CN212301771U - Semiconductor ETS equipment with sub-frame of modularization - Google Patents
Semiconductor ETS equipment with sub-frame of modularization Download PDFInfo
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- CN212301771U CN212301771U CN202022849452.0U CN202022849452U CN212301771U CN 212301771 U CN212301771 U CN 212301771U CN 202022849452 U CN202022849452 U CN 202022849452U CN 212301771 U CN212301771 U CN 212301771U
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Abstract
The application relates to a semiconductor ETS equipment with sub-frame of modularization belongs to semiconductor test equipment technical field, and it is used for the test of semiconductor chip, includes: a frame; the modularization sub-frame, the sub-frame fixed connection of modularization is in the frame, and the sub-frame of modularization includes the frame, is equipped with integrated circuit board and the backplate of mutual plug connection in the frame, and the integrated circuit board passes through integrated circuit board slide and frame sliding connection, backplate and frame fixed connection. The utility model provides a semiconductor ETS equipment adopts sub-frame and frame fixed connection of modularization, can ensure accurate butt joint of integrated circuit board and backplate in the frame, no longer needs the secondary adaptation, very big improvement the installation positioning efficiency of integrated circuit board and backplate. The modular subframe can be directly assembled on the frame as an independent module, and the modular subframe is used as an independent module to be a self-forming reference without considering the assembly error of the frame.
Description
Technical Field
The application relates to the technical field of semiconductor test equipment, in particular to a semiconductor ETS device provided with a modular subframe.
Background
An Engineering Test System (ETS) is used as one of Test equipment for a wafer Test (CP Test) or a package Test (FT). The whole frame of the engineering test system is a frame structure formed by splicing sectional materials, and the assembly precision is not high; the board card of the ETS and the back plate have a connection relationship, and generally need to be precisely matched.
The backboard support plate and the board card slide way are often fixed on the section bar, and the position of the board card slide way and the backboard support plate can be freely adjusted on the section bar along the vertical direction through the tightening screws. The backplate is fixed in the backplate backup pad, and the integrated circuit board pushes in to the backplate direction along the integrated circuit board slide until integrated circuit board connector and backplate connector laminate completely. In the process, if a deviation exists in the matching of the board connector and the backplane connector, the position of the board slideway or the backplane supporting plate needs to be adjusted for matching, and the process usually needs a lot of time.
In the correlation technique, in order to overcome the assembly error of section bar itself, often need make the moving part to backplate backup pad and integrated circuit board slide to reach the accurate complex effect of integrated circuit board and backplate. However, the movable parts made of the back plate supporting plate and the board card slide ways need a large amount of time to trial mount in an assembling link and adjust the positions of the back plate supporting plate and the board card slide ways, so that the production efficiency is low.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a semiconductor ETS equipment with sub-frame of modularization to it needs a large amount of time to try on the dress and adjusts the position of backplate backup pad and integrated circuit board slide to make the moving part in the assembly link to solve among the prior art backplate backup pad and integrated circuit board slide, leads to the problem that production efficiency is low.
The embodiment of the application provides a semiconductor ETS equipment with modularization subframe, and it is used for semiconductor chip test, includes:
a frame;
the modularization subframe, its fixed connection be in the frame, including the frame, be equipped with integrated circuit board and the backplate that mutual plug is connected in the frame, the integrated circuit board pass through the integrated circuit board slide with frame sliding connection, the backplate with frame fixed connection.
In some embodiments: the integrated circuit board is equipped with the polylith, and polylith integrated circuit board passes through respectively the integrated circuit board slide with frame sliding connection.
In some embodiments: the integrated circuit board is characterized in that an integrated circuit board connector connected with the backboard in a plugging mode is arranged on the integrated circuit board, and a backboard connector connected with the integrated circuit board in a plugging mode is arranged on the backboard.
In some embodiments: the board card comprises a service board card, a power supply board card and a master control board card, wherein the service board card is connected with the back plate, the power supply board card is connected with the service board card, and the master control board card is connected with the service board card and the power supply board card respectively.
In some embodiments: the machine frame is a hollow hexahedral structure formed by splicing a top plate, a bottom plate, a left side frame, a right side frame and a rear side frame;
and the joints among the top plate, the bottom plate, the left side frame, the right side frame and the rear side frame are fixedly connected through screws after being pre-positioned through cylindrical pins and positioning holes.
In some embodiments: the left side frame, the right side frame and the rear side frame are all hollow structures, and fans for cooling the board card in a heat dissipation mode are connected to the left side frame, the right side frame or the rear side frame.
In some embodiments: the left side frame includes many stands and many crossbeams that mutually perpendicular connected, many the stand is followed the depth direction of frame is parallel to each other and the interval sets up, many the crossbeam is followed the direction of height of frame is parallel to each other and the interval sets up, the right side frame with the structure of left side frame is the same.
In some embodiments: the upright post is provided with a plurality of grooves connected with the cross beam along the height direction of the upright post, and the cross beam is provided with a plurality of grooves connected with the upright post along the length direction of the cross beam.
In some embodiments: the cross-section of integrated circuit board slide is the rectangular shape structure of rectangle, seted up on the lateral wall of integrated circuit board slide with integrated circuit board sliding connection's draw-in groove, keep away from on the integrated circuit board slide set up on the lateral wall of draw-in groove with the screw hole that the frame is connected.
In some embodiments: the frame is a rectangular frame formed by overlapping a plurality of sectional materials.
The beneficial effect that technical scheme that this application provided brought includes:
the embodiment of the application provides a semiconductor ETS equipment with sub-frame of modularization, because the semiconductor ETS equipment of this application has set up frame and sub-frame of modularization, the sub-frame fixed connection of modularization is in the frame, and the sub-frame of modularization includes the frame, is equipped with integrated circuit board and the backplate of mutual plug connection in the frame, and the integrated circuit board passes through integrated circuit board slide and frame sliding connection, backplate and frame fixed connection.
Therefore, the semiconductor ETS equipment adopts the modularized sub-frame and the rack to be fixedly connected, so that the accurate butt joint of the board card and the backboard in the machine frame can be ensured, secondary adaptation is not needed, and the installation and positioning efficiency of the board card and the backboard is greatly improved. The modular subframe can be directly assembled on the frame as an independent module, and the modular subframe is used as an independent module to be a self-forming reference without considering the assembly error of the frame.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a semiconductor ETS device according to an embodiment of the present application;
FIG. 2 is a schematic structural view of a modular subframe according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a frame without a top plate according to an embodiment of the present disclosure;
fig. 4 is a schematic structural view of a modular subframe of an embodiment of the present application without a top plate.
Reference numerals:
1. a modular subframe; 2. a frame; 11. a top plate; 12. a base plate; 13. a left side frame; 14. a right side frame; 15. a rear side frame; 16. a board card slideway; 17. a back plate support plate; 18. a board card; 19. a back plate; 20. a fan; 131. a column; 132. a cross member.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides a semiconductor ETS equipment with sub-frame of modularization, it can solve among the prior art backplate backup pad and integrated circuit board slide and make the moving part and need a large amount of time trial assembly and adjust the position of backplate backup pad and integrated circuit board slide in the assembly link, lead to the problem that production efficiency is low.
Referring to fig. 1 and 4, an embodiment of the present application provides a semiconductor ETS apparatus provided with a modular subframe, including:
the frame 2, this frame 2 is the rectangle frame of constituteing by many aluminium alloy ex-trusions overlap joint.
The modular subframe 1, this modular subframe 1 is connected fixedly in the framework 2, the framework 2 can be equipped with a plurality of accommodation spaces to install the modular subframe 1 according to the number of the modular subframe 1.
The modularization sub-frame 1 comprises a machine frame, wherein a board card 18 and a back plate 19 which are connected in a plugging mode are arranged in the machine frame, the board card 18 is connected with the machine frame in a sliding mode through a board card slide rail 16, and the back plate 19 is fixedly connected with the machine frame.
The utility model provides a semiconductor ETS equipment adopts sub-frame 1 of modularization and frame 2 fixed connection, can ensure that integrated circuit board 18 and backplate 19 accurate butt joint in the frame, no longer needs the secondary adaptation, very big improvement integrated circuit board 18 and backplate 19's installation positioning efficiency. The modular subframe 1 can be directly assembled to the frame 2 as an independent module, and the modular subframe 1 is self-formed as an independent module without considering the assembly error of the frame 2.
In some alternative embodiments: referring to fig. 2 and 4, in the semiconductor ETS device provided with the modular subframe according to the embodiment of the present application, a plurality of boards 18 are provided, the boards 18 are slidably connected to a machine frame through board slideways 16 along a Y-axis direction, the boards 18 are parallel to a plane formed by the Y-axis direction and an X-axis direction, and the boards 18 are sequentially arranged at intervals along a Z-axis direction. The board card 18 is provided with a board card connector which is connected with the backboard 19 in a plugging and unplugging manner, the backboard 19 is provided with a backboard connector which is connected with the board card 18 in a plugging and unplugging manner, and the board card connector and the backboard connector are plugged to realize the electric connection of the board card 18 and the backboard 19.
The board cards 18 specifically include a service board card, a power supply board card and a main control board card, the service board card is connected to the backplane 19, the power supply board card is connected to the service board card, and the main control board card is connected to the service board card and the power supply board card, respectively. The main control board card is used for controlling and monitoring the service board card and the power supply board card.
In some alternative embodiments: referring to fig. 2 and 3, the embodiment of the present application provides a semiconductor ETS apparatus provided with a modular subframe, and the subframe of the semiconductor ETS apparatus is a hollow hexahedral structure formed by splicing a top plate 11, a bottom plate 12, a left side frame 13, a right side frame 14 and a rear side frame 15. The side of the frame opposite the rear frame 15 is an opening for inserting and removing a card 18. The joints among the top plate 11, the bottom plate 12, the left side frame 13, the right side frame 14 and the rear side frame 15 are fixedly connected through screws after being pre-positioned through cylindrical pins and positioning holes. The left side frame 13, the right side frame 14 and the rear side frame 15 are vertically connected to the base plate 12 with reference to the base plate 12, and the left side frame 13 and the right side frame 14 are located on both sides of the rear side frame 15 and vertically connected to the rear side frame 15.
The board card slide way 16 is horizontally positioned in the machine frame, the board card slide way 16 is provided with a plurality of boards, and the board card slide way 16 is fixedly connected to the left side frame 13 and the right side frame 14. A plurality of board card slide ways 16 are arranged in parallel at equal intervals along the height direction of the left side frame 13 and the right side frame 14, and two board card slide ways 16 with the same height on the left side frame 13 and the right side frame 14 are used for installing the same board card 18.
Be equipped with backplate backup pad 17 in the frame, this backplate backup pad 17 is vertical direction and is located the frame, and backplate backup pad 17 and rear side frame 15 fixed connection. The rear side frame 15 is provided with a cylindrical pin for pre-positioning the back plate support plate 17 on the rear side frame 15, and the back plate support plate 17 is provided with a positioning hole matched with the cylindrical pin. Before the back plate support plate 17 is fixed to the rear side frame 15, the back plate support plate 17 is first pre-positioned by the cylindrical pins and the positioning holes, so that the mounting accuracy between the back plate support plate 17 and the rear side frame 15 is improved. The back plate 19 is fixedly mounted on the rear side frame 15 via a back plate support plate 17.
In some alternative embodiments: referring to fig. 1 and 4, the embodiment of the present application provides a semiconductor ETS device provided with a modular subframe, in which a left side frame 13, a right side frame 14, and a rear side frame 15 of the semiconductor ETS device are all hollow structures. The left side frame 13, the right side frame 14, and the rear side frame 15 are connected to a fan 20 for radiating heat from the board card 18. Because the left side frame 13, the right side frame 14 or the rear side frame 15 adopt the hollow structure, the fan 20 arranged on the left side frame 13, the right side frame 14 or the rear side frame 15 dissipates heat and cools the board card 18, and the service life of the board card 18 is prolonged.
The left side frame 13 includes many stands 131 and many crossbeams 132 that mutually perpendicular connects, and many stands 131 are parallel to each other and the interval sets up along the depth direction of frame, and many crossbeams 132 are parallel to each other and the interval sets up along the direction of height of frame, encloses into the rectangle louvre between two adjacent stands 131 and two adjacent crossbeams 132. The right frame 14 and the left frame 13 have the same structure, and the description thereof is not repeated.
In some alternative embodiments: referring to fig. 3 and 4, in the semiconductor ETS apparatus provided with the modular subframe according to the embodiment of the present invention, a plurality of grooves connected to the cross beam 132 are formed in the vertical column 131 along the height direction of the vertical column 131, and a plurality of grooves connected to the vertical column 131 are formed in the cross beam 132 along the length direction of the cross beam 132.
Grooves are formed in the vertical columns 131 and the cross beams 132, and when the vertical columns 131 and the cross beams 132 are vertically connected with each other, the grooves of the vertical columns 131 are meshed with the grooves of the cross beams 132, so that the connection reliability of the vertical columns 131 and the cross beams 132 is guaranteed. The upright 131 and the cross beam 132 are connected by screws.
In some alternative embodiments: referring to fig. 3 and 4, in the semiconductor ETS apparatus provided with the modular subframe according to the embodiment of the present application, a cross section of a board card slide way 16 of the semiconductor ETS apparatus is a rectangular long strip-shaped structure, and a card slot slidably connected with a board card 18 is formed on a side wall of the board card slide way 16. And a threaded hole connected with the left side frame 13 or the right side frame 14 is formed in the side wall, far away from the clamping groove, of the board card slide way 16. The board card slideway 16 is fixedly connected with the left side frame 13 or the right side frame 14 through screws.
A positioning pin is further arranged on the side wall, far away from the clamping groove, of the board card slide way 16, and a positioning hole connected with the positioning pin is arranged on the left side frame 13 or the right side frame 14. Before the board card slide way 16 is fixed on the left side frame 13 or the right side frame 14, the board card slide way 16 is pre-positioned through the cylindrical pin and the positioning hole, and the installation accuracy between the board card slide way 16 and the left side frame 13 or the right side frame 14 is improved.
Principle of operation
The embodiment of the application provides a semiconductor ETS equipment with modularization sub-frame, because the semiconductor ETS equipment of this application has set up frame 2 and modularization sub-frame 1, modularization sub-frame 1 fixed connection is in frame 2, and modularization sub-frame 1 includes the frame, is equipped with integrated circuit board 18 and backplate 19 of mutual plug connection in the frame, and integrated circuit board 18 passes through integrated circuit board slide 16 and frame sliding connection, backplate 19 and frame fixed connection.
The utility model provides a semiconductor ETS equipment adopts sub-frame 1 of modularization and frame 2 fixed connection, can ensure that integrated circuit board 18 and backplate 19 accurate butt joint in the frame, no longer needs the secondary adaptation, very big improvement integrated circuit board 18 and backplate 19's installation positioning efficiency. The modular subframe 1 can be directly assembled to the frame 2 as an independent module, and the modular subframe 1 is self-formed as an independent module without considering the assembly error of the frame 2.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
It is noted that, in the present application, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A semiconductor ETS device provided with a modular subframe for semiconductor chip testing, comprising:
a frame (2);
modularization sub-frame (1), its fixed connection be in frame (2), including the frame, be equipped with integrated circuit board (18) and backplate (19) of mutual plug connection in the frame, integrated circuit board (18) pass through integrated circuit board slide (16) with frame sliding connection, backplate (19) with frame fixed connection.
2. A semiconductor ETS device provided with a modular subframe as claimed in claim 1, wherein:
integrated circuit board (18) are equipped with the polylith, the polylith integrated circuit board (18) pass through respectively integrated circuit board slide (16) with frame sliding connection.
3. A semiconductor ETS device provided with a modular subframe as claimed in claim 1, wherein:
the integrated circuit board is characterized in that an integrated circuit board connector connected with the backboard (19) in a plugging mode is arranged on the integrated circuit board (18), and a backboard connector connected with the integrated circuit board (18) in the plugging mode is arranged on the backboard (19).
4. A semiconductor ETS device provided with a modular subframe as claimed in claim 1, wherein:
the board card (18) comprises a service board card, a power supply board card and a master control board card, the service board card is connected with the back plate (19), the power supply board card is connected with the service board card, and the master control board card is connected with the service board card and the power supply board card respectively.
5. A semiconductor ETS device provided with a modular subframe as claimed in claim 1, wherein:
the machine frame is a hollow hexahedral structure formed by splicing a top plate (11), a bottom plate (12), a left side frame (13), a right side frame (14) and a rear side frame (15);
the connecting parts among the top plate (11), the bottom plate (12), the left side frame (13), the right side frame (14) and the rear side frame (15) are fixedly connected through screws after being pre-positioned through cylindrical pins and positioning holes.
6. A semiconductor ETS apparatus provided with a modular subframe as claimed in claim 5, wherein:
the heat dissipation device is characterized in that the left side frame (13), the right side frame (14) and the rear side frame (15) are all of hollow structures, and the left side frame (13), the right side frame (14) or the rear side frame (15) are connected with a fan (20) for cooling the board card (18) for heat dissipation.
7. A semiconductor ETS apparatus provided with a modular subframe as claimed in claim 5 or 6, wherein:
left side frame (13) are including many stands (131) and many crossbeams (132) that mutually perpendicular connects, many stand (131) are followed the depth direction of frame is parallel to each other and the interval sets up, many crossbeam (132) are followed the direction of height of frame is parallel to each other and the interval sets up, right side frame (14) with the structure of left side frame (13) is the same.
8. A semiconductor ETS device provided with a modular subframe as claimed in claim 7, wherein:
the vertical column (131) is provided with a plurality of grooves connected with the cross beam (132) along the height direction of the vertical column (131), and the cross beam (132) is provided with a plurality of grooves connected with the vertical column (131) along the length direction of the cross beam (132).
9. A semiconductor ETS device provided with a modular subframe as claimed in claim 1, wherein:
the cross-section of integrated circuit board slide (16) is the rectangular shape structure, seted up on the lateral wall of integrated circuit board slide (16) with integrated circuit board (18) sliding connection's draw-in groove, keep away from on integrated circuit board slide (16) set up on the lateral wall of draw-in groove with the screw hole that the frame is connected.
10. A semiconductor ETS device provided with a modular subframe as claimed in claim 1, wherein:
the frame (2) is a rectangular frame formed by overlapping a plurality of sectional materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022849452.0U CN212301771U (en) | 2020-12-02 | 2020-12-02 | Semiconductor ETS equipment with sub-frame of modularization |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022849452.0U CN212301771U (en) | 2020-12-02 | 2020-12-02 | Semiconductor ETS equipment with sub-frame of modularization |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212301771U true CN212301771U (en) | 2021-01-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022849452.0U Active CN212301771U (en) | 2020-12-02 | 2020-12-02 | Semiconductor ETS equipment with sub-frame of modularization |
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| Country | Link |
|---|---|
| CN (1) | CN212301771U (en) |
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- 2020-12-02 CN CN202022849452.0U patent/CN212301771U/en active Active
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