CN212269973U

CN212269973U - Die paster

Info

Publication number: CN212269973U
Application number: CN202021675868.9U
Authority: CN
Inventors: 王勤
Original assignee: Suzhou Baoyouji Technology Co ltd
Current assignee: Suzhou Baoyouji Technology Co ltd
Priority date: 2020-08-12
Filing date: 2020-08-12
Publication date: 2021-01-01
Anticipated expiration: 2030-08-12

Abstract

The utility model discloses mould paster, including mica lamella, adhesive layer and the release paper that sets up in order, its main part of mica lamella is microscler, is provided with two circular fretwork areas on the mica lamella, and two circular fretwork areas set up along the extending direction of microscler main part, and at least one still has by the convex microscler fretwork area in border in two circular fretwork areas. The mould paster of this scheme, simple structure can realize thermal-insulated efficiency effectively, has good application prospect in electronic equipment.

Description

Die paster

Technical Field

The utility model belongs to the technical field of it is thermal-insulated, concretely relates to mould paster.

Background

Thermal insulation materials (materials) are materials that can retard the transmission of heat flow, also known as thermal insulation materials. The heat insulating materials are classified into three types, namely porous materials, heat reflecting materials and vacuum materials. The former uses the pores contained in the material itself to insulate heat because the air or inert gas in the pores has a very low thermal conductivity, such as foam, fiber material, etc.; the heat reflecting material has high reflection coefficient and can reflect heat, such as gold, silver, nickel, aluminum foil or metal-plated polyester, polyimide film, etc. The vacuum insulation material is insulated by blocking convection by using internal vacuum of the material. The aerospace industry has stringent requirements for the weight and volume of the heat insulating materials used, and often requires that the heat insulating materials have sound insulation, vibration reduction, corrosion resistance and other properties. The need for insulation varies from aircraft to aircraft. Foam plastics, superfine glass wool, high silicon-oxygen wool and vacuum insulation boards are commonly used for heat insulation in cabins and cockpit of airplanes.

Mica has very high insulating and heat conducting performance, high chemical stability, strong acid, alkali and pressure resistance, so that it is an important material for making electric equipment and may be also used as the insulating material in blower. Mica has double refraction capability, so that mica is also an optical instrument material for manufacturing a polarizing plate. Mica mining for the electrical industry must be a block of mica with an effective area greater than 4 square centimeters, and without cracks, perforations, and non-mica minerals on the edges must not exceed 3 millimeters. After the mica is mined, the quality is divided into 4 types according to the effective area, and the best special type area is more than 65 square centimeters.

Mica heat insulating materials produced by using mica as a raw material are widely applied to electronic equipment such as mobile phones and computers, but due to the lamellar and brittle characteristics of mica, gaps are generated in application, and the heat insulating effect and the service life of the product are greatly influenced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses mould paster, simple structure can realize thermal-insulated efficiency effectively, has good application prospect in electronic equipment.

The utility model discloses a mould paster, including mica lamella, adhesive layer and the release paper that sets up in order, its main part of mica lamella is microscler, is provided with two circular fretwork areas on the mica lamella, and two circular fretwork areas set up along the extending direction of microscler main part, and at least one still has by the convex microscler fretwork area in border in two circular fretwork areas.

The utility model discloses an improvement of mould paster, at least one still has by the border to putting convex microscler fretwork district between them in two circular fretwork districts.

The utility model discloses an improvement of mould paster, the bulge in microscler fretwork district is the rectangle fretwork.

The utility model discloses an improvement of mould paster still is formed with a plurality of slot holes on the mica lamella, and the through-hole of slot hole for lining up the mica lamella.

The utility model discloses an improvement of mould paster, a plurality of slot holes surround on the mica lamella and be the round.

The utility model discloses an improvement of mould paster, the one end in circular fretwork district is kept away from at the rectangle fretwork to the slot hole surround on the mica lamella.

The utility model discloses an improvement of mould paster, the mica lamella has the symmetry axis along its extending direction.

The utility model discloses an improvement of mould paster, mica lamella are multilayer structure, and this multilayer structure is located to keep away from type paper side including the thermal-insulated mica layer, the aluminium foil layer (playing the radiating effect of thermal-arrest) and the heat-sink shell that set up in order, heat-sink shell. The heat absorbing layer is preferably a mica thin layer added with aluminum wires. Further, the diameter of the aluminum wire is 0.8-1 mm. Furthermore, the mica structures of the main bodies of the mica layer and the mica thin layer are slurry prepared by mica powder, and the slurry is obtained after molding and hot pressing.

The utility model discloses an improvement of a mould paster, the thickness of aluminium foil layer is 0.01-0.03 mm.

The utility model discloses an improvement of mould paster, mica powder is the grading mica powder.

The utility model discloses an improvement of mould paster, the second grade gradation system that mica powder formed for the mica powder of two kinds of different particle diameters.

The utility model discloses an improvement of mould paster, the particle diameter of two kinds of mica powder in the second grade composition system does respectively, and to the diameter of mica lamella, mica powder I2-3 mm, mica powder II 0.1-0.5 mm.

The utility model discloses an improvement of a die patch, which is 5-10% of the total volume of mica powder II fried mica powder in a secondary grading system.

The scheme improves the combination and heat conduction between mica and aluminum wires in the system through an effective heat absorption/heat dissipation/heat insulation process formed by matching between heat absorption/heat dissipation/heat insulation structures and mica powder of a secondary grading system, reduces the gap filtration between heat absorption layers, thereby reducing the heat transfer obstruction of low-heat-conductivity aluminum gaps, improving the effect and the effect of the aluminum wires as a heat conducting agent in heat transfer, obviously improving the stripping performance and the heat insulation performance, and improving the heat insulation efficiency of the die patch under the condition of limited overall thickness.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic diagram of the structure of the die patch of the present application.

Detailed Description

The present invention will be described in detail below with reference to embodiments. However, the present invention is not limited to the embodiments, and the structural, method, or functional changes made by those skilled in the art according to the embodiments are all included in the scope of the present invention.

As shown in fig. 1, the mold patch in this scheme, including the mica lamella that sets up in order, the adhesive layer and leave type paper, its main part of mica lamella is microscler multilayer structure, this multilayer structure includes the heat insulating mica layer that sets up in order, the heat absorbing layer that the mica thin layer that has added the right amount aluminium silk formed of aluminium foil layer, the heat absorbing layer is located to keep away from type paper side, be provided with two circular fretwork areas 011 on the mica lamella, two circular fretwork areas 011 sets up along the extending direction of microscler main part, one of two circular fretwork areas 011 has the outstanding rectangle fretwork area 021 in border by circular fretwork area 011, the extending direction of this outstanding rectangle fretwork area 021 is towards another circular fretwork area 011, thereby make these two circular fretwork areas 011 and rectangle fretwork area 021 pass through same symmetry axis. In addition, a plurality of long holes 031 are formed between the rectangular hollow-out area 021 and the other circular hollow-out area 011, the circle of long holes 031 is a circle, and the position of a part of the long holes 031 in a section of the long extension direction of the long circle coincides with the rectangular hollow-out area 021, so that the long circle is formed into an incomplete structure, and the long circle is partially replaced by the rectangular hollow-out area 021. The void structures are here all fitted to the device and can be obtained from a complete mica sheet by die stamping. In addition, in order to obtain a better heat insulation effect, a heat insulation paper cushion layer is attached to the mica sheet layer, and the heat insulation paper cushion layer is provided with gaps corresponding to the circular hollowed-out areas 011, the long holes 031 and the rectangular hollowed-out areas 021 correspondingly. Furthermore, the heat insulation paper cushion layer is also provided with a gap in the long round range surrounded by the long holes 031.

Example 1

In this embodiment, the die patch adopts the structure as described above, wherein the heat absorbing layer is a mica thin layer added with 10% aluminum wires by volume fraction, and the aluminum wires are short fibers with a length L of 2.5mm and a diameter D of 0.95 mm. The mica thin layer is prepared by mixing raw materials including 100 parts by weight of secondary graded mica powder, 1 part by weight of silane coupling agent KH550, heat conducting agent and water, and performing female die mold molding and demolding and hot press molding, wherein the particle sizes of the two mica powders in the secondary graded system are respectively as follows: the mica powder I is 2.3mm and the mica powder II is 0.5mm in diameter, the mica powder II accounts for 6% of the total volume of the mica powder, and the thickness of the aluminum foil layer is 0.015 mm.

Example 2

In this embodiment, the die patch adopts the structure as described above, wherein the heat absorbing layer is a mica thin layer added with 10% aluminum wires by volume fraction, and the aluminum wires are short fibers with a length L of 2.5mm and a diameter D of 0.85 mm. The mica thin layer is prepared by mixing raw materials including 100 parts by weight of secondary graded mica powder, 0.3 part by weight of silane coupling agent KH550, heat conducting agent and water, and performing female die molding and demolding and hot-press molding, wherein the particle sizes of the two mica powders in the secondary graded system are respectively as follows: the mica powder I is 2.5mm and the mica powder II is 0.2mm in diameter, the mica powder II accounts for 7% of the total volume of the mica powder, and the thickness of the aluminum foil layer is 0.025 mm.

Example 3

In this embodiment, the die patch adopts the structure as described above, wherein the heat absorbing layer is a mica thin layer added with 10% aluminum wires by volume fraction, and the aluminum wires are short fibers with a length L of 3mm and a diameter D of 0.8 mm. The mica thin layer is prepared by mixing raw materials including 100 parts by weight of secondary graded mica powder, 0.8 part by weight of silane coupling agent KH550, heat conducting agent and water, and performing female die molding and demolding and hot-press molding, wherein the particle sizes of the two mica powders in the secondary graded system are respectively as follows: the mica powder I is 3mm, the mica powder II is 0.1mm, the mica powder II accounts for 5% of the total volume of the mica powder, and the thickness of the aluminum foil layer is 0.02 mm.

Example 4

In this embodiment, the die patch adopts the structure as described above, wherein the heat absorbing layer is a mica thin layer added with 10% aluminum wires by volume fraction, and the aluminum wires are short fibers with a length L of 3mm and a diameter D of 0.9 mm. The mica thin layer is prepared by mixing raw materials including 100 parts by weight of secondary graded mica powder, 0.5 part by weight of silane coupling agent KH550, heat conducting agent and water, and performing female die molding and demolding and hot-press molding, wherein the particle sizes of the two mica powders in the secondary graded system are respectively as follows: the mica powder I is 2mm, the mica powder II is 0.4mm, the mica powder II accounts for 8% of the total volume of the mica powder, and the thickness of the aluminum foil layer is 0.03 mm.

Example 5

In this embodiment, the die patch adopts the structure as described above, wherein the heat absorbing layer is a mica thin layer added with 10% aluminum wires by volume fraction, and the aluminum wires are short fibers with a length L of 4mm and a diameter D of 1 mm. The mica thin layer is prepared by mixing raw materials including 100 parts by weight of secondary graded mica powder, 0.2 part by weight of silane coupling agent KH550, heat conducting agent and water, and performing female die molding and demolding and hot-press molding, wherein the particle sizes of the two mica powders in the secondary graded system are respectively as follows: the mica powder I is 2mm, the mica powder II is 0.25mm, the mica powder II accounts for 10% of the total volume of the mica powder, and the thickness of the aluminum foil layer is 0.01 mm.

Comparative example 1

In this embodiment, the die patch adopts the structure as described above, wherein the heat absorbing layer is a mica thin layer added with 10% aluminum wires by volume fraction, and the aluminum wires are short fibers with a length L of 4mm and a diameter D of 1 mm. The mica thin layer is prepared by mixing raw materials including 100 parts by weight of mica powder, 0.2 part by weight of silane coupling agent KH550, heat conducting agent and water, molding by a female die, demolding and hot-press molding, wherein the particle size of the mica powder is as follows: the diameter of the mica sheet is 2mm, and the thickness of the aluminum foil layer is 0.01 mm.

10 samples of the above-mentioned examples and comparative examples were subjected to aging tests and heat-insulating property tests, wherein the aging tests were conducted under a 1000W high-pressure sodium lamp simulated strong light, 45 degrees Celsius, and 80% air humidity environment for 24 days (aging test 1) and 45 days (aging test 2). The heat preservation performance test is to set stable heat sources at 45 ℃ (heat preservation performance 1) and 60 ℃ (heat preservation performance 2) on the side of the heat absorption layer respectively, and measure the temperature rise condition of the other side after the test is carried out for 45 min.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The die patch is characterized by comprising a mica sheet layer, an adhesive layer and release paper, wherein the mica sheet layer, the adhesive layer and the release paper are sequentially arranged, the main body of the mica sheet layer is long, two circular hollow areas are arranged on the mica sheet layer, the two circular hollow areas are arranged along the extending direction of the long main body, and at least one of the two circular hollow areas is provided with a long hollow area protruding from the edge.

2. The mold patch as recited in claim 1, wherein at least one of the two circular hollow areas further has an elongated hollow area that is convex from the edge to a central location of the two.

3. The mold patch as recited in claim 2, wherein the projections of the elongated hollowed-out areas are oblong hollowed-out.

4. A die patch according to claim 1, wherein the mica sheet layer is further formed with a plurality of elongated holes, the elongated holes being through holes passing through the mica sheet layer.

5. A die patch according to claim 4, wherein the plurality of slots are encircled as a circle on the mica sheet layer.

6. A mold patch according to claim 5 wherein the slot in the mica sheet surrounds the rectangular opening at an end thereof remote from the circular opening.

7. A mold patch according to claim 1, wherein the mica sheet layer has an axis of symmetry along its direction of extension.

8. A mold patch according to any one of claims 1 to 7, wherein the mica sheet layer is a multilayer structure comprising a heat insulating mica layer, an aluminium foil layer and a heat sink layer arranged in that order, the heat sink layer being located on the side remote from the release paper.

9. The mold patch as recited in claim 8, wherein the aluminum foil layer has a thickness of 0.01-0.03 mm.