CN212257378U - Heat radiator for electronic chip - Google Patents
Heat radiator for electronic chip Download PDFInfo
- Publication number
- CN212257378U CN212257378U CN202021021411.6U CN202021021411U CN212257378U CN 212257378 U CN212257378 U CN 212257378U CN 202021021411 U CN202021021411 U CN 202021021411U CN 212257378 U CN212257378 U CN 212257378U
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- Prior art keywords
- heat dissipation
- ring
- awl tooth
- chip
- dissipation ring
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Abstract
The utility model discloses a heat abstractor for electronic chip, including the heat dissipation ring, the inside wall welding of heat dissipation ring has four quantity to be the dead lever that the central point of heat dissipation ring is the centre of a circle and is the annular distribution, the dead lever is kept away from the one end welding of heat dissipation ring and is had the motor, the output shaft fixedly connected with pivot of motor, the lateral wall welding of pivot has annular awl tooth, the lateral wall meshing of annular awl tooth is connected with driven awl tooth, driven awl tooth is kept away from one side center fixedly connected with connecting rod of annular awl tooth; drive the pivot through the motor and rotate, drive the connecting rod through ring type awl tooth and driven awl tooth are mutually supported and are rotated, and then drive the montant through fixed awl tooth and first vertical awl tooth and rotate, and then the transmission horizontal pole, make the fan piece rotate, the direction of rotation of fan piece is the same with the direction of rotation of flabellum, the supplementary air current that the fan piece produced is nearer apart from the chip to improve near chip's air current intensity, thereby improve the radiating effect of chip.
Description
Technical Field
The utility model relates to an electronic chip technical field specifically is a heat abstractor for electronic chip.
Background
An electronic chip, which can also be called as an IC chip, is a micro-electronic device or component, which is a chip formed by placing an integrated circuit formed by a large number of microelectronic components (transistors, resistors, capacitors, etc.) on a plastic substrate, and is manufactured by interconnecting the components and wires of transistors, diodes, resistors, capacitors, inductors, etc. required in a circuit together on one or several small semiconductor wafers or dielectric substrates by a certain process, and then packaging in a package to form a micro-structure with the required circuit function.
At present, a general electronic chip adopts an air-cooled heat dissipation mode, a motor is adopted in the general air-cooled heat dissipation mode to drive fan blades to rotate, and the fan blades are always away from the chip by a certain distance, so that the flowability of wind at the chip is not strong, and the heat dissipation effect is not ideal. Therefore, a heat dissipation device for an electronic chip is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat abstractor for electronic chip to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a heat dissipation device for an electronic chip comprises a heat dissipation ring, wherein four fixing rods which are annularly distributed by taking the central point of the heat dissipation ring as the center of a circle are welded on the inner side wall of the heat dissipation ring, a motor is welded at one end, far away from the heat dissipation ring, of each fixing rod, an output shaft of the motor is fixedly connected with a rotating shaft, annular bevel gears are welded on the outer side wall of each rotating shaft, driven bevel gears are meshed and connected with outer side walls of the annular bevel gears, one side centers, far away from the annular bevel gears, of the driven bevel gears are fixedly connected with connecting rods, one ends, far away from the driven bevel gears, of the connecting rods penetrate through the heat dissipation ring and extend to the outer part of the heat dissipation ring, the connecting rods are rotatably connected with the heat dissipation ring through bearings, first vertical bevel gears are meshed and connected with the outer side walls of the fixed bevel gears, the outer side wall of the vertical rod is fixedly connected with the outer side wall of the heat dissipation ring through a bearing and a support.
As further preferable in the present technical solution: the bottom welding of montant has the vertical awl tooth of second, the lateral wall meshing of the vertical awl tooth of second is connected with first horizontal awl tooth, the welding of one side of first horizontal awl tooth has the horizontal pole, the one end that first horizontal awl tooth was kept away from to the horizontal pole runs through the inboard that the cooling ring extended to the cooling ring, the lateral wall of horizontal pole passes through the bearing and is connected with the cooling ring rotation.
As further preferable in the present technical solution: the bottom fixedly connected with power strip of heat dissipation ring, the chip is installed at the top of power strip, the top of chip is provided with the heat dissipation copper sheet, the heat dissipation copper sheet is kept away from the one end of chip and is run through the heat dissipation ring and extend to the outside of heat dissipation ring.
As further preferable in the present technical solution: the lateral wall fixedly connected with fixing bearing that first horizontal awl tooth was kept away from to the horizontal pole, fixing bearing's lateral wall welding has the straight-bar, the one end fixed connection of straight-bar has the top in the radiating ring, the lateral wall welding that the horizontal pole is close to fixing bearing has the fan piece.
As further preferable in the present technical solution: the lateral wall welding of pivot has the flabellum, the lateral wall welding of radiating ring has the fin, the fin is located the below of flabellum.
As further preferable in the present technical solution: the radiator-grid that quantity is four and is the annular distribution with the central point of radiator-ring as the centre of a circle is installed to the lateral wall of radiator-ring, the welding of the inside wall top of radiator-ring has the ring carrier, the filter screen is installed to the inner circle of ring carrier.
Compared with the prior art, the beneficial effects of the utility model are that: drive the pivot through the motor and rotate, drive the connecting rod through ring type awl tooth and driven awl tooth are mutually supported and are rotated, and then drive the montant through fixed awl tooth and first vertical awl tooth and rotate, and then the transmission horizontal pole, make the fan piece rotate, the direction of rotation of fan piece is the same with the direction of rotation of flabellum, the supplementary air current that the fan piece produced is nearer apart from the chip to improve near chip's air current intensity, thereby improve the radiating effect of chip.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the heat dissipating ring of the present invention;
fig. 3 is a schematic side view of the fixing bearing of the present invention.
In the figure: 1. a heat dissipation ring; 2. a power panel; 3. a chip; 4. a heat dissipation copper sheet; 5. a heat-dissipating web; 6. an annular support; 7. a filter screen; 8. fixing the rod; 9. a motor; 10. a rotating shaft; 11. a fan blade; 12. a heat sink; 13. annular bevel teeth; 14. driven bevel gears; 15. a connecting rod; 16. fixing the bevel gear; 17. a first vertical bevel gear; 18. a vertical rod; 19. a second vertical bevel gear; 20. a first transverse bevel gear; 21. a cross bar; 22. fixing the bearing; 23. a straight rod; 24. and (6) fanning the sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
Referring to fig. 1-3, the present invention provides a technical solution: a heat dissipation device for an electronic chip comprises a heat dissipation ring 1, wherein four fixing rods 8 which are annularly distributed by taking the central point of the heat dissipation ring 1 as the center point are welded on the inner side wall of the heat dissipation ring 1, a motor 9 is welded at one end, far away from the heat dissipation ring 1, of each fixing rod 8, an output shaft of each motor 9 is fixedly connected with a rotating shaft 10, annular bevel gears 13 are welded on the outer side walls of the rotating shafts 10, driven bevel gears 14 are connected with the outer side walls of the annular bevel gears 13 in a meshed mode, connecting rods 15 are fixedly connected with the centers of one sides, far away from the annular bevel gears 13, of the driven bevel gears 14, one ends, far away from the driven bevel gears 14, of the connecting rods 15 penetrate through the heat dissipation ring 1 and extend to the outer portion of the heat dissipation ring 1, the connecting rods 15 are rotatably connected with the heat dissipation ring 1 through bearings, first vertical bevel gears 17 are connected with the outer side walls, the outer side wall of the vertical rod 18 is fixedly connected with the outer side wall of the heat dissipation ring 1 through a bearing and a bracket.
In this embodiment, specifically: the bottom end of a vertical rod 18 is welded with a second vertical bevel gear 19, the outer side wall of the second vertical bevel gear 19 is meshed with a first horizontal bevel gear 20, one side of the first horizontal bevel gear 20 is welded with a cross rod 21, one end of the cross rod 21, which is far away from the first horizontal bevel gear 20, penetrates through the heat dissipation ring 1 and extends to the inner side of the heat dissipation ring 1, the outer side wall of the cross rod 21 is rotatably connected with the heat dissipation ring 1 through a bearing, through the arrangement, the motor 9 drives the rotating shaft 10 to rotate, so as to drive the annular bevel gear 13, the annular bevel gear 13 drives the driven bevel gear 14 to rotate, and further drives the connecting rod 15 to rotate, the rotation of the connecting rod 15 drives the fixed bevel gear 16 to rotate, the fixed bevel gear 16 drives the driven bevel gear 14 to rotate, the vertical rod 18 drives the second vertical bevel gear 19 to rotate, further drives the first horizontal bevel gear 20 to rotate, drives the cross rod 21 to rotate, the rotation of the cross rod 21, that is, the rotation direction of the fan blade 24 is the same as the rotation direction of the fan blade 11, so that the airflow generated by the fan blade 24 assists to enhance the airflow generated by the fan blade 11, the airflow generated by the fan blade 24 approaches the chip 3, the heat dissipation effect near the chip 3 is improved, and the airflow blows through the chip 3 and is blown out through the heat dissipation fins 12 and the filter screen 7.
In this embodiment, specifically: the bottom fixedly connected with power strip 2 of heat dissipation ring 1, chip 3 is installed at the top of power strip 2, and the top of chip 3 is provided with heat dissipation copper sheet 4, and the one end that heat dissipation copper sheet 4 kept away from chip 3 runs through the outside that heat dissipation ring 1 extended to heat dissipation ring 1, and heat dissipation copper sheet 4 can be with the high temperature heat conduction that chip 3 department produced to the outside of heat dissipation ring 1 to reduce the heat of chip 3, improve the radiating effect.
In this embodiment, specifically: lateral wall fixedly connected with fixed bearing 22 that first horizontal awl tooth 20 was kept away from to horizontal pole 21, the lateral wall welding of fixed bearing 22 has straight-bar 23, the one end fixed connection of straight-bar 23 is at the top of cooling ring 1, horizontal pole 21 has fan piece 24 near the lateral wall welding of fixed bearing 22, the rotation of horizontal pole 21 drives fan piece 24 and rotates, thereby produce the air current, the air current flows through chip 3, take away the air of 3 departments high temperature of chip, thereby reduce the heat of chip 3, and the radiating effect is improved.
In this embodiment, specifically: the outer side wall of the rotating shaft 10 is welded with fan blades 11, the outer side wall of the radiating ring 1 is welded with radiating fins 12, the radiating fins 12 are located below the fan blades 11, and the radiating fins 12 are used for assisting in heat dissipation.
In this embodiment, specifically: the radiator-grid 5 that quantity is four and is the annular distribution with the central point of radiator-grid 1 as the centre of a circle is installed to the lateral wall of radiator-grid 1, and the welding of the inside wall top of radiator-grid 1 has ring carrier 6, and filter screen 7 is installed to ring carrier 6's inner circle, and filter screen 7 and radiator-grid 5 can the external dust of separation of certain degree.
Working principle or structural principle, when in use, the heat radiating fin 12 is located below the fan blade 11, the heat radiating fin 12 is used for assisting in heat radiation, the rotation of the cross rod 21 drives the fan blade 24 to rotate, thereby generating wind current, the wind current flows through the chip 3, and takes away air with high temperature at the chip 3, thereby reducing heat of the chip 3, improving heat radiation effect, the heat radiating copper sheet 4 can conduct the high temperature generated at the chip 3 to the outside of the heat radiating ring 1, thereby reducing heat of the chip 3, improving heat radiation effect, the motor 9 drives the rotating shaft 10 to rotate, thereby driving the annular bevel gear 13, the annular bevel gear 13 drives the driven bevel gear 14 to rotate, thereby driving the connecting rod 15 to rotate, the rotation of the connecting rod 15 drives the fixed bevel gear 16 to rotate, the fixed bevel gear 16 drives the driven bevel gear 14 to rotate, thereby driving the vertical rod 18 to rotate, the vertical rod 18 drives the second vertical bevel gear 19 to rotate, thereby driving the, the rotation of the cross bar 21 drives the fan blade 24 to rotate, the rotation direction of the fan blade 24 is the same as the rotation direction of the rotating shaft 10, that is, the rotation direction of the fan blade 24 is the same as the rotation direction of the fan blade 11, so that the airflow generated by the fan blade 24 assists to enhance the airflow generated by the fan blade 11, the airflow generated by the fan blade 24 approaches the chip 3, thereby improving the heat dissipation effect near the chip 3, the air flow blows through the chip 3 and blows out through the heat dissipation fins 12 and the filter screen 7, the motor 9 drives the rotating shaft 10 to rotate, thereby driving the fan blades 11 to rotate, the rotation of the fan blades 11 enables the hot air inside the heat dissipation ring 1 to exchange with the outside air, thereby effectively reducing the temperature of the chip 3, preventing the chip 3 from being damaged due to overhigh temperature, blocking external dust to a certain degree by the filter screen 7 and the heat dissipation screen 5, meanwhile, air can be convected through the holes of the filter screen 7 and the radiating screen 5, and the heat radiation of the device is not influenced.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A heat dissipation device for an electronic chip comprises a heat dissipation ring (1), and is characterized in that: the heat dissipation ring is characterized in that the inner side wall of the heat dissipation ring (1) is welded with four fixing rods (8) which are distributed annularly and take the central point of the heat dissipation ring (1) as the center of a circle, the fixing rods (8) are welded with one ends of the heat dissipation ring (1) away from the fixing rods (8) and are welded with a motor (9), the output shaft of the motor (9) is fixedly connected with a rotating shaft (10), the outer side wall of the rotating shaft (10) is welded with annular bevel gears (13), the outer side wall of the annular bevel gears (13) is meshed with driven bevel gears (14), one side center of the driven bevel gears (14) away from the annular bevel gears (13) is fixedly connected with a connecting rod (15), one end of the connecting rod (15) away from the driven bevel gears (14) is fixedly connected with fixed bevel gears (16), one end of the connecting rod (15) away from the driven bevel gears (14) runs through the heat dissipation ring (1) and, the outer side wall of fixed awl tooth (16) meshes and is connected with first vertical awl tooth (17), the bottom center welding of first vertical awl tooth (17) has montant (18), the lateral wall of montant (18) passes through the lateral wall fixed connection of bearing and support and cooling ring (1).
2. The heat dissipating device for an electronic chip as claimed in claim 1, wherein: the bottom welding of montant (18) has the vertical awl tooth of second (19), the lateral wall meshing of the vertical awl tooth of second (19) is connected with first horizontal awl tooth (20), one side welding of first horizontal awl tooth (20) has horizontal pole (21), the one end that first horizontal awl tooth (20) was kept away from in horizontal pole (21) runs through the inboard that radiating ring (1) extended to radiating ring (1), the lateral wall of horizontal pole (21) passes through the bearing and rotates with radiating ring (1) to be connected.
3. The heat dissipating device for an electronic chip as claimed in claim 1, wherein: the bottom fixedly connected with power strip (2) of heat dissipation ring (1), chip (3) are installed at the top of power strip (2), the top of chip (3) is provided with heat dissipation copper sheet (4), the one end that chip (3) were kept away from in heat dissipation copper sheet (4) runs through the outside that heat dissipation ring (1) extended to heat dissipation ring (1).
4. The heat dissipating device for an electronic chip as claimed in claim 2, wherein: the lateral wall fixedly connected with fixing bearing (22) of first horizontal awl tooth (20) is kept away from in horizontal pole (21), the lateral wall welding of fixing bearing (22) has straight-bar (23), the one end fixed connection in the top of cooling ring (1) of straight-bar (23), the lateral wall welding that horizontal pole (21) is close to fixing bearing (22) has fan blade (24).
5. The heat dissipating device for an electronic chip as claimed in claim 1, wherein: the outer wall welding of pivot (10) has flabellum (11), the outer wall welding of radiating ring (1) has fin (12), fin (12) are located the below of flabellum (11).
6. The heat dissipating device for an electronic chip as claimed in claim 1, wherein: the heat dissipation ring is characterized in that the outer side wall of the heat dissipation ring (1) is provided with four heat dissipation nets (5) which are distributed annularly and take the central points of the heat dissipation ring (1) as the circle center, the top of the inner side wall of the heat dissipation ring (1) is welded with an annular support (6), and the inner ring of the annular support (6) is provided with a filter screen (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021021411.6U CN212257378U (en) | 2020-06-06 | 2020-06-06 | Heat radiator for electronic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021021411.6U CN212257378U (en) | 2020-06-06 | 2020-06-06 | Heat radiator for electronic chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212257378U true CN212257378U (en) | 2020-12-29 |
Family
ID=73978669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021021411.6U Expired - Fee Related CN212257378U (en) | 2020-06-06 | 2020-06-06 | Heat radiator for electronic chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212257378U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112815758A (en) * | 2020-12-30 | 2021-05-18 | 成都威诺电子设备制造有限责任公司 | Intelligent air-cooled radiator |
-
2020
- 2020-06-06 CN CN202021021411.6U patent/CN212257378U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112815758A (en) * | 2020-12-30 | 2021-05-18 | 成都威诺电子设备制造有限责任公司 | Intelligent air-cooled radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201229 Termination date: 20210606 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |