CN212191613U - Circuit board tin soldering device for electronic product production - Google Patents
Circuit board tin soldering device for electronic product production Download PDFInfo
- Publication number
- CN212191613U CN212191613U CN202020243456.1U CN202020243456U CN212191613U CN 212191613 U CN212191613 U CN 212191613U CN 202020243456 U CN202020243456 U CN 202020243456U CN 212191613 U CN212191613 U CN 212191613U
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- shell
- push rod
- bottom plate
- circuit board
- electronic product
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Abstract
The utility model discloses a circuit board soldering tin device is used in electronic product production, including stabilizer blade, backup pad, bottom plate, the bottom plate bottom is provided with 4 the stabilizer blade, be provided with between the stabilizer blade the backup pad, the bottom plate top is provided with the shell, the preceding front bezel that is provided with of shell, the shell is provided with the air exhauster at the back, the air exhauster is provided with the tuber pipe at the back, the tuber pipe bottom is provided with the active carbon rose box, the shell top is provided with the roof, shell one side is provided with actuating mechanism, the actuating mechanism bottom is provided with vertical cylinder, vertical cylinder bottom is provided with the second push rod, second push rod bottom is provided with the soldering tin head, the bottom plate top with the inside workstation that is provided with of shell, the workstation top is provided with 2 fixed cylinder. Has the advantages that: the utility model discloses be provided with cooling body, can accelerate the cooling to soldering tin mechanism after the use, avoid the workman to scald oneself when wasing.
Description
Technical Field
The utility model relates to an electronic product production technical field especially relates to a circuit board soldering tin device is used in electronic product production.
Background
The electronic product is a related product based on electric energy, and mainly comprises: watches, smart phones, telephones, televisions, video disc players (VCD, SVCD, DVD), video recorders, camcorders, radios, radio cassettes, combination speakers, compact disc players (CD), computers, games, mobile communication products, and the like. The early products were named electronic products mainly based on electronic tubes. After the electronic product is subjected to soldering tin processing, the soldering tin machine needs to be maintained, the service life of the electronic product is increased, but due to the fact that the temperature of the electronic product is too high after the electronic product is stopped, workers are easily scalded during cleaning, and mechanical accidents are caused.
SUMMERY OF THE UTILITY MODEL
An object of the present invention is to provide a circuit board soldering device for electronic product production.
The utility model discloses a following technical scheme realizes above-mentioned purpose:
a circuit board tin soldering device for electronic product production comprises support legs, support plates and a bottom plate, wherein 4 support legs are arranged at the bottom of the bottom plate, the support plates are arranged among the support legs, a shell is arranged at the top of the bottom plate, a front plate is arranged in front of the shell, an exhaust fan is arranged behind the shell, an air pipe is arranged behind the exhaust fan, an active carbon filter box is arranged at the bottom of the air pipe, a top plate is arranged at the top of the shell, a driving mechanism is arranged on one side of the shell, a vertical air cylinder is arranged at the bottom of the driving mechanism, a second push rod is arranged at the bottom of the vertical air cylinder, a tin soldering head is arranged at the bottom of the second push rod, a workbench is arranged at the top of the bottom plate and inside the shell, 2 fixed air cylinders are arranged at the top of the, the cooling device also comprises a cooling mechanism capable of accelerating internal cooling after use is finished, and the cooling mechanism is arranged on the top of the supporting plate.
Preferably, the cooling mechanism comprises a water tank, a water pump, a water pipe, cooling pipes and a return pipe, the water tank is arranged at the top of the supporting plate, the water pump is arranged at the top of the water tank, the water pipe is arranged at the top of the water pump, 2 cooling pipes are arranged at the top of the water pipe, and the return pipe is arranged at the bottom of each cooling pipe.
Preferably, actuating mechanism includes driving motor, screw rod, slider, slip table, driving motor sets up shell one side, the driving motor input links to each other with city bureau output electrical property, the driving motor output is provided with the screw rod, the screw rod radially is provided with the slider, the slider top is provided with the slip table.
Preferably, actuating mechanism includes slider, slip table, drives actuating cylinder, third push rod, it is in to drive actuating cylinder setting shell one side, it is provided with to drive actuating cylinder output the third push rod, third push rod one side is provided with the slider, the slider top is provided with the slip table.
Preferably, the support legs are welded to the bottom of the bottom plate, the support plate is welded to the support legs, the housing is welded to the bottom plate, the top plate is fixed to the housing through screws, and the workbench is fixed to the bottom plate through screws.
Has the advantages that: the utility model discloses be provided with cooling body, can accelerate the cooling to soldering tin mechanism after the use, avoid the workman to scald oneself when wasing.
Drawings
Fig. 1 is a structural view of an embodiment 1 of a circuit board soldering device for electronic product production according to the present invention;
fig. 2 is a cross-sectional view of an embodiment 1 of a circuit board soldering device for electronic product production according to the present invention;
fig. 3 is a cross-sectional view of a cooling mechanism of a circuit board soldering device for electronic product production according to the present invention;
fig. 4 is a structural view of a circuit board soldering device in accordance with an embodiment 2 of the present invention for manufacturing electronic products;
fig. 5 is a cross-sectional view of the embodiment 2 of the circuit board soldering device for electronic product production.
Reference numerals: 1. a support leg; 2. a support plate; 3. a cooling mechanism; 301. a water tank; 302. a water pump; 303. a water delivery pipe; 304. a cooling tube; 305. a return pipe; 4. a base plate; 5. a drive mechanism; 501. a drive motor; 502. a screw; 503. a slider; 504. a sliding table; 505. a driving cylinder; 506. a third push rod; 6. a front plate; 7. a housing; 8. a top plate; 9. a work table; 10. fixing the air cylinder; 11. a first push rod; 12. a fixing plate; 13. an exhaust fan; 14. an air duct; 15. an activated carbon filter box; 16. a vertical cylinder; 17. a second push rod; 18. and (6) soldering tin heads.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings:
a circuit board tin soldering device for electronic product production comprises support legs 1, support plates 2 and a bottom plate 4, wherein 4 support legs 1 are arranged at the bottom of the bottom plate 4, the support plates 2 are arranged between the support legs 1, a shell 7 is arranged at the top of the bottom plate 4, a front plate 6 is arranged in front of the shell 7, an exhaust fan 13 is arranged behind the shell 7, an air pipe 14 is arranged behind the exhaust fan 13, an active carbon filter box 15 is arranged at the bottom of the air pipe 14, a top plate 8 is arranged at the top of the shell 7, a driving mechanism 5 is arranged on one side of the shell 7, a vertical cylinder 16 is arranged at the bottom of the driving mechanism 5, a second push rod 17 is arranged at the bottom of the vertical cylinder 16, a tin soldering head 18 is arranged at the bottom of the second push rod 17, a workbench 9 is arranged at the top of the bottom plate 4 and inside the shell 7, and the cooling mechanism 3 can accelerate the internal cooling after the use is finished, and the cooling mechanism 3 is arranged on the top of the supporting plate 2.
Example 1
As shown in fig. 1, 2 and 3, the cooling mechanism 3 includes a water tank 301, a water pump 302, a water pipe 303, cooling pipes 304 and a return pipe 305, the water tank 301 is disposed on the top of the support plate 2, the water pump 302 is disposed on the top of the water tank 301, the water pipe 303 is disposed on the top of the water pump 302, the 2 cooling pipes 304 are disposed on the top of the water pipe 303, and the return pipe 305 is disposed at the bottom of the cooling pipes 304; the driving mechanism 5 comprises a driving motor 501, a screw 502, a sliding block 503 and a sliding table 504, wherein the driving motor 501 is arranged on one side of the shell 7, the input end of the driving motor 501 is electrically connected with the output end of a city bureau, the output end of the driving motor 501 is provided with the screw 502, the screw 502 is radially provided with the sliding block 503, and the top of the sliding block 503 is provided with the sliding table 504; stabilizer blade 1 welds in bottom plate 4 bottom, and backup pad 2 welds on stabilizer blade 1, and the shell 7 welds on bottom plate 4, and roof 8 passes through the fix with screw on shell 7, and workstation 9 passes through the fix with screw on bottom plate 4.
The working principle and the using flow of the embodiment are as follows: when the soldering tin device is used, a circuit board is placed on a workbench 9, a fixing cylinder 10 is started, the fixing cylinder 10 drives a first push rod 11 and a fixing plate 12 to fix the circuit board, then a driving motor 501 is started, the driving motor 501 drives a screw 502 and a slide block 503 to move, a soldering tin head 18 is moved to a proper position, a vertical cylinder 16 is started, the vertical cylinder 16 drives a second push rod 17 and the soldering tin head 18 to perform soldering operation on the circuit board, an exhaust fan 13 is started at the same time, gas generated in the soldering tin process is conveyed to an active carbon filter box 15 through an air pipe 14 by the exhaust fan 13 to be filtered, the ambient air is prevented from being influenced by overlarge smoke, after the soldering tin device is shut down, a water pump 301 is started, water is pumped out of a water tank 301 by the water pump 302 and conveyed to a water conveying pipe 303, the cooling pipe 304 cools the inside of the soldering tin device, and the cooled water flows to the, and recycling the waste water.
Example 2
As shown in fig. 3, 4 and 5, the difference between the embodiment 2 and the embodiment 1 is that the driving motor 501 and the screw 502 are replaced by the driving cylinder 505 and the third push rod 506, when in use, the circuit board is placed on the worktable 9, the fixed cylinder 10 is started, the fixed cylinder 10 drives the first push rod 11 and the fixed plate 12 to fix the circuit board, then the driving cylinder 505 is started, the driving cylinder 505 drives the third push rod 506 and the slider 503 to move, the soldering tin head 18 is moved to a proper position, the vertical cylinder 16 is started, the vertical cylinder 16 drives the second push rod 17 and the soldering tin head 18 to perform soldering work on the circuit board, the exhaust fan 13 is started at the same time, gas generated in the soldering process is conveyed to the activated carbon filter box 15 through the air pipe 14 to filter, the ambient air is prevented from being influenced by too much smoke, after the shutdown, the water pump 301 is started, the water pump 302 pumps water out of the water tank 301, and the water is conveyed to a water conveying pipe 303 and a cooling pipe 304 to cool the interior of the soldering device, and the cooled water flows to a water tank 301 from a return pipe 305 for recycling.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. A circuit board tin soldering device for electronic product production comprises support legs (1), support plates (2) and a bottom plate (4), wherein 4 support legs (1) are arranged at the bottom of the bottom plate (4), the support plates (2) are arranged between the support legs (1), a shell (7) is arranged at the top of the bottom plate (4), a front plate (6) is arranged in front of the shell (7), an exhaust fan (13) is arranged at the back of the shell (7), an air pipe (14) is arranged at the back of the exhaust fan (13), an activated carbon filter box (15) is arranged at the bottom of the air pipe (14), a top plate (8) is arranged at the top of the shell (7), a driving mechanism (5) is arranged on one side of the shell (7), a vertical cylinder (16) is arranged at the bottom of the driving mechanism (5), a second push rod (17) is, second push rod (17) bottom is provided with soldering tin head (18), bottom plate (4) top with inside workstation (9) that is provided with of shell (7), workstation (9) top is provided with 2 fixed cylinder (10), fixed cylinder (10) output is provided with first push rod (11), first push rod (11) one side is provided with fixed plate (12), its characterized in that: the cooling device also comprises a cooling mechanism (3) capable of accelerating internal cooling after use is finished, wherein the cooling mechanism (3) is arranged on the top of the supporting plate (2).
2. The circuit board soldering device for electronic product production according to claim 1, characterized in that: the cooling mechanism (3) comprises a water tank (301), a water pump (302), a water delivery pipe (303), cooling pipes (304) and a return pipe (305), wherein the water tank (301) is arranged at the top of the supporting plate (2), the water pump (302) is arranged at the top of the water tank (301), the water delivery pipe (303) is arranged at the top of the water pump (302), 2 cooling pipes (304) are arranged at the top of the water delivery pipe (303), and the return pipe (305) is arranged at the bottom of each cooling pipe (304).
3. The circuit board soldering device for electronic product production according to claim 1, characterized in that: actuating mechanism (5) include driving motor (501), screw rod (502), slider (503), slip table (504), driving motor (501) set up shell (7) one side, driving motor (501) output is provided with screw rod (502), screw rod (502) radially are provided with slider (503), slider (503) top is provided with slip table (504).
4. The circuit board soldering device for electronic product production according to claim 1, characterized in that: actuating mechanism (5) include slider (503), slip table (504), drive actuating cylinder (505), third push rod (506), it sets up to drive actuating cylinder (505) shell (7) one side, it is provided with to drive actuating cylinder (505) output third push rod (506), third push rod (506) one side is provided with slider (503), slider (503) top is provided with slip table (504).
5. The circuit board soldering device for electronic product production according to claim 1, characterized in that: the welding of stabilizer blade (1) is in bottom plate (4) bottom, backup pad (2) welding is in on stabilizer blade (1), shell (7) welding is in on bottom plate (4), roof (8) pass through the fix with screw on shell (7), workstation (9) pass through the fix with screw on bottom plate (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020243456.1U CN212191613U (en) | 2020-03-03 | 2020-03-03 | Circuit board tin soldering device for electronic product production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020243456.1U CN212191613U (en) | 2020-03-03 | 2020-03-03 | Circuit board tin soldering device for electronic product production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212191613U true CN212191613U (en) | 2020-12-22 |
Family
ID=73820373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020243456.1U Expired - Fee Related CN212191613U (en) | 2020-03-03 | 2020-03-03 | Circuit board tin soldering device for electronic product production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212191613U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113305465A (en) * | 2021-07-30 | 2021-08-27 | 徐州康仕居新材料科技有限公司 | Thermal resistance test fixture for flip chip |
-
2020
- 2020-03-03 CN CN202020243456.1U patent/CN212191613U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113305465A (en) * | 2021-07-30 | 2021-08-27 | 徐州康仕居新材料科技有限公司 | Thermal resistance test fixture for flip chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201222 |
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| CF01 | Termination of patent right due to non-payment of annual fee |