CN212183838U - Multifunctional chip mounter - Google Patents
Multifunctional chip mounter Download PDFInfo
- Publication number
- CN212183838U CN212183838U CN202021271537.9U CN202021271537U CN212183838U CN 212183838 U CN212183838 U CN 212183838U CN 202021271537 U CN202021271537 U CN 202021271537U CN 212183838 U CN212183838 U CN 212183838U
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- CN
- China
- Prior art keywords
- fixedly connected
- clamping
- chip mounter
- workbench
- grip block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000013016 damping Methods 0.000 claims description 30
- 238000003825 pressing Methods 0.000 claims description 21
- 230000035939 shock Effects 0.000 claims description 17
- 239000013013 elastic material Substances 0.000 claims description 9
- 230000001174 ascending effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract description 2
- 230000008878 coupling Effects 0.000 abstract 4
- 238000010168 coupling process Methods 0.000 abstract 4
- 238000005859 coupling reaction Methods 0.000 abstract 4
- 238000000034 method Methods 0.000 description 11
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 3
- 239000011435 rock Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The application relates to the field of circuit board manufacturing equipment, in particular to a multifunctional chip mounter, which comprises a machine body, wherein a machine head is connected above the machine body in a sliding manner, and the machine head can slide along the length direction and the width direction of a workbench; the rigid coupling has the lift cylinder on the aircraft nose, the piston rod of lift cylinder sets up along vertical direction, the piston rod rigid coupling of lift cylinder has the subsides head, the standing groove has been seted up on the workstation, the equal sliding connection of standing groove four sides has the grip block, the grip block is close to the one side bottom at standing groove center and has all been seted up the grip block, the equal rigid coupling in grip block one side has fixed spring, the fixed spring other end all with the workstation rigid coupling, fixed spring all can apply the level to the power at standing groove center for the grip block. This application has the grip block and can stably centre gripping the circuit board between the grip block under fixed spring's effect, and the circuit board edge can be pegged graft into the centre gripping groove simultaneously, strengthens the stability of centre gripping, improves electronic component's subsides dress machining precision's effect.
Description
Technical Field
The application relates to the field of circuit board manufacturing equipment, in particular to a multifunctional chip mounter.
Background
The chip mounter is used for a circuit board production line, accurately mounts electronic elements on the surface of a PCB substrate, then performs the next welding, the common chip mounter is of an arch frame type, the PCB substrate can be fixed on a machine table, the machine head moves on an X/Y axis, a vacuum suction nozzle is connected onto the machine head, the electronic elements on a feeder can be sucked onto the suction nozzle, and then the electronic elements are accurately placed on the PCB substrate.
The prior art can refer to the chinese utility model patent that the grant bulletin number is CN209497809U, and it discloses a chip mounter's panel jig, including main body frame, telescopic link, mount, flat body, sliding plate, first movable block, second movable block, connecting rod, fixed spring, first fixed block, the equal fixedly connected with telescopic link in both sides at main body frame inner wall top, main body frame's one end fixedly connected with mount is kept away from to the telescopic link, the surface activity of mount has flat body, the top sliding connection on flat body right side has the sliding plate, one side fixedly connected with first movable block of flat body is kept away from to the sliding plate.
For the related technologies, the inventor thinks that the chip mounter clamps the circuit board only through two symmetrically arranged clamping plates, so that the clamping stability is not high, and the circuit board is easy to be unstable in the mounting process to affect the mounting precision.
SUMMERY OF THE UTILITY MODEL
In order to improve the clamping stability of the chip mounter to the circuit board and improve the accuracy of chip mounting, the application provides a multifunctional chip mounter.
The application provides a multi-functional chip mounter adopts following technical scheme:
a multifunctional chip mounter comprises a mounter body, wherein a workbench is arranged at one end above the mounter body, a feeding table is arranged at the other end above the mounter body, first slide rails arranged along the width direction of the mounter body are fixedly connected at positions, close to the tops of the workbench and the feeding table, of two ends of the mounter body, the first slide rails are jointly connected with second slide rails arranged along the length direction of the mounter body in a sliding manner, and a machine head is connected onto the second slide rails in a sliding manner; the machine head is fixedly connected with a lifting cylinder, a piston rod of the lifting cylinder is arranged along the vertical direction, a mounting head is fixedly connected with a piston rod of the lifting cylinder, a vacuum suction nozzle is fixedly connected onto the mounting head, and a vacuum generator connected with the vacuum suction nozzle is arranged in the mounting head; the clamping groove is formed in the workbench, the positions, close to four sides of the placing groove, of the workbench are all connected with clamping blocks in a sliding mode, the clamping blocks are close to the bottom end of one side of the center of the placing groove, the clamping grooves are all arranged in the direction parallel to the surface of the workbench, the clamping blocks are far away from the positions at the center of the placing groove and are fixedly connected with fixing springs, the fixing springs are far away from one ends of the clamping blocks and are fixedly connected with the workbench, and the fixing springs can apply force, horizontally, towards the center of the placing groove, to the clamping blocks.
Through adopting above-mentioned technical scheme, place the electronic component that needs pasted the dress on to the circuit board on the feed table, the circuit board has been placed on the workstation, slide through the aircraft nose and vacuum nozzle's cooperation with electronic component from feed table fortune to workstation and paste the dress to the circuit board on, slide the grip block through fixed spring, place the circuit board between the grip block, release the grip block, the grip block can be with circuit board centre gripping steadily between the grip block under the effect of spring, the circuit board edge can be pegged graft into in the centre gripping groove simultaneously, strengthen the stability of centre gripping, the realization is to the stable of circuit board with holding, improve electronic component's subsides dress machining precision.
Preferably, a shock pad made of an elastic material is fixedly connected to the position, close to the bottom end of the placing groove, of the workbench.
Through adopting above-mentioned technical scheme, at electronic component's subsides dress in-process, the shock pad can realize the buffering between circuit board and the workstation, and the shock pad can improve the stability of subsides dress process.
Preferably, the clamping blocks are provided with pressing blocks sliding along the vertical direction, and driving devices for driving the pressing blocks to slide up and down are fixedly connected to the pressing blocks.
Through adopting above-mentioned technical scheme, drive arrangement can drive the compact heap and slide from top to bottom, makes the compact heap can produce decurrent pressure to the grip block to let the compact heap can compress tightly the grip block, under the elastic action of shock pad, produce the power that compresses tightly downwards to the circuit board, thereby let the centre gripping more stable, increase surface mounting's precision.
Preferably, the driving device comprises a fixed cylinder fixedly connected to the workbench, piston rods of the fixed cylinder are arranged along the vertical direction, and the piston rods of the fixed cylinder are fixedly connected to the pressing block.
Through adopting above-mentioned technical scheme, fixed cylinder can drive the slip of compact heap, provides stable drive power to the compact heap.
Preferably, the bottom ends of the pressing blocks are fixedly connected with pressing layers made of elastic materials.
Through adopting above-mentioned technical scheme, elastic layer that compresses tightly can let the effect of compressing tightly better after compressing tightly the compact heap through the cylinder.
Preferably, a chamfer is formed at the position, close to the clamping groove, of the clamping block.
By adopting the technical scheme, when the circuit board is inserted into the clamping groove, the insertion process of the circuit board can be more easily and conveniently due to the arrangement of the chamfer.
Preferably, a buffer layer made of an elastic material is fixedly connected to the position, close to the clamping groove, of the clamping block.
Through adopting above-mentioned technical scheme, the buffer layer can strengthen the centre gripping effect to the circuit board when the circuit board is pegged graft into in the centre gripping groove to can cushion the vibrations of subsides dress process, improve and paste the dress precision.
Preferably, a damping device is arranged between the bottom end of the workbench and the machine body.
Through adopting above-mentioned technical scheme, damping device can cushion the vibrations between subsides dress in-process workstation and the organism, thereby improves stability and improves and pastes dress precision.
Preferably, damping device include fixed connection in the slider in the position of workstation bottom four corners, the organism is close to the equal fixedly connected with upper end open-ended support shell in position of slider, the slider all can slide from top to bottom in the support shell, the equal fixedly connected with damping spring in slider bottom, the damping spring other end all with bottom surface fixed connection in the support shell, damping spring can right vertical ascending power is applyed to the slider.
Through adopting above-mentioned technical scheme, damping spring can cushion the workstation pasting the dress in-process, and damping spring restriction can improve the stability of workstation inside supporting the shell.
Preferably, the damping device further comprises a damping air cushion arranged between the bottom end of the workbench and the machine body.
Through adopting above-mentioned technical scheme, the shock attenuation air cushion can realize the secondary buffering to the workstation, strengthens buffering effect, makes the subsides dress process more stable.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the clamping block, the clamping groove and the pressing block are matched for use to realize stable clamping effect in vertical and horizontal directions on the circuit board, and the pressing layer can enhance the clamping and pressing effect, improve the stability and further improve the mounting precision;
2. damping spring can support the slider and slide in supporting the shell, realizes absorbing effect, avoids the workstation to rock because the spring is unstable simultaneously, and the shock attenuation air cushion can the secondary shock attenuation, improves stability, improves and pastes the dress precision.
Drawings
FIG. 1 is an overall schematic view of the present embodiment;
FIG. 2 is a cross-sectional view of the protruded table in the present embodiment;
FIG. 3 is a partial cross-sectional view of the protruding gripping and compression blocks of the present embodiment;
fig. 4 is a partial sectional view of the protruded damper spring in the present embodiment.
Description of reference numerals: 1. a body; 11. a first slide rail; 12. a second slide rail; 13. a machine head; 131. a lifting cylinder; 132. a mounting head; 133. a vacuum nozzle; 14. a feeding table; 2. a work table; 21. a placement groove; 211. a shock pad; 22. a clamping block; 221. a clamping groove; 222. a buffer layer; 223. chamfering; 23. fixing the spring; 24. a compression block; 241. a compression layer; 25. fixing the air cylinder; 3. a damping device; 31. a slider; 32. a support housing; 33. a damping spring; 34. shock attenuation air cushion.
Detailed Description
The present application is described in further detail below with reference to figures 1-4.
The embodiment of the application discloses a multifunctional chip mounter. Referring to fig. 1 and 2, the multifunctional chip mounter includes a body 1, a worktable 2 is disposed at one end of the upper portion of the body 1, a feeding table 14 is disposed at the other end of the upper portion of the body 1, first slide rails 11 disposed along the width direction of the body 1 are fixedly connected to positions of two ends of the body 1 near the upper portions of the worktable 2 and the feeding table 14, first slide grooves are disposed in the first slide rails 11, first threaded rods are disposed in one sides of the first slide grooves, guide rods are disposed in the other sides of the first slide grooves, a first driving motor is fixedly connected to one end of the first slide rails 11 near the threaded rods, an output shaft of the first driving motor is fixedly connected to the first threaded rods, second slide rails 12 disposed along the length direction of the body 1 are slidably connected to the first slide rails 11 together, one end of each second slide rail 12 is threadedly connected to the first threaded rod, the other end of each second slide rail 12 is slidably connected to, a second threaded rod is arranged in the second sliding groove, a second driving motor is fixedly connected to one end of the second sliding rail 12, a machine head 13 is slidably connected to the second sliding groove, and the machine head 13 is in threaded connection with the second threaded rod. Fixedly connected with lift cylinder 131 on the aircraft nose 13, the piston rod of lift cylinder 131 sets up along vertical direction, and lift cylinder 131's piston rod fixedly connected with pastes dress head 132. A vacuum suction nozzle 133 is fixedly connected to the mounting head 132, and a vacuum generator connected to the vacuum suction nozzle 133 is provided in the mounting head 132. During the use, through placing the circuit board on workstation 2, place electronic component on the feed table 14, through first driving motor drive second slide rail 12 along first slide rail 11 motion, second driving motor drive aircraft nose 13 along second slide rail 12 motion, can aim at the electronic component on the feed mechanism with aircraft nose 13, flagpole drive mounting head 132 downstream, adsorb electronic component on mounting head 132 through vacuum suction nozzle 133, slide aircraft nose 13 to the position of circuit board top again, lift cylinder 131 drives mounting head 132 downstream, with the accurate corresponding position of placing on the circuit board of electronic component.
Referring to fig. 2 and 3, a placing groove 21 has been seted up on the top surface of workstation 2, placing groove 21 bottom surface fixedly connected with is by the shock pad 211 of elastic material such as rubber, the equal sliding connection of placing groove 21 four sides has a grip block 22, grip block 22 all can slide to placing groove 21 center in placing groove 21, the equal fixedly connected with fixed spring 23 in one side that the center of placing groove 21 was kept away from to grip block 22, the fixed spring 23 other end all with workstation 2 fixed connection, grip block 22 keeps away from the one side bottom of fixed spring 23 and has all seted up grip groove 221. When the clamping device is used, a circuit board can be placed in the placing groove 21, the circuit board is clamped between the clamping blocks 22 through the sliding clamping blocks 22, the circuit board is clamped between the clamping blocks 22 through the elastic action of the springs, and when the circuit board is clamped between the clamping blocks 22 through the clamping blocks 22, the circuit board can be inserted into the clamping groove 221. In the process of mounting the electronic component, the shock absorption pad 211 can absorb the vibration force, so that the mounting precision is improved.
Referring to fig. 3, the clamping block 22 is provided with a chamfer 223 at a position close to the clamping groove 221. A buffer layer 222 made of an elastic material such as rubber is fixedly connected to the position of the clamping block 22 near the clamping groove 221. The provision of the chamfer 223 enables the insertion process of the circuit board to be easier and more convenient when the circuit board is inserted into the holding groove 221. The buffer layer 222 can enhance the clamping effect of the circuit board when the circuit board is inserted into the clamping groove 221, and can buffer the vibration of the mounting process, thereby improving the mounting accuracy.
Referring to fig. 3, the clamping blocks 22 are all provided with pressing blocks 24 sliding along the vertical direction, the workbench 2 is provided with fixed cylinders 25 fixedly connected to positions close to the pressing blocks 24, piston rods of the fixed cylinders 25 are all arranged along the vertical direction, and piston rods of the fixed cylinders 25 are all fixedly connected with the pressing blocks 24. The bottom ends of the pressing blocks 24 are fixedly connected with pressing layers 241 made of elastic materials such as rubber. Can use fixed cylinder 25 drive compact heap 24 to slide from top to bottom, make compact heap 24 can produce decurrent pressure to grip block 22 to let compact heap 24 can compress tightly grip block 22, under the elastic action of shock pad 211, produce the power that compresses tightly downwards to the circuit board, thereby let the centre gripping more stable, increase surface mounting's precision.
Referring to fig. 2 and 4, a damping device 3 is provided between the bottom end of the table 2 and the machine body 1. Damping device 3 includes the slider 31 of fixed connection in the position of 2 bottom four corners of workstation, the equal fixedly connected with upper end open-ended support shell 32 in the position that organism 1 is close to slider 31, slider 31 all can be in supporting shell 32 and slide from top to bottom, inside slider 31's cross section covers support shell 32, the equal fixedly connected with damping spring 33 in slider 31 bottom, the damping spring 33 other end all with support shell 32 in bottom surface fixed connection, damping spring 33 can apply vertical ascending power to slider 31. A shock absorption air cushion 34 is arranged between the bottom end of the worktable 2 and the machine body 1. Damping device 3 can support slider 31 through damping spring 33 and slide in supporting shell 32, realizes absorbing effect, avoids workstation 2 to rock because the spring is unstable simultaneously, and damping air cushion 34 can the secondary shock attenuation, improves stability, improves and pastes dress precision.
The implementation principle of the multifunctional chip mounter in the embodiment of the application is as follows: when the electronic component placement machine is used, a circuit board is stably clamped on the workbench 2, an electronic component is placed on the feeding table 14, the second slide rail 12 moves along the first slide rail 11, the machine head 13 moves along the second slide rail 12, the machine head 13 can be aligned to the electronic component on the feeding mechanism, the flagpole drives the placement head 132 to move downwards, the electronic component is adsorbed onto the placement head 132 through the vacuum suction nozzle 133, the machine head 13 slides to a position above the circuit board, the lifting cylinder 131 drives the placement head 132 to move downwards, and the electronic component is accurately placed at a corresponding position on the circuit board; the clamping of the circuit board is realized by the matching use of the clamping block 22, the clamping groove 221 and the pressing block 24, and the stable clamping effect in the vertical and horizontal directions can be realized on the circuit board; the shock pad 211, the buffer layer 222 and the compression layer 241 can enhance the clamping and compressing effect, buffer the vibration, improve the stability and further improve the mounting precision; damping spring 33 can support slider 31 and slide in supporting shell 32, realizes absorbing effect, avoids workstation 2 to rock because the spring is unstable simultaneously, and damping air cushion 34 can the secondary shock attenuation, improves stability, improves and pastes dress precision.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (10)
1. The utility model provides a multifunctional chip mounter, includes organism (1), organism (1) top one end is provided with workstation (2), organism (1) top other end is provided with feed platform (14), its characterized in that: the machine body (1) is fixedly connected with first sliding rails (11) arranged along the width direction of the machine body (1) at positions, close to the upper part of the workbench (2), of two ends of the machine body (1), the first sliding rails (11) are jointly connected with second sliding rails (12) arranged along the length direction of the machine body (1) in a sliding mode, and the second sliding rails (12) are connected with machine heads (13) in a sliding mode;
the head (13) is fixedly connected with a lifting cylinder (131), a piston rod of the lifting cylinder (131) is arranged along the vertical direction, a mounting head (132) is fixedly connected with a piston rod of the lifting cylinder (131), a vacuum suction nozzle (133) is fixedly connected onto the mounting head (132), and a vacuum generator connected with the vacuum suction nozzle (133) is arranged in the mounting head (132);
the clamping device is characterized in that a placing groove (21) is formed in the workbench (2), the workbench (2) is close to the four sides of the placing groove (21), clamping blocks (22) are connected to the bottom end of one side of the center of the placing groove (21) in a sliding mode, clamping grooves (221) are formed in the bottom end of the side, where the clamping blocks (22) are close to the center of the placing groove (21), of the clamping grooves (221), the clamping grooves (221) are all arranged in a direction parallel to the surface of the workbench (2), the clamping blocks (22) are far away from the center of the placing groove (21), fixing springs (23) are far away from one ends of the clamping blocks (22) and the workbench (2) in a fixed mode, and the fixing springs (23) can apply force of the horizontal direction to the center of the placing groove (21) to the clamping blocks (22).
2. The multifunctional chip mounter according to claim 1, wherein: the position of the workbench (2) close to the bottom end of the placing groove (21) is fixedly connected with a shock pad (211) made of elastic materials.
3. The multifunctional chip mounter according to claim 2, wherein: the clamping device is characterized in that pressing blocks (24) sliding in the vertical direction are arranged above the clamping blocks (22), and driving devices for driving the pressing blocks (24) to slide up and down are fixedly connected to the pressing blocks (24).
4. The multifunctional chip mounter according to claim 3, wherein: the driving device comprises a fixed air cylinder (25) fixedly connected to the workbench (2), piston rods of the fixed air cylinder (25) are arranged in the vertical direction, and piston rods of the fixed air cylinder (25) are fixedly connected with the pressing block (24).
5. The multifunctional chip mounter according to claim 3, wherein: the bottom surfaces of the pressing blocks (24) are fixedly connected with pressing layers (241) made of elastic materials.
6. The multifunctional chip mounter according to claim 1, wherein: and a chamfer (223) is formed at the position, close to the clamping groove (221), of the clamping block (22).
7. The multifunctional chip mounter according to claim 1, wherein: a buffer layer (222) made of elastic materials is fixedly connected to the position, close to the clamping groove (221), of the clamping block (22).
8. The multifunctional chip mounter according to claim 1, wherein: and a damping device (3) is arranged between the bottom end of the workbench (2) and the machine body (1).
9. The multifunctional chip mounter according to claim 8, wherein: damping device (3) include fixed connection in slider (31) of the position in workstation (2) bottom four corners, organism (1) is close to the equal fixedly connected with upper end open-ended in position of slider (31) supports shell (32), slider (31) all can support shell (32) in the upper and lower slip, the equal fixedly connected with damping spring (33) in slider (31) bottom, the damping spring (33) other end all with support shell (32) interior bottom surface fixed connection, damping spring (33) can be right vertical ascending power is applyed to slider (31).
10. The multifunctional chip mounter according to claim 9, wherein: the damping device (3) further comprises a damping air cushion (34) arranged between the bottom end of the workbench (2) and the machine body (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202021271537.9U CN212183838U (en) | 2020-07-01 | 2020-07-01 | Multifunctional chip mounter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202021271537.9U CN212183838U (en) | 2020-07-01 | 2020-07-01 | Multifunctional chip mounter |
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CN212183838U true CN212183838U (en) | 2020-12-18 |
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CN202021271537.9U Expired - Fee Related CN212183838U (en) | 2020-07-01 | 2020-07-01 | Multifunctional chip mounter |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113784610A (en) * | 2021-09-11 | 2021-12-10 | 南京久运科技有限公司 | Efficient mounting device and mounting method for electronic components |
-
2020
- 2020-07-01 CN CN202021271537.9U patent/CN212183838U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113784610A (en) * | 2021-09-11 | 2021-12-10 | 南京久运科技有限公司 | Efficient mounting device and mounting method for electronic components |
CN113784610B (en) * | 2021-09-11 | 2023-08-25 | 南京久运科技有限公司 | Efficient electronic component mounting device and mounting method |
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Legal Events
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201218 |