CN212293727U - Vacuum plating multilayer film structure and electronic equipment rear cover - Google Patents
Vacuum plating multilayer film structure and electronic equipment rear cover Download PDFInfo
- Publication number
- CN212293727U CN212293727U CN202020359100.4U CN202020359100U CN212293727U CN 212293727 U CN212293727 U CN 212293727U CN 202020359100 U CN202020359100 U CN 202020359100U CN 212293727 U CN212293727 U CN 212293727U
- Authority
- CN
- China
- Prior art keywords
- film
- dielectric
- dielectric film
- films
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model provides a vacuum coating multilayer film structure, pile up the section and pile up the section with mixed membrane including the dielectric film, the dielectric film piles up the section including the multilayer dielectric film that piles up each other, mixed membrane piles up the section and includes multilayer dielectric film and multilayer metal film, every layer dielectric film and every layer the metal film piles up the formation in turn each other in proper order mixed membrane piles up the section, the dielectric film that the section was piled up to the dielectric film with mixed membrane piles up the metal film contact of section. Through the utility model discloses, a lid behind vacuum plating multilayer film structure and the electronic equipment who simplifies the vacuum plating technology degree of difficulty, provides colour film colour effect and cohesion is provided.
Description
Technical Field
The utility model belongs to the technical field of the coating film, concretely relates to lid behind vacuum plating multilayer film structure and electronic equipment.
Background
With the development of technology, a large number of powerful electronic devices are produced and enter the market, such as mobile phones, MP3, IPADs, mobile hard disks, electronic paper book readers, and the like. The front of these devices is generally a display touch screen for implementing the interactive function of the electronic device, and the material, color and texture of the rear cover are also a lot of attention of consumers.
In order to improve the strength, aesthetic feeling and technological sense of the rear cover, designers adopt a metal material to manufacture the shell, but along with the high frequency of current in the electronic equipment, the metal material shell cannot have good electromagnetic shielding performance, so that the rear cover made of glass, resin and other materials becomes the development trend of future products of the electronic equipment.
In order to form different colors on the rear cover of the electronic equipment, the prior art adopts an optical interference principle, and prepares a color film of the rear cover of the electronic equipment by matching a vacuum coating with an ink printing process. In the mode, vacuum coating and ink printing are two completely different processes, and are matched and optimized with each other to meet the final performance requirement of the color film, so that the process difficulty is increased, the problems of color effect, binding force and the like are solved, and the process cost is increased.
SUMMERY OF THE UTILITY MODEL
Therefore, the utility model aims to overcome the not enough of prior art existence, and provide a lid behind vacuum plating multilayer film structure and the electronic equipment who simplifies the vacuum plating technology degree of difficulty, improves color film color effect and cohesion.
The utility model aims at accomplishing through following technical scheme, a vacuum coating multilayer film structure, pile up section and mixed membrane pile up the section including the dielectric film, the dielectric film piles up the section including the multilayer dielectric film that piles up each other, mixed membrane piles up the section and includes multilayer dielectric film and multilayer metal film, every layer the dielectric film and every layer the metal film piles up the formation in turn each other in proper order mixed membrane piles up the section, the dielectric film that the section was piled up to the dielectric film with mixed membrane piles up the metal film contact of section.
The utility model discloses a multilayer film structure, dielectric film produce required colour through interfering the principle, and the metal film is through absorbing principle reinforcing colour contrast, reduces the transmissivity of back light, piles up the cooperation through mutual alternation between dielectric film and the metal film, only utilizes the vacuum plating technology to realize the colour film on the apron, avoids using ink printing technology, has reduced the film forming technology degree of difficulty, has improved the colour effect and the cohesion of colour film, has reduced the technology cost.
Further, the utility model discloses a vacuum plating multilayer film structure, in the multilayer dielectric film of dielectric film stack section, the dielectric material between the adjacent dielectric film is different.
Further, the utility model discloses a vacuum plating multilayer film structure, the multilayer dielectric film that the dielectric film piles up the section comprises first dielectric film and second dielectric film.
Further, the utility model discloses a vacuum plating multilayer film structure, first dielectric film material is titanium oxide, tantalum oxide, zirconia, hafnium oxide, silicon oxide, aluminium oxide or magnesium fluoride, second dielectric film material is titanium oxide, tantalum oxide, zirconium oxide, hafnium oxide, silicon oxide, aluminium oxide or magnesium fluoride.
Further, the utility model discloses a vacuum plating multilayer film structure, the dielectric film piles up the section and includes 3 layers of first dielectric film and 3 layers of second dielectric film.
Further, the utility model discloses a vacuum plating multilayer film structure, the multilayer dielectric film in the section is piled up to mixed membrane includes the dielectric film of multiple different materials.
Further, the utility model discloses a vacuum plating multilayer film structure, the multilayer dielectric film that mixed membrane piles up in the section is the dielectric film of same material, and multilayer metallic film is the metallic film of same material.
Further, the utility model discloses a vacuum plating multilayer film structure, the mixed membrane piles up the section and includes 4 layers of dielectric film and 4 layers of metallic film.
Further, the utility model discloses a vacuum plating multilayer film structure, the dielectric film material is titanium oxide, tantalum oxide, zirconia, hafnium oxide, silicon oxide, aluminium oxide or magnesium fluoride, the metal film material is silver, chromium, aluminium, indium, tin, gold or copper.
Another object of the present invention is to provide a rear cover of an electronic device, which comprises a substrate and a plurality of layers of vacuum-plated film structures covering the outer surface of the substrate, wherein the substrate, the dielectric film stacking section and the mixed film stacking section are sequentially stacked.
The utility model discloses an above-mentioned technical scheme can realize following effect:
through the mutual alternate stacking cooperation between the dielectric film and the metal film on the rear cover of the electronic equipment, the use of an ink printing process is avoided, the difficulty of a film forming process is reduced, the color effect and the binding force of the color film are improved, and the process cost is reduced.
Drawings
Fig. 1 is a schematic view of a first embodiment of the present invention;
fig. 2 is a schematic view of a second embodiment of the present invention;
fig. 3 is a schematic view of a third embodiment of the present invention.
The reference numbers in the figures denote:
1-substrate, 2-first dielectric film, 3-second dielectric film, 4-metal film.
Detailed Description
The principles and spirit of the present invention will be described with reference to a number of exemplary embodiments. It should be understood that these embodiments are given solely for the purpose of enabling those skilled in the art to better understand and thereby implement the present invention, and are not intended to limit the scope of the invention in any way.
The utility model discloses a vacuum plating multilayer film structure, through the vacuum plating mode with multilayer film structure deposit on electronic equipment's base plate 1 on the surface, through the membrane thickness, membrane material and the collocation mode of adjusting each rete, generate the color film of different colour demands.
The utility model discloses first embodiment, vacuum plating multilayer film structure includes that the dielectric film piles up the section and mixes the membrane pile section, and the dielectric film piles up the direct deposit of section and on the base plate 1 of lid behind the electronic equipment, mixes the membrane pile section deposit and pile up the section on the dielectric film, forms the lid behind the complete electronic equipment that has the color film.
In this embodiment, the dielectric film stack segment includes 4 layers, wherein 2 layers of the first dielectric film 2 and 2 layers of the second dielectric film 3, the first dielectric film 2 is directly deposited on the substrate 1, the second dielectric film 3 is continuously deposited on the first dielectric film 2, and subsequently, 1 layer of the first dielectric film 2 and 1 layer of the second dielectric film 3 are sequentially deposited, thereby forming a complete dielectric film stack segment.
In this embodiment, the mixed film stacking segment is continuously deposited on the dielectric film stacking segment, the mixed film stacking segment includes 6 layers, 3 layers of second dielectric films 3, 3 layers of metal films 4, the metal films 4 are directly deposited on the second dielectric films 3 of the dielectric film stacking segment, one layer of the second dielectric films 3 is continuously deposited on the metal films 4, and subsequently, 2 layers of the metal films 4 and 2 layers of the second dielectric films 3 are sequentially deposited, so as to form a complete mixed film stacking segment.
In this embodiment, the second dielectric film 3 of mixed membrane stack section produces required colour through interfering the principle, and the metal level 4 is through absorbing the principle reinforcing colour contrast, reduces the transmissivity of back light, through piling up the cooperation in turn each other between second dielectric film 3 and the metal film 4, through interfering many times and absorbing, finally realizes the colour membrane on the base plate 1, avoids using ink printing process, has reduced the film forming process degree of difficulty, has improved the colour effect and the cohesion of colour membrane, has reduced the technology cost.
As shown in fig. 2, the second embodiment of the present invention, the dielectric film stacking section includes 6 layers, wherein 3 layers of the first dielectric film 2, 3 layers of the second dielectric film 3, the first dielectric film 2 is directly deposited on the substrate 1, the second dielectric film 3 is continuously deposited on the first dielectric film 2, and subsequently 2 layers of the first dielectric film 2 and 2 layers of the second dielectric film 3 are sequentially deposited again, thereby forming a complete dielectric film stacking section.
In this embodiment, the mixed film stacking segment is continuously deposited on the dielectric film stacking segment, the mixed film stacking segment includes 4 layers, 2 layers of second dielectric films 3, 2 layers of metal films 4, the metal films 4 are directly deposited on the second dielectric films 3 of the dielectric film stacking segment, one layer of second dielectric film 3 is continuously deposited on the metal films 4, and subsequently, 1 layer of metal film 4 and 1 layer of second dielectric film 3 are sequentially deposited again, so as to form a complete mixed film stacking segment.
As shown in fig. 3, the third embodiment of the present invention, the dielectric film stacking section includes 6 layers, wherein 3 layers of the first dielectric film 2, 3 layers of the second dielectric film 3, the first dielectric film 2 is directly deposited on the substrate 1, the second dielectric film 3 is continuously deposited on the first dielectric film 2, and subsequently 2 layers of the first dielectric film 2 and 2 layers of the second dielectric film 3 are sequentially deposited again, thereby forming a complete dielectric film stacking section.
In this embodiment, the mixed film stacking segment is continuously deposited on the dielectric film stacking segment, the mixed film stacking segment includes 8 layers, 4 layers of second dielectric films 3, 4 layers of metal films 4, the metal films 4 are directly deposited on the second dielectric films 3 of the dielectric film stacking segment, one layer of second dielectric film 3 is continuously deposited on the metal films 4, and subsequently, 3 layers of metal films 4 and 3 layers of second dielectric films 3 are sequentially deposited again, so as to form a complete mixed film stacking segment.
It should be noted that, in the utility model discloses in, the multilayer dielectric film of dielectric film stack section is used for realizing the required colour of multilayer film structure through interfering the principle, as long as the membrane material can realize interfering, and the membrane material between each layer dielectric film can be the same, also can be different. For example, in the dielectric film stacking section, the multilayer dielectric film may be formed by alternately stacking two dielectric films of different materials in sequence, or by alternately stacking three dielectric films of different materials in sequence, or by alternately depositing dielectric films of different materials after stacking two dielectric films of the same material without alternately stacking in sequence. For example, a dielectric film stack segment may also be formed by stacking multiple layers of dielectric films of the same material.
It should be noted that, in the present invention, the mixed film stacking section includes a plurality of dielectric films and a plurality of metal films, wherein each dielectric film and each metal film are stacked in sequence. In the mixed film stacking section, the dielectric film generates required colors according to an interference principle, the metal film enhances the color contrast according to an absorption principle, the transmittance of back light is reduced, the dielectric film and the metal film are alternately stacked and matched with each other, and the color film on the substrate 1 is finally realized through multiple interference and absorption, so that the ink printing process is avoided, the film forming process difficulty is reduced, the color effect and the bonding force of the color film are improved, and the process cost is reduced. Therefore, the dielectric film can be used as the dielectric film of the mixed film stacking section as long as the film material can realize interference, and the metal film can be used as the metal film of the mixed film stacking section as long as the film material can realize absorption, without limitation on whether the materials of the dielectric films are the same or whether the materials of the metal films are the same. For example, in the mixed film stacking section, the multilayer dielectric films may be two dielectric films of different materials stacked alternately with metal films in sequence, may also be three dielectric films of different materials stacked alternately with metal films in sequence, and may also be dielectric films of the same or different materials stacked alternately with metal films in sequence.
Specifically, the first dielectric film 2 and the second dielectric film 3 may be high refractive index dielectric films or low refractive index dielectric films, or one of the dielectric films may be a high refractive index dielectric film and the other dielectric film may be a low refractive index dielectric film. Specifically, the high refractive index dielectric film of the present invention may be titanium oxide, tantalum oxide, zirconium oxide, or hafnium oxide, or may be other dielectric film materials having high refractive index characteristics. Specifically, the low refractive index dielectric film of the present invention may be silicon oxide, aluminum oxide or magnesium fluoride, or may be other dielectric film materials with low refractive index characteristics.
Specifically, the metal film 4 may be silver, chromium, aluminum, indium, tin, gold, or copper, or may be other metal film materials having an absorbing ability.
In the fourth embodiment of the present invention, the thickness of each dielectric film is 1-200 nm, preferably 30-150 nm, and preferably 60-120 nm.
In the fifth embodiment of the present invention, the thickness of each metal film is 1 to 100 nm, preferably 30 to 70 nm, and preferably 50 to 60 nm.
The utility model discloses multilayer film structure concrete forming process step:
s1, placing the rear cover of the electronic equipment into a vacuum cavity for vacuumizing;
s2, performing ion source cleaning on the surface of the rear cover of the electronic equipment;
and S3, sequentially depositing each layer of film on the surface of the rear cover of the electronic equipment, wherein the deposition process can be conventional vacuum coating such as vacuum evaporation and sputtering.
The utility model discloses a multilayer film structure, dielectric film produce required colour through interfering the principle, and the metal film is through absorbing principle reinforcing colour contrast, reduces the transmissivity of back light, piles up the cooperation through mutual alternation between dielectric layer and the metal level, only utilizes the vacuum plating technology to realize the colour film on the apron, avoids using ink printing technology, has reduced the film forming technology degree of difficulty, has improved the colour effect and the cohesion of colour film, has reduced the technology cost.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention. The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A vacuum plating multilayer film structure is characterized in that: the dielectric film stacking section comprises a dielectric film stacking section and a mixed film stacking section, wherein the dielectric film stacking section comprises a plurality of layers of dielectric films which are stacked mutually, the mixed film stacking section comprises a plurality of layers of dielectric films and a plurality of layers of metal films (4), each layer of dielectric film and each layer of metal films (4) are sequentially and alternately stacked to form the mixed film stacking section, and the dielectric films of the dielectric film stacking section are contacted with the metal films (4) of the mixed film stacking section.
2. The vacuum plated multilayer film structure of claim 1, wherein: in the multilayer dielectric films of the dielectric film stacking section, dielectric materials between adjacent dielectric films are different.
3. The vacuum plated multilayer film structure of claim 2, wherein: the multilayer dielectric film of the dielectric film stacking section is composed of a first dielectric film (2) and a second dielectric film (3).
4. The vacuum plated multilayer film structure of claim 3, wherein: the first dielectric film (2) is made of titanium oxide, tantalum oxide, zirconium oxide, hafnium oxide, silicon oxide, aluminum oxide or magnesium fluoride, and the second dielectric film (3) is made of titanium oxide, tantalum oxide, zirconium oxide, hafnium oxide, silicon oxide, aluminum oxide or magnesium fluoride.
5. The vacuum plated multilayer film structure of claim 3, wherein: the dielectric film stack section comprises 3 layers of first dielectric films (2) and 3 layers of second dielectric films (3).
6. The vacuum plated multilayer film structure of claim 1, wherein: the multilayer dielectric films in the mixed film stack section include dielectric films of a plurality of different materials.
7. The vacuum plated multilayer film structure of claim 1, wherein: the multilayer dielectric films in the mixed film stacking section are dielectric films made of the same materials, and the multilayer metal films are metal films made of the same materials.
8. The vacuum plated multilayer film structure of claim 1, wherein: the dielectric film stack segment includes 4 dielectric films and 4 metal films (4).
9. The vacuum plated multilayer film structure of claim 7, wherein: the dielectric film material is titanium oxide, tantalum oxide, zirconium oxide, hafnium oxide, silicon oxide, aluminum oxide or magnesium fluoride, and the metal film (4) material is silver, chromium, aluminum, indium, tin, gold or copper.
10. A lid behind electronic equipment which characterized in that: comprising a substrate (1) and a vacuum-coated multilayer film structure according to any one of claims 1 to 9 covering the outer surface of the substrate (1), the dielectric film stack section and the hybrid film stack section being stacked one on top of the other in this order.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020359100.4U CN212293727U (en) | 2020-03-20 | 2020-03-20 | Vacuum plating multilayer film structure and electronic equipment rear cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020359100.4U CN212293727U (en) | 2020-03-20 | 2020-03-20 | Vacuum plating multilayer film structure and electronic equipment rear cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212293727U true CN212293727U (en) | 2021-01-05 |
Family
ID=73960685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020359100.4U Active CN212293727U (en) | 2020-03-20 | 2020-03-20 | Vacuum plating multilayer film structure and electronic equipment rear cover |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212293727U (en) |
-
2020
- 2020-03-20 CN CN202020359100.4U patent/CN212293727U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5924784B2 (en) | Conductive structure and manufacturing method thereof | |
| US8859911B2 (en) | Touch panel comprising conductive pattern | |
| EP2666077B1 (en) | Transparent touch panel | |
| KR101306563B1 (en) | Conductive structure body and method for manufacturing the same | |
| JP4862969B1 (en) | Transparent conductive element, input device, electronic device and transparent conductive element manufacturing master | |
| US9891731B2 (en) | Touch panel, method of producing the same, optical thin film substrate and method of producing the same | |
| KR101045026B1 (en) | Transparent conductive multilayered film, producing method of the same, and touch panel containing the same | |
| TWI514211B (en) | Touch panel and method for fabricating the same | |
| JP2013152579A (en) | Transparent conductive element, input device, electronic apparatus, and master for manufacturing transparent conductive element | |
| JP2010061425A (en) | Touch panel and display device using the same | |
| TWM343210U (en) | Display panel integrating the touch-control structure | |
| JP2014093070A (en) | Touch panel and manufacturing method of the same | |
| US20120292170A1 (en) | Touch panel | |
| CN212293727U (en) | Vacuum plating multilayer film structure and electronic equipment rear cover | |
| KR101125701B1 (en) | Touch panel device and method manufacturing it | |
| JP4245339B2 (en) | Method for producing conductive transparent substrate with multilayer film | |
| WO2015166954A1 (en) | Touch panel, method for manufacturing touch panel and optical thin film | |
| TW201005611A (en) | The touch screen and the manufacturing method thereof | |
| JPWO2014188683A1 (en) | Electrode substrate for touch panel, touch panel including the same, and display panel | |
| TW201719347A (en) | Touch panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |