CN212211385U

CN212211385U - Silicon microphone structure packaged by flexible circuit board

Info

Publication number: CN212211385U
Application number: CN202020774409.XU
Authority: CN
Inventors: 陈贤明
Original assignee: Luoding Yinge Semiconductor Technology Co ltd
Current assignee: Luoding Yinge Semiconductor Technology Co ltd
Priority date: 2020-05-12
Filing date: 2020-05-12
Publication date: 2020-12-22
Anticipated expiration: 2030-05-12

Abstract

The utility model discloses a silicon microphone structure packaged by a flexible circuit board, which comprises a frame and a shell positioned at the bottom end of the frame, wherein the flexible circuit board is arranged at the inner side of the shell and positioned at the bottom end of the frame, an IC chip is welded at the top end of the flexible circuit board, a first silicon oatmeal chip is arranged at one side of the IC chip, and a second silicon oatmeal chip is arranged at one side of the IC chip, which is far away from the first silicon oatmeal chip; the top end of the frame is provided with a radio countersink, a shielding film is arranged at the middle position of the radio countersink, a front sound inlet hole is formed in the bottom end of the radio countersink, the bottom end of the front sound inlet hole is connected with an amplifying device, and the bottom end of the amplifying device is connected with the first silicon cornchip. Has the advantages that: the packaging structure that two sound mouths of leading sound mouth and rearmounted sound mouth combine together is adopted to make this microphone can initiatively fall and make an uproar, shielding the ambient noise, and then improved the definition of main conversation sound, improve the speech recognition rate of user under the noise environment.

Description

Silicon microphone structure packaged by flexible circuit board

Technical Field

The utility model relates to a silicon microphone technical field particularly, relates to a silicon microphone structure of flexible circuit board encapsulation.

Background

A Microphone (also called a Microphone or a Microphone, formal name of chinese is a Microphone) is a transducer for converting sound into an electrical signal, which is encoded by english Microphone. The silicon microphone is manufactured based on the cmos mems technology and is smaller in volume. The consistency is more than 4 times better than that of an electret capacitor microphone, so that the silicon microphone is suitable for the microphone array application with high cost performance.

The existing silicon microphone packaging structure is mostly packaged by a hard substrate, and in addition, the existing microphone generally has only one sound port, so that the background sound filtering effect is poor under the complex environment, the noise is more, and the definition of the main call sound is not high.

An effective solution to the problems in the related art has not been proposed yet.

SUMMERY OF THE UTILITY MODEL

To the problem in the correlation technique, the utility model provides a silicon microphone structure of flexible printed circuit encapsulation to overcome the above-mentioned technical problem that current correlation technique exists.

Therefore, the utility model discloses a specific technical scheme as follows:

a silicon microphone structure packaged by a flexible circuit board comprises a frame and a shell positioned at the bottom end of the frame, wherein the flexible circuit board is arranged on the inner side of the shell and positioned at the bottom end of the frame, an IC chip is welded at the top end of the flexible circuit board, a first silicon oatmeal chip is arranged on one side of the IC chip, and a second silicon oatmeal chip is arranged on one side of the IC chip, which is far away from the first silicon oatmeal chip; the top end of the frame is provided with a radio countersink, a shielding film is arranged in the middle of the radio countersink, the bottom end of the radio countersink is provided with a front sound inlet, the bottom end of the front sound inlet is connected with an amplifying device, and the bottom end of the amplifying device is connected with the first silicon cornchip; and a rear sound inlet hole is formed in one side of the shell, which is close to the second silicon wafer, penetrates through the flexible circuit board and is connected with the second silicon wafer, and sound absorption damping is arranged at the position, which is close to the second silicon wafer, of the rear sound inlet hole.

Furthermore, in order to increase the area of the sound inlet channel and help to improve the sound inlet efficiency, the front sound inlet hole comprises a first sound inlet hole arranged at the top end of the amplifying device, and a second sound inlet hole is arranged on one side of the first sound inlet hole.

Further, in order to guarantee integrality and definition that main conversation sound extracted, amplification device is including the first plane of reflection that the symmetry set up, and the bottom of first plane of reflection all is provided with the second plane of reflection, and the bottom of two second planes of reflection is provided with inhales the sound film, and the bottom symmetry of inhaling the sound film is provided with the third plane of reflection.

Further, in order to improve the sensitivity and the signal-to-noise ratio of the first silicon oatmeal chip, the sound absorption film is made of polyimide materials.

Furthermore, in order to improve the conversion effect of the acoustic-electric signals, the input end of the IC chip is respectively connected with the output end of the first silicon oatmeal chip and the output end of the second silicon oatmeal chip, and the first silicon oatmeal chip and the second silicon oatmeal chip are both electrically connected with the flexible circuit board.

The utility model has the advantages that:

(1) the utility model discloses a packaging structure that two vocal mouths of leading vocal mouth and rearmounted vocal mouth combined together to make this microphone can initiatively fall and make an uproar, shielding ambient noise, and then improved the definition of main conversation sound, improve the speech recognition rate of user under noise environment.

(2) The first sound inlet hole is matched with the second sound inlet hole, so that the front sound inlet hole is of a double-sound inlet hole structure, the area of a sound inlet channel is increased, and the sound inlet efficiency is improved.

(3) Through setting up first plane of reflection and second plane of reflection and third plane of reflection and cooperating, the main voice that leads to is through first plane of reflection and the enhancement of second plane of reflection multiple reflection, is absorbed by the sound absorption film to the reflection face amplification feedback that is the loudspeaker form and distributes through two is silicon wheat chip one, and then has guaranteed the integrality and the definition that main voice of calling extracted.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a flexible printed circuit board packaged silicon microphone structure according to an embodiment of the present invention;

fig. 2 is a partially enlarged view of a portion a in fig. 1.

In the figure:

1. a frame; 2. a housing; 3. a flexible wiring board; 4. an IC chip; 5. a first silicon oatmeal chip; 6. a second silicon oatmeal chip; 7. reaming a radio; 8. a shielding film; 9. a sound inlet hole is arranged in front; 901. a first sound inlet hole; 902. a second sound inlet hole; 10. an amplifying device; 1001. a first reflective surface; 1002. a second reflective surface; 1003. a sound absorbing film; 1004. a third reflective surface; 11. a sound inlet hole is arranged at the rear part; 12. and (5) sound absorption and damping.

Detailed Description

For further explanation of the embodiments, the drawings are provided as part of the disclosure and serve primarily to illustrate the embodiments and, together with the description, to explain the principles of operation of the embodiments, and to provide further explanation of the invention and advantages thereof, it will be understood by those skilled in the art that various other embodiments and advantages of the invention are possible, and that elements in the drawings are not to scale and that like reference numerals are generally used to designate like elements.

According to the utility model discloses an embodiment provides a silicon microphone structure of flexible printed circuit board encapsulation.

Referring now to the drawings and the detailed description, as shown in fig. 1-2, according to the silicon microphone structure packaged by the flexible printed circuit board of the embodiment of the present invention, the silicon microphone structure includes a frame 1 and a casing 2 located at the bottom end of the frame 1, a flexible printed circuit board 3 is disposed at the bottom end of the frame 1 and inside the casing 2, an IC chip 4 is welded to the top end of the flexible printed circuit board 3, a first silicon microphone chip 5 is disposed at one side of the IC chip 4, and a second silicon microphone chip 6 is disposed at one side of the IC chip 4 away from the first silicon microphone chip 5; a radio countersink 7 is arranged at the top end of the frame 1, a shielding film 8 is arranged at the middle position of the radio countersink 7, a front sound inlet hole 9 is arranged at the bottom end of the radio countersink 7, an amplifying device 10 is connected to the bottom end of the front sound inlet hole 9, and the bottom end of the amplifying device 10 is connected with the first silicon cornchip 5; a rear sound inlet hole 11 is formed in one side, close to the second silicon wafer 6, of the shell 2, the rear sound inlet hole 11 penetrates through the flexible circuit board 3 to be connected with the second silicon wafer 6, and a sound absorption damper 12 is arranged at the position, close to the second silicon wafer 6, of the rear sound inlet hole 11.

By means of the above scheme, adopt the packaging structure that two vocal cords of leading vocal mouth and rearmounted vocal mouth combine together to make this microphone can initiatively fall the noise, shield the ambient noise, and then improved the definition of main conversation sound, improve the speech recognition rate of user under the noise environment.

In one embodiment, the front sound inlet 9 includes a first sound inlet 901 disposed at the top end of the amplification device 10, and a second sound inlet 902 is disposed at one side of the first sound inlet 901, so that the front sound inlet 9 adopts a dual sound inlet structure, which increases the area of the sound inlet channel and helps to improve the sound inlet efficiency.

In one embodiment, the amplifying device 10 includes first reflecting surfaces 1001 arranged symmetrically, second reflecting surfaces 1002 are arranged at the bottom ends of the first reflecting surfaces 1001, sound absorbing films 1003 are arranged at the bottom ends of the second reflecting surfaces 1002, third reflecting surfaces 1004 are arranged symmetrically at the bottom ends of the sound absorbing films 1003, so that the first reflecting surfaces 1001 are matched with the second reflecting surfaces 1002 and the third reflecting surfaces 1004, the main call sound is reflected by the first reflecting surfaces 1001 and the second reflecting surfaces 1002 for multiple times and is absorbed by the sound absorbing films 1003, and the main call sound is amplified and fed back to a silicon-wheat chip one 5 through the two third reflecting surfaces 1004 distributed in a horn shape, and therefore the integrity and the definition of the main call sound extraction are guaranteed.

In one embodiment, the sound absorbing film 1003 is made of polyimide, so that the influence of the cavity reflected sound waves is eliminated, and the sensitivity and the signal-to-noise ratio of the silicon microphone chip one 5 are improved.

In one embodiment, the input end of the IC chip 4 is connected to the output end of the first silicon wafer 5 and the output end of the second silicon wafer 6, and the first silicon wafer 5 and the second silicon wafer 6 are both electrically connected to the flexible printed circuit 3, so that the IC chip 4 can better process and analyze the sound signals received by the first silicon wafer 5 and the second silicon wafer 6, and convert the sound signals into electrical signals, thereby improving the conversion effect of the sound-electricity signals.

For the convenience of understanding the technical solution of the present invention, the following detailed description is made on the working principle or the operation mode of the present invention in the practical process.

In practical application, the front sound inlet hole 9 and the rear sound inlet hole 11 form two sound ports at different positions, when the sound reaches the two sound ports at different time, an external delay is generated, meanwhile, the joint of the rear sound inlet hole 11 and the second silicon wafer 6 is provided with a sound absorbing damper 12, when the sound enters the microphone from the rear sound inlet hole 11, an internal delay is generated by the filtering action of the sound absorbing damper 12, the internal delay and the external delay are equal, the sound from the front sound port and the rear sound port is received by the first silicon wafer 5 and the second silicon wafer 6 at the same time, sound signals received by the first silicon wafer 5 and the second silicon wafer 6 comprise a main voice and a background voice, and because the background voice has the same size, the background voice is processed by the IC chip 4 to cancel each other out, so that the microphone is insensitive to the sound from the rear sound inlet hole 11, if the internal delay is less than the external delay, the microphone is insensitive to sounds from other directions, so that the effects of actively reducing noise, shielding environmental noise and improving the speech recognition rate of a user in a noise environment are achieved.

To sum up, with the help of the above technical scheme of the utility model, cooperate through setting up first sound inlet 901 and second sound inlet 902 to make leading sound inlet 9 adopt the structure of two sound inlets, increased the area of advancing the sound passageway, help improving the efficiency of advancing the sound. Through the arrangement that the first reflecting surface 1001 is matched with the second reflecting surface 1002 and the third reflecting surface 1004, the main call sound is reflected and enhanced for multiple times by the first reflecting surface 1001 and the second reflecting surface 1002, is absorbed by the sound absorbing film 1003, and is amplified and fed back to the first silicon-wheat chip 5 by the two horn-shaped third reflecting surfaces 1004, so that the integrity and the definition of the main call sound extraction are ensured. Adopt the packaging structure that two vocal cords of leading vocal mouth and rearmounted vocal mouth combined together to make this microphone can initiatively fall and make an uproar, shielding environmental noise, and then improved the definition of main conversation sound, improve the speech recognition rate of user under noise environment, adopt the mode of soft base plate encapsulation simultaneously, increased the antidetonation effect of this microphone.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A silicon microphone structure packaged by a flexible circuit board is characterized by comprising a frame (1) and a shell (2) positioned at the bottom end of the frame (1), wherein the flexible circuit board (3) is arranged on the inner side of the shell (2) and positioned at the bottom end of the frame (1), an IC chip (4) is welded at the top end of the flexible circuit board (3), a first silicon microphone chip (5) is arranged on one side of the IC chip (4), and a second silicon microphone chip (6) is arranged on one side of the IC chip (4) far away from the first silicon microphone chip (5);

a radio counterboring (7) is arranged at the top end of the frame (1), a shielding film (8) is arranged at the middle position of the radio counterboring (7), a front sound inlet hole (9) is arranged at the bottom end of the radio counterboring (7), an amplifying device (10) is connected to the bottom end of the front sound inlet hole (9), and the bottom end of the amplifying device (10) is connected with the first silicon cornchip (5);

casing (2) are close to one side of two (6) silicon oatmeal chips has seted up rearmounted sound inlet (11), just rearmounted sound inlet (11) run through flexible printed circuit board (3) with two (6) silicon oatmeal chips are connected, rearmounted sound inlet (11) are close to the position of two (6) silicon oatmeal chips is provided with inhales sound damping (12).

2. The FPC packaged silicon microphone structure of claim 1, wherein the front sound input hole (9) comprises a first sound input hole (901) disposed at a top end of the amplifying device (10), and a second sound input hole (902) is disposed at one side of the first sound input hole (901).

3. A flexible printed circuit board packaged silicon microphone structure as claimed in claim 1 or 2, wherein the amplifying device (10) comprises a first reflecting surface (1001) symmetrically arranged, a second reflecting surface (1002) is arranged at the bottom end of each of the first reflecting surfaces (1001), a sound absorbing film (1003) is arranged at the bottom end of each of the second reflecting surfaces (1002), and a third reflecting surface (1004) is symmetrically arranged at the bottom end of each of the sound absorbing films (1003).

4. A fpc-packaged silicon microphone structure as claimed in claim 3, wherein the sound absorbing membrane (1003) is a polyimide material.

5. The FPC-packaged silicon microphone structure of claim 1, wherein the input terminal of the IC chip (4) is connected to the output terminal of the first silicon oatmeal chip (5) and the output terminal of the second silicon oatmeal chip (6), respectively, and both the first silicon oatmeal chip (5) and the second silicon oatmeal chip (6) are electrically connected to the FPC (3).