CN212257394U - a light emitting diode - Google Patents

Abstract

A light-emitting diode belongs to the field of light-emitting diodes. A light-emitting diode, including a carrier, a light-emitting body and a lens. Wherein, the carrier has a substrate, a dam formed on the substrate, and the dam and the substrate jointly define a die-bonding region. The light-emitting body is located in the die-bonding region and fixed on the substrate. The lens has a transparent base material and phosphors distributed in the transparent base material, which cover the carrier to encapsulate the light-emitting body in the die-bonding region. Wherein, the light-emitting body has a light-emitting group composed of at least three light-emitting chips arranged in a linear manner; wherein, among the at least three light-emitting chips, the light-emitting wavelength bands of two adjacent light-emitting chips do not overlap with each other. The above-mentioned light-emitting diodes can also achieve good color consistency on the premise that light-emitting chips with three light-emitting wavelength bands are used at the same time.

Description

a light emitting diode

technical field

The present application relates to the field of light emitting diodes, and in particular, to a light emitting diode.

Background technique

Existing light-emitting diodes (Light Emitting Diode, LED for short) based on a chip-on-board (COB) structure generally arrange the light-emitting chip on the circuit layer of the substrate, and form phosphor powder by pressing a circle of plastic sealing compound on the periphery. The glue dispensing area. Or draw a circle of white silica gel on the substrate through a glue dispenser as a dam, arrange the LED chips of the same wavelength in the area of the dam, and then make electrical connections, and then prepare the phosphor formula according to the wavelength of the LED chips. Current LEDs tend to exhibit poor color consistency, which is an urgent problem.

Utility model content

In order to improve or even solve the problem of poor color consistency of white LEDs, the present application proposes a light emitting diode.

This application is implemented like this:

In a first aspect, examples of the present application provide a light emitting diode.

The light-emitting diode includes a carrier, a light-emitting body and a lens.

Wherein, the carrier has a substrate, a dam formed on the substrate, and the dam and the substrate jointly define a die-bonding region. The light-emitting body has a selected characteristic light, is located in the die-bonding region, and is fixed on the substrate. The lens has a transparent base material and phosphors distributed in the transparent base material, and covers the carrier so as to encapsulate the light-emitting body in the die-bonding area. Wherein, the light-emitting body has a light-emitting group composed of at least three light-emitting chips arranged in a linear manner; wherein, among the at least three light-emitting chips, the light-emitting wavelength bands of two adjacent light-emitting chips do not overlap with each other.

By arranging light-emitting chips with different light-emitting wavelength bands in the above-mentioned manner, when the light-emitting chips with different light-emitting wavelength bands are used in combination, the excitation light with better monochromaticity can still be generated, thereby helping to improve white light emission. Consistency of the emitting color of the diode. In addition, since light-emitting chips of different light-emitting wavelength bands can be used in this structure, it is not necessary to manufacture different white light-emitting diodes in batches for light-emitting chips of different wavelength bands, so that the manufacturing complexity can be reduced (for example, light-emitting chips of different wavelength bands do not need to use different white light-emitting diodes). phosphor), thereby improving production efficiency and reducing production costs.

In combination with the first aspect, in a first possible implementation manner of the first aspect of the present application, the light-emitting body has at least two light-emitting groups, and all light-emitting groups are arranged in rows; or, the light-emitting body has at least two light-emitting groups, all of which are arranged in rows. The light-emitting groups are arranged in a row with the adjacent two equally spaced.

The above method allows to provide more arrangement of light-emitting chips, and on the premise of maintaining proper color consistency, the fabrication of white LEDs with a large light-emitting surface can be realized.

In combination with the first aspect or the first embodiment of the first aspect, in a third possible implementation of the first aspect of the present application, the light-emitting body is characterized by blue light, and the light-emitting chip has a light-emitting wavelength range of 450 to 452.5 nanometers The chip of the first type or the chip of the second type with the emission band of 452.5 to 455 nm or the chip of the third type with the emission band of 455 to 457.5 nm.

In combination with the first aspect, in a third possible implementation manner of the first aspect of the present application, the substrate has one or more of the following limitations: the first limitation is that the surface on which the light-emitting body is fixed is a reflective mirror surface; the second limitation , the substrate is thermally conductive; the third limitation, the substrate is aluminum.

When the surface of the substrate is a reflective mirror surface, the light intensity/brightness of the light-emitting diode can be improved and light loss can be reduced. The use of thermally conductive material on the substrate can avoid the occurrence of heat accumulation during the operation of the light-emitting diode, thereby avoiding the occurrence of damage (dead light) of the light-emitting chip due to heat, thus improving the service life of the light-emitting diode.

With reference to the first aspect, in a fifth possible implementation manner of the first aspect of the present application, the base plate has a positioning member; or, the base plate has a positioning hole provided therethrough.

The base plate is provided with positioning holes and positioning pieces to facilitate installation and fixation.

In combination with the first aspect, in a first possible implementation manner of the sixth aspect of the present application, the transparent substrate is silica gel.

In the above implementation process, the light-emitting diodes provided by the embodiments of the present application use light-emitting chips with different wavelength bands, and the selection of the arrangement of the light-emitting chips can make the light-emitting chips stable and uniform, thereby helping the diodes to emit light. Color consistency.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present application more clearly, the following drawings will briefly introduce the drawings that need to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore do not It should be regarded as a limitation of the scope, and for those of ordinary skill in the art, other related drawings can also be obtained according to these drawings without any creative effort.

1 is a schematic structural diagram of a carrier in an example of the application;

FIG. 2 is a schematic structural diagram of a luminous body in an example of the application;

FIG. 3 is a schematic structural diagram of the mutual cooperation between the carrier of FIG. 1 and the light-emitting body of FIG. 2;

4 is a schematic structural diagram of a light emitting diode in this example of the present application;

FIG. 5 is a flow chart of a manufacturing process of the light emitting diode of FIG. 4 .

Icon: 100-carrier; 101-substrate; 102-positioning hole; 103-positive connection wire; 104-negative connection wire; 105-die bonding area; 106-positive pad; 107-negative pad; 200-luminous body; 201-first type chip; 202-second type chip; 203-third type chip; 204-wire; 300-light emitting diode; 301-phosphor; 302-transparent substrate.

Detailed ways

White LEDs can produce white light in three ways:

1. Excite a yellow-emitting phosphor with a blue LED. That is, the blue LED and the fluorescent material such as YAG are spatially placed together, and the fluorescent material is excited by the blue light emitted by the blue LED, so that the blue light and the yellow light excited by the fluorescent powder are mixed to form white light.

2. Excite the R-G-B phosphor with UV LED. That is, based on the principle of three-primary color mixing, the violet light emitted by the violet LED is used to excite three phosphors, so that the phosphors produce three colors of red, green, and blue, and white light is produced by mixing.

3. Use red, green and blue light-emitting diodes to adjust their individual brightness to achieve white light.

An important indicator to measure the luminous performance of white LED is the consistency of its luminous color. However, the aforementioned color consistency is often the difficulty. Moreover, such a problem is particularly prominent in the aforementioned first white light generation method.

After research, the inventors found that the main cause of this problem lies in the problem of light emission of blue LEDs used as excitation light. Specifically, in the actual production process, when a chip manufacturer makes a blue LED, it is usually divided into 2-3 wavelength bands according to the wavelength band of the blue light it emits, and each wavelength band differs by 2.5 nm. Therefore, when making white LEDs, it needs to be produced in separate batches according to the excitation LEDs (ie, blue LEDs).

In addition, since the emission bands of the excited LEDs are different, different formulations of phosphors are required for the excitation of the LEDs in different bands, and in this way, the consistency of the emission color can be more ideal.

However, since the luminous colors of light sources produced by different wavelengths and different formulations will also vary, even if the corresponding phosphor formulation is used to produce white LEDs in batches for the luminous wavelength band of the excited LED, the luminous consistency of the white LEDs will remain unchanged. There is also no good consistency of the luminous color of the white LED produced by the phosphor powder of the same formula.

In addition, the above batch production method will also lead to high production management costs and a large number of final orders. At the same time, due to the poor control of color consistency, there is a risk of mixing orders and formulas, which will lead to material scrapping.

In addition, with the development and popularization of COB light sources, the requirements for the consistency of COB luminous colors are getting higher and higher, and the cost is also more and more sensitive. The existing batch production can no longer meet the requirements.

To sum up, the existing problems of white light LEDs that use excitation LEDs and phosphors to produce white light are mainly divided into wavelengths and batches, with many batches, many tails, high cost, easy mixing, and problems caused by formula differences. The problem of poor color consistency.

In view of the above problems, different from the aforementioned scheme of producing white LEDs in batches according to the different emission wavelength bands of the excited LEDs, the inventor creatively proposes that the excitation LEDs of each wavelength band are used in combination, and by changing the excitation LEDs of each wavelength band Arranged in a way to make it glow more stable and uniform. Therefore, through the aforementioned improvement of the arrangement of the excitation LEDs of different wavelength bands, the effect produced by the combination of the excitation LEDs can be relatively more "uniform".

This solution can also achieve the additional effect that, for this more uniform "synthetic excitation light", a single formulation of phosphors can be used without the need to select different formulations of phosphors for excitation LEDs of different wavelength bands.

Therefore, since the luminescence of the excited LEDs is more uniform and the formula of the phosphor powder is single, batch production of white LEDs is not required and the color consistency of luminescence is improved, thereby improving or even solving the above problems to a considerable extent.

The solutions described above will be explained below in conjunction with the light-emitting diodes in the examples of the present application.

An example light emitting diode includes a carrier, a light emitter, and a lens. The luminous body and the lens are all fixed and installed relying on the carrier. The light emitted by the light-emitting body is emitted through the lens. The light emitting diode has improved luminous color consistency and low production cost, can be applied to high-quality household lighting, commercial lighting and other fields, and has a very broad application prospect accordingly.

Referring to FIG. 1 , the carrier 100 mainly includes a substrate 101 and a dam 108 .

As the name implies, the substrate 101 is a plate-like structure with a relatively small thickness. It can be made of various materials such as metal such as aluminum plate, plastic plate, resin plate, etc., without being particularly limited. The thickness, size and material of the substrate 101 can be selected according to actual needs. For example, the size of the substrate 101 is selected according to the size of the lamp made of the white light diode.

The dam 108 is a structure fixed to the surface of the substrate 101 . The surface here mainly refers to any surface (eg, the upper surface or the lower surface) of the carrier 100 in the thickness direction. Generally, the dam 108 and the base plate 101 are fabricated independently and then connected together in a suitable manner. For example, the shrouds are made of ceramic or organic materials and then bonded by using glue (eg epoxy glue), or they can also be connected by electroplating. In other examples, the enclosure plate and the base plate 101 can also be made by integral molding, such as by injection molding, extrusion, etc., using organic polymer materials.

The dam 108 is generally disposed on the surface of the substrate 101 in an annular configuration and thereby defines an area on the surface of the substrate 101 . The die-bonding region 105 is jointly defined by the dam 108 and the substrate 101 , and the die-bonding region 105 is used to mount the aforementioned light-emitting body 200 . Since the light-emitting chip emits light in the die-bonding region 105, working heat and heat accumulation due to light rays will be generated. Therefore, certain hazards and risks will be caused to the dam 108, the substrate 101 and the light-emitting chip. The material is chosen such that it conducts heat easily, thereby avoiding heat buildup within die bond region 105 . In addition, in order to improve the light extraction rate, the shape of the surface of the substrate 101 of the die bonding region 105 can also be controlled, so that more light can be emitted. For example, the surface of the fixed light-emitting body 200 is a mirror surface. Exemplarily, when an aluminum plate is selected for the substrate 101, the surface of the substrate 101 can be ground and polished, so that the area is mirror-finished.

In addition to the above modifications to the substrate 101 , further modifications to the substrate 101 may also be made based on subsequent applications. For example, when the above-obtained light-emitting diode 300 is fabricated as a lighting device, the substrate 101 can be fixed on the selected object, and thus, the positioning member can be fabricated on the substrate 101 . The positioning member may be a convex structure, a concave structure, a notch or the like fabricated on the above-mentioned surface of the substrate 101 . Exemplarily, the positioning members may be selected as positioning holes 102 , which are provided through the substrate 101 . Thus, the positioning hole 102 can be used for positioning, and also can be used for installation and fixing (eg, bolting to a selected object). The number of positioning holes 102 may be one or more. For the substrate 101 having a rectangular structure in the example, the positioning holes 102 have two and are distributed in the direction of both ends of the diagonal.

In addition, in order to facilitate the extraction of electrodes from the light-emitting body 200 , a positive electrode pad 106 , a positive electrode connection wire 103 , a negative electrode pad 107 and a negative electrode connection wire 104 are also fabricated on the substrate 101 . The positive electrode pad 106 is integrally connected with the positive electrode connection wire 103 , and the positive electrode pad 106 is located at the corner of the substrate 101 , and the positive electrode connection wire 103 has a semicircular structure. The negative electrode pad 107 and the negative electrode connecting wire 104 are integrally connected, and the negative electrode pad 107 is located at another corner of the substrate 101 , and the negative electrode connecting wire 104 has a semicircular structure. Also, the positive electrode connection line 103 and the negative electrode connection line 104 are also arranged annularly around the periphery of the die-bonding region 105 (circular region).

The above-mentioned light-emitting body 200 refers to an excitation light source used to generate excitation of the phosphor 301 to emit light, and in an example, it is a blue LED. Of course, in other examples, the light-emitting body 200 can also be selected as a green LED or a red LED. In other words, the light-emitting body 200 has a certain characteristic light. As mentioned above, the light-emitting body 200 in the present application is a combination of a plurality of light-emitting chips. Therefore, the characteristic light mainly means that the light-emitting color of each light-emitting chip is one type of light. For example, each light-emitting chip produces blue light, although there are differences in the blue light band of each light-emitting chip.

Illustratively, the light emitter 200 is characterized by blue light. It is known that short-wave blue light has a wavelength between 400 nm and 480 nm, that is, its wavelength range is 400 nm to 480 nm. Therefore, in one example, the light-emitting chips constituting the aforementioned light-emitting body 200 may have three types. Wherein, the light-emitting chip with a light-emitting wavelength range of 450 to 452.5 nm is the first type chip 201; the light-emitting chip with a light-emitting wavelength range of 452.5 to 455 nm is the second type chip 202; the light-emitting chip with a light-emitting wavelength range of 455 to 457.5 nm is The third type of chip 203 . Although the above three types of chips have different wavelength bands and are continuously and adjacently distributed in the spectrum, they all belong to the blue light band.

Therefore, the light-emitting body 200 in the examples of the present application is composed of at least three light-emitting chips. In general, in the light-emitting diode 300, the light-emitting body 200 may be composed of one or more (eg, two, three, or more) light-emitting groups. As an arrangement scheme, when the light-emitting body 200 has at least two light-emitting groups, all the light-emitting groups are arranged in rows. Or, further, the light-emitting body 200 has at least two light-emitting groups, and all the light-emitting groups are arranged in a row with the adjacent two being equally spaced.

Referring to FIG. 2 , in the example of the drawings of the present application, the light-emitting body 200 has eight light-emitting groups, and the light-emitting chips in each light-emitting group are linearly arranged in the vertical direction, while the eight light-emitting groups are equally spaced in the horizontal direction arrangement.

Also, the light-emitting chips in the light-emitting group in the above description are arranged in a linear manner, and have at least three light-emitting chips. Meanwhile, in the light-emitting group, the light-emitting wavelength bands of two adjacent light-emitting chips do not overlap with each other. For example, a light-emitting group consisting of one of the aforementioned three types of chips is an example, the arrangement of the three chips in the light-emitting group may be: first type chip 201 - second type chip 202 - third type chip 203 .

In the present application, excitation LEDs of the same color in different wavelength bands are arranged in groups and form light-emitting groups. And in a light-emitting group, excitation LEDs of different light-emitting wavelength bands are arranged in a crossed manner. That is, the emission bands of two adjacent excited LEDs do not overlap. For example, for the above-mentioned three types of chips: the first type chip 201, the second type chip 202 and the third type chip 203, in the same light-emitting group including three light-emitting chips, the first-type chip 201 and the second-type chip 202 can be used. , the third type of chips 203, or the first type of chips 201, the third type of chips 203, the second type of chips 202, or the second type of chips 202, the first type of chips 201 , the third type of chips 203 are arranged in a manner, and so on. In the same light-emitting group including four light-emitting chips, the first-type chips 201, the second-type chips 202, the third-type chips 203, and the first-type chips 201 can be arranged, or the first-type chips can also be used. 201, the third type chip 203, the second type chip 202, the first type chip 201, or the second type chip 202, the first type chip 201, the third type chip 203, the first type chip 201 arranged in a way, and so on.

In the above manner, the color uniformity of the excitation light of the light-emitting body 200 as a whole can be improved by arranging the light-emitting chips of different wavelength bands in an intersecting manner. In addition, as a non-interleaved arrangement, it means that in a unified light-emitting group, the light-emitting wavelength bands of two adjacent light-emitting chips are the same. As an example of a non-interleaved arrangement, in a light-emitting group consisting of four light-emitting chips, the chips are arranged in such a manner as a first-type chip 201, a first-type chip 201, a second-type chip 202, and a third-type chip 203; or, The second type chip 202 , the third type chip 203 , the first type chip 201 , the first type chip 201 ;

After the light-emitting wavelength band of the light-emitting chip used is determined, the phosphor 301 can be selected according to the light-emitting wavelength of the light-emitting chip used, so as to improve the matching degree between the light-emitting chip and the phosphor 301 . For example, the phosphor 301 is selected according to the average value of the emission wavelength bands of all the light-emitting chips in the light-emitting group. Exemplarily, in the aforementioned three types of light-emitting chips, based on the central wavelength of the light-emitting wavelength band of each light-emitting chip, the average value of the light-emitting wavelengths of the three chips is calculated, and the phosphor 301 is selected for the average value.

For example, the first chip with the emission band of 450 to 452.5 nm; the second chip with the emission band of 452.5 to 455 nm; the third chip with the emission band of 455 to 457.5 nm. Then the average value A of the blue light wavelengths of the three light-emitting chips is 453.75, and the calculation method is such as A=(a1+a2+a3)/3.

Among them, a1=(450+452.5)/2; a2=(452.5+455)/2; a1=(455+457.5)/2.

As the demand for power supply, the positive and negative electrodes of each light-emitting LED are led out through wires 204 . All the light-emitting LEDs in the light-emitting body 200 may be matched in series, parallel or the like. The manner of the lead-out electrodes of each light-emitting chip and the manner of matching with the carrier 100 are disclosed in FIG. 3 .

The lens is a component for protecting the light-emitting chip, and at the same time, it is also responsible for reasonably exporting the light generated by the light-emitting chip. In an example, the lens includes a transparent substrate 302 and phosphors 301 , and the lens is covered on the carrier 100 to encapsulate the light-emitting body 200 in the die-bonding region 105 of the carrier 100 . Usually, the transparent substrate 302 is provided with glue that can be cured, and the phosphor 301 powder is mixed in the glue during actual production to form a viscous substance (such as the silica gel phosphor 301 mixed glue, correspondingly, transparent The substrate can be selected as silicone). Then, the light-emitting chip is fixed on the carrier 100 by coating or the like.

In order to make it easier for those skilled in the art to implement the present application, a method for fabricating a light emitting diode 300 as shown in FIG. 4 is given in the example.

The method includes the following steps, see FIG. 5 .

Step S101 , fabricating the substrate 101 .

The substrate 101 can be fabricated by trimming, grinding, polishing, etc., of aluminum materials to form a mirror-finished aluminum plate with a smooth surface and good reflection characteristics.

Step S102 , making the light-emitting body 200 .

On the mirror surface of the substrate 101, a light-emitting chip, that is, die bonding, is mounted. Specifically, a circular area is selected on the mirror surface as the die-bonding region 105, and then each chip placement line (eg, eight, not shown) that is parallel and spaced apart from the diameter of the die-bonding region 105 is selected as the die-bonding region 105. Fixed baseline. Then, each placement line is used as the arrangement direction of the chips, and the light-emitting chips are placed at intervals. For example, in FIG. 3 , based on this diagram, the rightmost side of the light-emitting body 200 has four light-emitting chips (constituting a light-emitting group) arranged at intervals from top to bottom, and are connected in series in sequence.

In particular, in a light-emitting group defined by any placement line, at least three light-emitting chips (such as four, nine, etc. in the example) are fixed at intervals in a linear arrangement, and in the same light-emitting group (by one of the aforementioned The placement line definition), the light-emitting wavelength bands of two adjacent light-emitting chips do not overlap with each other. In this way, an A-band chip, a B-band chip, and a C-band chip are arranged in sequence.

When the light-emitting body 200 needs to have fewer light-emitting chips, for example, three light-emitting chips, the light-emitting body 200 can form a light-emitting group, which can be fixed at any appropriate position in the die bonding area 105 . When the light-emitting body 200 needs to have fewer light-emitting chips, such as 112 as shown in FIG. 2 , it can be planned into eight light-emitting groups, and the number of light-emitting chips in each light-emitting group can be 4, 9, 11, 12, 12, 11, 9, 4. In such an example, the above-mentioned eight light-emitting groups are arranged in a row, and two adjacent light-emitting groups are spaced apart by a given distance.

In step S103, the luminous body 200 is led out of the positive electrode and the negative electrode.

As mentioned above, the substrate 101 has a positive electrode connection line 103 and a negative electrode connection line 104. Therefore, after each light-emitting chip in the light-emitting body 200 is connected in series or in parallel by the wires 204, it is electrically connected to the corresponding positive electrode connection line 103 and the negative electrode connection line 104. connect. In addition, the above-mentioned positive electrode connection line 103 and negative electrode connection line 104 are also connected to the positive electrode pad 106 and the negative electrode pad 107 respectively. Therefore, the electrode extraction of the light-emitting chip is realized in the above-mentioned manner.

Step S104 , setting a dam 108 on the substrate 101 to confine the light-emitting group within the dam 108 .

The dam 108 can usually be surrounded by glue in the form of "drawing" a circle on the periphery of the light-emitting body 200, and the glue can be cured after the glue is cured.

Step S105, packaging.

The prepared mixed glue containing the phosphor 301 is coated on the above-mentioned structure (eg, within the dam 108 ) to completely seal the light-emitting body 200 . After the glue is cured, a package body loaded with the phosphor powder 301 is formed, that is, a lens.

In the description of this application, it should be noted that the terms "center", "upper", "lower", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or The positional relationship is based on the orientation or positional relationship shown in the attached drawings, or the orientation or positional relationship that the product of the application is usually placed in use. It is only for the convenience of describing the application and simplifying the description, rather than indicating or implying the device referred to. Or elements must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as a limitation of the present application. Furthermore, the terms "first", "second", "third", etc. are only used to differentiate the description and should not be construed as indicating or implying relative importance.

The above descriptions are only preferred embodiments of the present application, and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this application shall be included within the protection scope of this application.

Claims (10)

1. A light-emitting diode, characterized in that, comprising: a carrier, comprising a substrate and a dam formed on the substrate, the dam and the substrate jointly define a die-bonding region; a light-emitting body with characteristic light of a selected color, located in the die-bonding region and fixed on the substrate; a lens, which has a transparent base material and phosphors distributed in the transparent base material, and covers the carrier so as to encapsulate the light-emitting body in the die-bonding region; Wherein, the light-emitting body has a light-emitting group composed of at least three light-emitting chips arranged in a linear manner; Wherein, among the at least three light-emitting chips, the light-emitting wavelength bands of two adjacent light-emitting chips do not overlap with each other. 2 . The light-emitting diode according to claim 1 , wherein the light-emitting body has at least two light-emitting groups, and all the light-emitting groups are arranged in rows. 3 . 3 . The light-emitting diode according to claim 2 , wherein all the light-emitting groups are arranged in a row with an equal distance between adjacent ones. 4 . 4. The light-emitting diode according to any one of claims 1 to 3, wherein the light-emitting body is characterized by blue light, and the light-emitting chip has a first-type chip with a light-emitting wavelength range of 450 to 452.5 nanometers, The second type chip with the emission wavelength band of 452.5 to 455 nm and the third type chip with the emission wavelength band of 455 to 457.5 nm. 5 . The light-emitting diode according to claim 1 , wherein the surface of the substrate to which the light-emitting body is fixed is a mirror surface. 6 . 6. The light emitting diode of claim 1 or 5, wherein the substrate is thermally conductive. 7. The light emitting diode of claim 1, wherein the substrate is made of aluminum. 8. The light emitting diode of claim 1, wherein the substrate has a positioning member. 9 . The light emitting diode according to claim 8 , wherein the positioning member is a positioning hole penetrating through the substrate. 10 . 10. The light emitting diode of claim 1, wherein the transparent substrate is silica gel.

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