CN212252508U - Packaging structure of high-power semiconductor light-emitting device - Google Patents

Packaging structure of high-power semiconductor light-emitting device Download PDF

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Publication number
CN212252508U
CN212252508U CN202021125091.9U CN202021125091U CN212252508U CN 212252508 U CN212252508 U CN 212252508U CN 202021125091 U CN202021125091 U CN 202021125091U CN 212252508 U CN212252508 U CN 212252508U
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China
Prior art keywords
threaded connection
welding
plate
semiconductor light
protective sheath
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CN202021125091.9U
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Chinese (zh)
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张士春
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Changzhou Shanneng Photoelectric Co ltd
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Changzhou Shanneng Photoelectric Co ltd
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Abstract

The utility model discloses a high-power semiconductor light-emitting device packaging structure, the inboard threaded connection who includes the fixed cover has interior protective sheath, the lower extreme welding of interior protective sheath has the sealing washer, the inboard of sealing washer has the apron through welded connecting plate threaded connection, the lower extreme welding of apron has the limiting plate, the welding of the upper end of limiting plate has the connecting seat, the upper end threaded connection of connecting seat has the connecting block, the upper surface threaded connection of connecting block has the metal foot, the welding of the upper end of interior protective sheath has the spacing ring, the inboard screw thread of spacing ring has cup jointed the semiconductor luminescent plate; this practicality provides the packaging structure who possesses certain leakproofness through the interior protective sheath that sets up and assorted auxiliary structure when using to this structure can conveniently be dismantled, when light-emitting device appears damaging, can directly dismantle and overhaul the operation such as.

Description

Packaging structure of high-power semiconductor light-emitting device
Technical Field
The utility model relates to a semiconductor design field specifically is a high-power semiconductor light emitting device packaging structure.
Background
The semiconductor is a substance with conductivity between an insulator and a conductor, and the conductivity of the semiconductor is easy to control and can be used as an element material for information processing. Semiconductors are very important from the viewpoint of technological or economic development. The core elements of many electronic products, such as computers, mobile phones, and digital recorders, utilize the conductivity change of semiconductors to process information. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is the most influential of various semiconductor materials in commercial applications.
When being applied to the field of luminescence, the semiconductor is usually simpler in structure, mature in manufacturing process and high in efficiency, but the semiconductor light-emitting device needs to be packaged, and cannot be directly installed or transported, and the existing semiconductor light-emitting device packaging structure has certain problems:
the existing semiconductor light-emitting device packaging structure mostly has strong sealing performance, but when the packaging structure is used, the packaging structure can not be easily disassembled, and when the packaging structure is used, the problem of easy disassembly cannot be solved conveniently, so that the situation that a follow-up light-emitting device is damaged and cannot be maintained in time is caused, certain use problems exist, the existing semiconductor light-emitting device packaging structure is used, the connection structure is not protected, the problem that water enters the connection part or dust interference exists easily due to negligence in the process of actual installation or transportation, and certain use limitation exists.
SUMMERY OF THE UTILITY MODEL
An object of the present invention is to provide a package structure for a high power semiconductor light emitting device to solve the above-mentioned problems in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high-power semiconductor illuminator packaging structure, has interior protective sheath including the inboard threaded connection of fixed cover, the lower extreme welding of interior protective sheath has the sealing washer, there is the apron inboard of sealing washer through welded connecting plate threaded connection, the lower extreme welding of apron has the limiting plate, the upper end welding of limiting plate has the connecting seat, the upper end threaded connection of connecting seat has the connecting block, the upper surface threaded connection of connecting block has the metal foot, the upper end welding of interior protective sheath has the spacing ring, the inboard screw thread of spacing ring has cup jointed the semiconductor luminescent plate.
Preferably, the upper surface of the fixed sleeve is fixedly provided with a glass baffle plate through a thread groove opening, and a sealing rubber ring is arranged at the lower side of the glass baffle plate in the thread groove opening of the fixed sleeve.
Preferably, the lower end of the semiconductor light-emitting plate is welded with a metal pin, and the metal pin of the semiconductor light-emitting plate is electrically connected with the metal pin of the connecting block through a fixing ring in threaded connection.
Preferably, the outside welding of connecting seat has the connecting pin, the connecting pin is copper electrode line.
Preferably, the material of spacing ring is transparent rubber material, gu fixed ring is upper and lower open-ended cylinder type structure metal rodlet.
Preferably, the fixed sleeve, the inner protective sleeve and the cover plate are all of cylindrical structures, and the shape of the limiting ring is matched with that of the semiconductor light-emitting plate.
Compared with the prior art, the beneficial effects of the utility model are that:
through the interior protective sheath that sets up and assorted auxiliary structure thereof, can be when using, provide the packaging structure who possesses certain leakproofness, and this structure can be dismantled conveniently, when damage appears in light-emitting device, can directly dismantle operations such as can overhaul, the instantaneity is stronger, possess certain beneficial effect, and apron and assorted auxiliary structure through setting up, can be when using, provide the stability and the seal structure of installation, before installing, can provide certain protection effect for connecting seat and connection stitch, avoid receiving the influence of dust and moisture, possess certain beneficial effect, more outstanding than traditional structure.
Drawings
Fig. 1 is a cross-sectional view of the present invention;
fig. 2 is a side view of the present invention;
fig. 3 is a top view of the present invention.
In the figure: 10-fixing a sleeve; 11-sealing rubber ring; 12-a glass baffle; 20-inner protective sheath; 21-metal feet; 22-a limiting plate; 23-a cover plate; 24-a fixed ring; 25-a sealing ring; 26-connecting blocks; 27-a stop collar; 28-a semiconductor light emitting panel; 30-a connecting seat; 31-connecting pins.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, a high-power semiconductor light-emitting device package structure includes an inner protective sleeve 20 in threaded connection with the inner side of a fixed sleeve 10, a sealing ring 25 is welded at the lower end of the inner protective sleeve 20, a cover plate 23 is connected with the inner side of the sealing ring 25 through a welded connecting plate in threaded connection, a limiting plate 22 is welded at the lower end of the cover plate 23, a connecting seat 30 is welded at the upper end of the limiting plate 22, a connecting block 26 is connected at the upper end of the connecting seat 30 in threaded connection, a metal pin 21 is connected at the upper surface of the connecting block 26 in threaded connection, a limiting ring 27 is welded at the upper end of the inner protective sleeve 20.
The upper surface of the fixed sleeve 10 is fixedly provided with a glass baffle 12 through a threaded notch, a sealing rubber ring 11 is arranged at the lower side of the glass baffle 12 in the threaded notch of the fixed sleeve 10, and a sealing structure at the top provides a light-transmitting structure and a sealing structure for the light-emitting device; the lower end of the semiconductor light-emitting plate 28 is welded with a metal pin 21, the metal pin of the semiconductor light-emitting plate 28 is electrically connected with the metal pin of the connecting block 26 through a fixing ring 24 in threaded connection, the limiting ring 27 is made of transparent rubber material, the fixing ring 24 is a cylindrical structure metal small rod with an upper opening and a lower opening, a medium for electrical connection is provided through the fixing ring 24, a limiting and stable structure is provided through the fixing ring 24, and the semiconductor light-emitting plate can be easily detached during maintenance; a connecting pin 31 is welded on the outer side of the connecting seat 30, and the connecting pin 31 is a copper electrode wire and is used for electrically connecting with a power supply or a circuit; fixed cover 10, interior protective sheath 20, apron 23 are cylindrical structure, the shape and the semiconductor light emitting panel 28 phase-match of spacing ring 27 ensure that spacing ring 27 can perfectly laminate semiconductor light emitting panel 28, avoid semiconductor light emitting panel 28 to appear the horizontal hunting in the use, and then cause the damage to metal foot 21.
The working principle is as follows: when using, at first, it is fixed through solid fixed ring 24 with two metal feet 21, fixed back is with connecting block 26 and the fixed of connecting seat 30 screw thread, connecting seat 30, connecting block 26 forms the whole of a connection with semiconductor light emitting board 28, later screw up sealing washer 25 and interior protective sheath 20, then with connecting seat 30, the whole of connecting block 26 and semiconductor light emitting board 28 is directly put into in the notch of interior protective sheath 20, semiconductor light emitting board 28 laminating spacing ring 27, will lap 23 and sealing washer 25 threaded connection this moment, form the encapsulation of bottom, screw up glass baffle 12 with fixed cover 10 with the upper end at last, can accomplish the operation.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a high-power semiconductor illuminator packaging structure, has interior protective sheath (20) including the inboard threaded connection of fixed cover (10), the lower extreme welding of interior protective sheath (20) has sealing washer (25), its characterized in that: the inboard of sealing washer (25) has apron (23) through welded connecting plate threaded connection, the lower extreme welding of apron (23) has limiting plate (22), the upper end welding of limiting plate (22) has connecting seat (30), the upper end threaded connection of connecting seat (30) has connecting block (26), the upper surface threaded connection of connecting block (26) has metal foot (21), the upper end welding of interior protective sheath (20) has spacing ring (27), semiconductor luminescent plate (28) have been cup jointed to the inboard screw thread of spacing ring (27).
2. The package structure of claim 1, wherein: the upper surface of fixed cover (10) has glass baffle (12) through the screw thread notch fixed mounting who offers, sealed rubber ring (11) have been seted up to the downside that is located glass baffle (12) in the screw thread notch of fixed cover (10).
3. The package structure of claim 1, wherein: the lower extreme welding of semiconductor light-emitting board (28) has metal foot (21), through threaded connection's solid fixed ring (24) electric connection between the metal foot of semiconductor light-emitting board (28) and the metal foot of connecting block (26).
4. The package structure of claim 1, wherein: the welding of the outside of connecting seat (30) has connecting pin (31), connecting pin (31) are copper electrode line.
5. The package structure of claim 3, wherein: the material of spacing ring (27) is transparent rubber material, solid fixed ring (24) are upper and lower open-ended cylinder type structure metal rodlet.
6. The package structure of claim 1, wherein: the fixing sleeve (10), the inner protective sleeve (20) and the cover plate (23) are all of cylindrical structures, and the limiting ring (27) is matched with the semiconductor light-emitting plate (28) in shape.
CN202021125091.9U 2020-06-17 2020-06-17 Packaging structure of high-power semiconductor light-emitting device Active CN212252508U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021125091.9U CN212252508U (en) 2020-06-17 2020-06-17 Packaging structure of high-power semiconductor light-emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021125091.9U CN212252508U (en) 2020-06-17 2020-06-17 Packaging structure of high-power semiconductor light-emitting device

Publications (1)

Publication Number Publication Date
CN212252508U true CN212252508U (en) 2020-12-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021125091.9U Active CN212252508U (en) 2020-06-17 2020-06-17 Packaging structure of high-power semiconductor light-emitting device

Country Status (1)

Country Link
CN (1) CN212252508U (en)

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