CN212276105U - Two-dimensional micromirror - Google Patents
Two-dimensional micromirror Download PDFInfo
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- CN212276105U CN212276105U CN201922195721.3U CN201922195721U CN212276105U CN 212276105 U CN212276105 U CN 212276105U CN 201922195721 U CN201922195721 U CN 201922195721U CN 212276105 U CN212276105 U CN 212276105U
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Abstract
The utility model relates to a two-dimensional micromirror, including first device layer, first insulation layer and second device layer, through first device layer sets up first electric isolation groove and the mode that the frame was consolidated in the setting of second device layer, first electric isolation groove only needs to carry out the sculpture technology for cellular-type electric isolation groove, needn't fill, can guarantee the mirror surface with movable frame electricity is kept apart, it will to consolidate the frame the regional connection together separated by first electric isolation groove on the movable frame, not only avoided the complicated technology in cellular-type electric isolation groove, can also play the reinforcement the effect of movable frame's rigidity, greatly reduced the cost of production.
Description
Technical Field
The utility model relates to a micro-electro-mechanical systems technical field, in particular to two-dimensional micro mirror.
Background
Since the first type of scanning silicon mirror was released in 1980, Micro Electro Mechanical Systems (MEMS), which is hereinafter referred to as MEMS, has been widely used in the field of optical scanning, and a large number of technologies and products have been developed. The field of optical scanning has become an important direction of MEMS research. With the development of technology, in the past decade, the application of micro-projection technology and numerous medical imaging technologies has become the main direction for the development of current MEMS optical scanning devices, especially laser scanning devices. The development of miniature projection technology has promoted the appearance of a series of novel products, for example miniature laser projector of cell-phone size or the smart mobile phone that has laser projection function, the new line display HUD that can be used to show navigation information that places when driving the vehicle in the car, various wearable equipment including virtual reality technique VR, augmented reality technique AR etc..
Electrostatic actuation is one of the primary actuation modes of MEMS micromirrors. When the micro-mirror works, the micro-mirror is driven by a periodic electric signal to generate an electrostatic force, so that the mirror surface of the micro-mirror moves periodically.
The existing electrostatic driving two-dimensional micro-mirror mostly adopts a form of combining a movable frame and a fixed frame to realize two-dimensional deflection, and an electric isolation groove must be arranged on the movable frame to keep insulation between moving comb teeth and static comb teeth. In order to connect the areas of the movable frame separated by the electrical isolation grooves together, which remain relatively stationary, filled electrical isolation grooves must be used. However, the filled electrical isolation trench needs to be subjected to multiple processes such as trench etching, insulation layer deposition/oxidation, polysilicon filling and the like during manufacturing, which greatly increases the complexity of the production process and increases the production cost.
Disclosure of Invention
The to-be-solved technical problem of the utility model is that the production technology that the filled electrical isolation groove that current micro mirror adopted caused is complicated, problem that manufacturing cost is high.
In order to solve the technical problem, the utility model discloses a two-dimensional micromirror is made by the SOI wafer, the SOI wafer includes: the device comprises a first device layer, a first insulating layer and a second device layer, wherein the first device layer, the first insulating layer and the second device layer are sequentially stacked from top to bottom;
the first device layer comprises a mirror surface and a movable frame, the mirror surface is arranged in the center of the movable frame, the movable frame is provided with a first electric isolation groove, the first electric isolation groove is a separated electric isolation groove, and the first electric isolation groove electrically isolates the mirror surface from the movable frame;
the second device layer comprises a reinforcing frame, the reinforcing frame is arranged below the movable frame, and the position of the reinforcing frame is matched with that of the movable frame.
Further, the movable frame is provided with second static comb teeth which are arranged along the Y-axis direction;
the first device layer further comprises a driving rod, one end of the driving rod is rigidly connected with the mirror surface, the other end of the driving rod is axially far away from the mirror surface along the Y direction, the second movable comb teeth are distributed on the driving rod, and the second movable comb teeth and the second static comb teeth are distributed in a staggered mode.
Further, the first device layer further comprises a first fixed frame, a first torsion shaft and a second torsion shaft;
the first fixed frame is erected around the movable frame;
one end of the first torsion shaft is connected with the first fixed frame, and the other end of the first torsion shaft is connected with the movable frame;
one end of the second torsion shaft is connected with the mirror surface, and the other end of the second torsion shaft is connected with the movable frame.
Furthermore, the movable frame is also provided with first movable comb teeth which are arranged along the X-axis direction;
the second device layer comprises a second fixed frame, and the second fixed frame is erected around the reinforced frame;
the second fixed frame is provided with first static comb teeth, and the first static comb teeth and the first moving comb teeth are arranged in a staggered mode in the vertical direction.
Furthermore, the first fixing frame is provided with an anchor point and a second electric isolation groove, and the second electric isolation groove is arranged around the anchor point;
one end of the first torsion shaft is connected with the anchor point, and the other end of the first torsion shaft is connected with the movable frame.
Furthermore, the second fixed frame is provided with a third electric isolation groove which surrounds the first static comb teeth.
Further, the first electrically isolating groove has a width gradually increasing toward an end of the mirror surface.
Further, the width of the reinforcing frame is T1, the width of the movable frame is T2, wherein 0.5 ≦ T1/T2 ≦ 1.5.
Furthermore, the reinforcing frame is provided with a groove, and the opening direction of the groove faces the second torsion shaft.
Furthermore, the SOI wafer further comprises a second insulating layer and a substrate layer, and the SOI wafer is formed by sequentially stacking the first device layer, the first insulating layer, the second device layer, the second insulating layer and the substrate layer from top to bottom;
the SOI wafer is provided with a cavity, and the movable frame, the mirror surface and the reinforcing frame are all located right above the cavity.
Adopt above-mentioned technical scheme, two-dimensional micromirror have following beneficial effect:
the two-dimensional micro-mirror comprises a first device layer, a first insulating layer and a second device layer, wherein the first device layer comprises a mirror surface and a movable frame, the movable frame is provided with a first electric isolation groove, and the first electric isolation groove is a separated electric isolation groove; the second device layer comprises a reinforcing frame, and the reinforcing frame is arranged below the movable frame and matched with the movable frame in position. Two-dimensional micro mirror is through adopting cellular-type electricity isolation groove and the mode that consolidates the frame phase combination, the first electricity isolation groove on first device layer only needs to carry out the sculpture technology, needn't fill, can guarantee the mirror surface with movable frame electricity is kept apart, through second device layer sets up consolidate the frame, it will to consolidate the frame be in the same place by the regional connection that first electricity isolation groove is separated on the movable frame, has not only avoided the complicated technology in filled formula electricity isolation groove, can also play the reinforcement the effect of movable frame's rigidity, greatly reduced the cost of production.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a top view of a two-dimensional micromirror according to an embodiment of the invention;
fig. 2 is a side view of a two-dimensional micromirror according to an embodiment of the invention;
fig. 3 is a first device layer according to an embodiment of the present invention;
fig. 4 is a second device layer according to an embodiment of the present invention;
FIG. 5 is a cross-sectional view taken along line A-A of FIG. 1;
FIG. 6 is a detailed view of block a of FIG. 3;
FIG. 7 is a detailed view of block b of FIG. 3;
FIG. 8 is a substrate layer of the present invention;
the following is a supplementary description of the drawings:
110-a first device layer; 111-mirror surface; 112-a movable frame; 113 a-a first electrically isolated tank; 113 b-a second electrically isolated tank; 114-a first fixed frame; 115 a-a first torsion axis; 115 b-a second torsion axis; 116-anchor point; 117-first moving comb teeth; 118 a-a second movable comb; 118 b-a second static comb; 119-a drive rod; 120-an island structure; 121-conductive blocks;
210-a first insulating layer;
310-a second device layer; 311-a groove; 312 — a reinforcing frame; 313 c-a third electrically isolated tank; 314-a second fixed frame; 317-first stationary comb teeth;
410-a second insulating layer; 510-a substrate layer; 511-cavity.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with at least one implementation of the invention is included. In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," and the like are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or otherwise described herein.
Example 1:
as shown in fig. 1 and 2, a two-dimensional micromirror is made of an SOI wafer comprising: a first device layer 110, a first insulating layer 210 and a second device layer 310, wherein the first device layer 110, the first insulating layer 210 and the second device layer 310 are stacked in sequence from top to bottom;
as shown in fig. 3, the first device layer 110 includes a mirror 111 and a movable frame 112, the mirror 111 is disposed at a central position of the movable frame 112, the movable frame 112 is disposed with a first electrical isolation groove 113a, the first electrical isolation groove 113a is a separated electrical isolation groove, and the first electrical isolation groove 113a electrically isolates the mirror 111 from the movable frame 112;
as shown in fig. 4, the second device layer 310 includes a reinforcing frame 312, the reinforcing frame 312 is disposed below the movable frame 112, and the position of the reinforcing frame 312 matches the position of the movable frame 112.
Two-dimensional micromirror, mirror surface 111 connects in movable frame 112, along with movable frame 112 rotates around the X axle together, simultaneously mirror surface 111 can rotate around the Y axle in movable frame 112, consequently obtains the diaxon deflection motion simultaneously.
Through the implementation of the technical scheme, the utility model discloses first electric isolation groove 113a only needs to carry out the sculpture technology, needn't fill, can guarantee mirror surface 111 with movable frame 112 electric isolation, through consolidate frame 312 will movable frame 112 is last by the regional connection of first electric isolation groove 113a spaced together, has not only avoided the complicated technology in filled electric isolation groove, can also play the reinforcement the effect of movable frame 112's rigidity, greatly reduced the cost of production.
The upper surface of the mirror 111 is plated with a metal reflecting layer by evaporation, the material is gold or aluminum, and the thickness is 50-500 nm.
As shown in fig. 3, the movable frame 112 is provided with second stationary comb teeth 118b, and the second stationary comb teeth 118b are arranged along the Y-axis direction;
It should be noted that, the embodiment of the present invention does not describe the number, size, and interval of the comb structure, the number, size, and interval of the comb structure need to be designed according to the actual requirement, so that the other embodiments of the present invention can adjust and modify the comb structure, which is within the protection scope of the present invention.
The first electric isolation groove 113a electrically isolates the second movable comb teeth 118a from the first movable comb teeth 117a, so that electric signals of an X axis and an Y axis are not interfered with each other, the first electric isolation groove 113a is formed through a deep etching process, filling is not needed, and the process complexity is reduced.
As shown in fig. 3, the first device layer 110 further includes a first fixing frame 114, a first torsion axis 115a, and a second torsion axis 115 b;
the first fixed frame 114 is disposed around the movable frame 112;
one end of the first torsion shaft 115a is connected to the first fixed frame 114, the other end of the first torsion shaft 115a is connected to the movable frame 112, and the first torsion shaft 115a provides X-axis deflection for the two-dimensional micromirror;
one end of the second torsion axis 115b is connected to the mirror surface 111, the other end of the second torsion axis 115b is connected to the movable frame 112, and the second torsion axis 115b provides Y-axis deflection for the two-dimensional micromirror.
The movable frame 112 is further provided with first movable comb teeth 117, and the first movable comb teeth 117 are arranged along the X-axis direction;
as shown in fig. 4, the second device layer 310 includes a second fixing frame 314, and the second fixing frame 314 is disposed around the reinforcing frame 312;
as shown in fig. 5, the second fixed frame 314 is provided with first fixed comb teeth 317, the first fixed comb teeth 317 and the first movable comb teeth 117 are arranged in a staggered manner in the vertical direction to jointly form the two-dimensional micromirror X-axis driving comb tooth structure, and the X-driving comb tooth structure is formed by vertically arranging the fixed comb teeth and the movable comb teeth.
It should be noted that, in other embodiments of the present invention, the X-axis driving comb structures may also be arranged in a plane, wherein the first stationary comb 317 is disposed on the first fixed frame 114 of the first device layer 110, and is arranged in a staggered manner with the first movable comb 117.
As shown in fig. 3, the first fixed frame 114 is provided with an anchor point 116, one end of the first torsion shaft 115a is connected to the anchor point 116, and the other end of the first torsion shaft 115a is connected to the movable frame 112.
The first fixing frame 114 is further provided with a second electrical isolation groove 113b, the second electrical isolation groove 113b is arranged around the anchor point 116, and the anchor point 116 and the first fixing frame 114 are electrically isolated by the second electrical isolation groove 113 b;
a metal pad is arranged on the surface of the anchor point 116, and the metal pad is formed through a metal evaporation process; in this embodiment, the metal pad is made of gold and has a thickness of 50-500 nm.
Specifically, as shown in fig. 6, the metal pad is connected by a lead, and an electrical signal provided by an external circuit is introduced by the anchor point 116, and is transmitted to the second movable comb teeth 118a through the conductive block 121, where the conductive block 121 is an area isolated by two first electrical isolation grooves 113 a; in addition, the regions separated by the first electrical isolation grooves 113a will be fixed by the reinforcing frame 312, which has the first insulating layer 210 sandwiched between the movable frame 112, achieving the effect of insulation between the two layers; it should be noted that, in the present invention, the number, size and specific arrangement position of the anchor points 116 and the metal pads need to be designed according to actual situations.
The width of the reinforcing frame 312 is T1, the width of the movable frame 112 is T2, wherein 0.5 ≦ T1/T2 ≦ 1.5, and the thickness of the reinforcing frame 312 may vary from 10 μm to 100 μm.
It should be noted that it is within the scope of the present invention to change only the size or thickness of the reinforcing frame 312; in addition, the first electrical isolation groove 113a and the arrangement position of the reinforcing frame 312 have different combination design modes according to actual conditions, which all belong to the protection scope of the present invention.
As shown in fig. 4, the second fixed frame 314 is provided with a third electrical isolation groove 313c, the third electrical isolation groove 313c is disposed around the first stationary comb teeth 317, the third electrical isolation groove 313c electrically isolates the first stationary comb teeth 317 from the second fixed frame 314, a metal pad is disposed at a position close to the first stationary comb teeth 317, a window is disposed on the first device layer 110, the window is opened to the metal pad of the second device layer 310, and an external circuit signal is introduced from the metal pad to the first stationary comb teeth 317 through a lead.
As shown in fig. 7, the first electrical isolation groove 113a is further disposed on the upper portion of the movable frame 112 near the second torsion axis 115b, the first electrical isolation groove 113a encloses an island structure 120, the island structure 120 is connected to the movable frame 112 via the first insulation layer 210 and the reinforcing frame 312, the reinforcing frame 312 is provided with a recess 311, and with reference to fig. 4, the opening direction of the recess 311 faces the second torsion axis 115 b; the movable frame 112, the first electrical isolation groove 113a, the island structure 120, and the recess 311 constitute a stress relief structure, which relieves stress concentration caused by the second torsion shaft 115 b.
The width of one end of the first electrical isolation groove 113a extending toward the mirror 111 gradually increases, the end of the first electrical isolation groove 113a is in a wedge shape, a cut angle β is formed on the movable frame 112, and a portion of the island structure 120 close to the second torsion axis 115b has a cut angle α, in this embodiment, the cut angles α and β are straight cut angles, and the angle is between 20 degrees and 80 degrees; in other embodiments, the cutting angles α and β may also be circular cutting angles with radian, and the angles are designed according to actual requirements, and only changing the type and angle of the cutting angles all belong to the protection scope of the present invention.
The shape of the groove 311 may be rectangular, semicircular, or other shapes, and the size of the groove 311 is designed according to actual requirements, so that only the shape and size of the groove 311 are changed, which belongs to the protection scope of the present invention.
As shown in fig. 3, an X-axis stress relief groove may be further included to relieve stress conducted by the first torsion shaft 115 a.
As shown in fig. 2, the SOI wafer further includes a second insulating layer 410 and a substrate layer 510, and the SOI wafer is formed by stacking the first device layer 110, the first insulating layer 210, the second device layer 310, the second insulating layer 410, and the substrate layer 510 in sequence from top to bottom;
the first insulating layer 210 and the second insulating layer 410 are both silicon dioxide buried layers, the substrate layer is a monocrystalline silicon substrate layer, the thicknesses of the first device layer 110 and the second device layer 310 are between 10 and 100 micrometers, the thicknesses of the silicon dioxide buried layers are between 0.1 and 3 micrometers, and the thickness of the monocrystalline silicon substrate layer is between 100 and 800 micrometers.
As shown in fig. 8, the SOI wafer is provided with a cavity 511 defining the movable range of the two-dimensional micromirror, and the cavity 511 is formed by etching the substrate layer 510 and the second insulating layer 410. The movable frame 112, the mirror 111, the first torsion axis 115a, the second torsion axis 115b, the X-axis comb-tooth structure, and the Y-axis comb-tooth structure are all located directly above the cavity 511.
The first electrical isolation groove 113a is combined with the reinforcing frame 312, so that electrical signals between two shafts are effectively isolated, the electrical signals of the two shafts are not interfered with each other, the separated areas on the movable frame 112 can be fixed together, and the rigidity of the movable frame 112 can be improved; in addition, the stress relieving structure effectively solves the problem of stress concentration, and greatly improves the reliability of the two-dimensional micromirror.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (10)
1. A two-dimensional micromirror, fabricated from an SOI wafer comprising: a first device layer (110), a first insulating layer (210), and a second device layer (310), the first device layer (110), the first insulating layer (210), and the second device layer (310) being stacked in order from top to bottom;
the first device layer (110) comprises a mirror (111) and a movable frame (112), the mirror (111) is arranged at the center of the movable frame (112), the movable frame (112) is provided with a first electric isolation groove (113a), the first electric isolation groove (113a) is a separated electric isolation groove, and the first electric isolation groove (113a) electrically isolates the mirror (111) from the movable frame (112);
the second device layer (310) comprises a reinforcing frame (312), the reinforcing frame (312) is arranged below the movable frame (112), and the position of the reinforcing frame (312) is matched with that of the movable frame (112).
2. The two-dimensional micromirror of claim 1, wherein:
the movable frame (112) is provided with second static comb teeth (118b), and the second static comb teeth (118b) are arranged along the Y-axis direction;
first device layer (110) still includes actuating lever (119), the one end of actuating lever (119) with mirror surface (111) rigid connection, the other end of actuating lever (119) is kept away from along the Y axial the direction extension of mirror surface (111), comb teeth (118a) are moved to the second of having arranged on actuating lever (119), comb teeth (118a) are moved to the second with the quiet comb teeth (118b) of second are crisscross to be arranged.
3. The two-dimensional micromirror of claim 1, wherein:
the first device layer (110) further comprises a first fixed frame (114), a first torsion axis (115a), and a second torsion axis (115 b);
the first fixed frame (114) is arranged around the movable frame (112);
one end of the first torsion shaft (115a) is connected to the first fixed frame (114), and the other end of the first torsion shaft (115a) is connected to the movable frame (112);
one end of the second torsion shaft (115b) is connected to the mirror surface (111), and the other end of the second torsion shaft (115b) is connected to the movable frame (112).
4. The two-dimensional micromirror of claim 2 or 3, wherein:
the movable frame (112) is also provided with first movable comb teeth (117), and the first movable comb teeth (117) are arranged along the X-axis direction;
the second device layer (310) comprises a second fixed frame (314), and the second fixed frame (314) is arranged on the periphery of the reinforced frame (312);
the second fixed frame (314) is provided with first static comb teeth (317), and the first static comb teeth (317) and the first movable comb teeth (117) are arranged in a staggered mode in the vertical direction.
5. The two-dimensional micromirror of claim 3, wherein:
the first fixing frame (114) is provided with an anchor point (116) and a second electric isolation groove (113b), and the second electric isolation groove (113b) is arranged on the periphery of the anchor point (116);
one end of the first torsion shaft (115a) is connected with the anchor point (116).
6. The two-dimensional micromirror of claim 4, wherein:
the second fixed frame (314) is provided with a third electric isolation groove (313c), and the third electric isolation groove (313c) is arranged around the first static comb teeth (317).
7. The two-dimensional micromirror of claim 1, wherein:
the first electrically isolating groove (113a) has a width gradually increasing toward one end of the mirror (111) extending.
8. The two-dimensional micromirror of claim 1, wherein:
the width of the reinforcing frame (312) is T1, the width of the movable frame (112) is T2, wherein 0.5 ≦ T1/T2 ≦ 1.5.
9. The two-dimensional micromirror of claim 3, wherein:
the reinforcing frame (312) is provided with a groove having an opening direction facing the second torsion shaft (115 b).
10. The two-dimensional micromirror of claim 1, wherein:
the SOI wafer further comprises a second insulating layer (410) and a substrate layer (510), and the SOI wafer is formed by sequentially stacking the first device layer (110), the first insulating layer (210), the second device layer (310), the second insulating layer (410) and the substrate layer (510) from top to bottom;
the SOI wafer is provided with a cavity, and the movable frame (112), the mirror surface (111) and the reinforcing frame (312) are all located right above the cavity.
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| CN201922195721.3U CN212276105U (en) | 2019-12-09 | 2019-12-09 | Two-dimensional micromirror |
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| CN201922195721.3U CN212276105U (en) | 2019-12-09 | 2019-12-09 | Two-dimensional micromirror |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023030047A1 (en) * | 2021-08-31 | 2023-03-09 | 华为技术有限公司 | Driving assembly and related device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023030047A1 (en) * | 2021-08-31 | 2023-03-09 | 华为技术有限公司 | Driving assembly and related device |
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