CN212227202U

CN212227202U - Heating plate connector

Info

Publication number: CN212227202U
Application number: CN202022489375.2U
Authority: CN
Inventors: 黄泽军; 孙敬山; 王桂玲; 谷新涛; 王娜
Original assignee: Jinan Baixiang Technology Development Co ltd
Current assignee: Jinan Baixiang Technology Development Co ltd
Priority date: 2020-07-15
Filing date: 2020-11-02
Publication date: 2020-12-25
Anticipated expiration: 2030-11-02
Also published as: CN212227201U

Abstract

The utility model relates to a heating plate conjunction, including the sheath that is used for accomodating the PI heating plate, fill heat conduction insulating filler between PI heating plate and sheath, the port of sheath passes through the sealing mechanism shutoff. The PI heating sheets are electrified to convert electric energy into heat energy, the heat energy is transferred to the sheath through the heat-conducting insulating filler, and then the sheath heats water. The position of the PI heating sheet lead-out wire is sealed, so that the sealing performance of the heating sheet combining piece is improved. The heat conduction insulating layer enables the heat conduction effect to be improved, the electric leakage risk of the PI heating sheet is reduced, and the use is safe.

Description

Heating plate connector

Technical Field

The utility model relates to a heating structure especially relates to a heating plate conjunction.

Background

The PI heating plate is a flexible film-shaped electric heating device and has the characteristics of high heating speed and high electric-heat conversion efficiency.

The PI heating plate needs to be packaged when being used for heating water, and the packaging form of the existing PI heating plate has the problems of poor sealing effect, easy deformation of a packaging structure, poor heat conduction effect, easy occurrence of safety accidents due to electric leakage and the like.

SUMMERY OF THE UTILITY MODEL

The utility model discloses to prior art's not enough, provide a heating plate conjunction.

The utility model discloses a following technical scheme realizes, provides a heating plate conjunction, including the heat conduction insulation layer of seting up at least one port and setting up at least one PI heating plate in the heat conduction insulation layer, the port department is sealed through sealing mechanism, and the wire of PI heating plate is worn out through heat conduction insulation layer or sealing mechanism, and the wire is worn out the sealed setting of department. The position of the PI heating sheet lead-out wire is sealed, so that the sealing performance of the heating sheet combining piece is improved, the electric leakage risk of the PI heating sheet is reduced, and meanwhile, the heat conducting effect is improved due to the heat conducting insulating layer;

preferably, the heat conducting insulation layer comprises a heat conducting sheath and a heat conducting insulation filler filled between the heat conducting sheath and the PI heating sheet. The heat-conducting insulating filler is used for realizing effective heat conduction and insulation, and can avoid direct contact between the PI heating sheet and the sheath and electric leakage.

Preferably, the sealing mechanism comprises a sealing cap that snaps over the port of the thermally conductive sheath. The sealing cover is used as the first seal of the port of the sheath.

Preferably, a sealant layer is disposed between the sealing cover and the heat-conducting sheath. The sealant layer serves as a second seal for the sheath port. The sealing cover is connected with the sheath through a sealing glue layer. The sealing cover and the sealing glue layer realize double sealing, and effective sealing protection of the PI heating plate is ensured. The sealing glue layer has certain deformation capacity after being cured, the boosting of the sheath after overheating can be counteracted, and the deformation of the sheath is reduced.

Preferably, the sealant layer is between the outer side surface of the port of the heat-conducting sheath and the sealing cover. The sealing glue layer plays a role in sealing and connecting twice. Effective sealing protection of the PI heating sheet is guaranteed, certain deformation capacity is achieved after the sealing adhesive layer is solidified, boosting of the sheath after overheating can be offset, and deformation of the sheath is reduced.

Preferably, the sealant layer is located in an inner hole of the port of the heat-conducting sheath and is fixedly connected with the inner side wall of the port of the heat-conducting sheath in a sealing manner.

Preferably, the sealing adhesive layer is located on the end face of the port of the heat-conducting sheath and is fixedly connected with the end face in a sealing mode.

Preferably, the inner side of the sealing adhesive layer is located in an inner hole of the port of the heat-conducting sheath and is fixedly connected with the inner side wall of the port of the heat-conducting sheath in a sealing manner, and the outer side of the sealing adhesive layer is located on the end face of the port of the heat-conducting sheath and is fixedly connected with the end face in a sealing manner.

Preferably, the inner side and the outer side of the sealant layer are of a two-layer structure.

Preferably, the inner side and the outer side of the sealant layer are fixedly connected by a layer of structure.

The utility model discloses a heat-resisting ageing resistance of sealed glue is and insulating, and the inboard and the outside on sealing glue layer can be one kind also can be two kinds of different sealed glues.

Preferably, the power supply lead wire on the PI heating plate penetrates through the sealing cover. The smooth outgoing line of the power supply outgoing line is realized, and the sealing performance of the power supply outgoing line is ensured through the sealing end cover.

Preferably, the heat conducting sheath is of a flat structure. The flat structure adapts to the flat form of the PI heating plate, and the assembly of the PI heating plate is convenient.

Preferably, one end of the heat conducting sheath is open, and the other end is closed. One end of the opening is a sheath port.

Preferably, both ends of the heat conducting sheath are open. Both ends of the opening are sheath ports.

Preferably, there are two PI heating plates. The two PI heating plates arranged inside the heating plate connector improve the heating efficiency of the heating plate connector on the premise of ensuring the sealing of the heating plate connector.

Preferably, a heat conducting and insulating filler is filled between the two PI heating sheets. And heat-conducting insulating fillers are arranged between the PI heating sheets, so that the risk of short circuit between the PI heating sheets is avoided.

The number of the PI heating sheets can be one, two or more. The utility model has the advantages that:

1. the PI heating sheets are electrified to convert electric energy into heat energy, the heat energy is transferred to the sheath through the heat-conducting insulating filler, and then the sheath heats water. The sealing structure has the advantages of good sealing effect, difficult deformation of the packaging structure, good heat conduction effect, electric leakage prevention and safe use.

2. Set up the clearance and fill the clearance through heat conduction insulating filler between PI heating plate and the sheath, can avoid PI heating plate and sheath direct contact, avoid the electric leakage. The heat-conducting insulating filler is used for realizing effective heat conduction and insulation.

3. The sealing cover is connected with the sheath through a sealing glue layer. The sealing cover and the sealing glue layer realize double sealing, and effective sealing protection of the PI heating plate is ensured. The sealing glue layer has certain deformation capacity after being cured, the boosting of the sheath after overheating can be counteracted, and the deformation of the sheath is reduced.

4. The sheath is a metal sheath which is high temperature resistant, not easy to deform, corrosion resistant, stable in performance and good in heat conduction effect.

5. The PI heating plate has high heating speed and high electrothermal conversion efficiency.

Drawings

FIG. 1 is a schematic structural diagram of embodiment 1 of the present invention;

FIG. 2 is a cross-sectional view of FIG. 1;

FIG. 3 is an enlarged view of a portion I of FIG. 1;

fig. 4 is a schematic structural diagram of embodiment 2 of the present invention;

fig. 5 is a schematic structural diagram of embodiment 3 of the present invention;

fig. 6 is a schematic structural diagram of embodiment 4 of the present invention;

fig. 7 is a schematic structural diagram of embodiment 5 of the present invention;

fig. 8 is a sectional view of embodiment 6 of the present invention;

shown in FIGS. 1-8:

1. the device comprises a PI heating sheet, 2, a sheath, 3, a heat-conducting insulating filler, 4, a sealing glue layer, 5, a sealing cover, 6 and a power supply lead-out wire.

Detailed Description

In order to clearly illustrate the technical features of the present solution, the present solution is explained below by way of specific embodiments.

Example 1

As shown in fig. 1-3, the utility model discloses a sheath 2 for taking in PI heating plate 1, sheath 2 is metal sheath, and metal sheath's material generally chooses for use aluminium, and metal sheath 2 is high temperature resistant non-deformable, anticorrosive, stable performance, and heat conduction is effectual.

And a heat-conducting insulating filler 3 is filled between the PI heating sheet 1 and the sheath 2, the heat-conducting insulating filler 3 is magnesia powder and/or alumina powder and/or ceramic paint and the like, and the heat-conducting insulating filler 3 is used for realizing effective heat conduction and insulation. The port of the sheath 2 is sealed by a sealing mechanism.

In this embodiment, the sealing mechanism comprises a sealing cover 5 fastened to the port of the sheath 2, and a layer of sealing glue 4 is provided between the sealing cover 5 and the sheath 2. The sealing cover 5 and the sealing glue layer 4 realize double sealing, and effective sealing protection of the PI heating plate 1 is ensured. The sealant layer 4 has certain deformation capability after being cured, so that the boosting of the sheath 2 after overheating can be counteracted, and the deformation of the sheath 2 is reduced. In this embodiment, the sealant layer 4 is made of a high temperature resistant silicone sealant.

A sealant layer 4 is arranged between the sealing cover 5 and the sheath 2. A part of the sealing glue layer 4 is arranged between the outer side surface of the port of the sheath 2 and the sealing cover 5; the inner side of the other part of the sealing glue layer 4 is positioned in an inner hole of the port of the sheath 2 and is fixedly connected with the inner side wall of the port of the sheath 2 in a sealing way, the outer side of the other part of the sealing glue layer 4 is positioned on the end surface of the port of the sheath 2 and is fixedly connected with the end surface in a sealing way, and the inner side and the outer side of the other part of the.

And a power lead 6 on the PI heating plate penetrates through the sealing cover 5. The sheath 2 is of a flat construction. One end of the sheath 2 is open, the other end is closed, one end of the opening is a sheath port, or both ends of the sheath are open, and both ends of the opening are sheath ports. The sheath 2 can also be processed into various forms such as a cylinder, a special shape and the like in the production process. The PI heat pieces 1 may be put into the sheath 2 from the open end of the sheath 2.

Example 2

As shown in fig. 4, the difference from embodiment 1 is that: the inner side and the outer side of the other part of the sealant layer 4 are of a layer structure.

Example 3

As shown in fig. 5, the difference from embodiment 1 is that: the sealant layer 4 is only between the outer side of the port of the sheath 2 and the sealing cover 5.

Example 4

As shown in fig. 6, the difference from embodiment 1 is that: the sealing glue layer 4 is positioned in the inner hole of the port of the sheath 2 and is fixedly connected with the inner side wall of the port of the sheath 2 in a sealing way.

Example 5

As shown in fig. 7, the difference from embodiment 1 is that: in example 5, the sealant layer 4 was not provided, and sealing was performed only by the sealing cap 5.

Example 6

As shown in fig. 8, the difference from embodiment 1 is that the PI heater chip 1 of embodiment 6 is provided with two pieces, so that the heating efficiency of the heater chip bonding member is improved in comparison with the case where one piece of PI heater chip is provided in the space of the sheath 2 of the same size.

The working principle of the utility model is that the PI heating plate 1 is electrified to convert the electric energy into heat energy, the heat is transferred to the sheath 2 through the heat-conducting insulating filler 3, and then the sheath 2 heats up the water. The sealing structure has the advantages of good sealing effect, difficult deformation of the packaging structure, good heat conduction effect, electric leakage prevention and safe use.

The theoretical thermal conductivity of the PI heating plate 1 reaches 5300W/m.K. Experiments show that 10 heating modules (the heating area is about 70 square meters) are arranged in the energy-saving electric heater, the power is about 1500W, the energy-saving electric heater has obvious electricity-saving effect compared with the traditional electric heater, and after the project is implemented, the energy-saving electric heater can play an industry leading role in the electric heating fields of coal-to-electricity engineering, household electric heaters and the like in vast rural areas.

Of course, the above description is not limited to the above examples, and technical features of the present invention that are not described in the present application may be implemented by or using the prior art, and are not described herein again; the above embodiments and drawings are only used for illustrating the technical solutions of the present invention and are not intended to limit the present invention, and the present invention has been described in detail with reference to the preferred embodiments, and those skilled in the art should understand that changes, modifications, additions or substitutions made by those skilled in the art within the spirit of the present invention should also belong to the protection scope of the claims of the present invention.

Claims

1. A heating plate binder, characterized in that: including the heat conduction insulating layer who sets up at least one port and set up at least one PI heating plate in the heat conduction insulating layer, the port department is sealed through sealing mechanism, and the wire of PI heating plate is worn out through heat conduction insulating layer or sealing mechanism, and the wire is worn out the department and is sealed the setting.

2. A heater chip bonding element according to claim 1, wherein: the heat conduction insulating layer comprises a heat conduction sheath and heat conduction insulating filler filled between the heat conduction sheath and the PI heating sheet.

3. A heater chip bonding element according to claim 2, wherein: the sealing mechanism comprises a sealing cover buckled at a port of the heat conducting sheath.

4. A heater chip bonding element according to claim 3, wherein: and a sealing glue layer is arranged between the sealing cover and the heat conducting sheath.

5. A heat patch combination as claimed in claim 4, wherein: the sealing adhesive layer is arranged between the outer side surface of the port of the heat-conducting sheath and the sealing cover.

6. A heat patch combination as claimed in claim 4 or 5, wherein: the sealing adhesive layer is positioned in an inner hole of the port of the heat-conducting sheath and is fixedly connected with the inner side wall of the port of the heat-conducting sheath in a sealing mode.

7. A heat patch combination as claimed in claim 4 or 5, wherein: the sealing adhesive layer is positioned on the end face of the port of the heat-conducting sheath and is fixedly connected with the end face in a sealing mode.

8. A heat patch combination as claimed in claim 4 or 5, wherein: the inner side of the sealing adhesive layer is positioned in an inner hole of the port of the heat-conducting sheath and is fixedly connected with the inner side wall of the port of the heat-conducting sheath in a sealing manner, and the outer side of the sealing adhesive layer is positioned on the end face of the port of the heat-conducting sheath and is fixedly connected with the end face in a sealing manner.

9. A heat patch combination as recited in claim 8, wherein: the inner side and the outer side of the sealing glue layer are of a two-layer structure.

10. A heat patch combination as recited in claim 8, wherein: the inner side and the outer side of the sealing glue layer are fixedly connected with one layer of structure.

11. A heat patch combination as claimed in claim 3 or 4, wherein: and a power supply leading-out wire on the PI heating sheet penetrates through the sealing cover.

12. A heat patch combination as claimed in any one of claims 2 to 5, wherein: the heat conducting sheath is of a flat structure.

13. A heater chip bonding element according to claim 2, wherein: one end of the heat conducting sheath is open, and the other end is closed.

14. A heater chip bonding element according to claim 2, wherein: both ends of the heat conduction sheath are open.

15. A heat patch combination as claimed in any one of claims 1 to 5, wherein: the number of the PI heating plates is two.

16. A heat patch combination as recited in claim 15, wherein: and heat-conducting insulating fillers are filled between the PI heating sheets.