor and a second connecting member, the flexible circuit board is used for carrying the sensor and the second connecting member and providing electrical connection, however, the size and shape of the main board module and the sensor module are required to meet the design requirements. For example, if the shape of the motherboard module is triangular, the sensor module is spliced on three sides of the triangle, and the respective sizes of the motherboard module and the sensor module are provided, it is necessary to manufacture the motherboard module and the sensor module according to the shape and size requirements.

And step S2, splicing the mainboard module and the at least one sensor module together based on the first connector and the second connector, so as to realize physical connection and electrical connection between the mainboard module and the sensor module via electrical connection and physical connection between the first connector and the second connector.

Step S3, providing a support structure for supporting the motherboard module and providing electrical connection to the motherboard module, so as to obtain an electronic assembly composed of the motherboard module, at least one sensor module and the support structure.

The key point of the manufacturing method provided by the embodiment is that the manufacturing process of the electronic component is completed by utilizing the formed main board module and the formed sensor module through a splicing method. In order to achieve the purpose, a plurality of mainboard modules and sensor modules of different models can be designed in advance, each model has a set shape and size, and an adaptive relationship is established between the models of the sensor modules and the mainboard modules, so that the proper sensor modules and the proper mainboard modules can be selected according to the adaptive relationship based on design requirements, and then the sensor modules and the mainboard modules are spliced to obtain the expected electronic component. The manufacturing method is beneficial to the large-scale production of the electronic component.

Further, the support structure is used for being connected with an external computer, and development and burning of the device side application are carried out in an actual use scene.

It should be noted that, although the electronic component can be designed with the motherboard module and the sensor module by using the current general-purpose drawing software, the drawing software cannot fully meet the design requirements of such electronic components, for example, when the flexible circuit board needs to be subjected to modeling, the general-purpose drawing software allows a designer to arbitrarily design the drawing area representing the flexible circuit board, but in fact, in order to avoid destroying the electrical characteristics of the flexible circuit board and various components thereon, some design manners are not allowed, and such a design drawing cannot be really implemented.

Based on this, the utility model provides a drawing system and drawing method to assist in the implementation of the manufacturing of above-mentioned electronic component. Hereinafter, the drawing system and the drawing method will be described in detail with reference to the above-described embodiments.

Fig. 5 is a structural diagram of a terminal device for implementing the mapping system according to the embodiment of the present invention. As shown in fig. 5, the terminal device includes a processor 41, a memory 42, a display 43, and a keyboard 44.

The processor 41 may be in communication with a memory 42, a display 43, and a keyboard 44. In some embodiments, the terminal device may include two or more processors. In some embodiments, some components not shown in the figures are also included in the terminal equipment, such as printers and scanners. The printer can be used for printing an output design drawing, and the scanner can be used for scanning various components to obtain appearance characteristic data required by subsequent drawing work. In some embodiments, the keyboard 44 may be replaced by other input devices, such as a stylus for replacing the keyboard, or a virtual keyboard for replacing a physical keyboard, and so on.

The terminal device is an electronic device that can be used to implement the drawing work. There are many devices on the market that can meet this need, such as portable notebooks, desktop computers, personal workstations, and even some very high performance PADs can be used for mapping work.

The memory 42 may store specification data 421, profile feature data 422, and correspondence data 423 of components such as a control unit, a printed circuit board, a flexible circuit board, a sensor, and the like. The memory 42 may also store drawing rules. These data will be described in more detail in the following functional description of the modules and will not be described in detail here.

The processor 41 is configured to acquire appearance feature data of the components according to the components constituting the electronic component, and draw a design drawing of the electronic component. Processor 41 may be a general purpose processing unit or a processor specifically designed for graphics tasks. The operations performed by the processor 41 may be divided into an operating system 414, an interaction module 413, a first drawing module 412, a second drawing module 411, and a redundant marking module 415 according to their functions.

The operating system 414 is a software system that organically combines the hardware of the terminal device to make it work properly. The operating system 414 mediates between the processor and the user and provides various service routines that enable the processor to receive user input, perform setting operations, and output results. For example, the operating system 414 provides drivers for various hardware so that the hardware can be used via APIs or routines provided by the operating system. The operating system also provides various resource management programs so that a variety of resources can be allocated among different users, different routines. And so on. Although the operating system 414 is a software system essential to implementing the mapping work, the influence and effect of the operating system 414 may not be considered when specifying the respective functional modules of the mapping system.

The interaction module 413, the first drawing module 412, and the second drawing module 411 are three functional modules divided for the drawing system.

The interaction module 413 obtains profile data of the components that make up the electronic assembly in a direct or indirect manner. The various components of the electronic assembly must include flexible circuit boards and printed circuit boards. The flexible circuit board is used for carrying other components and providing electrical connection, but of course, redundant flexible circuit boards can be manufactured only for realizing various models, for example, in the electronic assembly shown in fig. 1b, the flexible circuit board used for carrying the sensor is included, and the flexible circuit board used for implementing the model is also included. Printed circuit boards are also used to carry other components and provide electrical connections.

The interaction module 413 is configured to obtain shape feature data of each component constituting the electronic assembly, and includes one of the following methods: receiving appearance characteristic data of each component from a user; if the user only provides the appearance characteristic data of part of the components, for the rest of the components, the appearance characteristic data of the components (the components are general components) is obtained by retrieving the pre-stored appearance characteristic data; if the user only provides the appearance feature data of part of the components, for the rest of the components, the appearance feature data of the rest of the components can be determined through the appearance feature data of the provided components, for example, after the appearance feature data of the control unit is determined, the appearance feature data of the printed circuit board for bearing the control unit can be determined; if the user provides the model numbers of some components forming the mainboard module, the pre-stored appearance characteristic data can be retrieved through the model numbers to obtain the appearance characteristic data of the components.

The interaction module 413 may or may not include a graphical interface. When the graphical interface is not included, input information is provided via the input parameters. When a graphical interface is included, input information is provided through the UI component. The interaction module 413 may also provide input information via a configuration file. The input information may be the appearance data of the various components mentioned above, or the appearance data of other components may be retrieved or determined via the input information.

In some embodiments, when the graphical interface is included, the model numbers of various components to be selected are listed on the graphical interface through the UI component for selection by the user. The model and shape feature data corresponding to each component can be from specification data 421 and shape feature data 422 prestored in the memory 42. The specification data and the appearance characteristic data (made into thumbnails) corresponding to all the components can be listed as remark information for a user to refer to.

In some embodiments, the interaction module 413 may further provide an uploading function for uploading appearance feature data of the device on the graphical interface, so as to be used by a user for uploading data. In addition, there may be some situations of incompatibility between different components, for example, a microcontroller of a certain model cannot communicate with a specific sensor, so it is possible to establish correspondence data between various components, i.e., correspondence data 423 in memory 42, and to embody such correspondence data in the UI component, for example, for a plurality of microcontrollers and sensors listed on a graphical interface, when one microcontroller is selected, then it is necessary to select from the sensors adapted thereto, so as to reduce the technical difficulty of the drawing system and improve the drawing efficiency.

In some embodiments, the interaction module 413 provides preview functionality on the graphical interface. Various toolbars may also be provided on the graphical interface of the interaction module 413 for modifying the drawing rules currently used by default.

In some embodiments, the electronic assembly of FIG. 1a is taken as an example. If the electronic assembly comprises components such as a control unit, a sensor, a printed circuit board, a flexible circuit board, a first connecting piece and a second connecting piece, wherein each component is an independent component, the appearance characteristic data of the control unit and the sensor are firstly determined, then the appearance characteristic data of the printed circuit board is determined according to the appearance characteristic data of the control unit, then the appearance characteristic data of the flexible circuit board is determined according to the appearance characteristic data of the printed circuit board and the appearance characteristic data of the sensor, and the flexible circuit board contains certain redundancy. If the electronic component is composed of a mainboard module and a sensor module, the mainboard module and the sensor module are combined components, the appearance characteristic data uploaded by a user are received by the interaction module, the appearance characteristic data of the mainboard module comprises appearance characteristic data of each component borne by the mainboard module, and the appearance characteristic data of the sensor module also comprises appearance characteristic data of each component borne by the sensor module. Of course, if some components carried on the motherboard module and/or the sensor module are general components, the appearance feature data of these components can also be obtained by retrieving the memory.

The interaction module 413 passes the appearance feature data to the first drawing module 412. The first drawing module 412 is configured to invoke a drawing interface to draw a first design drawing of the electronic component according to the appearance feature data of each component and the drawing rules 424 of the memory 42. The first design drawing includes each component and a wiring structure between the components. The drawing rule 424 is rule data for organizing and arranging various components, and further includes rule data for drawing points, lines, planes, and the like. Again taking the electronic assembly of fig. 1a described above as an example. If the electronic component is composed of a control unit, sensors, a printed circuit board, flexible circuit boards, a first connecting piece and a second connecting piece (without considering a support structure), and each component is an independent device, the first drawing module 412 determines the position information of each sensor on each flexible circuit board based on drawing rules, determines the position information of the control unit on the printed circuit board, draws, sets six flexible circuit boards around the control unit according to a symmetrical mode, draws the first connecting piece and the second connecting piece, and draws a first wiring structure between the control unit and the first connecting piece and a second wiring structure between the sensors and the second connecting piece. If the electronic component includes a motherboard module and a sensor module, the first drawing module 412 draws the motherboard module first according to the drawing rule, then draws the six sensor modules at the periphery of the control unit in a symmetrical manner, and finally draws the first wiring structure of the motherboard module and the second wiring structure of the sensor module. It should be understood that if the conductor circuits in the printed circuit board and the flexible circuit board are used as the first wiring structure and the second wiring structure, it is necessary to acquire data of the conductor circuit on the printed circuit board used as the first wiring structure and data of the conductor circuit on the flexible circuit board used as the second wiring structure in order to draw the first wiring structure and the second wiring structure. Since it is necessary to perform various shapes on the first design drawing in order to avoid damage to the first wiring structure and the second wiring structure, the first wiring structure and the second wiring structure are drawn on the first design drawing as a preferred embodiment.

The redundancy flag module 415 is used to set a redundancy area on the flexible circuit board of the first design drawing. For example, the size and position of the redundant area of the flexible circuit board are calculated from the second wiring structure and the profile characteristic data of the sensor, and the position information of the redundant area is stored. The position and size of the redundant area can be calculated using the following method: the minimum distance from the edge position of the flexible circuit board to the sensor is calculated as a first distance, then the minimum distance from the edge position of the flexible circuit board to the second wiring structure is calculated as a second distance, the first distance and the second distance are compared to obtain a smaller distance, and the area between the edge position of the flexible circuit board and the smaller distance is divided into redundant areas, so that the sensor and the second wiring structure cannot be damaged.

In some cases, redundant flexible printed circuits may be provided for the design of the model, for example, a part of the flexible printed circuit shown in fig. 1b is not provided with any sensors, and the flexible printed circuit as a whole performs various models as redundant regions.

In some cases, either the first or second blueprint may be material or part of another blueprint. For example, a pattern representing the other component is added to the first design drawing or the second design drawing to form a design drawing of a new electronic component.

The second drawing module 411 is configured to implement a designated modeling manner in the redundant area of the flexible circuit board according to the designated modeling manner, so as to obtain a design drawing of the sensor module, and finally obtain a second design drawing of the electronic component.

In some embodiments, as shown in fig. 6, the second drawing module 411 includes a hollow-out modeling unit 4112, and the hollow-out modeling unit 4112 is used for hollow-out modeling on the flexible circuit board. A flexible circuit board for carrying sensors has one or more redundant regions. The hollow modeling unit 4112 applies hollow operation to the redundant area of the flexible circuit board, and further performs hollow operation according to drawing rules, and outputs the effect to the second design drawing. The hollow patterns can be provided for a user to select, namely, a plurality of hollow patterns to be selected and the example graph are output to the graphical interface for the user to select.

In some embodiments, as shown in fig. 6, the second drawing module 411 further includes a fold modeling unit 4113. Folding the flexible circuit board requires that the flexible circuit board and the backplane must have a certain tilt angle before, which may require the user to input the tilt angle in real time, or the tilt angle has already been designed in the previous first design drawing. When the user selects the folding operation, the folding modeling unit 4113 applies the folding operation to the redundant area of the flexible circuit board, and then folds the flexible circuit board according to the drawing rule data, and outputs the effect to the second design drawing. Wherein the particular folding mode may or may not be selected by the user. And if the folding mode can be selected by the user, outputting a plurality of folding modes to be selected and the example graph to the graphical interface.

In some embodiments, as shown in fig. 6, the second drawing module 411 further includes a curve modeling unit 4114. When the user selects a bending operation, the bending modeling unit 4114 applies the bending operation to a redundant region of the flexible circuit board, further bends the flexible circuit board according to drawing rule data, and outputs an effect to the second design drawing. Wherein the manner of bending may or may not be selected by the user. If the user can select the bending mode, a plurality of candidate bending modes and the example graph are output to the graphical interface.

In this embodiment, a redundant area is provided in the first design drawing outputted from the first drawing module, and the second drawing module 411 is provided with various shapes in the redundant area, so that various shapes of the electronic component are realized while avoiding damage to the electrical characteristics of the component and the wiring structure.

It should be understood that the first drawing module 412 and the second drawing module 411 need to call various drawing interfaces provided by the drawing library, but this part is related to the prior art and is not described in detail herein.

Fig. 7 is a prototype design drawing of a graphical interface of a graphics system according to an embodiment of the invention. The using step of the drawing system includes steps S1-S5, as shown in the drawing.

Step S1(circuit module) is for receiving a technical model of the control unit, and determining the profile characteristic data of the control unit by the technical model.

Step S2(Board Design) is used to receive the technical selection of the backplane and further determine the shape and size of the backplane, for example, the shape of the backplane may be one of an equilateral triangle, a reuleaux triangle, a rectangle, a hexagon, a polygon, and a circle.

Step S3(Module Design) is used to receive the technical model selection of the sensor Module and obtain the shape feature data of the sensor. The other components, such as the first connecting piece and the second connecting piece for connecting the bottom plate and the sensor module, can adopt connecting pieces of general models. The connecting piece of this general model thinks can generally be with components and parts such as control unit, sensor are compatible, and the size of the connecting piece of general model is less, and the area that occupies is also less on the bottom plate.

Step S4(Structure Design) is for four modeling modes set on the first Design drawing: flat (normal), folded (folded), hollowed (hollowed) and bent (blended). If the user selects to flatten, the first design drawing is output in step S5, if the user selects to fretwork, the user can continue to specify a fretwork pattern, the specified fretwork pattern is included in the second design drawing for the electronic component output in step S5, if the user selects to fold, the second design drawing for the electronic component with folding petals is output in step S5, and if the user selects to bend, the second design drawing for the electronic component with bent sculpts is selected to output in step S5.

Step S5(Export Layout): and outputting the second design drawing. After the user obtains the second design drawing, the printed circuit board and the flexible circuit board may be prepared for printing and surface mount soldering, and then cut by a CNC (computer Numerical Control) Machine.

In this prototype example, the execution of the various steps of the charting system was controlled through a graphical interface. The user only needs to provide input information according to the instruction, and the specific drawing process can be completely free from manual intervention until the design drawing is finally output. The user only adjusts the drawing rules and the drawing parameters to improve the design drawing, and the method is relatively safe. Of course, the user may also participate in some drawing processes, for example, the pattern may be drawn in a redundant area, but if the drawn pattern exceeds the redundant area, the system needs to give a prompt. Further, if the outputted second design includes an irrational design, the system does not output the second design or give a mark on the design.

Further, as shown in the figure, buttons Preview and Parameters Settings are provided on the graphical interface, the button Preview indicating that the user can skip the previous step, and the button Parameters Settings indicating that the user can modify various parameter Settings in the drawing rule.

Of course, fig. 6 is a prototype design drawing of a graphical interface of an alternative embodiment, which is only used to help illustrate the drawing system provided by the embodiment of the present invention, and those skilled in the art can provide other embodiments or other graphical interfaces completely under the condition of understanding the spirit of the present invention.

Corresponding to the above embodiments, fig. 8 is a flowchart of a drawing method according to an embodiment of the present invention. The method specifically comprises the following steps.

In step S801, profile characteristic data of each component constituting the electronic component is acquired. The length and width may be given if the component has a standard shape, such as a rectangle, and vector data may be provided if the component has an irregular shape.

In step S802, a first design drawing of the electronic component is drawn based on the appearance feature data of each component. As shown in fig. 1a, the electronic assembly may be composed of various components, but these various components must include a flexible circuit board for carrying one or more components, and the flexible circuit board should have a certain redundancy to implement various models, and these components must include a printed circuit board for carrying one or more components.

In step S803, a redundant area is set in the drawing area of the first design drawing. Setting the redundant area includes marking the redundant area on the first design drawing, and recording position information of the redundant area.

In step S804, the designated modeling manner is implemented in the redundant area according to the designated modeling manner, so as to obtain a second design drawing of the motherboard module. That is, various kinds of modeling are performed based on the redundant area marked on the first design drawing or the position information of the redundant area already recorded, and finally the second design drawing is output.

In this embodiment, a certain redundancy is provided for the flexible circuit board carrying the sensor, and a redundancy area is provided on the first design drawing, and then various shapes are provided in the redundancy area, so that various shapes of the sensor module can be realized while avoiding damaging the electrical characteristics of the components and the wiring structure, and further, an electronic component with a personalized appearance is realized.

Fig. 9 is a flowchart of a drawing method according to an embodiment of the present invention. The method specifically comprises the following steps.

In step S901, the model of the control unit and the model of the sensor input by the user are received.

In step S902, pre-stored appearance feature data is retrieved, and appearance feature data of the control unit and the sensor is acquired.

The shape characteristic data of a plurality of components can be prestored in the memory. The appearance feature data can be uploaded by a user, can be from technical specifications of various components provided by the official, and can also be obtained by shooting appearance images of various components. Index information of the appearance characteristic data can be established according to the models of various components. When the user provides the model of the component, the index information can be retrieved through the model to obtain the corresponding appearance characteristic data.

In step S903, profile feature data of the printed circuit board carrying the control unit is determined according to the profile feature data of the control unit. As shown in fig. 1a, the printed circuit board serves as a backplane, carrying the control unit and some auxiliary components, which are typically small in area and negligible in the calculations. The shape and size of the printed circuit board is thus determined according to the control unit. For example, the size of the printed circuit board may be calculated by multiplying a set scaling factor by the control unit. Visual coordination and aesthetics are sometimes also a consideration. For example, in fig. 1a, since there are six flexible circuit boards, the printed circuit boards are arranged in a hexagonal shape.

In step S904, profile data of the flexible circuit board carrying the sensor is determined from the profile data of the sensor. The flexible circuit board may carry one or more sensors, response devices, additional communication modules, and the like. It is therefore necessary to determine the area of the flexible circuit board according to the number and area of the sensors, the response devices, and the additional communication modules. The area of the flexible circuit board can be obtained by multiplying the area of the sensor by a set proportionality coefficient. Visual coordination and aesthetics are sometimes also a consideration. For example, in fig. 1a, the flexible circuit board is arranged in a trapezoidal shape. In some cases, the sensor is present in the form of an already formed sensor module, which needs to be considered as a whole.

In step S905, the shape feature data of the first connector, the second connector, and the other auxiliary components are determined. For example, profile data of various connecting members and auxiliary members of a common type can be acquired from prestored profile data.

In step S906, a first design drawing of the electronic component is drawn based on the external shape feature data of each component. That is, drawing interfaces provided by various graphic libraries can be called, the first design drawing is drawn, and the wiring structure is drawn on the first design drawing.

In step S907, on the first layout, a first wiring structure and a second wiring structure are drawn. The first wiring structure is from a printed circuit board and the second wiring structure is from a flexible circuit board, and therefore, in order to ensure that the conductor circuits serving as the first wiring structure and the second wiring structure are not damaged, it is preferable to draw the first wiring structure and the second wiring structure on the first design drawing.

In step S908, a redundant area is set in a drawing area of the first design drawing representing the flexible circuit board. In this step, a redundant area on the flexible circuit board is determined based on the first wiring structure and the positions of the sensor and the connector, and position information of the redundant area is recorded.

In step S909, a designated molding pattern is implemented in the redundant area of the flexible circuit board according to the designated molding pattern, thereby obtaining a second design drawing of the motherboard module. In this step, various shapes are realized according to the position information of the redundant area, thereby realizing the second design drawing of the main board module. Further, a second design drawing of the electronic component can be obtained according to the second design drawing of the mainboard module.

In this embodiment, a certain redundancy is provided for the flexible circuit board carrying the sensor, and a redundancy area is provided on the first design drawing, and further in the second drawing module, various shapes are provided in the redundancy area, so that various shapes of the electronic component can be realized while avoiding damaging the electrical characteristics of the components and the wiring structure.

It should be noted that in the above embodiments, the size and shape of the flexible circuit board and the printed circuit board for carrying other components need to be determined according to the size and shape of the other components. In the drawing process, the dimensions and shapes of the flexible circuit board and the printed circuit board can be adjusted by designing the drawing at any time, so that the step of acquiring the appearance feature data of the printed circuit board and the flexible circuit board is the first step of the embodiment, but in practice, the step can be performed at any time point and can be performed for multiple times.

It should be understood that in the above-described embodiments of the drawing method and the drawing system, the supporting structure in the electronic component is not described too much, because the design of the supporting structure is not the focus of the present invention, and the design of the supporting structure can be done based on the prior art drawing system. Thus, the drawing method and drawing system of the present invention may not be used to implement the supporting structure.

As will be appreciated by one skilled in the art, the present invention may be embodied as systems, methods and computer program products. Accordingly, the present invention may be embodied in the form of entirely hardware, entirely software (including firmware, resident software, micro-code), or in the form of a combination of software and hardware. Furthermore, in some embodiments, the invention may also be embodied as a computer program product in one or more computer-readable media having computer-readable program code embodied in the medium.

Any combination of one or more computer-readable media may be employed. The computer readable medium may be a computer readable signal medium or a computer readable storage medium. A computer readable storage medium is, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the foregoing. More specific examples of the computer-readable storage medium include: an electrical connection for the particular wire or wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical memory, a magnetic memory, or any suitable combination of the foregoing. In this context, a computer-readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with a processing unit, apparatus, or device.

A computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a chopper. Such a propagated data signal may take many forms, including, but not limited to, electro-magnetic, optical, or any other suitable combination. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction system, apparatus, or device.

Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., and any suitable combination of the foregoing.

Computer program code for carrying out embodiments of the present invention may be written in one or more programming languages or combinations. The programming language includes an object-oriented programming language such as JAVA, C + +, and may also include a conventional procedural programming language such as C. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet service provider).

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims (11)

1. An electronic assembly, comprising:

the mainboard module comprises a printed circuit board, a control unit and a first connecting piece, wherein the printed circuit board is used for bearing the control unit and the first connecting piece and providing electric connection;

the sensor module comprises a flexible circuit board, a sensor and a second connecting piece, wherein the flexible circuit board is used for bearing the sensor and the second connecting piece and providing electrical connection;

a support structure for supporting the motherboard module,

wherein the physical and electrical connections between the motherboard module and the sensor module are achieved via the electrical and physical connections between the first and second connectors.

2. The electronic assembly of claim 1, wherein the support structure comprises a base and a support disposed on the base for carrying and electrically connecting with the motherboard module.

3. The electronic component according to claim 1, wherein the first connecting member and the second connecting member respectively comprise a magnetic paste and a connecting wire, the physical connection between the two is realized by magnetic action of the magnetic paste, and the electrical connection between the two is realized by the connecting wire.

4. The electronic assembly of claim 1, wherein the first and second connectors comprise a snap and a connecting wire, respectively, wherein the physical connection between the two is achieved by a snap action, and the electrical connection between the two is achieved by the connecting wire.

5. The electronic assembly of claim 1, wherein the first connector and the second connector are physically connected at a set angle of inclination.

6. The electronic assembly of claim 1, wherein the flexible circuit board further has a redundant area other than the sensor, the redundant area having one or more of the following configurations implemented thereon: hollow out, bending and folding.

7. The electronic assembly of claim 1, wherein the sensor module is a plurality of, and wherein the plurality of sensor modules are disposed around the motherboard module.

8. The electronic assembly of claim 7, wherein the shape of the motherboard module is an n-polygon, the first connectors and the second connectors form interconnection units, the number of interconnection units and the number of sensor modules are both equal to n, each sensor module is connected to the motherboard module on one side of the n-polygon via an interconnection structure, and n is greater than or equal to 3.

9. An electronic assembly according to claim 1, wherein a first surface of the printed circuit board is provided with the control unit and a second surface of the printed circuit board opposite to the first surface is provided with a plurality of connection points via which the motherboard module is electrically connected with the mounting structure.

10. The electronic assembly of claim 1, wherein a USB interface and a power supply are disposed within the cradle structure.

11. The electronic assembly of claim 1, wherein the printed circuit board further comprises auxiliary components disposed thereon.

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