CN212264015U - Energy-saving semiconductor wafer cleaning machine - Google Patents

Abstract

The utility model discloses an energy-saving semiconductor wafer cleaning machine, which comprises a shell, wherein a cleaning shell is arranged below the shell, and a shell is arranged on one side of the cleaning shell and below the shell; the bottom end of the shell is provided with an installation cavity, a convex block is arranged in the middle of the installation cavity, a transmission chain is arranged in the installation cavity, a group of installation columns are symmetrically arranged at the bottom end of the transmission chain, a transmission motor matched with the transmission chain is arranged at the top end of the shell, a plurality of air cylinders are uniformly arranged at the bottom end of the transmission chain, installation plates are arranged on telescopic rods of the air cylinders, and a plurality of installation clamps are uniformly arranged at the bottom end of the installation plates; wherein, the inside of wasing the shell is provided with actuating mechanism, the feeding has been seted up at one side top of wasing the shell. Has the advantages that: the efficiency of air-drying and dust absorption has been greatly improved, has reduced the loss of electric power simultaneously.

Description

Energy-saving semiconductor wafer cleaning machine

Technical Field

The utility model relates to a semiconductor wafer cleaning machine field particularly, relates to an energy-saving semiconductor wafer cleaning machine.

Background

A wafer refers to a substrate (also called a substrate) from which semiconductor transistors or integrated circuits are fabricated. Since it is a crystalline material, it is called a wafer because it is circular in shape. The substrate material is silicon, germanium, etc. Since silicon is most commonly used, if the crystalline material is not specified, it is often referred to as a silicon wafer. Various circuit element structures can be processed on a silicon wafer to form an integrated circuit product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide. The silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon with very high purity.

The existing wafer cleaning machine is matched with devices such as a cleaning tank, an air heater, a dust suction device and a dust suction pipe through arrangement, although the wafer can be well cleaned, after cleaning is finished, one side of a rotating shaft is arranged due to the air heater, so that when the wafer is dried, the wafer far away from the air heater is difficult to be dried or needs to consume more time to be dried, more electric power can be wasted, and the wafer cleaning machine is also used for dust suction operation.

An effective solution to the problems in the related art has not been proposed yet.

SUMMERY OF THE UTILITY MODEL

To the problem among the correlation technique, the utility model provides an energy-saving semiconductor wafer cleaning machine to overcome the above-mentioned technical problem that current correlation technique exists.

Therefore, the utility model discloses a specific technical scheme as follows:

an energy-saving semiconductor wafer cleaning machine comprises a shell, wherein a cleaning shell is arranged below the shell, and a machine shell is arranged on one side of the cleaning shell and below the shell; the bottom end of the shell is provided with an installation cavity, a convex block is arranged in the middle of the installation cavity, a transmission chain is arranged in the installation cavity, a group of installation columns are symmetrically arranged at the bottom end of the transmission chain, a transmission motor matched with the transmission chain is arranged at the top end of the shell, a plurality of air cylinders are uniformly arranged at the bottom end of the transmission chain, installation plates are arranged on telescopic rods of the air cylinders, and a plurality of installation clamps are uniformly arranged at the bottom end of the installation plates; the cleaning device comprises a cleaning shell, a cleaning mechanism and a control mechanism, wherein the interior of the cleaning shell is provided with a driving mechanism, the top of one side of the cleaning shell is provided with a feeding hole, and a discharging hole is formed in one side of the cleaning shell and below the feeding hole; the driving mechanism comprises a stirring device arranged in the cleaning shell, and one side of the stirring device is provided with a power device matched with the stirring device; the machine shell comprises a first supporting plate connected with a protruding block, a base is arranged at the bottom end of the first supporting plate, a second supporting plate is arranged at the top end of the first supporting plate, which is located on the base, one end, away from the base, of the second supporting plate is connected with the shell, a first movable mechanism is evenly arranged on one side, close to the second supporting plate, of the first supporting plate, a dust suction head is arranged on one side, close to the second supporting plate, of the first movable mechanism, the dust suction head is connected with the dust suction device through a dust suction pipe, a second movable mechanism is evenly.

Further, in order to reach quick abluent purpose to through setting up agitating unit, and then the frictional force between multiplicable washing liquid and the wafer, agitating unit is provided with stirring gear including setting up at the inside stirring leaf of washing shell, the below of stirring leaf, and the stirring leaf passes through the (mixing) shaft and is connected with stirring gear.

Furthermore, in order to provide power for the stirring device, the power device comprises a power gear arranged on one side of the stirring gear, a power shaft is arranged at the middle position of the power gear, one end, far away from the power gear, of the power shaft is provided with a power motor matched with the power shaft, and the power motor is connected with the side wall of the cleaning shell through a mounting seat.

Furthermore, in order to enable the dust collection head and the fan heater to do circular motion in the horizontal direction, the dust collection area is enlarged, and the dust collection efficiency is improved.

Furthermore, in order to enlarge the dust absorption and air-dry area, the efficiency of dust absorption and air-dry is improved, so that through the arrangement of the movable device, the movable device comprises a movable plate arranged on one side of a supporting plate, a movable groove is formed in one side, far away from the supporting plate, of the movable plate, a movable block is arranged in the movable groove, the movable block is connected with the moving device through a movable shaft, and a dust absorption head is arranged on the movable block and on one side, far away from the moving device, of the movable shaft.

Further, in order to provide power for the movable device, through setting up the mobile device, the mobile device includes the actuating lever connected with the movable shaft, and the one end that the mobile device was kept away from to the actuating lever alternates and is provided with spacing post, and the one end that spacing post is close to the movable block is provided with spacing dish. The one end that spacing dish was kept away from to spacing post is provided with the drive post, and the drive post is kept away from the one end of actuating lever and is located the one side that the actuating lever was kept away from to the drive post and be provided with rather than matched with driving motor.

The utility model has the advantages that:

1. compare with traditional semiconductor wafer cleaning machine, the utility model discloses a set up devices such as head, mobile device and cooperate to in concrete use, can drive electric fan heater and dust absorption head and carry out the reciprocating motion of horizontal direction, and then the dust absorption of expansion and air-dried region, great improvement air-dry with the efficiency of dust absorption, reduced the loss of electric power simultaneously.

2. The utility model discloses a set up devices such as power device, agitating unit and cooperate to in concrete use, can increase the frictional force of wafer in the cleaning process and between the water, and then can improve the cleaning efficiency of wafer.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an energy-saving semiconductor wafer cleaning machine according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a housing of an energy-saving semiconductor wafer cleaning machine according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a cleaning shell of an energy-saving semiconductor wafer cleaning machine according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a housing of an energy-saving semiconductor wafer cleaning machine according to an embodiment of the present invention;

fig. 5 is a second schematic structural diagram of a housing of an energy-saving semiconductor wafer cleaning machine according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a driving mechanism of an energy-saving semiconductor wafer cleaning machine according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a movable mechanism of an energy-saving semiconductor wafer cleaning machine according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram of a driving column of an energy-saving semiconductor wafer cleaning machine according to an embodiment of the present invention;

fig. 9 is a schematic view of a drive train structure of an energy-saving semiconductor wafer cleaning machine according to an embodiment of the present invention.

In the figure:

1. a housing; 101. a mounting cavity; 102. a raised block; 2. cleaning the shell; 201. a feed inlet; 202. a discharge port; 3. a housing; 301. a first support plate; 302. a base; 303. a second support plate; 304. a dust collection device; 305. a dust collection head; 306. a dust collection pipe; 307. a warm air blower; 4. a drive chain; 5. mounting a column; 6. a drive motor; 7. a cylinder; 8. mounting a plate; 9. installing a clamp; 10. a drive mechanism; 1001. a stirring device; 1002. a power plant; 1003. stirring blades; 1004. a stirring gear; 1005. a stirring shaft; 1006. a power gear; 1007. a power shaft; 1008. a power motor; 11. a first movable mechanism; 1101. a mobile device; 1102. a mobile device; 1103. a movable plate; 1104. a movable groove; 1105. a movable block; 1106. a movable shaft; 1107. a drive rod; 1108. a limiting column; 1109. a limiting disc; 1110. a drive column; 1111. a drive motor; 12. a second movable mechanism; 13. and (7) mounting a seat.

Detailed Description

For further explanation of the embodiments, the drawings are provided as part of the disclosure and serve primarily to illustrate the embodiments and, together with the description, to explain the principles of operation of the embodiments, and to provide further explanation of the invention and advantages thereof, it will be understood by those skilled in the art that various other embodiments and advantages of the invention are possible, and that elements in the drawings are not to scale and that like reference numerals are generally used to designate like elements.

According to the utility model discloses an embodiment provides an energy-saving semiconductor wafer cleaning machine.

Referring to the drawings and the detailed description, as shown in fig. 1-9, the energy-saving semiconductor wafer cleaning machine according to the embodiment of the present invention includes a housing 1, a cleaning shell 2 is disposed below the housing 1, and a housing 3 is disposed below the housing 1 and on one side of the cleaning shell 2; the bottom end of the shell 1 is provided with an installation cavity 101, a convex block 102 is arranged in the middle of the installation cavity 101, a transmission chain 4 is arranged inside the installation cavity 101, a group of installation columns 5 are symmetrically arranged at the bottom end of the transmission chain 4, a transmission motor 6 matched with the transmission chain 4 is arranged at the top end of the shell 1, a plurality of air cylinders 7 are uniformly arranged at the bottom end of the transmission chain 4, an expansion link of each air cylinder 7 is provided with an installation plate 8, and a plurality of installation clamps 9 are uniformly arranged at the bottom end of each installation plate 8; the cleaning device comprises a cleaning shell 2, a driving mechanism 10, a feeding hole 201, a discharging hole 202 and a cleaning mechanism, wherein the driving mechanism 10 is arranged inside the cleaning shell 2, the top of one side of the cleaning shell 2 is provided with the feeding hole 201, and the discharging hole 202 is formed in one side of the cleaning shell 2 and is positioned below the feeding hole 201; the driving mechanism 10 comprises a stirring device 1001 arranged inside the cleaning shell 2, and one side of the stirring device 1001 is provided with a power device 1002 matched with the stirring device; wherein, the casing 3 comprises a first support plate 301 connected with the convex block 102, the bottom end of the first support plate 301 is provided with a base 302, a second support plate 303 is arranged at the top end of the first support plate 301 and positioned at the base 302, one end of the second support plate 303 far away from the base 302 is connected with the casing 1, one side of the first support plate 301 close to the second support plate 303 is uniformly provided with a plurality of first movable mechanisms 11, one side of the first movable mechanisms 11 is provided with a dust suction device 304, one side of the first movable mechanisms 11 close to the second support plate 303 is provided with a dust suction head 305, the dust suction head 305 is connected with the dust suction device 304 through a dust suction pipe 306, one side of the second support plate 303 close to the first support plate 301 is uniformly provided with a plurality of second movable mechanisms 12, one side, thereby through setting up the utility model discloses, and then can be fast even rinse the wafer and air-dry.

In one example, for the stirring apparatus 1001, the stirring apparatus 1001 includes a stirring blade 1003 disposed inside the cleaning shell 2, a stirring gear 1004 is disposed below the stirring blade 1003, and the stirring blade 1003 is connected to the stirring gear 1004 through a stirring shaft 1005, so that by disposing the stirring apparatus 1001, the friction between the cleaning liquid and the wafer can be increased, and the purpose of rapid cleaning can be achieved.

In one example, for the above power device 1002, the power device 1002 includes a power gear 1006 disposed on one side of the stirring gear 1004, a power shaft 1007 is disposed at a middle position of the power gear 1006, a power motor 1008 matched with the power shaft 1007 is disposed at an end of the power shaft 1007 far away from the power gear 1006, and the power motor 1008 is connected to the side wall of the cleaning shell 2 through the mounting base 13, so that the power device 1002 is disposed to provide power for the stirring device 1001.

In one example, for the first movable mechanism 11, the first movable mechanism 11 comprises a movable device 1101 arranged on one side of the first support plate 301, and a moving device 1102 is arranged on one side of the movable device 1101, which is far away from the first support plate 301, so that by arranging the first movable mechanism 11, the dust suction head 305 and the fan heater 307 perform circular motion in the horizontal direction, the dust suction area is enlarged, and the dust suction efficiency is improved; the second movable mechanism 12 and the first movable mechanism 11 have the same structure, and the warm air blower 307 is arranged on one side of the upper limit column 1108 of the second movable mechanism 12.

In an example, for the movable apparatus 1101, the movable apparatus 1101 includes a movable plate 1103 disposed on one side of the first support plate 301, a movable groove 1104 is disposed on one side of the movable plate 1103 away from the first support plate 301, a movable block 1105 is disposed in the movable groove 1104, the movable block 1105 is connected to the movable apparatus 1102 through a movable shaft 1106, and a dust suction head 305 is disposed on the movable block 1105 and on one side of the movable shaft 1106 away from the movable apparatus 1102, so that by disposing the movable apparatus 1101, a dust suction and air drying area can be enlarged, and dust suction and air drying efficiency can be improved.

In one example, for the above-mentioned moving device 1102, the moving device 1102 includes a driving rod 1107 connected to the movable shaft 1106, a position-limiting column 1108 is inserted into an end of the driving rod 1107 far from the moving device 1102, and a position-limiting disc 1109 is disposed at an end of the position-limiting column 1108 close to the movable block 1105. A driving column 1110 is arranged at one end of the limiting column 1108, which is far away from the limiting disc 1109, and a driving motor 1111 matched with the driving column 1110 is arranged at one end of the driving column 1110, which is far away from the driving rod 1107 and is positioned at one side of the driving column 1110, which is far away from the driving rod 1107, so that the power can be provided for the movable device 1101 by arranging the moving device 1102; the driving motor 1111 is connected to the sidewall of the first supporting plate 301 through the fixing base.

For the convenience of understanding the technical solution of the present invention, the following detailed description is made on the working principle or the operation mode of the present invention in the practical process.

In practical application, the transmission motor 6 is driven to drive the transmission chain 4 to rotate, so that the transmission chain 4 drives the cylinder 7, the mounting plate 8, the mounting clamp 9 and the wafer on the mounting clamp 9 to rotate, when the cleaning shell 2 rotates, the transmission motor 6 stops working, at this time, the cylinder 7 starts working, the telescopic rod of the cylinder 7 drives the mounting clamp 9 and the wafer of the transmission motor 6 to extend into the cleaning shell 2, meanwhile, the power motor 1008 is started to work, the power motor 1008 drives the power shaft 1007 and the power gear 1006 to rotate, the power gear 1006 drives the stirring gear 1004 and the stirring shaft 1005 to rotate, the stirring shaft 1005 drives the stirring blade 1005 to rotate, the stirring blade 1003 stirs the cleaning solution to increase friction between the cleaning solution and the wafer, after the cleaning is finished, the cylinder 7 works again to drive the piston rod to drive the mounting plate 8, the mounting clamp 9 and the wafer to move upwards, after the round crystal cleaning machine is moved out of the cleaning shell 2, the transmission motor 6 works again, so that the cleaned round crystal moves into the machine shell 3, at the moment, the fan heater 307 and the dust collection device 304 start to work, meanwhile, the driving motor 1111 starts to work, the driving motor 1111 drives the driving post 1110 to rotate, the driving post 1110 drives the driving rod 1107 to move, under the action of the driving post 1110 and the driving rod 1107, the movable block 1105 makes linear reciprocating motion in the movable groove 1104, and the movable block 1105 drives the fan heater 307 or the dust collection head 305 to reciprocate, so that the round crystal is cleaned.

To sum up, with the help of the above technical scheme of the utility model, compare with traditional semiconductor wafer cleaning machine, the utility model discloses a set up devices such as head 1101, mobile device 1102 and cooperate to in concrete use, can drive electric fan heater 307 and dust absorption head 305 and carry out the reciprocating motion of horizontal direction, and then the dust absorption of expansion and air-dried region, great improvement air-dry with the efficiency of dust absorption, reduced the loss of electric power simultaneously. The utility model discloses a set up devices such as power device 1002, agitating unit 1001 and cooperate to in concrete use, can increase the wafer in the cleaning process and the frictional force between the washing liquid, and then can improve the cleaning efficiency of wafer.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. An energy-saving semiconductor wafer cleaning machine is characterized by comprising a shell (1), wherein a cleaning shell (2) is arranged below the shell (1), and a machine shell (3) is arranged on one side of the cleaning shell (2) and below the shell (1);

the mounting structure comprises a shell (1), a mounting cavity (101) is formed in the bottom end of the shell (1), a protruding block (102) is arranged in the middle of the mounting cavity (101), a transmission chain (4) is arranged inside the mounting cavity (101), a group of mounting columns (5) are symmetrically arranged at the bottom end of the transmission chain (4), a transmission motor (6) matched with the transmission chain (4) is arranged at the top end of the shell (1), a plurality of cylinders (7) are uniformly arranged at the bottom end of the transmission chain (4), a mounting plate (8) is arranged on a telescopic rod of each cylinder (7), and a plurality of mounting clamps (9) are uniformly arranged at the bottom end of each mounting plate (8);

a driving mechanism (10) is arranged inside the cleaning shell (2), a feeding hole (201) is formed in the top of one side of the cleaning shell (2), and a discharging hole (202) is formed in one side of the cleaning shell (2) and below the feeding hole (201);

the driving mechanism (10) comprises a stirring device (1001) arranged inside the cleaning shell (2), and one side of the stirring device (1001) is provided with a power device (1002) matched with the stirring device;

wherein the casing (3) comprises a first support plate (301) connected with the protruding block (102), a base (302) is arranged at the bottom end of the first support plate (301), a second support plate (303) is arranged at the top end of the first support plate (301) and positioned at the base (302), one end, far away from the base (302), of the second support plate (303) is connected with the casing (1), a plurality of first movable mechanisms (11) are uniformly arranged on one side, close to the second support plate (303), of the first support plate (301), a dust suction device (304) is arranged on one side of the first movable mechanisms (11), a dust suction head (305) is arranged on one side, close to the second support plate (303), of the first movable mechanisms (11), the dust suction head (305) is connected with the dust suction device (304) through a dust suction pipe (306), and a plurality of second movable mechanisms (12) are uniformly arranged on one side, close to the first support plate (301), of the second support plate (303, and a warm air blower (307) is arranged on one side, away from the first supporting plate (301), of the second movable mechanism (12).

2. An energy-saving semiconductor wafer cleaning machine according to claim 1, characterized in that the stirring device (1001) comprises a stirring blade (1003) arranged inside the cleaning shell (2), a stirring gear (1004) is arranged below the stirring blade (1003), and the stirring blade (1003) is connected with the stirring gear (1004) through a stirring shaft (1005).

3. The energy-saving semiconductor wafer cleaning machine according to claim 2, wherein the power device (1002) comprises a power gear (1006) arranged on one side of the stirring gear (1004), a power shaft (1007) is arranged in the middle of the power gear (1006), one end of the power shaft (1007) far away from the power gear (1006) is provided with a power motor (1008) matched with the power shaft, and the power motor (1008) is connected with the side wall of the cleaning shell (2) through a mounting seat (13).

4. An energy-saving semiconductor wafer cleaning machine according to claim 1, characterized in that the first movable mechanism (11) comprises a movable device (1101) arranged on one side of the first supporting plate (301), and a moving device (1102) is arranged on one side of the movable device (1101) far away from the first supporting plate (301).

5. The energy-saving semiconductor wafer cleaning machine according to claim 4, wherein the movable device (1101) comprises a movable plate (1103) disposed on one side of the first supporting plate (301), a movable groove (1104) is disposed on one side of the movable plate (1103) away from the first supporting plate (301), a movable block (1105) is disposed in the movable groove (1104), the movable block (1105) is connected to the moving device (1102) through a movable shaft (1106), and the dust collection head (305) is disposed on the movable block (1105) and on one side of the movable shaft (1106) away from the moving device (1102).

6. The energy-saving semiconductor wafer cleaning machine according to claim 5, wherein the moving device (1102) comprises a driving rod (1107) connected with the movable shaft (1106), one end of the driving rod (1107) far away from the moving device (1102) is provided with a limiting column (1108) in an inserting way, and one end of the limiting column (1108) close to the movable block (1105) is provided with a limiting disc (1109); spacing post (1108) are kept away from the one end of spacing dish (1109) is provided with drive post (1110), drive post (1110) are kept away from the one end of actuating lever (1107) and are located drive post (1110) are kept away from one side of actuating lever (1107) is provided with rather than matched with driving motor (1111).

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