CN212211516U

CN212211516U - Tearing-resistant heat-resistant FPC capable of being bent repeatedly

Info

Publication number: CN212211516U
Application number: CN202020491450.6U
Authority: CN
Inventors: 谢向群
Original assignee: Shenzhen Jumper Computer Technology Lo Ltd
Current assignee: Shenzhen Jumper Computer Technology Lo Ltd
Priority date: 2020-04-07
Filing date: 2020-04-07
Publication date: 2020-12-22
Anticipated expiration: 2030-04-07

Abstract

The utility model discloses an anti FPC that tears heat-resisting bending repeatedly, include the substrate layer and plate respectively and locate the first wire and the second wire on the relative two surfaces of substrate layer, the relative both ends of substrate layer be equipped with respectively one row with first wire and/or the golden finger that the second wire electricity is connected, at least one row the golden finger is circular or oval golden finger. The utility model discloses a design the golden finger for circular or oval, increase welding area makes this heat-resisting FPC who can bend repeatedly of tearing be difficult for desoldering after buckling, reduces owing to buckle the defective rate that produces and the condition of reprocessing.

Description

Tearing-resistant heat-resistant FPC capable of being bent repeatedly

Technical Field

The utility model relates to the field of electronic equipment, especially, relate to a heat-resisting FPC that can bend repeatedly of anti tearing.

Background

A flexible circuit board (FPC) is a printed circuit board made of a flexible insulating base material. The flexible wiring board can be bent, wound and the like, can be flexibly arranged along with the installation space, is not limited by the installation space, and therefore integration of electronic component assembly and wire connection is achieved, and the limitation of the traditional interconnection technology is broken through. The common FPC usually has a three-layer structure, namely a substrate layer, an adhesive and a conductor layer, and belongs to an adhesive flexible circuit board, but the adhesive has poor heat resistance, and the use temperature can only be limited to be between 100 ℃ and 200 ℃ in long-term use, so that the application field of the adhesive flexible circuit board is limited; meanwhile, the FPC is generally provided with gold fingers at both ends thereof, and the gold fingers are used for electrically connecting with the main board and other components. However, when the FPC is bent, the soldered portion of the gold finger is easily detached, which causes poor contact of the circuit board and affects the yield of the product.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in that, to prior art's defect, a heat-resisting FPC that can bend repeatedly is torn in resistance is provided.

The utility model provides a technical scheme that its technical problem adopted is:

the utility model provides a heat-resisting FPC that can bend repeatedly of anti tearing, includes the substrate layer and plates respectively and locate the first wire and the second wire on the relative two surfaces of substrate layer, the relative both ends of substrate layer be equipped with respectively one row with first wire and/or the golden finger that the second wire electricity is connected, at least one row the golden finger is circular or oval golden finger.

Preferably, still be equipped with on the substrate layer and improve the bending region of substrate layer bendability, the bending region is latticed.

Preferably, the bending region comprises a plurality of point-shaped recesses which are independent from each other.

Preferably, the bending area comprises a first bending area and a second bending area, the first bending area and the first lead are arranged on the same side of the substrate layer, and the second bending area and the second lead are arranged on the same side of the substrate layer.

Preferably, the first bending region avoids the first lead arrangement, and the second bending region avoids the second lead arrangement.

Preferably, the substrate layer is a polyimide substrate.

Preferably, the thickness of the polyimide base layer is 0.2mm-3 mm.

Preferably, the first and second conductive lines are both copper foils.

The utility model discloses following beneficial effect has: through being circular or oval with the golden finger design, increase area of weld makes this FPC buckle the back difficult desoldering, reduces because the defective rate and the condition of reprocessing that buckle the production, directly plates the wire simultaneously and establish on the substrate layer, avoids using the adhesion agent for this FPC has the heat-resisting advantage of tearing resistance.

Drawings

The invention will be further explained with reference to the drawings and examples, wherein:

fig. 1 is a schematic structural diagram of the front surface of the substrate layer in one embodiment of the present invention;

fig. 2 is a schematic structural diagram of the reverse side of the substrate layer in one embodiment of the present invention.

Detailed Description

In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The utility model provides an anti FPC that tears heat-resisting and can bend repeatedly, wherein FPC specifically is flexible circuit board, generally can be used to among electronic equipment such as panel computer or notebook computer, as shown in fig. 1-fig. 2, the utility model provides an anti FPC that tears heat-resisting and can bend repeatedly includes substrate layer 10 and plates respectively and locate the first wire 21 and the second wire 22 on the relative two surfaces of substrate layer 10, wherein, in some embodiments, substrate layer 10 is preferred to be the polyimide material, PI membrane promptly the utility model discloses in, the thickness of PI membrane is preferred to be 0.2mm-3mm, and substrate layer 10 shape can be adjusted along with the in-service use requirement, does not do the restriction here. As a preferred embodiment of the present invention, the first wire 21 and the second wire 22 are copper foils, and the first wire 21 and the second wire 22 are plated on the front and back sides of the substrate layer 10, in the present invention, the arrangement of the first wire 21 and the second wire 22 can be adjusted according to the actual use, and is not limited herein. In some embodiments, the two opposite ends of the substrate layer 10 are respectively provided with a row of golden fingers 30 electrically connected to the first wires 21 and/or the second wires 22, generally, electronic components are welded and fixed to the tearing-resistant and heat-resistant and repeatedly bendable FPC through the golden fingers 30 in the electronic device, the golden fingers 30 are detached when the tearing-resistant and heat-resistant and repeatedly bendable FPC is folded, in order to avoid the phenomenon that the golden fingers 30 are detached when the tearing-resistant and heat-resistant and repeatedly bendable FPC is folded, the utility model discloses in at least one row of golden fingers 30 are circular or oval to increase the welding area of the golden fingers 30, so as to avoid the detachment phenomenon when the bending.

Simultaneously, all be equipped with bending zone 11 on the tow sides of this substrate layer 10 for improve the ability of buckling of substrate layer 10, this bending zone 11 is latticedly in some embodiments, specifically includes that a plurality of punctiform are sunken, and mutual independence between a plurality of punctiform are sunken, and this a plurality of punctiform are sunken to form latticed bending zone 11, and the ductility of substrate layer can be strengthened to the bending zone 11 that forms latticed, promotes the utility model discloses the heat-resisting FPC's that can bend repeatedly ability of buckling of tearing is resisted. In some embodiments, the bending region 11 includes a first bending region 111 and a second bending region 112 respectively disposed on the front and back sides of the substrate layer 10, and the areas and distribution ranges of the first bending region 111 and the second bending region 112 may be different; in some embodiments, the first bending region 111 and the first conductive line 21 are disposed on the same side of the substrate layer 10, and the first bending region 111 is disposed to avoid the first conductive line 21; the second bending region 112 and the second conductive line 22 are disposed on the same side of the substrate layer 10, and are disposed to avoid the second conductive line 22.

The utility model provides an among the heat-resisting FPC that can bend repeatedly of tearing resistance, first wire 21 and second wire 22 are plated on locating the substrate layer through sputtering method/electroplating method, coating method or hot pressing method, specifically as follows:

the first embodiment is as follows:

sputtering method/plating method: the PI film is used as a substrate, a layer of metal is plated on the PI film by a vacuum sputtering method, then the thickness of the copper foil is increased by an electroplating method, the method can be used for producing the ultrathin tearing-resistant heat-resistant FPC capable of being bent repeatedly, and the tearing-resistant heat-resistant FPC capable of being bent repeatedly is manufactured by the process method.

Example two:

coating method: and (2) taking a copper foil as a base material, extruding and coating the synthesized polyamic acid on the coiled copper foil by using a precision die head, and drying in an oven and imidizing to form the tearing-resistant heat-resistant FPC capable of being bent repeatedly.

Example three:

hot pressing method: the PI film is taken as a base material, a layer of thin thermoplastic PI resin is coated, the PI film is hardened at high temperature, and then the PI film is remelted at high temperature and high pressure to fix the copper foil.

The prior flexible circuit board mainly comprises a PI film (polyimide film), an adhesive and copper foil, namely belongs to a flexible circuit board with adhesive, but the adhesive has poor heat resistance, and the use temperature can only be limited to be between 100 ℃ and 200 ℃ when the adhesive is used for a long time, so that the application field of the flexible circuit board with adhesive is limited. The utility model provides an anti FPC that tears heat-resisting bending repeatedly is established on PI membrane (polyimide film) through directly plating the copper foil, avoids using the not good adhesion agent of heat resistance to extend flexible circuit board's application scope. And simultaneously, the utility model discloses an anti-tear heat-resisting FPC that can bend repeatedly sets up the golden finger 30 of at least one end into circular or oval to set up latticed bending zone 11 at substrate layer 10, strengthen substrate layer 10's buckling nature in increase golden finger 30 welding area, make the utility model discloses anti-tear heat-resisting FPC that can bend repeatedly is difficult for the desolder, and the ability of bending simultaneously strengthens greatly to electronic equipment such as better matching panel computer, notebook computer.

The above examples only represent some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a heat-resisting FPC that can bend repeatedly of tearing resistance, its characterized in that includes substrate layer (10) and plates respectively and locates first wire (21) and second wire (22) on the relative two surfaces of substrate layer (10), the relative both ends of substrate layer (10) be equipped with respectively one row with first wire (21) and/or golden finger (30) that second wire (22) electricity is connected, at least one row golden finger (30) are circular or oval golden finger (30).

2. The tear-resistant, heat-resistant and repeatedly bendable FPC of claim 1, wherein the substrate layer (10) is further provided with a bending region (11) for improving the bending capability of the substrate layer (10), and the bending region (11) is in a grid shape.

3. The tear resistant, heat resistant, repeatably bendable FPC of claim 2 wherein said fold region (11) comprises a plurality of dot-like depressions that are independent of each other.

4. The tear-resistant, heat-resistant, and repeatedly bendable FPC according to claim 2, wherein the bending region (11) comprises a first bending region (111) and a second bending region (112), the first bending region (111) and the first conductive line (21) are disposed on the same side of the substrate layer (10), and the second bending region (112) and the second conductive line (22) are disposed on the same side of the substrate layer (10).

5. The tear resistant, heat resistant, repeatably bendable FPC of claim 4 wherein said first bending region (111) is disposed away from said first conductive line (21) and said second bending region (112) is disposed away from said second conductive line (22).

6. The tear-resistant, heat-resistant, and repeatedly bendable FPC of claim 1, wherein the substrate layer (10) is a polyimide substrate.

7. The tear resistant, heat resistant, and repeatably bendable FPC of claim 6 wherein the thickness of the polyimide substrate is 0.2mm to 3 mm.

8. The tear resistant, heat resistant, repeatably bendable FPC of claim 1 wherein said first and second conductive lines (21, 22) are both copper foil.