CN212303617U - Rotary die bonder - Google Patents

Abstract

The utility model discloses a rotary die bonder, which comprises a die bonder arm, an elastic sheet and a driving device, wherein the die bonder arm is provided with a suction nozzle for sucking a wafer; the driving device and the die bonding arm form a revolute pair connection through the elastic sheet. The utility model discloses a solid brilliant device of rotation type is whole with motor rigid connection, fast, and the precision is high, has replaced rectilinear movement by the rotation, and the load diminishes, and no wearing and tearing can keep the high accuracy for a long time.

Description

Rotary die bonder

Technical Field

The utility model relates to a solid brilliant machine technical field of semiconductor, concretely relates to solid brilliant device of rotation type.

Background

The die bonder is a core component of a die bonder, and as die bonding speed is faster and die bonding quality requirements are higher and higher, higher requirements are put on die bonder equipment, so that the efficiency of the die bonder is required to be maximized, and the accuracy of the die bonder is required to be kept unchanged for a long time. The general die bonder can not meet the processing requirements, so that a better die bonder capable of meeting the modern processing requirements is needed.

SUMMERY OF THE UTILITY MODEL

To the problem that prior art exists, the utility model provides a solid brilliant device of rotation type.

The technical scheme of the utility model is that:

a rotary die bonder comprises a die bonder arm, a spring plate and a driving device, wherein the die bonder arm is provided with a suction nozzle for sucking a wafer; the driving device and the die bonding arm form a revolute pair connection through the elastic sheet.

Preferably, the elastic sheet forms a revolute pair connection at the joint of the driving device and the die bonding arm.

Preferably, the driving device comprises a die bonding rotating mechanism and a die bonding lifting mechanism, the spring plate is mounted at the bottom of the die bonding rotating mechanism and used for connecting the die bonding arm and the die bonding rotating mechanism, and the die bonding rotating mechanism can drive the die bonding arm to rotate in the horizontal direction through the spring plate; the die bonding lifting mechanism is arranged on the side wall of the die bonding rotating mechanism and used for controlling the die bonding arm to swing up and down.

Preferably, the die bonding rotation mechanism comprises a rotation motor, a rotation motor base, a rotation base, a bearing and a swinging piece, the rotation motor is mounted at the top of the rotation motor base, the rotation base is rigidly connected with the rotation motor, the swinging piece is mounted at the bottom of the rotation base and connected with the rotation base through a spring plate, the other end of the swinging piece is connected with the die bonding arm, and the bearing is mounted on the swinging piece.

Preferably, the die bonding lifting mechanism comprises a lifting motor, a lifting motor base, a sliding block, a rotating shaft and a bearing clamping plate, the lifting motor base is fixed on the side wall of the rotating motor base, the lifting motor is installed on the lifting motor base, the sliding block is installed on the lifting motor base, and a track for the sliding block to move is arranged on the corresponding lifting motor base; the bearing clamping plate is connected with the sliding block through a rotating shaft and is used for clamping the bearing on the swinging piece.

Preferably, the slide block is provided with an eccentric shaft, and the eccentric shaft is connected with a rotating shaft of the lifting motor and used for controlling the slide block to move.

Preferably, an origin sensor is further installed on the lifting motor base and located above the sliding block.

Adopt the technical scheme of the utility model, following beneficial effect has:

1. the main motion of the up-and-down motion of the suction nozzle on the die bonding arm adopts a rotating pair to replace a moving pair of a traditional crossed roller guide rail or a linear guide rail, so that the design of removing the guide rail is realized, the die bonding arm has the characteristics of no abrasion and long service life, and the long-term stability of the structural precision is ensured, so that the long-term stability of the position precision of the suction nozzle is ensured, the realization efficiency is higher, and the precision is better;

2. the horizontal swing and the vertical swing are mutually independent, the control is more flexible, and the movement precision is higher.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic structural view of the die bonding rotation mechanism of the present invention;

FIG. 3 is a schematic view of a partial structure of the present invention;

fig. 4 is a schematic structural view of the die bonding lifting mechanism of the present invention;

fig. 5 is a movement diagram of the present invention.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and specific embodiments. Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1 to 5, the utility model provides a rotary die bonder, which comprises a die bonder arm 1, a spring plate 2 and a driving device, wherein the die bonder arm 1 is provided with a suction nozzle for sucking a wafer, and the chip can be other semiconductor components, copper sheets, glass sheets, ceramic sheets and the like; the driving device and the die bonding arm 1 form a revolute pair connection through the elastic sheet 2. Preferably, the pressure of the suction nozzle is adjustable.

The elastic sheet 2 forms a revolute pair connection at the bottom of the joint of the driving device and the die bonding arm 1.

The driving device comprises a die bonding rotating mechanism 3 and a die bonding lifting mechanism 4, the elastic sheet 2 is arranged at the bottom of the die bonding rotating mechanism 3 and is used for connecting the die bonding arm 1 with the die bonding rotating mechanism 3, and the die bonding rotating mechanism 3 can drive the die bonding arm 1 to rotate in the horizontal direction through the elastic sheet 2; the die bonding lifting mechanism 4 is arranged on the side wall of the die bonding rotating mechanism 6 and used for controlling the die bonding arm 1 to swing up and down. The elastic sheet 2 may also be a bearing, a cross elastic sheet, or other structural members capable of rotating. The die bonding lifting mechanism can also be a multi-link mechanism, a special-shaped elastic sheet, piezoelectric ceramics or memory alloy and the like, and can directly generate a structure of vertical displacement without a moving pair and a rotating pair. The die bonding upgrading mechanism 4 can also be installed on the rotating base 303 and horizontally rotates along with the rotating base 303.

The die bonding rotation mechanism 3 comprises a rotation motor 301, a rotation motor base 302, a rotation base 303, a bearing 304 and a swinging piece 305, wherein the rotation motor 301 is installed at the top of the rotation motor base 302, the rotation base 303 is rigidly connected with a motor shaft of the rotation motor 301, the swinging piece 305 is installed at the bottom of the rotation base 303 and is connected with the rotation base 303 through an elastic sheet 2, the other end of the swinging piece 305 is connected with a die bonding arm 1, and the bearing 304 is installed on the swinging piece 305.

The die bonding lifting mechanism 4 comprises a lifting motor 401, a lifting motor base 402, a sliding block 403, a rotating shaft 404 and a bearing clamping plate 405, wherein the lifting motor base 402 is fixed on the side wall of the rotating motor base 302, the lifting motor 401 is installed on the lifting motor base 402, the sliding block 403 is installed on the lifting motor base 402, and a track for the sliding block 403 to move is arranged on the corresponding lifting motor base 402; the bearing holding plate 405 is connected to the slider 403 via the rotating shaft 404, and the bearing holding plate 405 holds the bearing 304 on the swinging member 305. Preferably, the rotating base 303 is further provided with a track for the bearing clamping plate 405 to move, and when the bearing clamping plate 405 clamps the bearing 304 and moves up and down, the rotating base 303 can be driven to rotate up and down, so as to control the die bonding arm 1 and the suction nozzle to swing up and down.

An eccentric shaft 406 is mounted on the sliding block 403, and the eccentric shaft 406 is connected with the rotating shaft of the lifting motor 401 and is used for controlling the sliding block 403 to move.

An origin sensor 407 is further installed on the lifting motor base 401, and is located above the sliding block 403.

The utility model discloses the theory of operation does: the crystal fixing arm and the suction nozzle of the rotary crystal fixing device can independently swing in the horizontal direction or the vertical direction, and can also do compound motion in the horizontal direction and the vertical direction, and the crystal fixing arm 1 can be controlled to rotate in the horizontal direction through the crystal fixing rotating mechanism 2 and can also swing up and down through the crystal fixing lifting mechanism 4; the die bonding arm 1 is mounted on a swinging piece 305, the swinging piece 305 can be controlled by a rotating motor 301, a bearing 304 on the swinging piece 305 can be controlled by a lifting motor 401 and a bearing clamping plate 405, and the die bonding arm 1 can rotate in two directions at any time.

The specific working method comprises the following steps:

(1) forming a revolute pair connection between the die bonding arm and the driving device through a spring plate to enable the die bonding arm to swing up and down, wherein the die bonding arm is provided with a suction nozzle for sucking a wafer;

(2) a die bonding rotating mechanism in the driving device drives a die bonding arm to horizontally swing so that the suction nozzle moves above the wafer;

(3) a die bonding lifting mechanism in the driving device drives a die bonding arm to swing downwards, so that the suction nozzle descends to the upper surface of the wafer to pick up the wafer, and then the die bonding lifting mechanism drives the die bonding arm to swing upwards to enable the suction nozzle and the wafer to rise to a certain height together;

(4) a die bonding rotating mechanism in the driving device drives a die bonding arm to horizontally swing, so that the suction nozzle and the wafer move to the position above the position needing die bonding;

(5) a die bonding lifting mechanism in the driving device drives a die bonding arm to swing downwards, so that the suction nozzle and the wafer are lowered to the height required for die bonding, the wafer is released to complete die bonding, and then the die bonding lifting mechanism drives the die bonding arm to swing upwards to enable the suction nozzle to rise to a certain height;

(6) and (5) repeating the actions from (2) to (5) to enable the die bonding arm to continuously and circularly work, so that the cyclic work of die taking and die bonding of the die bonding device is realized.

The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.

Claims (7)

1. A rotary die bonder is characterized in that: the wafer fixing device comprises a wafer fixing arm, an elastic sheet and a driving device, wherein the wafer fixing arm is provided with a suction nozzle for sucking a wafer; the driving device is connected with the die bonding arm through a revolute pair formed by the elastic sheet.

2. The rotary die bonder of claim 1, wherein: the elastic sheet forms revolute pair connection at the joint of the driving device and the die bonding arm.

3. The rotary die bonder of claim 1, wherein: the driving device comprises a die bonding rotating mechanism and a die bonding lifting mechanism, the elastic sheet is arranged at the bottom of the die bonding rotating mechanism and used for connecting the die bonding arm with the die bonding rotating mechanism, and the die bonding rotating mechanism can drive the die bonding arm to rotate in the horizontal direction through the elastic sheet; the die bonding lifting mechanism is arranged on the side wall of the die bonding rotating mechanism and used for controlling the die bonding arm to swing up and down.

4. The rotary die bonder of claim 3, wherein: the die bonding rotation mechanism comprises a rotation motor, a rotation motor base, a rotation base, a bearing and a swinging piece, the rotation motor is installed at the top of the rotation motor base, the rotation base is rigidly connected with the rotation motor, the swinging piece is installed at the bottom of the rotation base and connected with the rotation base through a spring plate, the other end of the swinging piece is connected with a die bonding arm, and the bearing is installed on the swinging piece.

5. The rotary die bonding apparatus according to claim 4, wherein: the die bonding lifting mechanism comprises a lifting motor, a lifting motor base, a sliding block, a rotating shaft and a bearing clamping plate, wherein the lifting motor base is fixed on the side wall of the rotating motor base; the bearing clamping plate is connected with the sliding block through a rotating shaft and is used for clamping the bearing on the swinging piece.

6. The rotary die bonder of claim 5, wherein: and the slide block is provided with an eccentric shaft, and the eccentric shaft is connected with a rotating shaft of the lifting motor and is used for controlling the slide block to move.

7. The rotary die bonder of claim 5, wherein: and the lifting motor base is also provided with an origin sensor which is positioned above the sliding block.

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