CN212196765U - IGBT module packing carton - Google Patents

Abstract

The utility model discloses a IGBT module packing carton, including tray and closing cap pad, the tray sets to squarely, and tray and closing cap pad are made by preventing that static pearl is cotton, and the upper surface of tray is recessed to form a plurality of holes of placing of arranging the distribution, places the hole and is squarely, and one of them tip of placing the hole is provided with the protruding structure that is higher than placing the hole bottom surface, and the closing cap pad is the tiling at the upper surface of tray. This tray and closing cap pad have possessed better absorption collision energy's performance, the impaired probability of IGBT product when having reduced the packing carton carelessly and falling of very big degree. Simultaneously, place downthehole being provided with and prevent slow-witted structure, there is the terminal other end no terminal to one end, and the back can't distinguish the IGBT product at both ends, can avoid appearing the inconsistent individual case of tip when packing above-mentioned IGBT product completely, has effectively ensured the rate of accuracy that the IGBT product was placed.

Description

IGBT module packing carton

Technical Field

The utility model relates to an electronic product packaging protection technical field, in particular to IGBT module packing carton.

Background

In the existing packaging scheme of the IGBT (insulated Gate Bipolar transistor) product, a harder paper card or plastic is mostly adopted to package the IGBT product. The laminating degree of packing carton and IGBT product made by paper card or plastics is lower, and is relatively poor to the fixed position effect of product, causes the phenomenon that the product breaks away from fixed position to appear easily in the transportation, and then causes the damage to the product. Meanwhile, the paper card or the plastic is hard and has poor buffering performance, so that the phenomenon that products are damaged by falling is easy to occur once the packaging box falls carelessly in the transportation process.

Meanwhile, for some IGBT products, the left end and the right end cannot be distinguished from the back surface, and one end of the two ends of the front surface of the IGBT products is provided with a terminal, while the other end of the IGBT products is not provided with the terminal. When packing this IGBT product, because the IGBT product back is up puts into to the packing carton, the in-process of placing, and the vision can't discern which end of this product has the terminal, and the operator loads easily the opposite direction, leads to the inconsistent IGBT product of end about can appearing in the whole packing carton, and then leads to follow-up automation equipment to appear snatching wrong situation and take place.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a IGBT module packing carton, when using this IGBT module packing carton packing IGBT product, can realize that the packing is prevented slow-witted and the effect of buffer protection product when falling.

The utility model adopts the technical proposal that:

the utility model provides a IGBT module packing carton, includes tray and closing cap pad, the tray sets up squarely, the tray with the closing cap pad is made by antistatic pearl cotton, the upper surface of tray is recessed to form a plurality of arrangement's of distributing place the hole, it is square to place the hole, one of them tip of placing the hole is provided with the protruding structure that is higher than placing the hole bottom surface, the closing cap pad tiling the upper surface of tray.

As a further improvement of the scheme, the protruding structures are square strips transversely arranged in the placing holes, and the top surfaces of the square strips are parallel to the upper surface of the tray.

As a further improvement of the scheme, two ends of the placing hole are respectively provided with a guide post, the guide posts are perpendicular to the upper surface of the tray, and one of the guide posts is perpendicular to the top surface of the square strip.

As a further improvement of this aspect, the top surfaces of the guide posts are disposed flush with the upper surface of the tray, and the height of the top surfaces of the guide posts is lower than the height of the upper surface of the tray.

As a further improvement of this solution, the guide post is provided with a semicircular cross section.

As a further improvement of the scheme, two opposite arc-shaped gaps are formed on two side walls of the placing hole respectively and are vertically arranged.

As a further improvement of the proposal, the arc-shaped notches in two adjacent placing holes on the side part are arranged in a staggered way.

As a further improvement of the scheme, the tray cover further comprises an outer package, the transverse dimension of the inner part of the outer package is equal to the transverse dimension of the outer periphery of the tray, and the sum of the heights of the tray and the cover pad is equal to the vertical dimension of the inner part of the outer package.

Has the advantages that: because tray and closing cap pad are made by antistatic pearl cotton for this tray and closing cap pad have possessed better performance of absorbing collision energy, very big degree reduced the impaired probability of IGBT product when the packing carton falls carelessly. Simultaneously, place downthehole being provided with and prevent slow-witted structure, there is the terminal other end no terminal to one end, and the back can't distinguish the IGBT product at both ends, can avoid appearing the inconsistent individual case of tip when packing above-mentioned IGBT product completely, has effectively ensured the rate of accuracy that the IGBT product was placed.

Drawings

The invention will be further described with reference to the following figures and examples:

FIG. 1 is a schematic structural view of a pallet;

FIG. 2 is a top view of FIG. 1;

FIG. 3 is a schematic view of the structure of the cover pad;

fig. 4 is a schematic view of the overall structure of the IGBT module in this embodiment.

Detailed Description

This section will describe in detail the embodiments of the present invention, preferred embodiments of the present invention are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can intuitively and vividly understand each technical feature and the whole technical solution of the present invention, but they cannot be understood as the limitation of the protection scope of the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

Referring to fig. 1 to 4, an embodiment of the present invention provides an IGBT module packing box, which mainly comprises a tray 100, a cover gasket 200 and an outer package. The packaging box is mainly used for packaging the IGBT product 10 shown in figure 4. Specifically, the tray 100 is set to be square, the tray 100 and the cover gasket 200 are both made of antistatic pearl cotton, the upper surface of the tray 100 is recessed to form a plurality of arrangement-distributed placing holes 110, the placing holes 110 are square, one end of each placing hole 110 is provided with a raised structure 111 higher than the bottom surface of each placing hole 110, and the cover gasket 200 is tiled on the upper surface of the tray 100. The size of the cover pad 200 is identical to that of the tray 100, ensuring that the cover pad 200 can completely cover all the placing holes 110 and also ensuring the minimum size of the packing box. In this embodiment, the number of the placing holes 110 is 10, and the placing holes are distributed in five rows and two columns, and the IGBT products 10 can be assembled in the placing holes 110.

Because tray 100 and closing cap pad 200 are all made by antistatic pearl cotton for this tray 100 and closing cap pad 200 have possessed better performance of absorbing the collision energy, the impaired probability of IGBT product 10 when having reduced the packing carton carelessly and falling to a great extent. Meanwhile, a fool-proof structure is arranged in the placing hole 110, and the protruding structure 111 higher than the bottom surface of the placing hole 110 is arranged at one end of the placing hole 110, so that when the IGBT product 10 is packaged, one end of the non-terminal and one end provided with the protruding structure 111 are matched with each other, and correct installation is completed. When the IGBT product 10 is turned upside down, the back surface of the IGBT product 10 is uneven, and the end having the terminal 11 is raised above the placing hole 110 so as to be noticeable to an operator, or the capping of the capping pad 200 cannot be completed at all.

Use the packing carton that this embodiment provided, there is terminal 11 other end to one end, and the back can't distinguish the IGBT product 10 at both ends, can avoid appearing the inconsistent individual example of tip when packing above-mentioned IGBT product 10 completely, effectively ensured the rate of accuracy that IGBT product 10 placed.

Preferably, the convex structures 111 are square bars laterally disposed in the placing holes 110, and top surfaces of the square bars are parallel to the upper surface of the tray 100. The top surface of square strip just with the positive butt of IGBT product 10 one end, face-to-face contact is favorable to avoiding IGBT product 10 to take place the upset in placing hole 110.

Meanwhile, the two ends of the placing hole 110 are respectively provided with guide posts 112, the guide posts 112 are perpendicular to the upper surface of the tray 100, and one of the guide posts 112 is perpendicular to the top surface of the square bar. Because the two ends of the IGBT product 10 to be packaged by the packaging box provided by this embodiment are both provided with two notches 12, the guide posts 112 are provided to match with the notches 12 on one hand, so as to realize the guiding of the IGBT product 10 when placed; on the other hand, the guide posts 112 are embedded into the notches 12, so that the IGBT product 10 is limited and fixed, and the IGBT product 10 is ensured to be always kept at a correct placement position in the placement hole 110.

Further, the guide posts 112 are arranged in a semicircular shape in cross section. Since the recess 12 of the present IGBT product 10 is square, the guide post 112 is configured in a semicircular shape, the radius of the semicircular shape is substantially equal to the width of the recess 12, and the guide post 112 is in abutting fit with the recess 12 in a line-surface fit manner. Therefore, the limiting effect of the guide post 112 itself can be ensured, the contact area between the guide post 112 and the square notch 12 is reduced as much as possible, and the reserved space between the guide post 112 and the notch 12 is convenient for avoiding the interference problem caused by manufacturing errors.

While the top surfaces of the guide posts 112 are disposed flush with the upper surface of the tray 100 and the height of the top surfaces of the guide posts 112 is lower than the height of the upper surface of the tray 100. Because the both ends of the IGBT product 10 that this application packing carton packed have two recesses 12, the bottom of recess 12 is a little higher than the bottom surface of product itself. Therefore, the height of the top surface of the guide posts 112 is set to be slightly lower than the height of the upper surface of the tray 100, so that the bottom of the recess 12 can be placed on the top surface of the guide posts 112, and the stability of the package is further ensured.

Preferably, two opposite arc-shaped notches 113 are formed on two side walls of the placing hole 110, respectively, and the arc-shaped notches 113 are vertically arranged. The arc-shaped gap 113 can be used for fingers to stretch into, and the arrangement of the arc-shaped gap is convenient for taking and placing the IGBT product 10.

In order to provide the tray 100 with the largest possible number of the placement holes 110 and to save the manufacturing material of the tray 100, the arc-shaped notches 113 in the two adjacent placement holes 110 on the side are arranged in a staggered manner, so that the thickness between the two adjacent placement holes 110 is reduced as much as possible, and more placement holes 110 are distributed.

The lateral dimension of the interior of the outer package is equal to the lateral dimension of the outer periphery of the tray 100 and the sum of the heights of the tray 100 and the lidding pad 200 is equal to the vertical dimension of the interior of the outer package. The tray 100 and the cover gasket 200 are perfectly matched with the outer package, and stable packaging is realized.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the gist of the present invention within the scope of knowledge possessed by those skilled in the art.

Claims (8)

1. The utility model provides a IGBT module packing carton which characterized in that: including tray and closing cap pad, the tray sets up to squarely, the tray with the closing cap pad is made by preventing that static pearl is cotton, the upper surface of tray is recessed to form a plurality of arrangement distribution's the hole of placing, it is square to place the hole, one of them tip of placing the hole is provided with the protruding structure that is higher than placing the hole bottom surface, the closing cap pad tiling is in the upper surface of tray.

2. The IGBT module packaging box according to claim 1, wherein: the protruding structures are square strips transversely arranged in the placing holes, and the top surfaces of the square strips are parallel to the upper surface of the tray.

3. The IGBT module packaging box according to claim 2, wherein: the two end parts of the placing hole are respectively provided with a guide post, the guide posts are perpendicular to the upper surface of the tray, and one of the guide posts is perpendicularly arranged on the top surface of the square strip.

4. The IGBT module packaging box of claim 3, characterized in that: the top surfaces of the guide posts are arranged to be flush with the upper surface of the tray, and the top surfaces of the guide posts are lower than the upper surface of the tray.

5. The IGBT module packaging box of claim 4, characterized in that: the cross section of the guide post is arranged to be semicircular.

6. The IGBT module packaging box according to claim 1, wherein: the two side walls of the placing hole are respectively provided with opposite arc-shaped notches which are vertically arranged.

7. The IGBT module packaging box of claim 6, characterized in that: the arc-shaped notches in the two adjacent placing holes on the side parts are arranged in a staggered mode.

8. The IGBT module packaging box according to claim 1, wherein: the tray is characterized by further comprising an outer package, the transverse size of the inner portion of the outer package is equal to the transverse size of the periphery of the tray, and the sum of the heights of the tray and the cover sealing pad is equal to the vertical size of the inner portion of the outer package.

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