CN214956835U - Power board chip with good heat dissipation effect - Google Patents
Power board chip with good heat dissipation effect Download PDFInfo
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- CN214956835U CN214956835U CN202120832741.1U CN202120832741U CN214956835U CN 214956835 U CN214956835 U CN 214956835U CN 202120832741 U CN202120832741 U CN 202120832741U CN 214956835 U CN214956835 U CN 214956835U
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- heat dissipation
- fixedly connected
- fixing frame
- connecting rod
- fixing
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Abstract
The utility model discloses a power strip chip that radiating effect is good, concretely relates to power strip chip field, including power strip chip main part, power strip chip main part lower surface is equipped with heat dissipation mechanism, heat dissipation mechanism includes fixed connection and is in the heat dissipation mount of power strip chip main part lower surface, fixed pipe No. one of the inside intermediate position fixedly connected with of heat dissipation mount, fixed pipe No. two fixed pipes of a plurality of fixedly connected with under fixed pipe, lower extreme position fixedly connected with heat dissipation dust screen between the surface about heat dissipation mount is inside. The utility model discloses a heat dissipation motor rotates to drive connecting rod and rotate, thereby drive gear revolve No. one, thereby drive gear revolve No. two, thereby drive connecting rod revolve No. two, thereby drive radiator vane and rotate, thereby blow into ventilation cooling grid the inside to heat dissipation dust screen outside cold wind, thereby dispel the heat to the power board chip.
Description
Technical Field
The utility model relates to a power strip chip technical field, more specifically says, the utility model relates to a power strip chip that the radiating effect is good.
Background
The power panel chip is a chip which plays roles of conversion, distribution, detection and other electric energy management of electric energy in an electronic equipment system, and is mainly responsible for identifying the power supply amplitude of a CPU (central processing unit), generating corresponding short moment waves and pushing a rear-stage circuit to output power. The application range of the power supply board chip is very wide, the development of the power supply board chip has important significance for improving the performance of the whole machine, the selection of the power supply board chip is directly related to the requirement of a system, and the development of the digital power supply board chip is difficult to overcome the cost.
The power panel chip can give off heat when working, and is very important to the power panel chip heat dissipation in time, and this determines the stability of power panel chip, and power panel chip radiating effect is all relatively poor on the market at present, especially in summer high temperature weather, can not be effectively to power panel chip heat dissipation scheduling problem.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above-mentioned defect of prior art, the embodiment of the utility model provides a power board chip that radiating effect is good to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a power panel chip with good heat dissipation effect comprises a power panel chip main body, wherein a heat dissipation mechanism is arranged on the lower surface of the power panel chip main body, the heat dissipation mechanism comprises a heat dissipation fixing frame fixedly connected to the lower surface of the power panel chip main body, a first fixing tube is fixedly connected to the middle position inside the heat dissipation fixing frame, a plurality of second fixing tubes are fixedly connected to the lower surface of the first fixing tube, a heat dissipation dustproof net is fixedly connected to the lower end position between the left surface and the right surface inside the heat dissipation fixing frame, a heat dissipation motor is fixedly connected to the position of the upper surface of the heat dissipation dustproof net at the lower end of the left surface inside the heat dissipation fixing frame, a first connecting rod is fixedly connected to the surface of an output shaft of the heat dissipation motor through a coupler, the first connecting rod penetrates through the interiors of the lower ends of the plurality of the second fixing tubes, and the surface of the first connecting rod is rotatably connected with the plurality of second fixing tubes through bearings, every two be equipped with air cooling mechanism between the fixed pipe of No. two, the inside top of heat dissipation mount is equipped with cooling body, a plurality of air cooling mechanism wears to establish including fixed No. three fixed pipes on No. two fixed pipe surfaces.
Furthermore, No. two connecting rods penetrate through the inside of the No. three fixed tubes, and the surfaces of the No. two connecting rods are rotatably connected with the inside of the No. three fixed tubes through bearings.
Furthermore, the lower surface of the second connecting rod is fixedly connected with a first gear, the surface of the second fixing pipe is fixedly sleeved with a plurality of second gears, each second gear corresponds to each first gear, and the surface of each first gear is meshed with the surface of each second gear.
Furthermore, No. two connecting rod upper end surface fixed cover have connect with No. four fixed pipes, No. four fixed pipe left and right sides surface respectively fixedly connected with symmetric distribution's radiator vane.
Furthermore, the lower end of the right surface in the heat dissipation fixing frame is located on a fifth fixing pipe fixedly connected to the corresponding position of the first connecting rod, and the right end surface of the first connecting rod is rotatably connected with the fifth fixing pipe through a bearing.
Furthermore, a plurality of round holes are formed in the upper surface of the heat dissipation fixing frame and above the heat dissipation blades, and a ventilation and heat dissipation net is fixedly mounted inside the round holes of the heat dissipation fixing frame.
Furthermore, the upper end of the left surface inside the heat dissipation fixing frame is fixedly connected with three fixing plates which are distributed in an up-and-down symmetrical mode, the two fixing plates are far away from one end of the left surface inside the heat dissipation fixing frame is fixedly connected with a cooling copper pipe, the upper end of the right surface inside the heat dissipation fixing frame is fixedly connected with a cooler, and the upper pipe orifice and the lower pipe orifice of the cooling copper pipe are respectively and fixedly connected with the cooler inlet and outlet.
The utility model discloses a technological effect and advantage:
1. compared with the prior art, the heat dissipation motor rotates to drive the first connecting rod to rotate, so as to drive the first gear to rotate, and drive the second gear to rotate, so as to drive the second connecting rod to rotate, so as to drive the heat dissipation blades to rotate, so that cold air outside the heat dissipation dustproof net is blown into the ventilation and heat dissipation net, and the power board chip is cooled.
2. Compared with the prior art, the cooling device has the advantages that the cooler is used for filling cold air into the cooling copper pipe, the air is cooled through the cooling copper pipe, and then the radiating blades are blown to the power panel chip, so that a better radiating effect is achieved, and the radiating problem of the power panel chip is effectively solved.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is an enlarged schematic structural diagram of a point a in fig. 1 according to the present invention.
Fig. 3 is an enlarged schematic structural diagram of the point B in fig. 1 according to the present invention.
The reference signs are: 1. a power panel chip body; 2. a heat dissipation fixing frame; 3. a first fixed tube; 4. a second fixed tube; 5. a heat dissipation dustproof net; 6. a heat dissipation motor; 7. a first connecting rod; 8. a third fixed tube; 9. a second connecting rod; 10. a first gear; 11. a second gear; 12. a fourth fixed tube; 13. a heat dissipating fin; 14. a fifth fixed tube; 15. a ventilation and heat dissipation net; 16. a third fixing plate; 17. cooling the copper pipe; 18. a cooler.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in the attached figures 1-3, the power panel chip with good heat dissipation effect comprises a power panel chip main body 1, wherein a heat dissipation mechanism is arranged on the lower surface of the power panel chip main body 1, the heat dissipation mechanism comprises a heat dissipation fixing frame 2 fixedly connected to the lower surface of the power panel chip main body 1, a first fixing tube 3 is fixedly connected to the middle position inside the heat dissipation fixing frame 2, a plurality of second fixing tubes 4 are fixedly connected to the lower surface of the first fixing tube 3, a heat dissipation dustproof net 5 is fixedly connected to the lower end position between the left surface and the right surface inside the heat dissipation fixing frame 2, a heat dissipation motor 6 is fixedly connected to the lower end position on the upper surface of the heat dissipation dustproof net 5 at the lower end inside the heat dissipation fixing frame 2, a first connecting rod 7 is fixedly connected to the surface of an output shaft of the heat dissipation motor 6 through a coupler, the first connecting rod 7 penetrates through the insides of the lower ends of the plurality of the second fixing tubes 4, and the surface of the first connecting rod 7 is rotatably connected with the insides of the plurality of the second fixing tubes 4 through bearings, be equipped with air cooling mechanism between per two fixed tubes 4 No. two, the inside top of heat dissipation mount 2 is equipped with cooling body, and a plurality of air cooling mechanism is including fixed No. three fixed tubes 8 of wearing to establish on No. two fixed tubes 4 surfaces.
In a preferred embodiment, No. two connecting rods 9 penetrate through the inside of the No. three fixed pipe 8, and the surface of the No. two connecting rods 9 is rotatably connected with the inside of the No. three fixed pipe 8 through bearings, so that the No. two connecting rods 9 can be rotated more stably through the No. three fixed pipe 8.
In a preferred embodiment, a first gear 10 is fixedly connected to the lower surface of the second connecting rod 9, a plurality of second gears 11 are fixedly sleeved on the surface of the second fixing pipe 4, each second gear 11 corresponds to each first gear 10, and the surface of each first gear 10 is meshed with the surface of each second gear 11, so that the first gears 10 can be driven to rotate through the rotation of the second gears 11.
In a preferred embodiment, the upper end surface of the second connecting rod 9 is fixedly sleeved with a fourth fixing tube 12, and the left and right surfaces of the fourth fixing tube 12 are respectively and fixedly connected with radiating blades 13 which are symmetrically distributed, so that the radiating blades 13 can be rotated more stably through the fourth fixing tube 12.
In a preferred embodiment, the lower end of the right surface inside the heat dissipation fixing frame 2 is fixedly connected with a fifth fixing tube 14 at a position corresponding to the first connecting rod 7, and the right end surface of the first connecting rod 7 is rotatably connected with the inside of the fifth fixing tube 14 through a bearing, so that the first connecting rod 7 can be more smoothly rotated through the fifth fixing tube 14.
In a preferred embodiment, a plurality of circular holes are formed in the upper surface of the heat dissipation fixing frame 2 above the heat dissipation blades 13, and a ventilation and heat dissipation net 15 is fixedly installed inside the circular holes of the heat dissipation fixing frame 2, so that cold air can be blown to the power panel chip through the ventilation and heat dissipation net 15 to cool the power panel chip.
In a preferred embodiment, the upper end of the left surface inside the heat dissipation fixing frame 2 is fixedly connected with three fixing plates 16 which are distributed vertically and symmetrically, one end of each of the two three fixing plates 16, which is far away from the left surface inside the heat dissipation fixing frame 2, is fixedly connected with a cooling copper pipe 17, the upper end of the right surface inside the heat dissipation fixing frame 2 is fixedly connected with a cooler 18, and the upper and lower two pipe orifices of the cooling copper pipe 17 are respectively and fixedly connected with the inlet and outlet of the cooler 18, so that the cooling copper pipe 17 can be more stable through the three fixing plates 16.
The utility model discloses the theory of operation: through the rotation of heat dissipation motor 6 to drive connecting rod 7 and rotate, thereby drive gear 10 and rotate, thereby drive gear 11 No. two and rotate, thereby drive connecting rod 9 No. two and rotate, thereby drive radiator vane 13 and rotate, thereby blow into ventilation radiator mesh 15 the inside to the cold wind of heat dissipation dust screen 5 outside, thereby dispel the heat to the power board chip. Meanwhile, cold air is filled into the cooling copper pipe 17 through the cooler 18, the air is cooled through the cooling copper pipe 17, and then the radiating blades 13 are blown to the power panel chip, so that a better radiating effect is achieved, and the radiating problem of the power panel chip is effectively solved.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;
and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a power strip chip that radiating effect is good, includes power strip chip main part (1), its characterized in that: the lower surface of the power panel chip main body (1) is provided with a heat dissipation mechanism, the heat dissipation mechanism comprises a heat dissipation fixing frame (2) fixedly connected to the lower surface of the power panel chip main body (1), a first fixing tube (3) is fixedly connected to the middle position inside the heat dissipation fixing frame (2), a plurality of second fixing tubes (4) are fixedly connected to the lower surface of the first fixing tube (3), a heat dissipation dustproof net (5) is fixedly connected to the lower end position between the left surface and the right surface inside the heat dissipation fixing frame (2), the lower end of the left surface inside the heat dissipation fixing frame (2) is positioned on the upper surface of the heat dissipation dustproof net (5) and is fixedly connected with a heat dissipation motor (6), the surface of an output shaft of the heat dissipation motor (6) is fixedly connected with a first connecting rod (7) through a coupler, and the first connecting rod (7) penetrates through the insides of the lower ends of the second fixing tubes (4), just connecting rod (7) surface and a plurality of No. two fixed pipe (4) are inside to be rotated through the bearing and are connected, per two be equipped with air-cooled mechanism between No. two fixed pipe (4), the inside top of heat dissipation mount (2) is equipped with cooling body, a plurality of air-cooled mechanism wears to establish including fixed No. three fixed pipe (8) on No. two fixed pipe (4) surfaces.
2. The power board chip with good heat dissipation effect of claim 1, wherein: no. three fixed pipe (8) inside wears to be equipped with No. two connecting rods (9), just No. two connecting rods (9) surface with No. three fixed pipe (8) inside is rotated through the bearing and is connected.
3. The power board chip with good heat dissipation effect of claim 2, wherein: no. two connecting rod (9) lower surface fixedly connected with gear (10), No. two fixed pipe (4) fixed surface cup joints a plurality of No. two gear (11), every No. two gear (11) and every No. one gear (10) are corresponding, No. one gear (10) surface with No. two gear (11) surface meshing is connected.
4. The power board chip with good heat dissipation effect of claim 3, wherein: no. two fixed pipe (12) have been cup jointed to connecting rod (9) upper end fixed surface, surface fixedly connected with radiating fin (13) of symmetric distribution respectively about No. four fixed pipe (12).
5. The power board chip with good heat dissipation effect of claim 4, wherein: the lower end of the right surface in the heat dissipation fixing frame (2) is located on a fifth fixing pipe (14) fixedly connected to the corresponding position of the first connecting rod (7), and the right end surface of the first connecting rod (7) is rotatably connected with the fifth fixing pipe (14) through a bearing.
6. The power board chip with good heat dissipation effect of claim 5, wherein: the upper surface of the heat dissipation fixing frame (2) is located above the heat dissipation blades (13) and is provided with a plurality of round holes, and a ventilation and heat dissipation net (15) is fixedly mounted inside the round holes of the heat dissipation fixing frame (2).
7. The power board chip with good heat dissipation effect of claim 6, wherein: the heat dissipation fixing frame is characterized in that a third fixing plate (16) and a second fixing plate (16) are symmetrically distributed on the upper end of the inner left surface of the heat dissipation fixing frame (2) from top to bottom, the third fixing plate (16) is far away from a cooling copper pipe (17) fixedly connected with one end of the inner left surface of the heat dissipation fixing frame (2), a cooler (18) is fixedly connected with the upper end of the inner right surface of the heat dissipation fixing frame (2), and two upper and lower pipe orifices of the cooling copper pipe (17) are respectively fixedly connected with an inlet and an outlet of the cooler (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120832741.1U CN214956835U (en) | 2021-04-22 | 2021-04-22 | Power board chip with good heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120832741.1U CN214956835U (en) | 2021-04-22 | 2021-04-22 | Power board chip with good heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214956835U true CN214956835U (en) | 2021-11-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120832741.1U Active CN214956835U (en) | 2021-04-22 | 2021-04-22 | Power board chip with good heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214956835U (en) |
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2021
- 2021-04-22 CN CN202120832741.1U patent/CN214956835U/en active Active
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